CN103077958A - 带空气间隙结构的半导体功率器件及其制造方法 - Google Patents
带空气间隙结构的半导体功率器件及其制造方法 Download PDFInfo
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104713930A (zh) * | 2015-03-17 | 2015-06-17 | 东北师范大学 | 一种基于场效应气体传感器的鉴定气体种类的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1947261A (zh) * | 2004-03-31 | 2007-04-11 | 皇家飞利浦电子股份有限公司 | 沟槽半导体器件及其制造方法 |
US20080038880A1 (en) * | 2006-08-08 | 2008-02-14 | Sanyo Electric Co., Ltd. | Method of manufacturing a semiconductor device |
CN102122631A (zh) * | 2010-01-08 | 2011-07-13 | 上海华虹Nec电子有限公司 | 获得空气间隙沟槽的方法 |
US20110169081A1 (en) * | 2010-01-08 | 2011-07-14 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing the same |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1947261A (zh) * | 2004-03-31 | 2007-04-11 | 皇家飞利浦电子股份有限公司 | 沟槽半导体器件及其制造方法 |
US20080038880A1 (en) * | 2006-08-08 | 2008-02-14 | Sanyo Electric Co., Ltd. | Method of manufacturing a semiconductor device |
CN102122631A (zh) * | 2010-01-08 | 2011-07-13 | 上海华虹Nec电子有限公司 | 获得空气间隙沟槽的方法 |
US20110169081A1 (en) * | 2010-01-08 | 2011-07-14 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing the same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104713930A (zh) * | 2015-03-17 | 2015-06-17 | 东北师范大学 | 一种基于场效应气体传感器的鉴定气体种类的方法 |
CN104713930B (zh) * | 2015-03-17 | 2017-07-21 | 东北师范大学 | 一种基于场效应气体传感器的鉴定气体种类的方法 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140109 |
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