TWI351096B - Molding methods to manufacture single-chip chip-on-board usb device - Google Patents
Molding methods to manufacture single-chip chip-on-board usb deviceInfo
- Publication number
- TWI351096B TWI351096B TW096147220A TW96147220A TWI351096B TW I351096 B TWI351096 B TW I351096B TW 096147220 A TW096147220 A TW 096147220A TW 96147220 A TW96147220 A TW 96147220A TW I351096 B TWI351096 B TW I351096B
- Authority
- TW
- Taiwan
- Prior art keywords
- chip
- usb device
- molding methods
- manufacture single
- board usb
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/773,830 US7872871B2 (en) | 2000-01-06 | 2007-07-05 | Molding methods to manufacture single-chip chip-on-board USB device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200926394A TW200926394A (en) | 2009-06-16 |
TWI351096B true TWI351096B (en) | 2011-10-21 |
Family
ID=44786167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096147220A TWI351096B (en) | 2007-07-05 | 2007-12-11 | Molding methods to manufacture single-chip chip-on-board usb device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI351096B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI449271B (en) * | 2011-11-16 | 2014-08-11 | Dawning Leading Technology Inc | Electrical device with connection interface, circuit board thereof, and method for manufacturing the same |
TWI651897B (en) * | 2016-03-22 | 2019-02-21 | 東芝記憶體股份有限公司 | USB device and method of manufacturing same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012163100A1 (en) * | 2011-05-30 | 2012-12-06 | 深圳市江波龙电子有限公司 | Semiconductor chip and storage device |
TWI466137B (en) * | 2011-07-22 | 2014-12-21 | Taiwan Busway Co Ltd | Power transmission bus |
-
2007
- 2007-12-11 TW TW096147220A patent/TWI351096B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI449271B (en) * | 2011-11-16 | 2014-08-11 | Dawning Leading Technology Inc | Electrical device with connection interface, circuit board thereof, and method for manufacturing the same |
TWI651897B (en) * | 2016-03-22 | 2019-02-21 | 東芝記憶體股份有限公司 | USB device and method of manufacturing same |
Also Published As
Publication number | Publication date |
---|---|
TW200926394A (en) | 2009-06-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1256622A1 (en) | Antibodies to il-6 and use thereof | |
PL2130108T3 (en) | Connection to a usb device | |
IL232276A0 (en) | Antibodies to il-6 and their uses | |
PT3660073T (en) | Low-burst polymers and methods to produce polymers | |
GB201002860D0 (en) | Improvements to responsive units | |
EP2358731A4 (en) | Methods related to modified glycans | |
EP2261483A4 (en) | Supercharging device | |
HK1217711A1 (en) | Antibodies specific to cadherin-17 -17 | |
EP2125890A4 (en) | Antibodies to phosphorylated-irak4 | |
EP2212431A4 (en) | Antibodies to irem-1 | |
EP2167949A4 (en) | Cross-reference to related applications | |
TWI351096B (en) | Molding methods to manufacture single-chip chip-on-board usb device | |
HK1119894A1 (en) | Complex usb device applicable to tv set | |
EP2126817A4 (en) | Using scenario-related metadata to direct advertising | |
GB201006786D0 (en) | Improvements in relation to air bricks | |
GB201013836D0 (en) | Improvements relating to gutters | |
GB0806706D0 (en) | Improvememts relating to opening devices | |
GB0801891D0 (en) | Brekkie to go range | |
GB201019103D0 (en) | Improvements in or relating to moulding | |
GB0817760D0 (en) | Improvements to fasteners | |
AU4626P (en) | Bobz White Loropetalum chinense | |
GB0814100D0 (en) | 1 to 1 | |
GB0901240D0 (en) | Stairway to heaven | |
GB0906633D0 (en) | Improvements in or relating to injection moulding | |
GB0906761D0 (en) | Improvements in or relating to injection moulding |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |