CN103026469B - 层合膜及使用其的半导体制造用膜 - Google Patents

层合膜及使用其的半导体制造用膜 Download PDF

Info

Publication number
CN103026469B
CN103026469B CN201180036822.XA CN201180036822A CN103026469B CN 103026469 B CN103026469 B CN 103026469B CN 201180036822 A CN201180036822 A CN 201180036822A CN 103026469 B CN103026469 B CN 103026469B
Authority
CN
China
Prior art keywords
film
layer
outermost layer
carboxylic acid
semiconductor manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180036822.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN103026469A (zh
Inventor
青山正贵
森本厚司
一关主税
广中芳孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Mitsui Polychemicals Co Ltd
Original Assignee
Du Pont Mitsui Polychemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont Mitsui Polychemicals Co Ltd filed Critical Du Pont Mitsui Polychemicals Co Ltd
Publication of CN103026469A publication Critical patent/CN103026469A/zh
Application granted granted Critical
Publication of CN103026469B publication Critical patent/CN103026469B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24967—Absolute thicknesses specified
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]
    • Y10T428/31797—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31913—Monoolefin polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31928—Ester, halide or nitrile of addition polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
CN201180036822.XA 2010-07-28 2011-07-28 层合膜及使用其的半导体制造用膜 Active CN103026469B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010-169787 2010-07-28
JP2010169787 2010-07-28
JP2011098199 2011-04-26
JP2011-098199 2011-04-26
PCT/JP2011/004287 WO2012014487A1 (ja) 2010-07-28 2011-07-28 積層フィルム及びそれを用いた半導体製造用フィルム

Publications (2)

Publication Number Publication Date
CN103026469A CN103026469A (zh) 2013-04-03
CN103026469B true CN103026469B (zh) 2016-06-15

Family

ID=45529714

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180036822.XA Active CN103026469B (zh) 2010-07-28 2011-07-28 层合膜及使用其的半导体制造用膜

Country Status (7)

Country Link
US (1) US20130130001A1 (enrdf_load_stackoverflow)
EP (1) EP2600391A1 (enrdf_load_stackoverflow)
JP (2) JP5087717B2 (enrdf_load_stackoverflow)
KR (1) KR101845857B1 (enrdf_load_stackoverflow)
CN (1) CN103026469B (enrdf_load_stackoverflow)
TW (1) TWI498215B (enrdf_load_stackoverflow)
WO (1) WO2012014487A1 (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5993255B2 (ja) * 2012-09-11 2016-09-14 三菱樹脂株式会社 アクリル系樹脂フィルム及びダイシング用粘着シート
JP5480415B1 (ja) * 2012-10-11 2014-04-23 古河電気工業株式会社 半導体ウェハ加工用粘着テープ
CN105765699A (zh) * 2013-11-22 2016-07-13 琳得科株式会社 切割片用基材膜及基材膜的制造方法
US20160297179A1 (en) * 2013-11-22 2016-10-13 Lintec Corporation Base film for dicing sheet, dicing sheet comprising base film, and method of manufacturing base film
CN106604816B (zh) * 2014-08-15 2020-07-24 电化株式会社 覆盖膜及使用其的电子部件包装体
CN107004587A (zh) * 2014-11-19 2017-08-01 住友电木株式会社 切割膜
JP2017108090A (ja) * 2015-12-08 2017-06-15 リンテック株式会社 ダイシングシートおよびダイシングシートの製造方法
CN110023438B (zh) * 2016-11-25 2022-01-25 三井化学东赛璐株式会社 粘着性层叠膜及电子装置的制造方法
WO2018123804A1 (ja) * 2016-12-27 2018-07-05 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材およびダイシングフィルム
AR117529A1 (es) * 2019-01-18 2021-08-11 Dow Mitsui Polychemicals Co Ltd Laminado para recipiente de papel y recipiente de papel
CN113453900B (zh) * 2019-03-26 2023-06-09 三井—陶氏聚合化学株式会社 层叠体、包装体、挠性容器内袋及挠性容器
JP7562278B2 (ja) * 2020-03-24 2024-10-07 リンテック株式会社 ワーク加工用シート

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1580168A (zh) * 2003-08-08 2005-02-16 日东电工株式会社 再剥离型粘合片材
CN101136329A (zh) * 2006-08-29 2008-03-05 日东电工株式会社 半导体晶圆背面加工方法,衬底背面加工方法,和辐射固化型压敏粘着片

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995019392A1 (en) * 1994-01-12 1995-07-20 E.I. Du Pont De Nemours And Company Sealing composite for gage and drain holes
JP4780828B2 (ja) * 2000-11-22 2011-09-28 三井化学株式会社 ウエハ加工用粘着テープ及びその製造方法並びに使用方法
JP4726405B2 (ja) * 2002-07-26 2011-07-20 日東電工株式会社 加工用粘着シートとその製造方法
KR101016081B1 (ko) * 2002-07-26 2011-02-17 닛토덴코 가부시키가이샤 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법
JP4351487B2 (ja) 2003-07-14 2009-10-28 ロンシール工業株式会社 ウエハバックグラインド用粘着テープ
JP5030461B2 (ja) * 2006-04-03 2012-09-19 グンゼ株式会社 半導体ウェハの裏面研削に用いる表面保護テープ用基材フィルム
JP5089358B2 (ja) * 2007-12-04 2012-12-05 古河電気工業株式会社 ウエハ加工用テープ
WO2009072405A1 (ja) * 2007-12-07 2009-06-11 Jsr Corporation 化学機械研磨パッドおよび化学機械研磨方法
JP5318435B2 (ja) * 2008-02-29 2013-10-16 日東電工株式会社 半導体ウエハの裏面研削用粘着シート及びこの裏面研削用粘着シートを用いる半導体ウエハの裏面研削方法
JP4934620B2 (ja) 2008-03-25 2012-05-16 古河電気工業株式会社 ウエハ加工用テープ
JP5356748B2 (ja) * 2008-07-31 2013-12-04 アキレス株式会社 ウエハ研削テープ用基材フィルム
JP2010074136A (ja) * 2008-08-20 2010-04-02 Hitachi Chem Co Ltd 半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1580168A (zh) * 2003-08-08 2005-02-16 日东电工株式会社 再剥离型粘合片材
CN101136329A (zh) * 2006-08-29 2008-03-05 日东电工株式会社 半导体晶圆背面加工方法,衬底背面加工方法,和辐射固化型压敏粘着片

Also Published As

Publication number Publication date
KR101845857B1 (ko) 2018-05-18
JPWO2012014487A1 (ja) 2013-09-12
CN103026469A (zh) 2013-04-03
JP5882142B2 (ja) 2016-03-09
TW201213124A (en) 2012-04-01
JP5087717B2 (ja) 2012-12-05
JP2012248851A (ja) 2012-12-13
TWI498215B (zh) 2015-09-01
EP2600391A1 (en) 2013-06-05
US20130130001A1 (en) 2013-05-23
KR20130032373A (ko) 2013-04-01
WO2012014487A1 (ja) 2012-02-02

Similar Documents

Publication Publication Date Title
CN103026469B (zh) 层合膜及使用其的半导体制造用膜
TWI709485B (zh) 半導體晶圓加工用片材用基材、半導體晶圓加工用片材、及半導體裝置之製造方法
TWI382074B (zh) 切割用黏著片
WO2013099778A1 (ja) レーザーダイシング用フィルム基材、レーザーダイシング用フィルム、及び電子部品の製造方法
CN105073931B (zh) 叠层膜的制造方法、叠层膜以及使用该叠层膜的半导体装置的制造方法
JP7463478B2 (ja) 圧縮成形法による樹脂封止プロセス用離型フィルム
CN110178203B (zh) 切割膜基材及切割膜
WO2013015012A1 (ja) 半導体加工シート用基材フィルム、半導体加工シート及び半導体装置の製造方法
KR102483810B1 (ko) 다이싱 필름 기재용 수지 조성물, 다이싱 필름 기재 및 다이싱 필름
JP2019110316A (ja) ダイシングシート
TWI642717B (zh) 切割膜片
JP7252945B2 (ja) 粘着性フィルムおよび電子装置の製造方法
JP6472972B2 (ja) ダイシングテープ基材用樹脂組成物およびダイシングテープ基材
JP2004228420A (ja) 半導体ウェハー固定用粘着テープ
CN117264553A (zh) 切割带以及使用切割带的半导体芯片和半导体装置的制造方法
JP7049796B2 (ja) 粘着性フィルム
CN103038300B (zh) 隔离膜的选择方法和使用通过该选择方法选择的隔离膜的粘合片
CN114634768A (zh) 切割胶带和切割芯片接合膜
JP2022032729A (ja) 積層体、建造物用フィルム、膜構造物、建造物、膜構造物の建築方法及び膜構造物の補修方法
CN116731624A (zh) 切割胶带和使用切割胶带的半导体装置的制造方法
JP2004292580A (ja) 粘着シート用基材および粘着シート

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan, Japan

Patentee after: Mitsui-Dow Polymerization Chemical Co., Ltd.

Address before: Tokyo, Japan, Japan

Patentee before: Du Pont-Mitsui Polychemicals Co., Ltd.