CN103227270A - 发光二极管装置及其制造方法 - Google Patents

发光二极管装置及其制造方法 Download PDF

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Publication number
CN103227270A
CN103227270A CN2013100296699A CN201310029669A CN103227270A CN 103227270 A CN103227270 A CN 103227270A CN 2013100296699 A CN2013100296699 A CN 2013100296699A CN 201310029669 A CN201310029669 A CN 201310029669A CN 103227270 A CN103227270 A CN 103227270A
Authority
CN
China
Prior art keywords
emitting diode
resin layer
light
potting resin
list
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013100296699A
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English (en)
Chinese (zh)
Inventor
片山博之
大薮恭也
佐藤慧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN103227270A publication Critical patent/CN103227270A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/10—Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
CN2013100296699A 2012-01-27 2013-01-25 发光二极管装置及其制造方法 Pending CN103227270A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012015796A JP2013157408A (ja) 2012-01-27 2012-01-27 発光ダイオード装置およびその製造方法
JP2012-015796 2012-01-27

Publications (1)

Publication Number Publication Date
CN103227270A true CN103227270A (zh) 2013-07-31

Family

ID=47605384

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013100296699A Pending CN103227270A (zh) 2012-01-27 2013-01-25 发光二极管装置及其制造方法

Country Status (6)

Country Link
US (1) US20130193477A1 (de)
EP (1) EP2620990A3 (de)
JP (1) JP2013157408A (de)
KR (1) KR20130087428A (de)
CN (1) CN103227270A (de)
TW (1) TW201332161A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018001162A1 (zh) * 2016-07-01 2018-01-04 京东方科技集团股份有限公司 布线保护膜层的贴附方法、布线结构和显示面板
CN112490339A (zh) * 2020-12-10 2021-03-12 鸿利智汇集团股份有限公司 一种led无机封装方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101596725B1 (ko) * 2013-05-22 2016-02-24 삼성디스플레이 주식회사 충전 필름 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
JP2015050359A (ja) * 2013-09-02 2015-03-16 日東電工株式会社 封止半導体素子および半導体装置の製造方法
JP6677966B2 (ja) * 2014-11-17 2020-04-08 日東電工株式会社 セパレータ付き封止用シート、及び、半導体装置の製造方法
JP2016096308A (ja) * 2014-11-17 2016-05-26 日東電工株式会社 半導体装置の製造方法
CN106469772B (zh) * 2015-08-18 2018-01-05 江苏诚睿达光电有限公司 一种基于滚压式的热塑性树脂光转换体贴合封装led的工艺方法
JP6964421B2 (ja) * 2017-03-23 2021-11-10 ローム株式会社 半導体発光装置
JP6856787B1 (ja) * 2020-01-29 2021-04-14 住友化学株式会社 電子部品の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01207935A (ja) * 1988-02-16 1989-08-21 Sumitomo Bakelite Co Ltd 半導体搭載部品の製造方法
JPH01256133A (ja) * 1988-04-06 1989-10-12 Olympus Optical Co Ltd 半導体装置の製造方法及びその製造装置
JPH02194633A (ja) * 1989-01-24 1990-08-01 Matsushita Electric Ind Co Ltd 半導体装置の製造方法およびその製造装置
TW319875B (de) * 1995-11-01 1997-11-11 Fuji Polymertech Kk
JP3681636B2 (ja) * 2000-12-27 2005-08-10 サンユレック株式会社 電子部品の製造方法及び装置
WO2005124401A1 (ja) * 2004-06-21 2005-12-29 Idemitsu Kosan Co., Ltd. バックシャーシ一体型反射器、バックライト装置及び液晶表示装置
JP2006036930A (ja) * 2004-07-27 2006-02-09 Nitto Denko Corp 光半導体素子封止用樹脂
JP2008159820A (ja) * 2006-12-22 2008-07-10 Tdk Corp 電子部品の一括実装方法、及び電子部品内蔵基板の製造方法
JP5233170B2 (ja) * 2007-05-31 2013-07-10 日亜化学工業株式会社 発光装置、発光装置を構成する樹脂成形体及びそれらの製造方法
JP5113627B2 (ja) * 2007-06-12 2013-01-09 日本電波工業株式会社 電子部品及びその製造方法
TWM329857U (en) * 2007-08-21 2008-04-01 Ko-Hsin Lee LED package structure
JP2010052152A (ja) * 2008-08-26 2010-03-11 Brother Ind Ltd 露光装置およびその製造方法
JP2010159411A (ja) * 2008-12-12 2010-07-22 Nitto Denko Corp 半硬化状シリコーン樹脂シート
JP4913858B2 (ja) * 2009-04-14 2012-04-11 日東電工株式会社 熱硬化性シリコーン樹脂用組成物
JP5738541B2 (ja) 2010-04-21 2015-06-24 日東電工株式会社 光半導体装置
JP5494264B2 (ja) * 2010-06-14 2014-05-14 富士ゼロックス株式会社 発光装置、プリントヘッドおよび画像形成装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018001162A1 (zh) * 2016-07-01 2018-01-04 京东方科技集团股份有限公司 布线保护膜层的贴附方法、布线结构和显示面板
US10446413B2 (en) 2016-07-01 2019-10-15 Boe Technology Group Co., Ltd. Method for attaching wiring protective film layer, wiring structure and display panel
CN112490339A (zh) * 2020-12-10 2021-03-12 鸿利智汇集团股份有限公司 一种led无机封装方法
CN112490339B (zh) * 2020-12-10 2022-06-03 鸿利智汇集团股份有限公司 一种led无机封装方法

Also Published As

Publication number Publication date
US20130193477A1 (en) 2013-08-01
EP2620990A2 (de) 2013-07-31
TW201332161A (zh) 2013-08-01
JP2013157408A (ja) 2013-08-15
KR20130087428A (ko) 2013-08-06
EP2620990A3 (de) 2014-02-26

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Application publication date: 20130731