CN103117262A - 具有连接接口的电子装置、其电路基板以及其制造方法 - Google Patents

具有连接接口的电子装置、其电路基板以及其制造方法 Download PDF

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Publication number
CN103117262A
CN103117262A CN2012104057476A CN201210405747A CN103117262A CN 103117262 A CN103117262 A CN 103117262A CN 2012104057476 A CN2012104057476 A CN 2012104057476A CN 201210405747 A CN201210405747 A CN 201210405747A CN 103117262 A CN103117262 A CN 103117262A
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China
Prior art keywords
line layer
circuit substrate
perforate
opening
connecting interface
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CN2012104057476A
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English (en)
Inventor
林殿方
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Dawning Leading Technology Inc
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Dawning Leading Technology Inc
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Publication of CN103117262A publication Critical patent/CN103117262A/zh
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    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
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Abstract

本发明是有关于一种具有连接接口的电子装置、其电路基板以及其制造方法，该具有连接接口的电子装置包括：电路基板，设有第一线路层以及第二线路层，第二线路层具有复数个终端垫，其中，终端垫设有开口，开口延伸至该第一线路层，于该开口内设置金属层，金属层形成有一开孔且连接第一线路层与终端垫；半导体芯片，电性连接至第一电路层；以及导电组件嵌入开孔。本发明的具有连接接口的电子装置，因导电组件直接设置于电路基板上，故无需额外组装端子模块。

Description

具有连接接口的电子装置、其电路基板以及其制造方法
技术领域
本发明是关于一种电子装置、其电路基板以及其制造方法，尤其指一种具有连接接口的电子装置、其电路基板与制造方法。
背景技术
随着可携式电子装置、电子卡、或其他电子设备不断推陈出新，其连接器接口规格亦不断地迭替，如通用串行总线(Universal Serial Bus，简称「USB」)，其规格从早期USB1.0至USB2.0，时至今日已发展至USB3.0，往后亦会不断继续发展下去。
目前常见的连接接口可参阅于2011年10月11日公开的中国台湾发明专利申请M413989号所揭示的一种具有端子模块的连接接口，其包含电路基板以及端子模块，其中，该连接接口的端子模块与电路基板两者各自独立组装后，再对位堆叠使端子模块的导电片与弹性端子与电路基板的电性接点连接，以组设成完整的连接接口。
由此可知，目前连接接口内的弹性端子大多设至于端子模块内，再经由端子模块与电路基板的堆叠组装，达到弹性端子连接电性接点的目的，而非将弹性端子直接组设于电路基板，因此额外需要进行端子模块的组装步骤等，反而增加组装步骤与额外的成本开销。
发明内容
本发明的目的在于提供一种具有连接接口的电子装置及制造方法。
本发明的又一目的在于提供一种供导电组件嵌设的电路基板及其制造方法。
为实现上述目的，本发明提供的具有连接接口的电子装置，包括：
一电路基板，具有一第一表面及一相对的第二表面，该第一表面设有一第一线路层，该第二表面设有一第二线路层，该第一线路层具有复数个电性连接垫，该第二线路层具有复数个金属接触垫及复数个终端垫，其中，该些终端垫分别设有一开口，该开口延伸至该第一线路层且设置一金属层于该开口内，该金属层形成有一开孔且连接该第一线路层与该终端垫；
一半导体芯片，设置于该第一表面上且具有复数个电极垫，其中，该半导体芯片的该些电极垫分别电性连接至该第一电路层的该些电性连接垫；以及
一导电组件，具有一栓状体，该栓状体是嵌入该开孔。
所述具有连接接口的电子装置中，包括一接着层，设置于该导电组件的该栓状体与该金属层及/或该第一线路层之间。
所述具有连接接口的电子装置中，包括一黏着膜，设置于该半导体芯片与该电路基板的该第一表面之间。
所述具有连接接口的电子装置中，该导电组件具有一弹性结构。
所述具有连接接口的电子装置中，该开孔是贯穿该金属层。
所述具有连接接口的电子装置中，包括一绝缘层，位于该第一线路层及/或第二线路层表面，其中，该绝缘层形成有复数接触窗，以暴露该些电性连接垫、该些金属接触垫、或该些终端垫。
本发明提供的具有连接接口的电子装置的制造方法，包括以下步骤：
提供一电路基板，该电路基板具有一第一表面及一相对的第二表面，该第一表面设有一第一线路层，该第二表面设有一第二线路层，该第一线路层具有复数个电性连接垫，该第二线路层具有复数个金属接触垫及终端垫，其中，该些终端垫分别设有一开口，该开口延伸至该第一线路层且设置一金属层于该开口内，该金属层连接该第一线路层及该终端垫且形成有一开孔于该金属层中；
于该电路基板的该第一表面上设置一半导体芯片，该半导体芯片具有复数个电极垫，其中，该半导体芯片的该些电极垫系分别电性连接至该第一电路层的该些电性连接垫；以及
于该电路基板的该开孔内设置一导电组件，其中，该导电组件具有一栓状体，该栓状体是嵌入该开孔。
所述具有连接接口的电子装置的制造方法中，该电路基板的该开口、该开孔与该金属层是由一包含以下步骤的方法所形成：
于该电路基板的该些终端垫分别开设一开口，其中，该开口延伸至该第一线路层；
于该开口内电镀一金属；以及
于该金属开设一开孔，以形成一金属层覆盖该开口内的侧壁表面。
所述具有连接接口的电子装置的制造方法中，包括一以下步骤：于该导电组件的该栓状体与该金属层及/或该第一线路层之间，设置一接着层。
所述具有连接接口的电子装置的制造方法中，包括一以下步骤：于该半导体芯片与该电路基板的该第一表面之间，设置一黏着膜。
所述具有连接接口的电子装置的制造方法中，该导电组件具有一弹性结构。
所述具有连接接口的电子装置的制造方法中，该开孔是贯穿该金属层。
所述具有连接接口的电子装置的制造方法中，包括一以下步骤：于该第一线路层及/或第二线路层表面，形成一绝缘层，其中，该绝缘层形成有复数接触窗，以暴露该些电性连接垫、该些金属接触垫、或该些终端垫。
本发明提供的供导电组件嵌设的电路基板，包括：
一第一表面；
一第二表面，相对于该第一表面；
一第一线路层，设于该第一表面，其中，该第一线路层具有复数个电性连接垫；以及
一第二线路层，设于该第二表面，其中，该第二线路层具有复数个金属接触垫及终端垫，该终端垫设有一开口，该开口延伸至该第一线路层且内壁表面设置一金属层，该金属层连接该第一线路层及该终端垫且设有一开孔，该开孔系供该导电组件嵌设于其中。
本发明提供的供导电组件嵌设的电路基板的制造方法，包括以下步骤：
提供一电路基板，该电路基板具有一第一表面及一相对的第二表面，该第一表面设有一第一线路层，该第二表面设有一第二线路层，该第一线路层具有复数个电性连接垫，该第二线路层具有复数个金属接触垫及终端垫；
于该电路基板的该些终端垫分别开设一开口，其中，该开口延伸至该第一线路层；
于该开口内电镀一金属；以及
于该金属开设一开孔，以形成一金属层覆盖该开口的内壁表面，其中，该开孔供该导电组件嵌设于其中。
由上述可知，本发明在电路基板上设计出可供导电组件置放的空间，且导电组件可以固定于该空间中，而无需额外组装端子模块，简化相关组装流程。
附图说明
图1A至图1D是本发明实施例一制造供导电组件嵌设的电路基板的流程示意图。
图1D至图1I是本发明实施例二制造具有连接接口的电子装置的流程示意图。
图2是本发明实施例三中具有连接接口的电子装置的结构示意图。
图3是本发明实施例四中具有连接接口的电子装置的结构示意图。
图4是本发明实施例五中具有连接接口的电子装置的结构示意图。
图5是本发明实施例六中具有连接接口的电子装置的结构示意图。
图6是本发明实施例七中具有连接接口的电子装置的结构示意图。附图中主要组件符号说明：
电路基板1；第一表面10a；第二表面10b；第一线路层11；第二线路层12；电性连接垫13；金属接触垫14；终端垫16；开口160；金属160’；金属层161；开孔162；绝缘层17；接触窗171；半导体芯片2；电极垫23；黏着膜32；电线33；封胶材料35；导电组件4；弹性结构41；栓状体46；导电组件支架5；接着层64。
具体实施方式
本发明首先提供了一种具有连接接口的电子装置，其中电路基板上形成有开孔，因此可以让导电组件可以直接设置于电路基板上，而无需额外组装端子模块，简化相关组装流程，增加工艺可靠性。
为此，本发明的一态样提供一种具有连接接口的电子装置，包括：一电路基板、一半导体芯片、以及一导电组件。该电路基板具有一第一表面及一相对的第二表面，该第一表面设有一第一线路层，该第二表面设有一第二线路层，该第一线路层具有复数个电性连接垫，该第二线路层具有复数个金属接触垫及复数个终端垫，其中，该些终端垫分别设有一开口，该开口延伸至该第一线路层且设置一金属层于该开口内，该金属层形成有一开孔且连接该第一线路层与该终端垫。该半导体芯片设置于该第一表面上且具有复数个电极垫，且该半导体芯片的该些电极垫系分别电性连接至该第一电路层的该些电性连接垫。该导电组件具有一栓状体，且该栓状体系嵌入该开孔。
于一较佳具体实施例中，本发明的具有连接接口的电子装置，可选择性地还包括：一接着层，该接着层设置于该导电组件的该栓状体与该金属层及/或该第一线路层之间，如此可让该导电组件的该栓状体固定于该电路基板上，避免该导电组件因为外力而脱落。除此之外，亦可选择性地还包括：一黏着膜，该黏着膜设置于该半导体芯片与该电路基板的该第一表面之间，以将该半导体芯片固着于电路基板上；若有数个半导体芯片相互堆叠，则堆叠的半导体芯片之间亦可以设置该黏着层，使该些半导体芯片之间得以相互固着。
本发明具有连接接口的电子装置中，该导电组件可选择性地还具有一弹性结构，该弹性结构举例可为弯折状、弧状、未封闭拋物线状、双曲线状、不规则凸起状、蕈状等形状，以因应各种需求，并增加外观的识别性。
于一较佳具体实施例中，本发明具有连接接口的电子装置中，设置于电路基板终端垫开口内的该金属层，其中该开孔贯穿该金属层，因此该开孔延伸入该第一线路层，亦即该开孔显露该第一线路层。不过，该开孔的深度与形状没有特别限制，只要可让该导电组件的该栓状体嵌入并固定于其中即可，较佳是根据该导电组件的该栓状体的形状及长度，此表示该开孔也可以没有显露该第一线路层。此外，上述金属接触垫可做为金手指接触点(golden finger)。
此外，本发明的具有连接接口的电子装置，可选择性地还包括：一绝缘层，位于该第一线路层及/或第二线路层表面，其中，该绝缘层形成有复数接触窗，以暴露该些电性连接垫、该些金属接触垫、或该些终端垫。此绝缘层主要用于绝缘保护第一线路层与该第二线路层，并针对该些电性连接垫、该些金属接触垫、或该些终端垫开设出接触窗，如此可暴露出后续需进行电性连接的部分，例如需为打线接合而进行电镀的电性连接垫，因此降低需要电镀的面积，便可降低制造成本。于另一较佳具体实施例中，该绝缘层设于该第一线路层以及该第二线路层两者表面，但该绝缘层的设置不局限于此，也可以仅设于该第一线路层以及该第二线路层其中一者的表面。
本发明的还提供了具有连接接口的电子装置的制造方法，其中于形成有开孔的电路基板上，让导电组件可以直接设置于电路基板上，而无需额外组装端子模块，简化相关组装流程。
为此，本发明的另一态样提供一种具有连接接口的电子装置的制造方法，包括以下步骤：提供一电路基板，该电路基板具有一第一表面及一相对的第二表面，该第一表面设有一第一线路层，该第二表面设有一第二线路层，该第一线路层具有复数个电性连接垫，该第二线路层具有复数个金属接触垫及终端垫，其中，该些终端垫分别设有一开口，该开口延伸至该第一线路层且设置一金属层于该开口内，该金属层连接该第一线路层及该终端垫且形成有一开孔于该金属层中；于该电路基板的该第一表面上设置一半导体芯片，该半导体芯片具有复数个电极垫，其中，该半导体芯片的该些电极垫是分别电性连接至该第一电路层的该些电性连接垫；以及于该电路基板的该开孔内设置一导电组件，其中，该导电组件具有一栓状体，该栓状体是嵌入该开孔。
本发明的上述具有连接接口的电子装置的制造方法中，该电路基板的该开口、该开孔与该金属层是由一包含以下步骤的方法所形成：于该电路基板的该些终端垫分别开设一开口，其中，该开口延伸至该第一线路层；于该开口内电镀一金属；以及于该金属开设一开孔，以形成一金属层覆盖该开口内的侧壁表面。由上述可知，在电路基板上利用两次开设孔洞的方式，于电路基板上设计出可以容置导电组件的区域，如此可以让导电组件直接设在电路基板，而无需额外的模块。
本发明的上述具有连接接口的电子装置的制造方法可以选择性地还包括一以下步骤：于该导电组件的该栓状体与该金属层及/或该第一线路层之间，设置一接着层。此外，亦可选择性地还包括一以下步骤：于该半导体芯片与该电路基板的该第一表面之间，设置一黏着膜，该黏着膜亦可用于固着两相邻半导体芯片。另外，亦可选择性地还包括一以下步骤：于该第一线路层及/或第二线路层表面，形成一绝缘层，其中，该绝缘层形成有复数接触窗，以暴露该些电性连接垫、该些金属接触垫、或该些终端垫。于一较佳具体实施例中，该绝缘层的形成步骤是于设置该半导体芯片2之前执行，但此步骤的执行顺序不限于此，可以依需求而调整。
本发明又提供了一种供导电组件嵌设的电路基板及其制造方法，其中电路基板上利用两次开孔技术设制出可以供导电组件嵌置的空间，因此使用此电路基板的电子装置无需额外组装端子模块，故可简化相关组装流程。
为此，本发明的另一态样提供一种供导电组件嵌设的电路基板，包括：一第一表面；一第二表面，相对于该第一表面；一第一线路层，设于该第一表面，其中，该第一线路层具有复数个电性连接垫；以及一第二线路层，设于该第二表面，其中，该第二线路层具有复数个金属接触垫及终端垫，该终端垫设有一开口，该开口延伸至该第一线路层且内壁表面设置一金属层，该金属层连接该第一线路层及该终端垫且设有一开孔，该开孔是供该导电组件嵌设于其中。
本发明的再另一态样提供一种供导电组件嵌设的电路基板的制造方法，包括以下步骤：提供一电路基板，该电路基板具有一第一表面及一相对的第二表面，该第一表面设有一第一线路层，该第二表面设有一第二线路层，该第一线路层具有复数个电性连接垫，该第二线路层具有复数个金属接触垫及终端垫；于该电路基板的该些终端垫分别开设一开口，其中，该开口延伸至该第一线路层；于该开口内电镀一金属；以及于该金属上开设一开孔，以形成一金属层覆盖该开口的内壁表面，其中，该开孔是供该导电组件嵌设于其中。
上述的连接接口可适用各种规格，例如：外围组件互连(peripheralcomponent interconnection bus，PCI)总线、工业标准体系结构(industrystandard architecture，ISA)总线或通用串行总线(Universal Serial Bus，以下简称USB)或其等效接口，较佳可为USB3.0。
由上述可知，本发明在电路基板上设计出可供导电组件置放的空间，且导电组件可以固定于该空间中，而无需额外组装端子模块，简化相关组装流程。
以下由特定的具体实施例说明本发明的实施方式，熟习此技艺的人士可由本说明书所揭示的内容轻易地了解本发明的其他优点与功效。本发明亦可由其他不同的具体实施例加以施行或应用，本说明书中的各项细节亦可基于不同观点与应用，在不悖离本发明的精神下进行各种修饰与变更。
本发明的实施例中该些附图均为简化的示意图。惟该些图标仅显示与本发明有关的组件，其所显示的组件非为实际实施时的态样，其实际实施时的组件数目、形状等比例为一选择性的设计，且其组件布局型态可能更复杂。
实施例一
首先，参考图1A至图1D，是本发明制造供导电组件嵌设的电路基板的流程示意图。
如图1A所示，提供一电路基板1。该电路基板1具有一第一表面10a及一相对的第二表面10b，该第一表面10a设有一第一线路层11，该第二表面10b设有一第二线路层12，该第一线路层11具有复数个电性连接垫13，该第二线路层12具有复数个金属接触垫14及终端垫16。此电路基板1的形成方式没有特别限定，本领域通常知识者可以利用通常知识制得，举例而言利用双面铜箔基板经由微影蚀刻工艺图案化铜箔形成第一线路层11与第二线路层12。
接着，如图1B所示，于该电路基板1的该些终端垫16分别开设一开口160，其中，该开口160延伸至该第一线路层11，而越过该第一线路层11表面。该开口160的开设方是没有特别限定，例如以激光穿孔的方式制成。
再者，如图1C所示，于该开口160内电镀一金属160’，其中，可以使用阻层保护其他部份，而使用无电电镀或有电电镀形成金属160’。
如图1D所示，在于该金属160’开设一开孔162，以形成一金属层161覆盖该开口160的内壁表面，其中，该开孔162是供一导电组件嵌设于其中。该开孔162的形成同样可以使用阻层保护其他部份，而通过蚀刻形成该开孔162，或者使用激光穿孔的方式形成。
据此，本发明的供导电组件嵌设的电路基板，包括：一第一表面10a；一第二表面10b，相对于该第一表面10a；一第一线路层11，设于该第一表面10a，其中，该第一线路层11具有复数个电性连接垫13；以及一第二线路层12，设于该第二表面10b，其中，该第二线路层12具有复数个金属接触垫14及终端垫16，该终端垫16设有一开口160，该开口160延伸至该第一线路层11且内壁表面设置一金属层161，该金属层161连接该第一线路层11及该终端垫16且设有一开孔162，该开孔162是供该导电组件嵌设于其中。
实施例二
首先，参考图1D至图1I，是本发明制造具有连接接口的电子装置的流程示意图。
如图1D所示，提供一电路基板1，该电路基板1具有一第一表面10a及一相对的第二表面10b，该第一表面10a设有一第一线路层11，该第二表面10b设有一第二线路层12，该第一线路层11具有复数个电性连接垫13，该第二线路层12具有复数个金属接触垫14及终端垫16，其中，该些终端垫16分别设有一开口160，该开口160延伸至该第一线路层11且设置一金属层161于该开口160内，该金属层161连接该第一线路层11及该终端垫16且形成有一开孔162于该金属层161中。
接着，如图1E所示，于该半导体芯片2与该电路基板1的该第一表面10a之间，设置一黏着膜32，而将一半导体芯片2设置于该电路基板1的该第一表面10a上，其中，该半导体芯片2具有复数个电极垫23。再者，如图1F所示，利用打线技术，通过电线33使该些电极垫23分别电性连接至该第一电路层11的该些电性连接垫13。然后，如图1G所示，利用封胶技术，使用封胶材料35如环氧树脂等，保护该些半导体芯片2。
接着，如图1H以及图1I所示，经由导电组件支架5携带具有一栓状体46的导电组件4，该导电组件支架5会引导该导电组件4的栓状体46对准并嵌入该电路基板1的该开孔162，其中，该导电组件支架5可以一次携带复数个导电组件4，因此可以一次将数个导电组件设置于该电路基板1的该开孔162内。由此可知，导电组件4与开孔162之间的关系，如同栓与栓孔之间的关系。
据此，本发明的具有连接接口的电子装置，包括：一电路基板1，具有一第一表面10a及一相对的第二表面10b，该第一表面10a设有一第一线路层11，该第二表面10b设有一第二线路层12，该第一线路层11具有复数个电性连接垫13，该第二线路层12具有复数个金属接触垫14及复数个终端垫16，其中，该些终端垫16分别设有一开口160，该开口160延伸至该第一线路层11且设置一金属层161于该开口160内，该金属层161形成有一开孔162且连接该第一线路层11与该终端垫16；一半导体芯片2，设置于该第一表面10a上且具有复数个电极垫23，其中，该半导体芯片2的该些电极垫23分别电性连接至该第一电路层11的该些电性连接垫13；一导电组件4，具有一栓状体46，该栓状体46是嵌入该开孔162；以及一黏着膜32，设置于该半导体芯片2与该电路基板1的该第一表面10a之间。
实施例三至七
参考图2至图6，其分别是实施例三至实施例七的具有连接接口的电子装置的结构示意图。
如图2所示，实施例三具有连接接口的电子装置的结构大致上同实施例二所述，不同点在于该电路基板1的该开孔162设置该导电组件4前，先于该导电组件4的栓状体46底部涂布一接着层64，而后才将该导电组件4的栓状体46对准并嵌入该电路基板1的该开孔162。除此之外，该电路基板1的该开孔162未延伸至该第一电路层11，亦即该开孔162没有显露该第一电路层11。因此，相较于实施例二的具有连接接口的电子装置，实施例三的具有连接接口的电子装置更包含一接着层64，设置于该导电组件4的该栓状体46与该金属层161之间。
如图3所示，实施例四具有连接接口的电子装置的结构大致上同实施例三所述，不同点在于该电路基板1的该开孔162延伸至该第一电路层11，亦即该开孔162有显露该第一电路层11，因此接着层64设置于该导电组件4的该栓状体46与该第一线路层11之间。此外，半导体芯片2设置于该第一线路层11表面而非电路基板1尚未设置线路的空白区域。
如图4所示，实施例五具有连接接口的电子装置的结构大致上同实施例二所述，不同点在于该电路基板1的该开孔162延伸至该第一电路层11，亦即该开孔162有显露该第一电路层11，因此接着层64设置于该导电组件4的该栓状体46与该第一线路层11之间。此外，该导电组件4具有一弧状弹性结构41，以吸收压力。
如图5所示，实施例五具有连接接口的电子装置的结构大致上同实施例四所述，不同点在于接着层64设置于该导电组件4的该栓状体46与该第一线路层11以及该金属层161之间。此外，该导电组件4具有一折形弹性结构41，以吸收压力。
如图6所示，实施例七具有连接接口的电子装置的结构大致上同实施例三所述，不同点在于设置该半导体芯片2之前，先于该电路基板1的该第一表面10a与该第二表面10b上，形成一绝缘层17，覆盖该第一线路层11以及该第二线路层12，且将该绝缘层17图案化形成复数接触窗171，以暴露该些电性连接垫13、该些金属接触垫14与该些终端垫16。
上述实施例仅为了方便说明而举例而已，本发明所主张的权利范围自应以申请的权利要求范围所述为准，而非仅限于上述实施例。

Claims (15)

1.一种具有连接接口的电子装置，包括：
一电路基板，具有一第一表面及一相对的第二表面，该第一表面设有一第一线路层，该第二表面设有一第二线路层，该第一线路层具有复数个电性连接垫，该第二线路层具有复数个金属接触垫及复数个终端垫，其中，该些终端垫分别设有一开口，该开口延伸至该第一线路层且设置一金属层于该开口内，该金属层形成有一开孔且连接该第一线路层与该终端垫；
一半导体芯片，设置于该第一表面上且具有复数个电极垫，其中，该半导体芯片的该些电极垫分别电性连接至该第一电路层的该些电性连接垫；以及
一导电组件，具有一栓状体，该栓状体是嵌入该开孔。
2.如权利要求1所述具有连接接口的电子装置，其中，包括一接着层，设置于该导电组件的该栓状体与该金属层及/或该第一线路层之间。
3.如权利要求2所述具有连接接口的电子装置，其中，包括一黏着膜，设置于该半导体芯片与该电路基板的该第一表面之间。
4.如权利要求3所述具有连接接口的电子装置，其中，该导电组件具有一弹性结构。
5.如权利要求1至4中任一项所述具有连接接口的电子装置，其中，该开孔是贯穿该金属层。
6.如权利要求1至4中任一项所述具有连接接口的电子装置，其中，包括一绝缘层，位于该第一线路层及/或第二线路层表面，其中，该绝缘层形成有复数接触窗，以暴露该些电性连接垫、该些金属接触垫、或该些终端垫。
7.一种具有连接接口的电子装置的制造方法，包括以下步骤：
提供一电路基板，该电路基板具有一第一表面及一相对的第二表面，该第一表面设有一第一线路层，该第二表面设有一第二线路层，该第一线路层具有复数个电性连接垫，该第二线路层具有复数个金属接触垫及终端垫，其中，该些终端垫分别设有一开口，该开口延伸至该第一线路层且设置一金属层于该开口内，该金属层连接该第一线路层及该终端垫且形成有一开孔于该金属层中；
于该电路基板的该第一表面上设置一半导体芯片，该半导体芯片具有复数个电极垫，其中，该半导体芯片的该些电极垫系分别电性连接至该第一电路层的该些电性连接垫；以及
于该电路基板的该开孔内设置一导电组件，其中，该导电组件具有一栓状体，该栓状体是嵌入该开孔。
8.如权利要求7所述具有连接接口的电子装置的制造方法，其中，该电路基板的该开口、该开孔与该金属层是由一包含以下步骤的方法所形成：
于该电路基板的该些终端垫分别开设一开口，其中，该开口延伸至该第一线路层；
于该开口内电镀一金属；以及
于该金属开设一开孔，以形成一金属层覆盖该开口内的侧壁表面。
9.如权利要求8所述具有连接接口的电子装置的制造方法，其中，包括一以下步骤：于该导电组件的该栓状体与该金属层及/或该第一线路层之间，设置一接着层。
10.如权利要求9所述具有连接接口的电子装置的制造方法，其中，包括一以下步骤：于该半导体芯片与该电路基板的该第一表面之间，设置一黏着膜。
11.如权利要求10所述具有连接接口的电子装置的制造方法，其中，该导电组件具有一弹性结构。
12.如权利要求7至11中任一项所述具有连接接口的电子装置的制造方法，其中，该开孔是贯穿该金属层。
13.如权利要求7至11中任一项所述具有连接接口的电子装置的制造方法，包括一以下步骤：于该第一线路层及/或第二线路层表面，形成一绝缘层，其中，该绝缘层形成有复数接触窗，以暴露该些电性连接垫、该些金属接触垫、或该些终端垫。
14.一种供导电组件嵌设的电路基板，包括：
一第一表面；
一第二表面，相对于该第一表面；
一第一线路层，设于该第一表面，其中，该第一线路层具有复数个电性连接垫；以及
一第二线路层，设于该第二表面，其中，该第二线路层具有复数个金属接触垫及终端垫，该终端垫设有一开口，该开口延伸至该第一线路层且内壁表面设置一金属层，该金属层连接该第一线路层及该终端垫且设有一开孔，该开孔系供该导电组件嵌设于其中。
15.一种供导电组件嵌设的电路基板的制造方法，包括以下步骤：
提供一电路基板，该电路基板具有一第一表面及一相对的第二表面，该第一表面设有一第一线路层，该第二表面设有一第二线路层，该第一线路层具有复数个电性连接垫，该第二线路层具有复数个金属接触垫及终端垫；
于该电路基板的该些终端垫分别开设一开口，其中，该开口延伸至该第一线路层；
于该开口内电镀一金属；以及
于该金属开设一开孔，以形成一金属层覆盖该开口的内壁表面，其中，该开孔供该导电组件嵌设于其中。
CN2012104057476A 2011-11-16 2012-10-23 具有连接接口的电子装置、其电路基板以及其制造方法 Pending CN103117262A (zh)

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