JP5271393B2 - レーザスクライブ装置 - Google Patents
レーザスクライブ装置 Download PDFInfo
- Publication number
- JP5271393B2 JP5271393B2 JP2011158883A JP2011158883A JP5271393B2 JP 5271393 B2 JP5271393 B2 JP 5271393B2 JP 2011158883 A JP2011158883 A JP 2011158883A JP 2011158883 A JP2011158883 A JP 2011158883A JP 5271393 B2 JP5271393 B2 JP 5271393B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- support plate
- stone surface
- plate
- surface plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011158883A JP5271393B2 (ja) | 2011-07-20 | 2011-07-20 | レーザスクライブ装置 |
TW101113523A TWI474888B (zh) | 2011-07-20 | 2012-04-16 | Lightning scribing device |
CN201210110615.0A CN102886830B (zh) | 2011-07-20 | 2012-04-16 | 激光划线装置 |
KR1020120065471A KR101350012B1 (ko) | 2011-07-20 | 2012-06-19 | 레이저 스크라이브 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011158883A JP5271393B2 (ja) | 2011-07-20 | 2011-07-20 | レーザスクライブ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013022611A JP2013022611A (ja) | 2013-02-04 |
JP5271393B2 true JP5271393B2 (ja) | 2013-08-21 |
Family
ID=47530611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011158883A Expired - Fee Related JP5271393B2 (ja) | 2011-07-20 | 2011-07-20 | レーザスクライブ装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5271393B2 (ko) |
KR (1) | KR101350012B1 (ko) |
CN (1) | CN102886830B (ko) |
TW (1) | TWI474888B (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11033982B2 (en) * | 2016-01-30 | 2021-06-15 | Electro Scientific Industries, Inc. | System isolation and optics bay sealing |
CN107478168B (zh) * | 2017-07-17 | 2019-06-21 | 浙江大学 | 奥氏体不锈钢冲压成形封头塑性变形量测量系统及方法 |
CN108176930A (zh) * | 2018-03-02 | 2018-06-19 | 沈阳飞机工业(集团)有限公司 | 一种激光打标机操作台 |
CN109434295A (zh) * | 2018-12-25 | 2019-03-08 | 东莞市智汇五金有限公司 | 一种微型电池五金壳自动化镭雕装置 |
JP6763038B2 (ja) * | 2019-01-18 | 2020-09-30 | 株式会社ソディック | 積層造形装置 |
JP7254538B2 (ja) * | 2019-01-30 | 2023-04-10 | 株式会社ディスコ | 加工装置 |
CN110590145A (zh) * | 2019-08-22 | 2019-12-20 | 江苏荣泰玻璃制品有限公司 | 一种玻璃制品具有防震调高的切割设备 |
CN217193306U (zh) * | 2022-03-10 | 2022-08-16 | 深圳市汉清达科技有限公司 | 一种视觉镭雕机 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2230929B1 (ko) * | 1973-05-22 | 1980-10-31 | Stumpf Guenter | |
JPH08118061A (ja) * | 1994-10-21 | 1996-05-14 | Amada Co Ltd | レーザ加工機のワークテーブル |
EP1136809A1 (de) * | 2000-03-22 | 2001-09-26 | Alusuisse Technology & Management AG | Bestimmung des Festigkeitszustandes eines vorgewärmten Metallköpers mit thixotropen Eigenschaften |
JP2006049465A (ja) * | 2004-08-03 | 2006-02-16 | Nikon Corp | 露光装置及びマイクロデバイスの製造方法 |
KR100780442B1 (ko) * | 2006-09-05 | 2007-12-05 | 주식회사 코리아이엔지 | 자동차용 조향각도 측정장치 |
WO2008032725A1 (fr) * | 2006-09-13 | 2008-03-20 | Hiraide Precision Co., Ltd. | Appareil d'usinage par faisceau et appareil d'observation par faisceau |
JP4803551B2 (ja) * | 2006-09-13 | 2011-10-26 | 株式会社平出精密 | ビーム加工装置およびビーム観察装置 |
US20080263877A1 (en) * | 2007-04-24 | 2008-10-30 | Newport Corporation | Laser scribing system and method of use |
JP5314674B2 (ja) * | 2008-04-14 | 2013-10-16 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の加工方法 |
JP2009291815A (ja) * | 2008-06-05 | 2009-12-17 | Kyushu Mitoyo Kk | レーザ加工装置 |
JP2010089143A (ja) * | 2008-10-10 | 2010-04-22 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の割断方法及び割断装置 |
JP5478957B2 (ja) * | 2009-06-30 | 2014-04-23 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の割断方法 |
TW201114525A (en) * | 2009-10-30 | 2011-05-01 | Sun Yueh Way | Method for cutting a liquid crystal display cell mother board and automatic cutting system for the same |
JP5123923B2 (ja) * | 2009-12-08 | 2013-01-23 | 三星ダイヤモンド工業株式会社 | 脆性基板の加工方法及び装置 |
JP5554593B2 (ja) * | 2010-03-04 | 2014-07-23 | 株式会社ディスコ | 加工装置 |
KR101008319B1 (ko) | 2010-07-05 | 2011-01-13 | (주)앤앤아이테크 | 반도체 칩 검사장치 |
-
2011
- 2011-07-20 JP JP2011158883A patent/JP5271393B2/ja not_active Expired - Fee Related
-
2012
- 2012-04-16 TW TW101113523A patent/TWI474888B/zh not_active IP Right Cessation
- 2012-04-16 CN CN201210110615.0A patent/CN102886830B/zh not_active Expired - Fee Related
- 2012-06-19 KR KR1020120065471A patent/KR101350012B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR101350012B1 (ko) | 2014-01-14 |
CN102886830B (zh) | 2015-04-01 |
JP2013022611A (ja) | 2013-02-04 |
CN102886830A (zh) | 2013-01-23 |
TW201304896A (zh) | 2013-02-01 |
KR20130011911A (ko) | 2013-01-30 |
TWI474888B (zh) | 2015-03-01 |
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Legal Events
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