CN102891116A - 内埋元件封装结构及制造方法 - Google Patents

内埋元件封装结构及制造方法 Download PDF

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CN102891116A
CN102891116A CN2011102039002A CN201110203900A CN102891116A CN 102891116 A CN102891116 A CN 102891116A CN 2011102039002 A CN2011102039002 A CN 2011102039002A CN 201110203900 A CN201110203900 A CN 201110203900A CN 102891116 A CN102891116 A CN 102891116A
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metallic elastic
embedded element
sheet metal
substrate
encapsulating structure
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CN102891116B (zh
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肖俊义
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AMBIT ELECTRONICS (ZHONGSHAN) Co Ltd
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AMBIT ELECTRONICS (ZHONGSHAN) Co Ltd
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Priority to US13/206,532 priority patent/US8625297B2/en
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Abstract

一种内埋元件封装结构，包括基板、至少一个芯片，多个被动元件、多个金属弹性组件及第一封胶体。芯片、被动元件及金属弹性组件之一端电连接于所述基板，第一封胶体包覆芯片、被动元件及金属弹性组件于所述基板之上。金属弹性组件之另一端裸露于第一封胶体之外表面。本发明的内埋元件封装结构，适用全系列规格的被动元件。本发明还揭示一种内埋元件封装结构制造方法，利用表面贴装技术及注胶成型技术将被动元件内埋于封胶体内，制程简单，制造成本低。

Description

内埋元件封装结构及制造方法
技术领域
本发明涉及一种内埋元件封装结构及制造方法，尤其涉及包括金属弹性组件的内埋元件封装结构及制造方法。
背景技术
现有技术中，内埋元件封装结构是在基板上制造收容槽，将被动元件固定在所述收容槽内，再对基板进行封装。由于需要在基板上制造收容槽，使得基板加工工艺复杂，成本高，不易实现量产。而且被动元件的尺寸需要小于收容槽，因此现有技术的内埋元件封装结构无法适用全系列规格的被动元件，需要订制特别外观的被动元件。
发明内容
有鉴于此，需提供一种内埋元件封装结构及制造方法，被动元件内埋于封胶体内，适用全系列规格的被动元件，且制程简单，能有效降低制造成本。
本发明提供的内埋元件封装结构，包括基板、至少一个芯片、多个被动元件、多个金属弹性组件及第一封胶体。所述芯片、所述被动元件及所述金属弹性组件之一端电连接于所述基板，所述第一封胶体包覆所述芯片、所述被动元件及所述金属弹性组件于所述基板上，所述金属弹性组件之另一端裸露于所述第一封胶体之外表面。
优选地，所述金属弹性组件包括金属弹性件及设于所述金属弹性件之两端的第一金属片及第二金属片，所述第一金属片分别固定于所述基板并与所述基板电连接，所述第二金属片裸露于所述第一封胶体之外表面。
优选地，所述第一金属片及所述第二金属片之边缘为斜面。
优选地，所述金属弹性件为弹簧。
优选地，所述金属弹性组件之第二金属片相互连接形成连续的金属屏蔽罩以屏蔽所述内埋元件封装结构。
优选地，所述芯片通过导热胶与所述金属屏蔽罩固定连接，所述芯片借助所述金属屏蔽罩散热。
本发明提供的内埋元件封装结构的制造方法，用于将至少一个芯片及多个被动元件内埋于第一封胶体内。所述内埋元件封装结构的制造方法包括：将所述芯片、所述被动元件及多个金属弹性组件之一端固定于基板并与所述基板电连接；利用注胶成型技术固定及填埋所述芯片、所述被动元件及所述金属弹性组件以形成第一封胶体，所述金属弹性组件之另一端裸露于所述第一封胶体之外表面；及蚀刻所述金属弹性组件之另一端的表面残留的胶体以使所述金属弹性组件之另一端完全裸露于所述第一封胶体之外表面。
优选地，所述金属弹性组件包括金属弹性件及设于所述金属弹性件之两端的第一金属片及第二金属片，所述第一金属片分别固定于所述基板并与所述基板电连接，所述第二金属片裸露于所述第一封胶体之外表面。
优选地，所述金属弹性组件之第二金属片相互连接形成连续的金属屏蔽罩以屏蔽所述内埋元件封装结构。
优选地，所述芯片通过导热胶与所述金属屏蔽罩固定连接，所述芯片借助所述金属屏蔽罩散热。
相较于现有技术，本发明的内埋元件封装结构将被动元件内埋于封胶体内，并通过设置金属弹性组件将基板的输入/输出接口导出至封胶体之外表面。由于金属弹性组件在封装过程中可适应不同的高度变化，故此种封装结构适用全系列规格的被动元件，无需订制特殊外观的被动元件，从而降低了封装产品的成本。
附图说明
图1所示为本发明一具体实施方式的内埋元件封装结构截面示意图。
图2所示为图1中内埋元件封装结构另一方向截面示意图，所述内埋元件封装结构具有电磁屏蔽结构。
图3所示为图2所示内埋元件封装结构示意图，所述内埋元件封装结构具有电磁屏蔽及散热结构。
图4所示为将芯片、被动元件及金属弹性组件固定于基板的示意图。
图5所示为图1中内埋元件封装结构之基板的第二表面封装电子元件之示意图。
主要元件符号说明
内埋元件封装结构        100
基板                    10
第一表面                11
第二表面                12
第一电路层              13
第二电路层              14
贯孔                    15
被动元件                20
金属弹性组件            30
金属弹性件              31
第一金属片              32
第二金属片              33
斜面                    34
芯片                    41
电子元件                42
第一封胶体              50
外表面                  51
第二封胶体              60
锡膏                    71
胶体                    72
导热胶                  73
锡球                    74
金属线                  80
金属屏蔽罩              90
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请同时参照图1及图2。本发明之内埋元件封装结构100包括基板10、多个被动元件20、多个金属弹性组件30、至少一个芯片41及第一封胶体50。所述被动元件20、芯片41及金属弹性组件30之一端电连接于所述基板10。所述第一封胶体50包覆所述被动元件20、金属弹性组件30及芯片41于所述基板10之上。所述金属弹性组件30之另一端裸露于所述第一封胶体50之外表面51。所述基板10之输入/输出接口通过所述金属弹性组件30导出至第一封胶体50之外表面51。也就是说，金属弹性组件30与设于基板10上的电路层电连接，通过金属弹性组件30裸露于所述第一封胶体50之外表面51的部分，实现基板10与外界电路之间的电连接。
基板10包括第一表面11、与所述第一表面11相对设置的第二表面12及贯通所述第一表面11及第二表面12的多个贯孔15。所述第一表面11设有第一电路层13，所述第二表面12设有第二电路层14，所述第一电路层13及所述第二电路层14通过所述贯孔15实现电连接。本实施方式中，所述基板10之输入/输出接口(未图示)设于所述基板10之第二表面12的第二电路层14之上。
所述被动元件20通过第一封胶体50固定于所述基板10之第一表面11并通过锡膏71与所述基板10之第一电路层13电连接。所述芯片41通过胶体72与所述基板10之第一电路层13固定，并通过金属导线80与所述基板10第一电路层13实现电连接。当然，芯片41也可以通过锡球74与所述基板10之第一电路层13直接固定并实现电连接，如图3所示。
金属弹性组件30之一端通过锡膏71与所述基板10固定并与基板10之第一电路层13电连接，另一端裸露于第一封胶体50之外表面51。由于基板10之输入/输出接口位于基板10之第二表面12的第二电路层14，所述基板10之输入/输出接口通过贯孔15从第二电路层14被导入到第一电路层13，并通过金属弹性组件30从所述第一电路层13导出至第一封胶体50之外表面51。由于所述基板10之输入/输出接口被导出至第一封胶体50之外表面51，基板10之第二表面12无需与外部电路连接，因此，基板10之第二表面12可以封装其它电子元件42实现堆叠式封装，从而可以减小产品的尺寸，如图5所示。电子元件42固定于基板10之第二表面12并与基板10之第二电路层14电连接。第二封胶体60包覆所述电子元件42。本实施方式中，所述第一及第二封胶体50、60为环氧树脂。
本发明之内埋元件封装结构100将被动元件20内埋第一封胶体50内，并通过设置金属弹性组件30将位于基板10之第二表面12的输入/输出接口导出至第一封胶体50之外表面51，以实现内埋元件封装结构。由于金属弹性组件30在封装过程中可适应被动元件20不同的高度变化，故此种封装结构100适用全系列规格的被动元件20，无需订制特殊外观的被动元件20，从而降低了封装产品的成本。同时，所述基板10之第二表面12无需与外部电路连接，可以封装其它电子元件42，实现堆叠式封装，以减小产品的尺寸。
本实施方式中，所述金属弹性组件30包括金属弹性件31及分别设于金属弹性件31之两端的第一金属片32及第二金属片33。第一金属片32固定于所述基板10之第一表面11并与所述基板10之第一电路层13电连接，第二金属片33裸露于所述第一封胶体50之外表面51。第一封胶体50在注塑成型过程中，所述金属弹性组件30由于所述金属弹性件31的弹性不会因为注塑模具的压力而被损坏。同时，所述第二金属片33在金属弹性件31的弹性作用下与注塑模具之上模具始终保持紧密接触，不但可以防止环氧树脂覆盖所述第二金属片33以使所述第二金属片33裸露于第一封胶体50之外表面51，还可以消除所述第二金属片33之间的高度误差，保证第一封胶体50之外表面51的平整度。本实施方式中，金属弹性件31为弹簧，第一金属片32及第二金属片33之材质为铜，其表面均镀锡。当然，在本发明的其他实施方式中，金属弹性件31可以为金属弹片，第一金属片32及第二金属片33也可以为其它金属材质，其表面亦可以根据实际需求镀金或镀银。
本实施方式中，所述金属弹性组件30之第一金属片32及第二金属片33之边缘均为斜面34，所述斜面34的设置有利于环氧树脂与所述金属片32、33紧密结合，防止金属弹性组件30松动，以增强内埋元件封装结构100的性能稳定性。
请参照图2。作为本发明的改进，所述金属弹性组件30之第二金属片33相互连接形成连续的金属屏蔽罩90。所述金属屏蔽罩90遮蔽所述被动元件20及芯片41并与基板10之电路层13、14电连接，从而对内埋元件封装结构100实现电磁屏蔽功能。
请参照图3。作为本发明的进一步改进，本发明之内埋元件封装结构100之芯片41通过导热胶73与所述金属屏蔽罩90固定连接，从而所述芯片41可借助所述金属屏蔽罩90散热。
本发明之内埋元件封装结构制造方法用于将至少一个芯片41及多个被动元件30内埋于第一封胶体50内。所述内埋元件封装结构制造方法包括如下步骤。
请参阅图4，将所述芯片41、所述被动元件20及多个金属弹性组件30之一端利用表面贴装技术(SMT)固定于所述基板10并与所述基板10实现电连接。本实施方式中，被动元件20通过锡膏71焊接于所述基板10之第一表面11并与第一电路层13电连接，金属弹性组件30通过第一金属片32与基板10之第一表面11固定。所述第一金属片32通过锡膏71焊接于所述基板10之第一表面11并与第一电路层13电连接。芯片41通过锡球74与基板10之第一表面11固定并实现电连接。在其它实施方式中，芯片41通过胶体72与基板固定并通过金属线80与基板10实现电连接。
利用注胶成型技术固定及填埋所述被动元件20、所述芯片41及所述金属弹性组件30以形成第一封胶体50，所述金属弹性组件30之另一端裸露于所述第一封胶体50之外表面51。本实施方式中，所述金属弹性组件30之另一端，即第二金属片33裸露于所述第一封胶体50之外表面51。位于基板10之第二表面12的输入/输出接口通过基板10之贯孔15从第二电路层14被导入到第一电路层13，并通过金属弹性组件30从所述第一电路层13导出至第一封胶体50之外表面51。
蚀刻金属弹性组件30之另一端的表面残留的环氧树脂以使弹性组件30之另一端的表面完全裸露于所述第一封胶体50之外表面51。本实施方式中，蚀刻金属弹性组件30之第二金属片33之表面残留的环氧树脂以使第二金属片33之表面完全裸露于所述第一封胶体50之外表面51。
在金属弹性组件30之另一端的表面电镀锡。当然根据实际需要，若不需要镀锡，所述步骤亦可以省略。
本发明的内埋元件封装结构制造方法利用表面贴装技术(SMT)及注胶成型技术将被动元件20内埋于封胶体内，并通过金属弹性组件30将基板之输入/输出接口导出至所述第一封胶体50之外表面51以实现内埋元件封装结构，制程简单，制造成本低。

Claims (10)

1.一种内埋元件封装结构，包括基板、至少一个芯片、多个被动元件及第一封胶体，其特征在于，所述内埋元件封装结构还包括多个金属弹性组件，所述芯片、所述被动元件及所述金属弹性组件之一端电连接于所述基板，所述第一封胶体包覆所述芯片、所述被动元件及所述金属弹性组件于所述基板上，所述金属弹性组件之另一端裸露于所述第一封胶体之外表面。
2.如权利要求1所述的内埋元件封装结构，其特征在于，所述金属弹性组件包括金属弹性件及设于所述金属弹性件之两端的第一金属片及第二金属片，所述第一金属片分别固定于所述基板并与所述基板电连接，所述第二金属片裸露于所述第一封胶体之外表面。
3.如权利要求2所述的内埋元件封装结构，其特征在于，所述第一金属片及所述第二金属片之边缘为斜面。
4.如权利要求2所述的内埋元件封装结构，其特征在于，所述金属弹性件为弹簧。
5.如权利要求2所述的内埋元件封装结构，其特征在于，所述金属弹性组件之第二金属片相互连接形成连续的金属屏蔽罩以屏蔽所述内埋元件封装结构。
6.如权利要求5所述的内埋元件封装结构，其特征在于，所述芯片通过导热胶与所述金属屏蔽罩固定连接，所述芯片借助所述金属屏蔽罩散热。
7.一种内埋元件封装结构的制造方法，用于将至少一个芯片及多个被动元件内埋于第一封胶体内，其特征在于，所述内埋元件封装结构的制造方法包括：
将所述芯片、所述被动元件及多个金属弹性组件之一端固定于基板并与所述基板电连接；
利用注胶成型技术固定及填埋所述芯片、所述被动元件及所述金属弹性组件以形成第一封胶体，所述金属弹性组件之另一端裸露于所述第一封胶体之外表面；及
蚀刻所述金属弹性组件之另一端的表面残留的胶体以使所述金属弹性组件之另一端完全裸露于所述第一封胶体之外表面。
8.如权利要求7所述的内埋元件封装结构的制造方法，其特征在于，所述金属弹性组件包括金属弹性件及设于所述金属弹性件之两端的第一金属片及第二金属片，所述第一金属片分别固定于所述基板并与所述基板电连接，所述第二金属片裸露于所述第一封胶体之外表面。
9.如权利要求8所述的内埋元件封装结构的制造方法，其特征在于，所述金属弹性组件之第二金属片相互连接形成连续的金属屏蔽罩以屏蔽所述内埋元件封装结构。
10.如权利要求9所述的内埋元件封装结构的制造方法，其特征在于，所述芯片通过导热胶与所述金属屏蔽罩固定连接，所述芯片借助所述金属屏蔽罩散热。
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CN113453430B (zh) * 2018-03-08 2024-08-06 绿点高新科技股份有限公司 电子模组及其制造方法
CN112271170A (zh) * 2020-10-27 2021-01-26 苏州通富超威半导体有限公司 封装基板、倒装芯片封装结构及其制作方法

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