CN102915965B - 用于制造柔性显示设备的装置和方法 - Google Patents
用于制造柔性显示设备的装置和方法 Download PDFInfo
- Publication number
- CN102915965B CN102915965B CN201210272392.8A CN201210272392A CN102915965B CN 102915965 B CN102915965 B CN 102915965B CN 201210272392 A CN201210272392 A CN 201210272392A CN 102915965 B CN102915965 B CN 102915965B
- Authority
- CN
- China
- Prior art keywords
- substrate
- infrabasal plate
- carrier substrate
- plate
- separated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 183
- 238000000926 separation method Methods 0.000 claims description 26
- 239000004973 liquid crystal related substance Substances 0.000 claims description 21
- 239000000565 sealant Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 11
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000005096 rolling process Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000010409 thin film Substances 0.000 description 7
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- 238000005304 joining Methods 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000002800 charge carrier Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000001962 electrophoresis Methods 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
- Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
- Y10T156/1707—Discrete spaced laminae on adhered carrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1712—Indefinite or running length work
- Y10T156/1734—Means bringing articles into association with web
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1712—Indefinite or running length work
- Y10T156/1737—Discontinuous, spaced area, and/or patterned pressing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1712—Indefinite or running length work
- Y10T156/1741—Progressive continuous bonding press [e.g., roll couples]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
- Y10T156/1917—Electromagnetic radiation delaminating means [e.g., microwave, uv, ir, etc.]
Abstract
用于制造柔性显示设备的装置和方法。公开了一种通过卷对卷方法制造柔性显示设备的装置和方法,所述装置包括:基板传送部,所述基板传送部用于传送附接到载体基板上的下基板;基板分离部,所述基板分离部用于将所述载体基板与由所述基板传送部传送的所述下基板分离;上接合部,所述上接合部用于将上基板接合到与所述载体基板分离的所述下基板的上表面;以及下接合部,所述下接合部用于将后基板接合到与所述载体基板分离的所述下基板的下表面。
Description
技术领域
本发明涉及柔性显示设备,并且更具体地,涉及通过卷对卷(roll-to-roll)方法制造柔性显示设备的装置和方法。
背景技术
柔性显示设备是可卷曲(rollable)或可卷绕(windable)的设备,其为纸状,由此柔性显示设备能够容易保持并且具有良好的可携带性。由于这些优点,已对柔性显示设备进行稳定研究并且将其发展为下一代的显示设备。
可以通过卷对卷方法制造柔性显示设备,以由此提高产量。
卷对卷方法在通过使用供应辊供应柔性基板并且通过使用收集辊收集柔性基板期间,在柔性基板上形成各种器件层。这些处理可以连续执行。因此,与现有技术的批处理式方法相比,卷对卷方法实现了更高的效率(更高的产量)。
然而,如果应用卷对卷方法,则柔性基板在经过多个辊时可能由于多种原因而变形。在这方面,将卷对卷方法应用于柔性显示设备存在限制。
为了解决与基板的变形相关的以上问题并且提高基板传送的便利性,提出了如下方法,在该方法中,在将柔性基板附接于额外提供的载体基板(诸如玻璃基板)的条件下执行处理,并且在完成该处理之后将载体基板与柔性基板分离。
然而,迄今为止,该方法还没有应用于卷对卷方法,这造成效率降低。
发明内容
因此,本发明针对用于制造柔性显示设备的装置和方法,其基本上消除了由于现有技术的限制和缺点导致的一个或更多个问题。
本发明的一个方面在于提供一种用于制造柔性显示设备的装置和方法,其通过在柔性基板附接于载体基板的条件下执行处理,并且通过卷对卷方法执行后面的接合处理,而有助于提高产量。
为了实现这些和其它优点并且根据本发明的目的,如本文具体实施和广泛描述的,提供了一种用于制造柔性显示设备的装置,所述装置包括:基板传送部,所述基板传送部用于传送附接到载体基板上的下基板;基板分离部,所述基板分离部用于将所述载体基板与由所述基板传送部传送的所述下基板分离;上接合部,所述上接合部用于将上基板接合到与所述载体基板分离的所述下基板的上表面;以及下接合部,所述下接合部用于将后基板接合到与所述载体基板分离的所述下基板的下表面。
在本发明的另一个方面中,提供了一种用于制造柔性显示设备的装置,所述装置包括:基板传送部,所述基板传送部用于传送附接到载体基板上的下基板;基板分离部,所述基板分离部用于将所述载体基板与由所述基板传送部传送的所述下基板分离;上图案部,所述上图案部用于在与所述载体基板分离的所述下基板的上表面上形成图案材料;以及下接合部,所述下接合部用于将后基板接合到与所述载体基板分离的所述下基板的下表面。
在本发明的另一个方面中,提供了一种用于制造柔性显示设备的方法,所述方法包括以下步骤:将下基板附接到载体基板上,并且在所述下基板上形成预定器件层;通过使用基板传送部,将附接到所述载体基板上的所述下基板传送到基板分离部;通过使用基板分离部,将所述载体基板与所述下基板分离;通过使用上接合部,将上基板接合到与所述载体基板分离的所述下基板的上表面,或者形成图案材料;以及通过使用下接合部,将后基板接合到与所述载体基板分离的所述下基板的下表面。
在本发明的另一个方面中,提供了一种用于制造柔性显示设备的方法,所述方法包括以下步骤:将下基板附接到载体基板上,并且在所述下基板上形成预定器件层;通过使用基板传送部,将附接到所述载体基板上的所述下基板传送到基板分离部;通过使用基板分离部,将所述载体基板与所述下基板分离;通过使用上图案部,在与所述载体基板分离的所述下基板的上表面上形成图案材料;以及通过使用下接合部,将后基板接合到与所述载体基板分离的所述下基板的下表面。
要理解的是,本发明的以上概括描述和以下详细描述二者都是示例性和说明性的,并且旨在提供对要求保护的本发明的进一步说明。
附图说明
所包括的附图用于提供对本发明的进一步理解,并被并入且构成本申请的一部分,附图示出了本发明的(多个)实施方式,并且与说明书一起用于说明本发明的原理。在附图中:
图1例示根据本发明的一个实施方式的用于制造柔性显示设备的装置;以及
图2是示出根据本发明的一个实施方式的用于制造柔性显示设备的方法的流程图。
具体实施方式
现在,将详细参照本发明的示例性实施方式,在附图中例示了这些示例性实施方式的示例。在可能的情况下,贯穿附图将使用相同的附图标记指代相同或类似的部件。
下文中,将参照附图描述根据本发明的用于制造柔性显示设备的装置和方法。
图1例示根据本发明的一个实施方式的用于制造柔性显示设备的装置。
如图1所示,根据本发明的一个实施方式的用于制造柔性显示设备的装置包括:基板传送部100、基板分离部200、上接合部300和下接合部400。
基板传送部100传送基板。更详细地说,基板传送部100传送附接到载体基板20上的下基板10,并且传送与下基板10分离的载体基板20。因此,与下基板10分离的载体基板20由基板传送部100传送,并且然后被装载到预定的装载部中,这使得能够高效率地重新使用载体基板20。
基板传送部100可以设置有以固定间隔布置的多个传送辊,但不是必须的。
在这种情况下,下基板10可以由柔性基板形成。下基板10可以应用于诸如液晶显示设备、有机发光设备或电泳显示设备的显示设备。
例如,如果下基板10应用于液晶显示设备,则可以在下基板10上形成薄膜晶体管和像素电极。如果有需要,可以在下基板10上额外形成滤色器。另外,如果下基板10应用于有机发光设备,则可以在下基板10上形成有机发光层。如果下基板10应用于电泳显示设备,则可以在下基板10上形成薄膜晶体管和像素电极。
载体基板20附接于柔性下基板10,其中,载体基板20防止下基板10的变形,并且同时有助于传送下基板10。载体基板20可以由玻璃基板形成。通过使用粘合剂15将载体基板20附接于下基板10的下表面。
粘合剂15使下基板10和载体基板20彼此粘附。例如,粘合剂15可以包括氢化非晶硅(a-Si:H)。
基板分离部200将载体基板20与由基板传送部100传送的下基板10分离。基板分离部200可以由激光照射设备形成,但不是必须的。
当用由激光照射设备提供的激光束照射载体基板20时,从包括在粘合剂15中的氢化非晶硅(a-Si:H)产生氢气(H2),以由此降低载体基板20与下基板10之间的粘合强度。因此,载体基板20与下基板10分离。
为了使激光束照射到载体基板20的没有与下基板10接触的表面(例如,载体基板20的下表面)上,优选地,基板分离部200位于下基板10和载体基板20下面。如果朝向下基板10照射激光束,则可能对形成在下基板10上的器件造成损害。
如图所示,基板分离部200可以位于设置在下基板10和载体基板20下面的支承辊(support roll)250内部。
支承辊250面对上接合部300的上接合辊310。更具体地讲,支承辊250位于上接合辊310下面,同时面对上接合辊310,使得可以有助于在上接合辊310中进行接合处理。
如果基板分离部200位于支承辊250内部,则支承辊250由使激光束能够从中穿过的透明材料(诸如玻璃或石英)形成。
支承辊250可以沿着与上接合辊310相反的方向旋转。在这种情况下,可以通过支承辊250与基板传送部100的传送辊相配合地传送基板。
上接合部300被设置成将上基板30接合到下基板10的上表面。上接合部300可以包括上接合辊310和上供应辊320。
上接合辊310被设置成将下基板10和上基板30彼此接合。为了进行平滑的接合处理,上接合辊310被定位为面对支承辊250,如上所述。
可以在上接合辊310的表面上额外地形成衬垫(cushion)层312。在这种情况下,由于额外提供的衬垫层312,可以平滑地执行上接合辊310的接合处理。衬垫层312可以由粘性材料形成。
上供应辊320被设置成将上基板30供应到上接合辊310。因此,上基板30被缠绕在上供应辊320上,并且然后通过使上供应辊320和上接合辊310旋转而将上基板30供应到上接合辊310。
然而,并非总是需要供应被缠绕在上供应辊320上的上基板30。替代地,可以通过额外的加工线(processing line)制造上基板30,并且可以向上接合辊310连续地供应所制造的上基板30。也就是说,如果有需要,可以省略上供应辊320。
按照与下基板10相同的方式,上基板30可以由柔性基板形成。另外,上基板30的结构可以根据下基板10的结构而变化。也就是说,上基板30的结构取决于下基板10的结构,其中,根据将要应用的显示设备的模式(例如,液晶显示设备、有机发光设备或电泳显示设备),上基板30的结构可以是可改变的。
例如,如果上述下基板10应用于液晶显示设备并且在该下基板10上形成薄膜晶体管和像素电极,则可以在上基板30上形成滤色器。同时,如果上述下基板10应用于液晶显示设备并且在该下基板10上形成薄膜晶体管、像素电极和滤色器,则可以在上基板30上只形成配向层。
另外,如果上述下基板10应用于有机发光设备,则上基板30可以由诸如EVA膜的密封膜形成。
如果上述下基板10应用于电泳显示设备,则上基板30可以由包括电荷载体(charge carrier)和溶剂的电泳膜形成。
同时,上接合部300的功能不限于将上基板30接合到下基板10的上表面。此外,上接合部300可以被设置成在下基板10上形成额外的图案材料。
在这种情况下,包括在上接合部300中的上接合辊310可以设置有图案化表面,例如,包括突起和中空部分的不平坦表面。上接合辊310用作上图案部。在上接合辊310的不平坦表面的突起部分涂覆有期望的图案材料之后,图案材料被印刷到下基板10上,以由此在下基板10上形成预定的图案材料。例如,包括图案化表面的上接合辊310可以应用于用于制造电泳显示设备的处理,并且更具体地讲,应用于用于在电泳显示设备的下基板10上形成间隔壁(partition wall)的处理。间隔壁设置为划分像素,其中,彩色电泳墨水被放置于间隔壁内部,以由此实现彩色电泳显示设备。
下接合部400被设置成将后基板40接合到下基板10的下表面。下接合部400可以包括下接合辊410和下供应辊420。
下接合辊410被设置成将下基板10和后基板40彼此接合。为了进行平滑的接合处理,下接合辊410被定位为面对上接合辊310,如上所述。虽然未示出,但可以在下接合辊410的表面上额外提供衬垫层。
下供应辊420被设置成将后基板40供应到下接合辊410。因此,后基板40缠绕在下供应辊420上,然后通过使下供应辊420和下接合辊410旋转而将后基板40供应到下接合辊410。
后基板40可以由柔性基板形成,并且后基板40可以用作柔性显示设备的支撑基板。
可以用预定粘合剂涂覆将要接合到下基板10的后基板40的接合表面。为此,可以在下接合辊410与下供应辊420之间额外地形成预定的粘合剂涂覆装置(means)。
根据将要制造的显示设备的种类,用于制造以上柔性显示设备的装置还可以包括额外的结构。
例如,用于制造柔性显示设备的装置还可以包括密封剂分配(dispense)装置500和液晶分配装置600。
密封剂分配装置500被设置成将下基板10和上基板30彼此接合,其中该密封剂分配装置500将预定的密封剂分配到下基板10的边缘上。在将下基板10和上基板30彼此接合之前执行分配密封剂的处理。优选地,在分离载体基板20之前执行用于分配密封剂的处理。在这方面,密封剂分配装置500位于上接合部300的前面,并且还位于基板分离部200的前面。
如果以上柔性显示设备是液晶显示设备,则液晶分配装置600被设置成将液晶分配到下基板10上。
在将下基板10和上基板30彼此接合之前执行用于分配液晶的处理。优选地,在分离载体基板20之前执行用于分配液晶的处理。在这方面,液晶分配装置600位于上接合部300的前面,并且还位于基板分离部200的前面。
在附图中,液晶分配装置600位于密封剂分配装置500之后,但不是必须的。另选地,密封剂分配装置500可以位于液晶分配装置600之后。
下文中,将参照图1和图2描述通过使用根据本发明的一个实施方式的柔性显示装置来制造根据本发明的实施方式的柔性显示设备的方法。
图2是示出根据本发明的一个实施方式的用于制造柔性显示设备的方法的流程图。
首先,通过使用粘合剂15将下基板10附接到载体基板20上,并且在下基板10上形成预定的器件层(1S)。
载体基板20可以是玻璃基板,并且粘合剂15可以包含氢化非晶硅(a-Si:H)。
如果柔性显示设备是液晶显示设备,则设置在下基板10上的器件层可以包括薄膜晶体管、像素电极和公共电极。另外,设置在下基板10上的器件层可以包括滤色器和黑柱间隔件(black column spacer)。
如果柔性显示设备是有机发光设备,则设置在下基板10上的器件层可以包括薄膜晶体管、阳极、有机发光层和阴极。
如果柔性显示设备是电泳显示设备,则设置在下基板10上的器件层可以包括薄膜晶体管和像素电极。
然后,通过使用基板传送部100向基板分离部200传送附接到载体基板20上的下基板10(2S)。
如果柔性显示设备是液晶显示设备,则在以上传送处理期间通过使用密封剂分配装置500在下基板10上分配密封剂,并且在以上传送处理期间通过使用液晶分配装置600在下基板10上分配液晶。在这种情况下,该处理不必限于执行分配密封剂和分配液晶的步骤的任何特定顺序。
如果柔性显示设备是有机发光设备或电泳显示设备,则可以在以上传送处理期间通过使用密封剂分配装置500在下基板10上分配密封剂。
然后,通过使用基板分离部200将载体基板20与下基板10分离(S3)。
可以通过用由激光照射设备提供的激光束照射载体基板20执行以上分离处理,该激光照射设备布置在下基板10下面的支承辊250内部。
可以通过使用基板传送部100将在分离处理期间分离的载体基板20传送到预定的装载部。
然后,通过使用上接合部300将上基板30接合到下基板10的上表面(4S)。
用于将下基板10和上基板30彼此接合的处理可以包括以下步骤:将上基板30供应至上接合辊310,并且使所供应的上基板30经过上接合辊310与支承辊250之间的空间。因此,上基板30被接合到下基板10的通过支承辊250的上表面。
可以通过将上基板30从上供应辊320解开,或者将由额外的加工线制造的上基板30连续地供应到上接合辊310,来执行用于将上基板30供应到上接合辊310的处理。
如果柔性显示设备是液晶显示设备,则可以在上基板30上形成黑底、滤色器和配向层。在一些情况下,可以在上基板30上只形成配向层。
如果柔性显示设备是有机发光设备,则上基板30可以由诸如EVA膜的密封膜形成。
如果柔性显示设备是电泳显示设备,则上基板30可以由包括电荷载体和溶剂的电泳膜形成。
同时,如果上接合辊310设置有图案化表面,则执行用于涂覆预定的图案材料的处理,而不是用于将上基板30接合到下基板10的上表面的处理。这可以应用于制造电泳显示设备的处理,并且更具体地讲,可应用于在下基板10上形成划分像素的间隔壁的处理。
然后,通过使用下接合部400将后基板40接合到下基板10的下表面(5S)。
用于将下基板10和后基板40彼此接合的处理可以包括如下步骤:将后基板40供应到下接合辊410,并且使所供应的后基板40经过下接合辊410与上接合辊310之间的空间。因此,后基板40被接合到下基板10的通过上接合辊310的下表面。
可以通过将后基板40从下供应辊420解开来执行用于将后基板40供应到下接合辊410的处理。
因此,通过卷对卷方法执行用于将载体基板20与下基板10分离的处理、将上基板30接合到下基板10的上表面的处理以及将后基板40接合到下基板10的下表面的处理,以由此提高产量。
对于本领域的技术人员而言将明显的是,在不脱离本发明的精神或范围的情况下,可以在本发明中进行各种修改和变型。因此,本发明旨在涵盖落入所附权利要求书及其等同物的范围内的本发明的修改和变型。
相关申请的交叉引用
本专利申请要求2011年8月02日提交的韩国专利申请No.10-2011-0076882的权益,通过引用方式将该韩国专利申请并入本文,如同在本文中完全阐述一样。
Claims (9)
1.一种用于制造柔性显示设备的装置,所述装置包括:
基板传送部,所述基板传送部用于传送附接到载体基板上的下基板;
基板分离部,所述基板分离部用于将所述载体基板与由所述基板传送部传送的所述下基板分离;
上接合部,所述上接合部用于将上基板接合到与所述载体基板分离的所述下基板的上表面;以及
下接合部,所述下接合部用于将后基板接合到与所述载体基板分离的所述下基板的下表面,
其中,所述上接合部包括上接合辊,所述上接合辊面对设置在所述下基板下面的支承辊。
2.根据权利要求1所述的装置,其中,所述基板分离部位于设置在所述下基板下面的所述支承辊内部。
3.根据权利要求1所述的装置,其中,所述下接合部包括下接合辊和下供应辊,所述下供应辊将所述后基板供应到所述下接合辊。
4.根据权利要求1所述的装置,其中,在所述上接合部的前面额外设置密封剂分配装置或液晶分配装置。
5.一种用于制造柔性显示设备的装置,所述装置包括:
基板传送部,所述基板传送部用于传送附接到载体基板上的下基板;
基板分离部,所述基板分离部用于将所述载体基板与由所述基板传送部传送的所述下基板分离;
上图案部,所述上图案部用于在与所述载体基板分离的所述下基板的上表面上形成图案材料;以及
下接合部,所述下接合部用于将后基板接合到与所述载体基板分离的所述下基板的下表面,
其中,所述上图案部包括设置有图案化表面的辊,所述设置有图案化表面的辊面对设置在所述下基板下面的支承辊。
6.一种用于制造柔性显示设备的方法,所述方法包括以下步骤:
将下基板附接到载体基板上,并且在所述下基板上形成预定器件层;
通过使用基板传送部,将附接到所述载体基板上的所述下基板传送到基板分离部;
通过使用基板分离部,将所述载体基板与所述下基板分离;
通过使用上接合部,将上基板接合到与所述载体基板分离的所述下基板的上表面;以及
通过使用下接合部,将后基板接合到与所述载体基板分离的所述下基板的下表面,
其中,通过将所述上基板供应到所述上接合部的上接合辊,并且使所供应的上基板经过所述上接合辊与支承辊之间的空间,来执行用于将所述上基板接合到所述下基板的所述上表面的处理。
7.根据权利要求6所述的方法,其中,通过用由激光照射设备提供的激光束照射所述载体基板来执行用于分离所述载体基板的处理,该激光照射设备布置在所述下基板下的支承辊内部。
8.根据权利要求6所述的方法,其中,通过将所述后基板供应到面对所述上接合辊的所述下接合辊,并且使所供应的后基板经过所述上接合辊与所述下接合辊之间的空间,来执行用于将所述后基板接合到所述下基板的所述下表面的处理。
9.一种用于制造柔性显示设备的方法,所述方法包括以下步骤:
将下基板附接到载体基板上,并且在所述下基板上形成预定器件层;
通过使用基板传送部,将附接到所述载体基板上的所述下基板传送到基板分离部;
通过使用基板分离部,将所述载体基板与所述下基板分离;
通过使用上图案部,在与所述载体基板分离的所述下基板的上表面上形成图案材料;以及
通过使用下接合部,将后基板接合到与所述载体基板分离的所述下基板的下表面,
其中,通过将所述后基板供应到所述下接合部的下结合辊,并且使所供应的后基板经过所述下结合辊与所述上图案部之间的空间,来执行用于将所述后基板接合到所述下基板的所述下表面的处理。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110076882A KR101839453B1 (ko) | 2011-08-02 | 2011-08-02 | 플렉시블 디스플레이 장치의 제조 장비 및 제조 방법 |
KR10-2011-0076882 | 2011-08-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102915965A CN102915965A (zh) | 2013-02-06 |
CN102915965B true CN102915965B (zh) | 2015-06-10 |
Family
ID=47614280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210272392.8A Active CN102915965B (zh) | 2011-08-02 | 2012-08-01 | 用于制造柔性显示设备的装置和方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8641851B2 (zh) |
KR (1) | KR101839453B1 (zh) |
CN (1) | CN102915965B (zh) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5899220B2 (ja) * | 2010-09-29 | 2016-04-06 | ポスコ | ロール状の母基板を利用したフレキシブル電子素子の製造方法、フレキシブル電子素子及びフレキシブル基板 |
CN102902093B (zh) * | 2012-09-05 | 2015-08-05 | 京东方科技集团股份有限公司 | 柔性基板、载体平台、柔性显示器及其制备方法 |
KR101932562B1 (ko) * | 2012-09-18 | 2018-12-28 | 삼성디스플레이 주식회사 | 필름 부착장치 및 그것을 이용한 필름 부착방법 |
KR102092925B1 (ko) * | 2013-07-03 | 2020-03-25 | 삼성디스플레이 주식회사 | 표시 패널용 지지 장치 및 이를 이용한 표시 장치의 제조 방법 |
CN103456689B (zh) * | 2013-08-13 | 2015-02-25 | 京东方科技集团股份有限公司 | 用于将柔性基板与玻璃基板分离的装置及生产设备 |
KR101581775B1 (ko) | 2013-12-27 | 2015-12-31 | 엘아이지인베니아 주식회사 | 플렉서블 기판 처리장치 및 이의 클리닝 방법 |
DE102014202985B4 (de) * | 2014-02-19 | 2018-07-12 | 4Jet Microtech Gmbh & Co. Kg | Herstellung von elektronischen Bauteilen auf einem Substrat |
KR101863252B1 (ko) | 2014-09-11 | 2018-06-01 | 인베니아 주식회사 | 게이트 밸브, 게이트 밸브의 제어방법 및 게이트 밸브를 포함하는 플렉시블 기판 처리장치 |
CN104880846B (zh) | 2015-06-15 | 2018-07-24 | 京东方科技集团股份有限公司 | 柔性基板及其制作方法、显示装置 |
KR102336684B1 (ko) | 2015-08-25 | 2021-12-08 | 삼성디스플레이 주식회사 | 플렉서블 디스플레이 장치의 제조 방법 |
CN105116574B (zh) * | 2015-09-25 | 2018-09-11 | 京东方科技集团股份有限公司 | 一种基板传送装置及基板清洗设备 |
CN106364900B (zh) * | 2016-08-31 | 2019-01-18 | 浙江尚越新能源开发有限公司 | 绝缘胶片预分离装置 |
CN107039604B (zh) * | 2017-04-18 | 2018-09-04 | 武汉华星光电技术有限公司 | 柔性显示面板贴附装置及其贴附方法 |
KR101953195B1 (ko) | 2017-06-26 | 2019-02-28 | 엘지디스플레이 주식회사 | 게이트밸브 조립체 및 이를 갖는 플렉서블 기판 처리장치 |
CN111833749B (zh) * | 2020-07-13 | 2022-11-15 | Oppo广东移动通信有限公司 | 柔性显示装置以及电子设备 |
CN112234122B (zh) * | 2020-10-15 | 2022-05-27 | 青岛融合装备科技有限公司 | 一种硅基太阳能电池的制造设备 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4904065A (en) * | 1987-06-22 | 1990-02-27 | Idemitsu Kosan Co., Ltd. | Liquid crystal optical element and method of producing the same using ferroelectric polymer liquid crystal |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5465263A (en) * | 1992-12-12 | 1995-11-07 | Xerox Corporation | Monolithic, multiple wavelength, dual polarization laser diode arrays |
US6296735B1 (en) * | 1993-05-03 | 2001-10-02 | Unaxis Balzers Aktiengesellschaft | Plasma treatment apparatus and method for operation same |
US6741085B1 (en) * | 1993-11-16 | 2004-05-25 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
US6246247B1 (en) * | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US5806181A (en) * | 1993-11-16 | 1998-09-15 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
US5974662A (en) * | 1993-11-16 | 1999-11-02 | Formfactor, Inc. | Method of planarizing tips of probe elements of a probe card assembly |
US5580410A (en) * | 1994-12-14 | 1996-12-03 | Delta Technology, Inc. | Pre-conditioning a substrate for accelerated dispersed dye sublimation printing |
JP3698749B2 (ja) * | 1995-01-11 | 2005-09-21 | 株式会社半導体エネルギー研究所 | 液晶セルの作製方法およびその作製装置、液晶セルの生産システム |
US6139402A (en) * | 1997-12-30 | 2000-10-31 | Micron Technology, Inc. | Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates |
KR100646906B1 (ko) * | 1998-09-22 | 2006-11-17 | 동경 엘렉트론 주식회사 | 기판처리장치 및 기판처리방법 |
US6358129B2 (en) * | 1998-11-11 | 2002-03-19 | Micron Technology, Inc. | Backing members and planarizing machines for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods of making and using such backing members |
US6231428B1 (en) * | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
WO2001006030A1 (en) * | 1999-07-19 | 2001-01-25 | Young Park | High throughput thin film deposition for optical disk processing |
US6460369B2 (en) * | 1999-11-03 | 2002-10-08 | Applied Materials, Inc. | Consecutive deposition system |
US6543286B2 (en) * | 2001-01-26 | 2003-04-08 | Movaz Networks, Inc. | High frequency pulse width modulation driver, particularly useful for electrostatically actuated MEMS array |
US7223672B2 (en) * | 2002-04-24 | 2007-05-29 | E Ink Corporation | Processes for forming backplanes for electro-optic displays |
US6875497B2 (en) * | 2002-05-08 | 2005-04-05 | Flexcon Company, Inc. | Multilayer composite for the dry transfer of graphics to receptive substrates |
US7012746B2 (en) * | 2002-05-20 | 2006-03-14 | Eastman Kodak Company | Polyvinyl butyral films prepared by coating methods |
FR2840078B1 (fr) * | 2002-05-22 | 2004-08-13 | Saint Gobain | Dispositif electrocommandable a proprietes optiques et/ou energetiques variables |
KR20040002796A (ko) * | 2002-06-28 | 2004-01-07 | 후지 샤신 필름 가부시기가이샤 | 편광판 점착방법 및 그 장치 |
DE10245631B4 (de) * | 2002-09-30 | 2022-01-20 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterbauelement |
DE10337920B4 (de) * | 2003-08-18 | 2008-08-28 | Schott Ag | Verfahren zur Herstellung einer Mehrzahl von Bauteilen und Zwischenprodukt in Form eines Schichtverbundes |
US9307648B2 (en) * | 2004-01-21 | 2016-04-05 | Microcontinuum, Inc. | Roll-to-roll patterning of transparent and metallic layers |
US7338983B2 (en) * | 2004-02-10 | 2008-03-04 | World Properties, Inc. | Low density polyurethane foam, method of producing, and articles comprising the same |
JP2007033537A (ja) * | 2005-07-22 | 2007-02-08 | Sharp Corp | 可撓性表示素子の製造装置およびその素子の製造方法 |
US7522323B2 (en) * | 2005-10-24 | 2009-04-21 | Francis Stace Murray Clube | Method and apparatus for printing a pattern with improved focus correction and higher throughput |
KR101256663B1 (ko) * | 2005-12-28 | 2013-04-19 | 엘지디스플레이 주식회사 | 액정표시장치와 그의 제조 및 구동방법 |
KR101166828B1 (ko) * | 2005-12-29 | 2012-07-19 | 엘지디스플레이 주식회사 | 평판표시장치용 검사장비 및 검사 방법 |
JP4606388B2 (ja) * | 2006-06-12 | 2011-01-05 | 川崎重工業株式会社 | 基板移載装置の搬送系ユニット |
FR2904123B1 (fr) * | 2006-07-21 | 2008-09-12 | Saint Gobain | Dispositif electrochimique / electrocommandable du type vitrage et a proprietes optiques et/ou energetiques variables. |
JP4549432B2 (ja) * | 2007-10-03 | 2010-09-22 | パナソニック株式会社 | 粘着テープ貼付装置及びテープ接続方法 |
JP5058953B2 (ja) * | 2007-12-06 | 2012-10-24 | 日東電工株式会社 | 光学表示ユニットの製造方法およびそれに用いられるロール原反 |
KR20090108951A (ko) * | 2008-04-14 | 2009-10-19 | 삼성전자주식회사 | 표시 장치의 제조 방법 |
US8182633B2 (en) * | 2008-04-29 | 2012-05-22 | Samsung Electronics Co., Ltd. | Method of fabricating a flexible display device |
KR101458901B1 (ko) * | 2008-04-29 | 2014-11-10 | 삼성디스플레이 주식회사 | 가요성 표시 장치의 제조 방법 |
-
2011
- 2011-08-02 KR KR1020110076882A patent/KR101839453B1/ko active IP Right Grant
-
2012
- 2012-07-13 US US13/549,160 patent/US8641851B2/en active Active
- 2012-08-01 CN CN201210272392.8A patent/CN102915965B/zh active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4904065A (en) * | 1987-06-22 | 1990-02-27 | Idemitsu Kosan Co., Ltd. | Liquid crystal optical element and method of producing the same using ferroelectric polymer liquid crystal |
Also Published As
Publication number | Publication date |
---|---|
CN102915965A (zh) | 2013-02-06 |
US20130032282A1 (en) | 2013-02-07 |
US8641851B2 (en) | 2014-02-04 |
KR101839453B1 (ko) | 2018-03-16 |
KR20130015068A (ko) | 2013-02-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102915965B (zh) | 用于制造柔性显示设备的装置和方法 | |
KR101295532B1 (ko) | 플렉시블 평판소자의 제조방법 | |
CN101669157B (zh) | 显示面板的制造装置及制造方法 | |
US20040123753A1 (en) | Method of fabricating color filter in display device | |
US9126356B2 (en) | Roll mold, method for fabricating the same and method for fabricating thin film pattern using the same | |
WO2012128468A2 (ko) | 디스플레이 패널용 필름 부착 장치 및 이를 이용한 필름 부착 방법 | |
KR100726419B1 (ko) | 인쇄장치 | |
KR101339170B1 (ko) | 액정 표시 패널 및 그 제조 방법 | |
US20120164317A1 (en) | Method for fabricating polarizer | |
CN104698686B (zh) | 一种挂版装置和取向膜涂布系统 | |
CN107561788A (zh) | 一种配相膜印刷版及其制作方法和配相膜印刷装置 | |
JP2016078393A (ja) | スクリーンマスク、スクリーンマスクの製造方法 | |
US7483114B2 (en) | Liquid crystal display device, substrate bonding apparatus, and method for fabricating liquid crystal display device using the same | |
KR20110025288A (ko) | 디스플레이 패널 유리판의 초박형화를 위한 에칭방법 | |
KR20100090916A (ko) | 롤러 타입 스템퍼 | |
CN101204870B (zh) | 印刷器件及使用该类器件构图薄膜的方法 | |
KR20110005425A (ko) | 인쇄롤러용 블랭킷 및 그 제조 방법 | |
CN105404051A (zh) | 一种显示面板及其制备方法和显示装置 | |
JP2008290032A (ja) | 塗布装置及び電気光学装置の製造方法 | |
JP2016541016A (ja) | フレキシブル基板接合方法 | |
KR100976557B1 (ko) | 액정표시장치의 배향막 인쇄장치 및 방법 | |
KR101903386B1 (ko) | 곡면형 플렉시블 디스플레이 제조 방법 | |
KR101347080B1 (ko) | 기판 합착용 프리 디스펜싱 장치, 및 이를 구비한 기판 합착 장치 | |
KR101533485B1 (ko) | 유리섬유시트의 수지조성물 도포용 자외선 경화기 | |
CN102436089A (zh) | 一种柔性基板强化方法及柔性强化基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |