CN102886830B - 激光划线装置 - Google Patents

激光划线装置 Download PDF

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Publication number
CN102886830B
CN102886830B CN201210110615.0A CN201210110615A CN102886830B CN 102886830 B CN102886830 B CN 102886830B CN 201210110615 A CN201210110615 A CN 201210110615A CN 102886830 B CN102886830 B CN 102886830B
Authority
CN
China
Prior art keywords
price fixing
frame
laser
support plate
stone price
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210110615.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN102886830A (zh
Inventor
太田欣也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN102886830A publication Critical patent/CN102886830A/zh
Application granted granted Critical
Publication of CN102886830B publication Critical patent/CN102886830B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
CN201210110615.0A 2011-07-20 2012-04-16 激光划线装置 Expired - Fee Related CN102886830B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-158883 2011-07-20
JP2011158883A JP5271393B2 (ja) 2011-07-20 2011-07-20 レーザスクライブ装置

Publications (2)

Publication Number Publication Date
CN102886830A CN102886830A (zh) 2013-01-23
CN102886830B true CN102886830B (zh) 2015-04-01

Family

ID=47530611

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210110615.0A Expired - Fee Related CN102886830B (zh) 2011-07-20 2012-04-16 激光划线装置

Country Status (4)

Country Link
JP (1) JP5271393B2 (ko)
KR (1) KR101350012B1 (ko)
CN (1) CN102886830B (ko)
TW (1) TWI474888B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108463928B (zh) * 2016-01-30 2020-07-14 伊雷克托科学工业股份有限公司 系统隔离和光学隔间密封
CN107478168B (zh) * 2017-07-17 2019-06-21 浙江大学 奥氏体不锈钢冲压成形封头塑性变形量测量系统及方法
CN108176930A (zh) * 2018-03-02 2018-06-19 沈阳飞机工业（集团）有限公司 一种激光打标机操作台
CN109434295A (zh) * 2018-12-25 2019-03-08 东莞市智汇五金有限公司 一种微型电池五金壳自动化镭雕装置
JP6763038B2 (ja) * 2019-01-18 2020-09-30 株式会社ソディック 積層造形装置
JP7254538B2 (ja) * 2019-01-30 2023-04-10 株式会社ディスコ 加工装置
CN110590145A (zh) * 2019-08-22 2019-12-20 江苏荣泰玻璃制品有限公司 一种玻璃制品具有防震调高的切割设备
CN217193306U (zh) * 2022-03-10 2022-08-16 深圳市汉清达科技有限公司 一种视觉镭雕机

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2230929B1 (ko) * 1973-05-22 1980-10-31 Stumpf Guenter
JPH08118061A (ja) * 1994-10-21 1996-05-14 Amada Co Ltd レーザ加工機のワークテーブル
EP1136809A1 (de) * 2000-03-22 2001-09-26 Alusuisse Technology & Management AG Bestimmung des Festigkeitszustandes eines vorgewärmten Metallköpers mit thixotropen Eigenschaften
JP2006049465A (ja) * 2004-08-03 2006-02-16 Nikon Corp 露光装置及びマイクロデバイスの製造方法
KR100780442B1 (ko) * 2006-09-05 2007-12-05 주식회사 코리아이엔지 자동차용 조향각도 측정장치
WO2008032725A1 (fr) * 2006-09-13 2008-03-20 Hiraide Precision Co., Ltd. Appareil d'usinage par faisceau et appareil d'observation par faisceau
JP4803551B2 (ja) * 2006-09-13 2011-10-26 株式会社平出精密 ビーム加工装置およびビーム観察装置
US20080263877A1 (en) * 2007-04-24 2008-10-30 Newport Corporation Laser scribing system and method of use
WO2009128314A1 (ja) * 2008-04-14 2009-10-22 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
JP2009291815A (ja) * 2008-06-05 2009-12-17 Kyushu Mitoyo Kk レーザ加工装置
JP2010089143A (ja) * 2008-10-10 2010-04-22 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法及び割断装置
JP5478957B2 (ja) * 2009-06-30 2014-04-23 三星ダイヤモンド工業株式会社 脆性材料基板の割断方法
CN102050564A (zh) * 2009-10-30 2011-05-11 孙月卫 切割液晶显示器单元母板的方法及其自动化切割系统
JP5123923B2 (ja) * 2009-12-08 2013-01-23 三星ダイヤモンド工業株式会社 脆性基板の加工方法及び装置
JP5554593B2 (ja) * 2010-03-04 2014-07-23 株式会社ディスコ 加工装置
KR101008319B1 (ko) 2010-07-05 2011-01-13 (주)앤앤아이테크 반도체 칩 검사장치

Also Published As

Publication number Publication date
TWI474888B (zh) 2015-03-01
KR101350012B1 (ko) 2014-01-14
TW201304896A (zh) 2013-02-01
CN102886830A (zh) 2013-01-23
JP2013022611A (ja) 2013-02-04
KR20130011911A (ko) 2013-01-30
JP5271393B2 (ja) 2013-08-21

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150401

Termination date: 20210416

CF01 Termination of patent right due to non-payment of annual fee