CN103221171B - 输送装置 - Google Patents
输送装置 Download PDFInfo
- Publication number
- CN103221171B CN103221171B CN201180055615.9A CN201180055615A CN103221171B CN 103221171 B CN103221171 B CN 103221171B CN 201180055615 A CN201180055615 A CN 201180055615A CN 103221171 B CN103221171 B CN 103221171B
- Authority
- CN
- China
- Prior art keywords
- chain
- key member
- support member
- transport
- rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-258596 | 2010-11-19 | ||
| JP2010258596A JP5299409B2 (ja) | 2010-11-19 | 2010-11-19 | 搬送装置 |
| PCT/JP2011/076426 WO2012067155A1 (ja) | 2010-11-19 | 2011-11-16 | 搬送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103221171A CN103221171A (zh) | 2013-07-24 |
| CN103221171B true CN103221171B (zh) | 2015-04-15 |
Family
ID=46084078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180055615.9A Active CN103221171B (zh) | 2010-11-19 | 2011-11-16 | 输送装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5299409B2 (enExample) |
| CN (1) | CN103221171B (enExample) |
| WO (1) | WO2012067155A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102745457A (zh) * | 2012-07-05 | 2012-10-24 | 无锡金洋铝业有限公司 | 一种异型双t型轨道 |
| CN117066625A (zh) * | 2023-08-30 | 2023-11-17 | 四川景恒科技有限公司 | 一种多腔室隧道真空回流焊炉 |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61200654A (ja) * | 1985-02-28 | 1986-09-05 | Futaba Corp | 螢光表示装置 |
| JPH01118091A (ja) * | 1987-10-30 | 1989-05-10 | Matsushita Electric Ind Co Ltd | 加熱炉用搬送装置 |
| CN1033778A (zh) * | 1987-11-20 | 1989-07-12 | 日本电热计器株式会社 | 印刷电路板输送装置 |
| JPH0486609A (ja) * | 1990-07-27 | 1992-03-19 | Sumitomo Electric Ind Ltd | 光コネクタ |
| JPH04344869A (ja) * | 1991-05-17 | 1992-12-01 | Denkoo:Kk | 熱処理装置 |
| JPH0645747A (ja) * | 1992-07-23 | 1994-02-18 | Matsushita Electric Ind Co Ltd | リフロー装置 |
| JP2002037431A (ja) * | 2000-07-27 | 2002-02-06 | Nec Saitama Ltd | 板状物体の搬送機構及びリフロー装置 |
| JP2002299812A (ja) * | 2001-04-03 | 2002-10-11 | Tamura Seisakusho Co Ltd | 搬送装置および加熱装置 |
| JP2003179342A (ja) * | 2001-12-10 | 2003-06-27 | Senju Metal Ind Co Ltd | リフロー炉 |
| CN1516543A (zh) * | 2002-11-25 | 2004-07-28 | 千住金属工业株式会社 | 回流焊炉 |
| CN1636664A (zh) * | 2003-12-26 | 2005-07-13 | 株式会社田村制作所 | 焊锡连接装置 |
| CN1902020A (zh) * | 2004-01-07 | 2007-01-24 | 千住金属工业株式会社 | 回流炉 |
| JP4401537B2 (ja) * | 2000-05-26 | 2010-01-20 | 千住金属工業株式会社 | リフロー炉 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH032371Y2 (enExample) * | 1985-06-07 | 1991-01-23 | ||
| JPH0739030B2 (ja) * | 1990-01-22 | 1995-05-01 | 東洋ラジエーター株式会社 | 熱交換器ろう付け用ハンガ |
| JPH0730567Y2 (ja) * | 1990-11-30 | 1995-07-12 | 権士 近藤 | プリント基板の搬送チェーン |
-
2010
- 2010-11-19 JP JP2010258596A patent/JP5299409B2/ja active Active
-
2011
- 2011-11-16 CN CN201180055615.9A patent/CN103221171B/zh active Active
- 2011-11-16 WO PCT/JP2011/076426 patent/WO2012067155A1/ja not_active Ceased
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61200654A (ja) * | 1985-02-28 | 1986-09-05 | Futaba Corp | 螢光表示装置 |
| JPH01118091A (ja) * | 1987-10-30 | 1989-05-10 | Matsushita Electric Ind Co Ltd | 加熱炉用搬送装置 |
| CN1033778A (zh) * | 1987-11-20 | 1989-07-12 | 日本电热计器株式会社 | 印刷电路板输送装置 |
| JPH0486609A (ja) * | 1990-07-27 | 1992-03-19 | Sumitomo Electric Ind Ltd | 光コネクタ |
| JPH04344869A (ja) * | 1991-05-17 | 1992-12-01 | Denkoo:Kk | 熱処理装置 |
| JPH0645747A (ja) * | 1992-07-23 | 1994-02-18 | Matsushita Electric Ind Co Ltd | リフロー装置 |
| JP4401537B2 (ja) * | 2000-05-26 | 2010-01-20 | 千住金属工業株式会社 | リフロー炉 |
| JP2002037431A (ja) * | 2000-07-27 | 2002-02-06 | Nec Saitama Ltd | 板状物体の搬送機構及びリフロー装置 |
| JP2002299812A (ja) * | 2001-04-03 | 2002-10-11 | Tamura Seisakusho Co Ltd | 搬送装置および加熱装置 |
| JP2003179342A (ja) * | 2001-12-10 | 2003-06-27 | Senju Metal Ind Co Ltd | リフロー炉 |
| CN1516543A (zh) * | 2002-11-25 | 2004-07-28 | 千住金属工业株式会社 | 回流焊炉 |
| CN1636664A (zh) * | 2003-12-26 | 2005-07-13 | 株式会社田村制作所 | 焊锡连接装置 |
| CN1902020A (zh) * | 2004-01-07 | 2007-01-24 | 千住金属工业株式会社 | 回流炉 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012106273A (ja) | 2012-06-07 |
| CN103221171A (zh) | 2013-07-24 |
| JP5299409B2 (ja) | 2013-09-25 |
| WO2012067155A1 (ja) | 2012-05-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |