CN103098565B - 元器件内置基板 - Google Patents

元器件内置基板 Download PDF

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Publication number
CN103098565B
CN103098565B CN201080069036.5A CN201080069036A CN103098565B CN 103098565 B CN103098565 B CN 103098565B CN 201080069036 A CN201080069036 A CN 201080069036A CN 103098565 B CN103098565 B CN 103098565B
Authority
CN
China
Prior art keywords
components
welding disk
parts
substrate
conductive welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080069036.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN103098565A (zh
Inventor
户田光昭
清水良
清水良一
长谷川琢哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meiko Electronics Co Ltd
Original Assignee
Meiko Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiko Electronics Co Ltd filed Critical Meiko Electronics Co Ltd
Publication of CN103098565A publication Critical patent/CN103098565A/zh
Application granted granted Critical
Publication of CN103098565B publication Critical patent/CN103098565B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
CN201080069036.5A 2010-09-10 2010-09-10 元器件内置基板 Expired - Fee Related CN103098565B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/065626 WO2012032654A1 (ja) 2010-09-10 2010-09-10 部品内蔵基板

Publications (2)

Publication Number Publication Date
CN103098565A CN103098565A (zh) 2013-05-08
CN103098565B true CN103098565B (zh) 2016-08-03

Family

ID=45810274

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080069036.5A Expired - Fee Related CN103098565B (zh) 2010-09-10 2010-09-10 元器件内置基板

Country Status (5)

Country Link
JP (1) JP5659234B2 (ko)
KR (1) KR101713640B1 (ko)
CN (1) CN103098565B (ko)
TW (1) TWI539870B (ko)
WO (1) WO2012032654A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6073339B2 (ja) * 2012-09-11 2017-02-01 株式会社メイコー 部品内蔵基板の製造方法及びこれを用いた部品内蔵基板
EP2897447A4 (en) * 2012-09-11 2016-05-25 Meiko Electronics Co Ltd METHOD FOR PRODUCING A SUBSTRATE WITH AN EMBEDDED COMPONENT AND SUBSTRATE PRODUCED IN THIS METHOD WITH AN EMBEDDED COMPONENT
KR102281458B1 (ko) * 2014-06-23 2021-07-27 삼성전기주식회사 소자 내장형 인쇄회로기판, 반도체 패키지 및 그 제조방법
US20220312591A1 (en) * 2021-03-26 2022-09-29 Juniper Networks, Inc. Substrate with conductive pads and conductive layers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2324753A (en) * 1997-05-02 1998-11-04 Nec Corp Manufacturing printed circuit and printed wiring boards
CN1867224A (zh) * 2005-05-20 2006-11-22 松下电器产业株式会社 部件内置基板和部件内置基板的制造方法
CN101690434A (zh) * 2007-06-26 2010-03-31 株式会社村田制作所 元器件内置基板的制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4034073B2 (ja) * 2001-05-11 2008-01-16 株式会社ルネサステクノロジ 半導体装置の製造方法
JP4874305B2 (ja) * 2008-07-22 2012-02-15 株式会社メイコー 電気・電子部品内蔵回路基板とその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2324753A (en) * 1997-05-02 1998-11-04 Nec Corp Manufacturing printed circuit and printed wiring boards
CN1867224A (zh) * 2005-05-20 2006-11-22 松下电器产业株式会社 部件内置基板和部件内置基板的制造方法
CN101690434A (zh) * 2007-06-26 2010-03-31 株式会社村田制作所 元器件内置基板的制造方法

Also Published As

Publication number Publication date
JP5659234B2 (ja) 2015-01-28
WO2012032654A1 (ja) 2012-03-15
KR20140006771A (ko) 2014-01-16
CN103098565A (zh) 2013-05-08
KR101713640B1 (ko) 2017-03-08
TWI539870B (zh) 2016-06-21
TW201216793A (en) 2012-04-16
JPWO2012032654A1 (ja) 2013-12-12

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160803

Termination date: 20170910