CN103002658B - 电路板 - Google Patents

电路板 Download PDF

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Publication number
CN103002658B
CN103002658B CN201210320809.3A CN201210320809A CN103002658B CN 103002658 B CN103002658 B CN 103002658B CN 201210320809 A CN201210320809 A CN 201210320809A CN 103002658 B CN103002658 B CN 103002658B
Authority
CN
China
Prior art keywords
imager
circuit board
temperature
printed circuit
temperature adjustment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210320809.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN103002658A (zh
Inventor
渡边俊夫
市村功
前田龙男
永田琢磨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN103002658A publication Critical patent/CN103002658A/zh
Application granted granted Critical
Publication of CN103002658B publication Critical patent/CN103002658B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10219—Thermoelectric component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Studio Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN201210320809.3A 2011-09-09 2012-08-31 电路板 Active CN103002658B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011196819A JP6035015B2 (ja) 2011-09-09 2011-09-09 回路基板
JP2011-196819 2011-09-09

Publications (2)

Publication Number Publication Date
CN103002658A CN103002658A (zh) 2013-03-27
CN103002658B true CN103002658B (zh) 2017-06-30

Family

ID=47829088

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210320809.3A Active CN103002658B (zh) 2011-09-09 2012-08-31 电路板

Country Status (3)

Country Link
US (1) US9161432B2 (enExample)
JP (1) JP6035015B2 (enExample)
CN (1) CN103002658B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101885874B1 (ko) * 2017-05-31 2018-08-07 (주)유진프로텍 금속판재 절곡장치
JP6467478B1 (ja) * 2017-09-28 2019-02-13 Ｋｙｂ株式会社 部品実装体及び電子機器
CN107683019B (zh) * 2017-09-30 2021-03-30 奇酷互联网络科技（深圳）有限公司 电路板、电路板制作方法、温度检测方法及电子设备
EP3531806B1 (de) 2018-02-26 2020-03-25 ZKW Group GmbH Elektronische leiterplattenbaugruppe für hochleistungsbauteile
CN108490615A (zh) * 2018-03-30 2018-09-04 京东方科技集团股份有限公司 Vr一体机
US20240413051A1 (en) * 2021-10-06 2024-12-12 Denka Company Limited Heat dissipation member

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62226646A (ja) * 1986-03-27 1987-10-05 Nec Corp ヒ−トシンク
JPH0767177B2 (ja) 1993-01-28 1995-07-19 日本電気株式会社 固体撮像素子の放熱構造
JP2002093960A (ja) * 2000-09-12 2002-03-29 Nec Corp マルチチップモジュールの冷却構造およびその製造方法
US6614659B2 (en) * 2001-12-07 2003-09-02 Delphi Technologies, Inc. De-mountable, solderless in-line lead module package with interface
TW566572U (en) * 2003-03-07 2003-12-11 Lite On Technology Corp Flexible assembling device applied in an optical projection apparatus and its mechanism
US6914783B2 (en) * 2003-06-02 2005-07-05 Infocus Corporation Digital micromirror device mounting system
JP2006054318A (ja) * 2004-08-11 2006-02-23 Seiko Instruments Inc 電気部品モジュールおよびその製造方法
JP4722505B2 (ja) * 2005-02-10 2011-07-13 オリンパス株式会社 撮像装置
CN101273674A (zh) * 2005-08-30 2008-09-24 松下电器产业株式会社 基板结构
JP4715798B2 (ja) * 2007-04-10 2011-07-06 ブラザー工業株式会社 電子装置
TWI345127B (en) * 2007-11-27 2011-07-11 Coretronic Corp Dmd module
US8148747B2 (en) * 2008-03-25 2012-04-03 Bridge Semiconductor Corporation Semiconductor chip assembly with post/base/cap heat spreader
JP2010225919A (ja) * 2009-03-24 2010-10-07 Sony Corp 半導体装置
JP6017107B2 (ja) * 2009-12-28 2016-10-26 ソニー株式会社 イメージセンサ及びその製造方法、並びにセンサデバイス
KR101672738B1 (ko) * 2010-08-31 2016-11-07 삼성전자 주식회사 쿨링 구조를 가지는 전자기기
US8737073B2 (en) * 2011-02-09 2014-05-27 Tsmc Solid State Lighting Ltd. Systems and methods providing thermal spreading for an LED module

Also Published As

Publication number Publication date
US20130062717A1 (en) 2013-03-14
CN103002658A (zh) 2013-03-27
US9161432B2 (en) 2015-10-13
JP6035015B2 (ja) 2016-11-30
JP2013058663A (ja) 2013-03-28

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