CN103201617B - 基板检查方法 - Google Patents

基板检查方法 Download PDF

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Publication number
CN103201617B
CN103201617B CN201180048854.1A CN201180048854A CN103201617B CN 103201617 B CN103201617 B CN 103201617B CN 201180048854 A CN201180048854 A CN 201180048854A CN 103201617 B CN103201617 B CN 103201617B
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China
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substrate
mentioned
measurement object
plane equation
real estate
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CN201180048854.1A
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English (en)
Chinese (zh)
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CN103201617A (zh
Inventor
李贤基
权达颜
全廷悦
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Gaoying Technology Co ltd
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Koh Young Technology Inc
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Publication of CN103201617A publication Critical patent/CN103201617A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/93—Detection standards; Calibrating baseline adjustment, drift correction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
CN201180048854.1A 2010-10-14 2011-10-13 基板检查方法 Active CN103201617B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020100100406A KR101158323B1 (ko) 2010-10-14 2010-10-14 기판 검사방법
KR10-2010-0100406 2010-10-14
PCT/KR2011/007630 WO2012050378A2 (ko) 2010-10-14 2011-10-13 기판 검사방법

Publications (2)

Publication Number Publication Date
CN103201617A CN103201617A (zh) 2013-07-10
CN103201617B true CN103201617B (zh) 2016-08-17

Family

ID=45938812

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180048854.1A Active CN103201617B (zh) 2010-10-14 2011-10-13 基板检查方法

Country Status (5)

Country Link
US (1) US20130194569A1 (enExample)
JP (2) JP2013545972A (enExample)
KR (1) KR101158323B1 (enExample)
CN (1) CN103201617B (enExample)
WO (1) WO2012050378A2 (enExample)

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US9167314B2 (en) * 2012-05-21 2015-10-20 Video Expressions LLC Embedding information in an image
JP6176598B2 (ja) * 2012-07-25 2017-08-09 国立大学法人金沢大学 寸法測定プログラム、寸法測定装置、及び、寸法測定方法
KR101401040B1 (ko) * 2012-09-28 2014-05-30 삼성중공업 주식회사 타겟 검사 장치 및 방법
KR101418462B1 (ko) * 2013-02-26 2014-07-14 애니모션텍 주식회사 3차원 측정기를 이용한 스테이지 캘리브레이션 방법
KR101452928B1 (ko) * 2013-02-26 2014-10-22 애니모션텍 주식회사 카메라와 변위센서를 이용한 스테이지 캘리브레이션 방법
KR101447968B1 (ko) * 2013-04-16 2014-10-13 주식회사 고영테크놀러지 기판 검사를 위한 기준평면 설정방법 및 기준평면을 이용한 기판 검사방법
CN103322944B (zh) * 2013-06-14 2016-06-29 上海大学 同轴照明镜像莫尔测量装置及方法
KR101511089B1 (ko) * 2013-07-22 2015-04-10 (주)펨트론 Ａｏｉ 장비의 티칭 데이터 자동 생성 방법
US9816940B2 (en) 2015-01-21 2017-11-14 Kla-Tencor Corporation Wafer inspection with focus volumetric method
JP6459613B2 (ja) * 2015-02-24 2019-01-30 三菱電機株式会社 プリント配線板作業支援方法及びプリント配線板作業支援システム
JP2017083419A (ja) * 2015-10-22 2017-05-18 キヤノン株式会社 計測装置および方法、物品製造方法、較正マーク部材、加工装置、ならびに加工システム
JP6189984B2 (ja) * 2016-02-12 2017-08-30 Ckd株式会社 三次元計測装置
JP6248244B1 (ja) 2016-08-09 2017-12-20 ナルックス株式会社 位置測定部を備えた部品
TWI630453B (zh) * 2017-11-22 2018-07-21 牧德科技股份有限公司 投影式複檢機及其校正方法
JP2019168328A (ja) * 2018-03-23 2019-10-03 株式会社東芝 半導体装置の検査方法及び半導体装置の製造方法
JP7202828B2 (ja) * 2018-09-26 2023-01-12 東京エレクトロン株式会社 基板検査方法、基板検査装置および記録媒体
WO2020070880A1 (ja) * 2018-10-05 2020-04-09 株式会社Ｆｕｊｉ 測定装置及び部品実装機
JP7283982B2 (ja) * 2019-06-04 2023-05-30 ビアメカニクス株式会社 レーザ加工装置およびレーザ加工方法
KR20220043974A (ko) 2020-09-28 2022-04-06 삼성디스플레이 주식회사 표시 장치
KR102428841B1 (ko) * 2020-12-09 2022-08-04 두산산업차량 주식회사 구조광을 이용한 연마 로봇 시스템 및 그 제어방법

Citations (4)

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CN101113891A (zh) * 2006-07-27 2008-01-30 三丰株式会社 光学式测量装置
CN101149252A (zh) * 2006-09-22 2008-03-26 株式会社拓普康 位置测量装置、位置测量方法和位置测量程序
EP2071614A1 (en) * 2006-09-01 2009-06-17 Nikon Corporation Mobile body driving method, mobile body driving system, pattern forming method and apparatus, exposure method and apparatus and device manufacturing method
CN101782375A (zh) * 2009-01-20 2010-07-21 Ckd株式会社 三维测量装置

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JPH061288B2 (ja) * 1986-10-07 1994-01-05 富士通株式会社 高さ補正による自動焦点合せ装置
JP2720202B2 (ja) 1989-07-05 1998-03-04 日立電子エンジニアリング株式会社 基板露光装置におけるギャップ制御方法
JP3124535B2 (ja) * 1990-04-20 2001-01-15 富士通株式会社 表面実装部品検査装置
JPH04208803A (ja) * 1990-11-30 1992-07-30 Yaskawa Electric Corp プリント基板実装検査装置
JP2860857B2 (ja) * 1993-04-01 1999-02-24 日立電子エンジニアリング株式会社 基板露光装置
JP4019293B2 (ja) * 1998-11-11 2007-12-12 澁谷工業株式会社 マウント検査部における照明装置
US6501554B1 (en) * 2000-06-20 2002-12-31 Ppt Vision, Inc. 3D scanner and method for measuring heights and angles of manufactured parts
JP4610702B2 (ja) * 2000-07-27 2011-01-12 パナソニック株式会社 電子基板検査方法
US7317531B2 (en) * 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
JP4796232B2 (ja) * 2001-03-02 2011-10-19 名古屋電機工業株式会社 半田高さ計測方法およびその装置
US20090123060A1 (en) * 2004-07-29 2009-05-14 Agency For Science, Technology And Research inspection system
JP4387900B2 (ja) 2004-09-07 2009-12-24 アイパルス株式会社 実装基板の検査方法及び検査装置
KR100841662B1 (ko) * 2006-06-23 2008-06-26 주식회사 고영테크놀러지 모아레와 스테레오를 이용한 3차원형상 측정시스템 및 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101113891A (zh) * 2006-07-27 2008-01-30 三丰株式会社 光学式测量装置
EP2071614A1 (en) * 2006-09-01 2009-06-17 Nikon Corporation Mobile body driving method, mobile body driving system, pattern forming method and apparatus, exposure method and apparatus and device manufacturing method
CN101149252A (zh) * 2006-09-22 2008-03-26 株式会社拓普康 位置测量装置、位置测量方法和位置测量程序
CN101782375A (zh) * 2009-01-20 2010-07-21 Ckd株式会社 三维测量装置

Also Published As

Publication number Publication date
JP2016173371A (ja) 2016-09-29
WO2012050378A3 (ko) 2012-06-28
KR20120038770A (ko) 2012-04-24
JP2013545972A (ja) 2013-12-26
JP6151406B2 (ja) 2017-06-21
US20130194569A1 (en) 2013-08-01
WO2012050378A2 (ko) 2012-04-19
CN103201617A (zh) 2013-07-10
KR101158323B1 (ko) 2012-06-26

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Address after: Han Guoshouershi

Patentee after: Gaoying Technology Co.,Ltd.

Address before: Han Guoshouershi

Patentee before: KOH YOUNG TECHNOLOGY Inc.