TWI351096B - Molding methods to manufacture single-chip chip-on-board usb device - Google Patents

Molding methods to manufacture single-chip chip-on-board usb device

Info

Publication number
TWI351096B
TWI351096B TW096147220A TW96147220A TWI351096B TW I351096 B TWI351096 B TW I351096B TW 096147220 A TW096147220 A TW 096147220A TW 96147220 A TW96147220 A TW 96147220A TW I351096 B TWI351096 B TW I351096B
Authority
TW
Taiwan
Prior art keywords
chip
usb device
molding methods
manufacture single
board usb
Prior art date
Application number
TW096147220A
Other languages
Chinese (zh)
Other versions
TW200926394A (en
Inventor
S Hiew Siew
Ni Jim
C Lee Charles
Yu I-Kang
Ming Shiang Shen
Original Assignee
Imicro Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/773,830 external-priority patent/US7872871B2/en
Application filed by Imicro Technology Ltd filed Critical Imicro Technology Ltd
Publication of TW200926394A publication Critical patent/TW200926394A/en
Application granted granted Critical
Publication of TWI351096B publication Critical patent/TWI351096B/en

Links

TW096147220A 2007-07-05 2007-12-11 Molding methods to manufacture single-chip chip-on-board usb device TWI351096B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/773,830 US7872871B2 (en) 2000-01-06 2007-07-05 Molding methods to manufacture single-chip chip-on-board USB device

Publications (2)

Publication Number Publication Date
TW200926394A TW200926394A (en) 2009-06-16
TWI351096B true TWI351096B (en) 2011-10-21

Family

ID=44786167

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096147220A TWI351096B (en) 2007-07-05 2007-12-11 Molding methods to manufacture single-chip chip-on-board usb device

Country Status (1)

Country Link
TW (1) TWI351096B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449271B (en) * 2011-11-16 2014-08-11 Dawning Leading Technology Inc Electrical device with connection interface, circuit board thereof, and method for manufacturing the same
TWI651897B (en) * 2016-03-22 2019-02-21 東芝記憶體股份有限公司 USB device and method of manufacturing same

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012163100A1 (en) * 2011-05-30 2012-12-06 深圳市江波龙电子有限公司 Semiconductor chip and storage device
TWI466137B (en) * 2011-07-22 2014-12-21 Taiwan Busway Co Ltd Power transmission bus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI449271B (en) * 2011-11-16 2014-08-11 Dawning Leading Technology Inc Electrical device with connection interface, circuit board thereof, and method for manufacturing the same
TWI651897B (en) * 2016-03-22 2019-02-21 東芝記憶體股份有限公司 USB device and method of manufacturing same

Also Published As

Publication number Publication date
TW200926394A (en) 2009-06-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees