TWI539870B - Built-in components of the substrate - Google Patents

Built-in components of the substrate Download PDF

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Publication number
TWI539870B
TWI539870B TW100129324A TW100129324A TWI539870B TW I539870 B TWI539870 B TW I539870B TW 100129324 A TW100129324 A TW 100129324A TW 100129324 A TW100129324 A TW 100129324A TW I539870 B TWI539870 B TW I539870B
Authority
TW
Taiwan
Prior art keywords
substrate
spacer
conductive
component
built
Prior art date
Application number
TW100129324A
Other languages
English (en)
Chinese (zh)
Other versions
TW201216793A (en
Inventor
Mitsuaki Toda
Ryoichi Shimizu
Takuya Hasegawa
Original Assignee
Meiko Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiko Electronics Co Ltd filed Critical Meiko Electronics Co Ltd
Publication of TW201216793A publication Critical patent/TW201216793A/zh
Application granted granted Critical
Publication of TWI539870B publication Critical patent/TWI539870B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
TW100129324A 2010-09-10 2011-08-17 Built-in components of the substrate TWI539870B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/065626 WO2012032654A1 (ja) 2010-09-10 2010-09-10 部品内蔵基板

Publications (2)

Publication Number Publication Date
TW201216793A TW201216793A (en) 2012-04-16
TWI539870B true TWI539870B (zh) 2016-06-21

Family

ID=45810274

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100129324A TWI539870B (zh) 2010-09-10 2011-08-17 Built-in components of the substrate

Country Status (5)

Country Link
JP (1) JP5659234B2 (ko)
KR (1) KR101713640B1 (ko)
CN (1) CN103098565B (ko)
TW (1) TWI539870B (ko)
WO (1) WO2012032654A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9596765B2 (en) 2012-09-11 2017-03-14 Meiko Electronics Co., Ltd. Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the method
US9355990B2 (en) 2012-09-11 2016-05-31 Meiko Electronics Co., Ltd. Manufacturing method of device embedded substrate and device embedded substrate manufactured by this method
KR102281458B1 (ko) * 2014-06-23 2021-07-27 삼성전기주식회사 소자 내장형 인쇄회로기판, 반도체 패키지 및 그 제조방법
US20220312591A1 (en) * 2021-03-26 2022-09-29 Juniper Networks, Inc. Substrate with conductive pads and conductive layers

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3173423B2 (ja) * 1997-05-02 2001-06-04 日本電気株式会社 プリント配線板
JP4034073B2 (ja) * 2001-05-11 2008-01-16 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2006324567A (ja) * 2005-05-20 2006-11-30 Matsushita Electric Ind Co Ltd 部品内蔵基板とその製造方法
WO2009001621A1 (ja) * 2007-06-26 2008-12-31 Murata Manufacturing Co., Ltd. 部品内蔵基板の製造方法
JP4874305B2 (ja) 2008-07-22 2012-02-15 株式会社メイコー 電気・電子部品内蔵回路基板とその製造方法

Also Published As

Publication number Publication date
JPWO2012032654A1 (ja) 2013-12-12
CN103098565A (zh) 2013-05-08
JP5659234B2 (ja) 2015-01-28
KR20140006771A (ko) 2014-01-16
CN103098565B (zh) 2016-08-03
TW201216793A (en) 2012-04-16
KR101713640B1 (ko) 2017-03-08
WO2012032654A1 (ja) 2012-03-15

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MM4A Annulment or lapse of patent due to non-payment of fees