CN102928763B - 一种晶体管关键参数的可寻址测试电路及其测试方法 - Google Patents
一种晶体管关键参数的可寻址测试电路及其测试方法 Download PDFInfo
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- CN102928763B CN102928763B CN201210492931.9A CN201210492931A CN102928763B CN 102928763 B CN102928763 B CN 102928763B CN 201210492931 A CN201210492931 A CN 201210492931A CN 102928763 B CN102928763 B CN 102928763B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2621—Circuits therefor for testing field effect transistors, i.e. FET's
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/50—Marginal testing, e.g. race, voltage or current testing
- G11C29/50008—Marginal testing, e.g. race, voltage or current testing of impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/50—Marginal testing, e.g. race, voltage or current testing
- G11C2029/5002—Characteristic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/50—Marginal testing, e.g. race, voltage or current testing
- G11C2029/5006—Current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Automation & Control Theory (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
Claims (6)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210492931.9A CN102928763B (zh) | 2012-11-28 | 2012-11-28 | 一种晶体管关键参数的可寻址测试电路及其测试方法 |
PCT/CN2013/076969 WO2014082438A1 (zh) | 2012-11-28 | 2013-06-08 | 一种晶体管关键参数的可寻址测试电路及其测试方法 |
US14/523,927 US20150042372A1 (en) | 2012-11-28 | 2014-10-26 | Addressable test circuit and test method for key parameters of transistors |
US15/351,421 US9817058B2 (en) | 2012-11-28 | 2016-11-14 | Addressable test circuit and test method for key parameters of transistors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210492931.9A CN102928763B (zh) | 2012-11-28 | 2012-11-28 | 一种晶体管关键参数的可寻址测试电路及其测试方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102928763A CN102928763A (zh) | 2013-02-13 |
CN102928763B true CN102928763B (zh) | 2014-12-24 |
Family
ID=47643607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210492931.9A Active CN102928763B (zh) | 2012-11-28 | 2012-11-28 | 一种晶体管关键参数的可寻址测试电路及其测试方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20150042372A1 (zh) |
CN (1) | CN102928763B (zh) |
WO (1) | WO2014082438A1 (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102928763B (zh) * | 2012-11-28 | 2014-12-24 | 杭州广立微电子有限公司 | 一种晶体管关键参数的可寻址测试电路及其测试方法 |
CN103366055A (zh) * | 2013-06-28 | 2013-10-23 | 杭州广立微电子有限公司 | 一种可寻址测试芯片版图的生成方法 |
CN103794597B (zh) * | 2014-01-26 | 2017-01-04 | 杭州广立微电子有限公司 | 可选择连接或断开待测目标芯片的测试方法 |
JP2015220632A (ja) * | 2014-05-19 | 2015-12-07 | ソニー株式会社 | 半導体装置及びmosトランジスタの制御方法 |
DE102014115204B4 (de) | 2014-10-20 | 2020-08-20 | Infineon Technologies Ag | Testen von Vorrichtungen |
CN104267329B (zh) * | 2014-10-21 | 2017-03-15 | 京东方科技集团股份有限公司 | 晶体管测试电路以及测试方法 |
CN105095594B (zh) * | 2015-08-19 | 2018-06-26 | 杭州广立微电子有限公司 | 基于不同测试目的而生成测试单元版图的方法 |
CN105137329B (zh) * | 2015-09-12 | 2018-07-20 | 上海华虹宏力半导体制造有限公司 | 一种检查电路中mos场效应管栅极悬空的方法及系统 |
CN106201820B (zh) * | 2016-06-29 | 2018-11-20 | 努比亚技术有限公司 | 应用待运行时长的预测装置及方法 |
CN106124832B (zh) * | 2016-08-08 | 2019-04-30 | 武汉新芯集成电路制造有限公司 | 一种元器件饱和电流的量测方法和量测系统 |
CN108267682B (zh) * | 2016-12-30 | 2020-07-28 | 杭州广立微电子有限公司 | 一种高密度测试芯片及其测试系统及其测试方法 |
KR102413192B1 (ko) * | 2017-11-03 | 2022-06-24 | 삼성전자주식회사 | Nbti 또는 pbit를 모니터링하는 테스트 회로 |
CN108256219B (zh) * | 2018-01-18 | 2021-08-06 | 上海华虹宏力半导体制造有限公司 | 一种mos晶体管的器件失配模型的修正方法及系统 |
CN110187249A (zh) * | 2018-02-22 | 2019-08-30 | 河南省无线发射传输管理中心 | 一种大功率mos管检测系统及方法 |
CN113835007B (zh) * | 2020-06-08 | 2022-09-20 | 长鑫存储技术有限公司 | 热载流效应耐受度的测试方法 |
CN112687663B (zh) * | 2020-12-16 | 2023-03-14 | 深圳市紫光同创电子有限公司 | 晶圆监控结构及监控方法 |
CN112698179A (zh) * | 2021-01-08 | 2021-04-23 | 胜达克半导体科技(上海)有限公司 | 一种用于浮动直流小信号电压的精密测量方法 |
CN113740697B (zh) * | 2021-09-26 | 2024-04-19 | 长鑫存储技术有限公司 | 半导体器件的测试方法、设备及系统 |
CN115327333A (zh) * | 2022-08-11 | 2022-11-11 | 方思微(上海)半导体有限公司 | 可寻址测试阵列 |
TWI830414B (zh) * | 2022-09-30 | 2024-01-21 | 華邦電子股份有限公司 | 求值電路、半導體裝置以及求值方法 |
CN115579046B (zh) * | 2022-11-15 | 2023-03-31 | 全芯智造技术有限公司 | 半导体器件的特性参数的规格的预测方法及装置、终端 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100832187B1 (ko) * | 1998-08-24 | 2008-05-23 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 집적회로 |
JP3483869B2 (ja) * | 2001-08-28 | 2004-01-06 | 株式会社半導体先端テクノロジーズ | トランジスタの特性評価回路及び特性評価方法 |
TWI223092B (en) * | 2003-07-29 | 2004-11-01 | Primtest System Technologies | Testing apparatus and method for thin film transistor display array |
KR100529615B1 (ko) * | 2003-12-24 | 2005-11-17 | 동부아남반도체 주식회사 | 트랜지스터들의 열화정도를 측정할 수 있는 테스트회로 |
US7417451B2 (en) * | 2005-10-07 | 2008-08-26 | Synopsys, Inc. | Leakage power management with NDR isolation devices |
CN101452042B (zh) * | 2007-11-30 | 2011-06-15 | 中芯国际集成电路制造(上海)有限公司 | 场效应管负温度不稳定性的晶片级可靠性平行测试方法 |
CN101545945B (zh) * | 2008-03-25 | 2011-08-03 | 中芯国际集成电路制造(上海)有限公司 | 一种mos器件漏电流的测试方法 |
CN102445644B (zh) * | 2010-10-15 | 2014-02-12 | 中芯国际集成电路制造(北京)有限公司 | Mos器件的spice测试结构 |
CN102176440B (zh) * | 2010-12-14 | 2013-06-19 | 浙江大学 | 一种放置在划片槽内的改进型可寻址测试芯片及制作方法 |
CN102928763B (zh) * | 2012-11-28 | 2014-12-24 | 杭州广立微电子有限公司 | 一种晶体管关键参数的可寻址测试电路及其测试方法 |
-
2012
- 2012-11-28 CN CN201210492931.9A patent/CN102928763B/zh active Active
-
2013
- 2013-06-08 WO PCT/CN2013/076969 patent/WO2014082438A1/zh active Application Filing
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2014
- 2014-10-26 US US14/523,927 patent/US20150042372A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
CN102928763A (zh) | 2013-02-13 |
WO2014082438A1 (zh) | 2014-06-05 |
US20150042372A1 (en) | 2015-02-12 |
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CP01 | Change in the name or title of a patent holder | ||
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Address after: Room b412, Neusoft venture building, 99 Huaxing Road, Xihu District, Hangzhou, Zhejiang 310000 Patentee after: Hangzhou Guangli Microelectronics Co.,Ltd. Address before: Room b412, Neusoft venture building, 99 Huaxing Road, Xihu District, Hangzhou, Zhejiang 310000 Patentee before: Semitronix Corp. |
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Effective date of registration: 20210426 Address after: 310000 building F1, 15 / F, building a, Paradise Software Park, No.3 xidoumen Road, Xihu District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou Guangli Microelectronics Co.,Ltd. Patentee after: ZHEJIANG University Address before: 310000 B412 room, Neusoft building, 99 Huaxing Road, Hangzhou, Zhejiang, Xihu District Patentee before: Hangzhou Guangli Microelectronics Co.,Ltd. |