CN103081088B - 静电夹盘和使用静电夹盘的方法 - Google Patents

静电夹盘和使用静电夹盘的方法 Download PDF

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Publication number
CN103081088B
CN103081088B CN201180042581.XA CN201180042581A CN103081088B CN 103081088 B CN103081088 B CN 103081088B CN 201180042581 A CN201180042581 A CN 201180042581A CN 103081088 B CN103081088 B CN 103081088B
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China
Prior art keywords
control plate
substrate
electrode
thermal control
disk
Prior art date
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CN201180042581.XA
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English (en)
Chinese (zh)
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CN103081088A (zh
Inventor
尚布休·N·罗伊
马丁·李·莱克
基思·A·米勒
维贾伊·D·帕克赫
史蒂芬·V·桑索尼
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN103081088A publication Critical patent/CN103081088A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
CN201180042581.XA 2010-08-06 2011-08-04 静电夹盘和使用静电夹盘的方法 Active CN103081088B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US37145510P 2010-08-06 2010-08-06
US61/371,455 2010-08-06
US13/198,204 US8559159B2 (en) 2010-08-06 2011-08-04 Electrostatic chuck and methods of use thereof
US13/198,204 2011-08-04
PCT/US2011/046611 WO2012019017A2 (en) 2010-08-06 2011-08-04 Electrostatic chuck and methods of use thereof

Publications (2)

Publication Number Publication Date
CN103081088A CN103081088A (zh) 2013-05-01
CN103081088B true CN103081088B (zh) 2016-04-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180042581.XA Active CN103081088B (zh) 2010-08-06 2011-08-04 静电夹盘和使用静电夹盘的方法

Country Status (5)

Country Link
US (1) US8559159B2 (enExample)
JP (1) JP6195519B2 (enExample)
KR (1) KR101892911B1 (enExample)
CN (1) CN103081088B (enExample)
WO (1) WO2012019017A2 (enExample)

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Also Published As

Publication number Publication date
WO2012019017A3 (en) 2012-05-31
US8559159B2 (en) 2013-10-15
JP6195519B2 (ja) 2017-09-13
WO2012019017A2 (en) 2012-02-09
JP2013535842A (ja) 2013-09-12
KR101892911B1 (ko) 2018-08-29
US20120033340A1 (en) 2012-02-09
KR20140004062A (ko) 2014-01-10
CN103081088A (zh) 2013-05-01

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