KR101892911B1 - 정전 척 및 정전 척의 사용 방법들 - Google Patents

정전 척 및 정전 척의 사용 방법들 Download PDF

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Publication number
KR101892911B1
KR101892911B1 KR1020137005720A KR20137005720A KR101892911B1 KR 101892911 B1 KR101892911 B1 KR 101892911B1 KR 1020137005720 A KR1020137005720 A KR 1020137005720A KR 20137005720 A KR20137005720 A KR 20137005720A KR 101892911 B1 KR101892911 B1 KR 101892911B1
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disk
substrate
control plate
thermal control
disc
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Korean (ko)
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KR20140004062A (ko
Inventor
삼브후 엔. 로이
마틴 이 라이커
케이스 에이. 밀러
비제이 디. 파르케
스티븐 브이. 산소니
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
KR1020137005720A 2010-08-06 2011-08-04 정전 척 및 정전 척의 사용 방법들 Active KR101892911B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US37145510P 2010-08-06 2010-08-06
US61/371,455 2010-08-06
PCT/US2011/046611 WO2012019017A2 (en) 2010-08-06 2011-08-04 Electrostatic chuck and methods of use thereof
US13/198,204 2011-08-04
US13/198,204 US8559159B2 (en) 2010-08-06 2011-08-04 Electrostatic chuck and methods of use thereof

Publications (2)

Publication Number Publication Date
KR20140004062A KR20140004062A (ko) 2014-01-10
KR101892911B1 true KR101892911B1 (ko) 2018-08-29

Family

ID=45556003

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137005720A Active KR101892911B1 (ko) 2010-08-06 2011-08-04 정전 척 및 정전 척의 사용 방법들

Country Status (5)

Country Link
US (1) US8559159B2 (enExample)
JP (1) JP6195519B2 (enExample)
KR (1) KR101892911B1 (enExample)
CN (1) CN103081088B (enExample)
WO (1) WO2012019017A2 (enExample)

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KR20180110213A (ko) 2013-08-06 2018-10-08 어플라이드 머티어리얼스, 인코포레이티드 국부적으로 가열되는 다-구역 기판 지지부
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Also Published As

Publication number Publication date
WO2012019017A2 (en) 2012-02-09
JP6195519B2 (ja) 2017-09-13
US20120033340A1 (en) 2012-02-09
KR20140004062A (ko) 2014-01-10
CN103081088A (zh) 2013-05-01
WO2012019017A3 (en) 2012-05-31
CN103081088B (zh) 2016-04-06
JP2013535842A (ja) 2013-09-12
US8559159B2 (en) 2013-10-15

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