WO2009128314A1 - 脆性材料基板の加工方法 - Google Patents
脆性材料基板の加工方法 Download PDFInfo
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- WO2009128314A1 WO2009128314A1 PCT/JP2009/055059 JP2009055059W WO2009128314A1 WO 2009128314 A1 WO2009128314 A1 WO 2009128314A1 JP 2009055059 W JP2009055059 W JP 2009055059W WO 2009128314 A1 WO2009128314 A1 WO 2009128314A1
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- substrate
- laser
- scribe line
- scribe
- crack
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Definitions
- the present invention relates to a method for processing a brittle material substrate by laser irradiation, and more specifically, a scribe consisting of cracks of a finite depth on a substrate by irradiating a first laser beam along a scribe line set on the substrate.
- the present invention relates to a processing method of a brittle material substrate in which a line is formed and then a second laser beam is irradiated to penetrate the scribe line deeply or completely divided.
- the brittle material substrate means a glass substrate, sintered ceramics, single crystal silicon, a semiconductor wafer, a sapphire substrate, a ceramic substrate, or the like.
- laser scribing which irradiates a brittle material substrate such as a glass substrate with a laser beam, scans the beam spot formed on the substrate, heats it in a line, and blows and cools the coolant immediately after heating.
- a brittle material substrate such as a glass substrate
- laser beam which irradiates a brittle material substrate such as a glass substrate with a laser beam, scans the beam spot formed on the substrate, heats it in a line, and blows and cools the coolant immediately after heating.
- the occurrence of cullet can be reduced, and the end face strength can be improved.
- laser scribing is employed in various manufacturing processes and the like that require cutting a glass substrate and the like, including flat panel displays.
- a virtual line to be divided (referred to as a scribe planned line) is set. Then, an initial crack is formed with a cutter wheel or the like at the substrate end that is the starting end of the scheduled scribe line, and a beam spot and a cooling spot (region where the coolant is injected) are formed at the starting end along the scheduled scribe line. Scan. At this time, as a result of the stress gradient generated based on the temperature distribution generated in the vicinity of the scribe line, a line-shaped crack is formed (see Patent Document 1, Patent Document 2, and Patent Document 3).
- a line-shaped crack formed by scanning a laser beam with respect to a brittle material substrate has a “finite depth crack” in which the tip in the depth direction of the crack does not reach the back surface of the substrate, and the crack is formed on the substrate.
- a “penetrating crack” (see, for example, Patent Document 2) that reaches the back surface of the substrate and divides the substrate all at once.
- the cutting line formed by the former “crack of finite depth” is called a scribe line, and the dividing line by the latter through crack is called a full cut line.
- FIG. 8 is a cross-sectional view of a substrate schematically showing the mechanism by which cracks of finite depth are formed. That is, the preceding laser heating causes a compressive stress HR on the substrate GA as shown in FIG. Subsequently, as a result of cooling after heating, a tensile stress CR is generated on the substrate surface as shown in FIG. At this time, the compressive stress HR moves inside the substrate due to the movement of heat, and an internal stress field Hin is formed. As a result, as shown in FIG. 8C, a stress gradient in the depth direction is generated, and a crack Cr is formed.
- the compressive stress field Hin existing inside the substrate prevents further penetration of the crack Cr in the depth direction.
- the crack Cr has a finite depth. Therefore, in order to completely divide the substrate, a break process must be further performed after a scribe line having a finite depth by the crack Cr is formed.
- the processed end face of the scribe line by the crack Cr is very beautiful (the surface unevenness is small), and is excellent in straightness, which is an ideal state as the processed end face.
- FIG. 9 is a perspective view (FIG. 9 (a)) and a plan view (FIG. 9 (b)) of a substrate schematically showing a mechanism of forming a through crack. That is, a compressive stress HR is generated on the substrate surface by the beam spot BS of the laser beam scanned from the position of the initial crack TR. At the same time, a tensile stress CR is generated on the substrate surface due to the cooling spot CS behind the beam spot BS. As a result, a stress gradient in the front-rear direction is formed on the scanning line (on the planned scribe line L), and this stress gradient causes a force that tears the substrate left and right along the scanning line direction to form a through crack. Then, the substrate is divided.
- a compressive stress HR is generated on the substrate surface by the beam spot BS of the laser beam scanned from the position of the initial crack TR.
- a tensile stress CR is generated on the substrate surface due to the cooling spot CS behind the beam spot BS.
- this “penetration crack” is formed, it is convenient in that the substrate can be divided (full cut) without performing a break treatment, and depending on the processing application, division by this mechanism may be desired.
- the straightness of the processing end surface of the full cut line may be impaired, and the beauty (surface irregularities) of the end surface of the full cut line is also described above. The quality is inferior compared to the scribe line.
- Whether a scribe line or a full cut line is formed by laser scribing depends on heating conditions (laser wavelength, irradiation time, output power, scanning speed, etc.) and cooling conditions (refrigerant temperature, spraying amount, spraying). Position, etc.) and the thickness of the substrate. In general, when the thickness of the glass substrate is thin, a full cut line is likely to be formed as compared with the case where the glass substrate is thick, and the process window for processing conditions capable of forming a scribe line is narrow.
- a mechanical break treatment in which a bending moment is applied by pressing a break bar or the like against a scribe line may be used.
- cullet may be generated when a large bending moment is applied to the substrate. Therefore, in a manufacturing process that does not like the occurrence of cullet, it is necessary to form a scribe line that is as deep as possible so that the breaking process can be performed only by applying a small bending moment.
- a second laser irradiation is performed along the scribe line formed by laser scribing to penetrate the crack of a finite depth deeper (in this case, a mechanical break treatment is further performed), or the crack reaches the back surface.
- Laser break processing is performed to penetrate and divide (see, for example, Patent Documents 1 to 3). JP 2001-130921 A JP 2006-256944 A WO2003 / 008352 Publication
- the present invention can perform a stable laser breaking process when a laser scribing process is performed on the substrate after the laser scribing process is performed and then the substrate is completely cut or a deeper scribing line is formed. It is an object of the present invention to provide a method for processing a brittle material substrate. Another object of the present invention is to provide a method for processing a brittle material substrate that can stably perform a cutting process with excellent end face quality of a processed end face.
- the present invention has been made by observing a processed surface formed by laser scribe processing and examining its characteristics. That is, the processing method of the brittle material substrate of the present invention made in order to solve the above-mentioned problems, the following scribe planned line from the first substrate end to the second substrate end set to the brittle material substrate, the following The substrate is processed by performing laser irradiation twice in the procedure.
- an initial crack forming step is performed in which an initial crack is formed on a scribe line near the first substrate end. At this time, similarly to the initial crack at the time of the conventional laser scribing process, it can be formed at the substrate end (first substrate end), but it may be formed inside the substrate on the scribe line near the substrate end.
- the beam spot of the first laser irradiation is relatively moved from the first substrate end side along the scribe line to the second substrate end to heat the substrate below the softening temperature, and A laser scribing process for forming a scribe line of a finite depth along the planned scribe line is performed using a stress gradient in the depth direction generated in the planned scribe line by blowing a coolant on the portion immediately after passing.
- a scribe line composed of a finite depth crack formed based on the stress gradient in the depth direction is formed, Avoid full cut lines.
- the heating condition for example, laser output increase
- the cooling condition for example, increase in the refrigerant injection amount
- the heating conditions and the cooling conditions should not be so extreme.
- a laser break process is performed in which the beam spot of the second laser irradiation is relatively moved along the scribe line in the reverse direction from the second substrate end to the first substrate end to penetrate the scribe line further deeply. .
- a laser break process is performed in which the scribe line is further deeply penetrated to be completely divided.
- a deep scribe line is advanced in a reverse direction along a planned scribe line by performing a laser break process starting from a locally deep crack at the edge of the second substrate formed in the laser scribe process.
- a deeper scribe line than before can be formed easily and stably, and the cutting process can be easily performed.
- a process window (a range that can be set as a processing condition) that can be set during the laser break process can be widened.
- the initial crack is preferably formed so as to be separated from the end of the first substrate.
- the initial crack is preferably formed so as to be separated from the end of the first substrate.
- the pre-run phenomenon means that the initial crack TR formed at the start end is caused by the beam spot BS at the start end (first substrate end) which is the substrate end on the side where laser irradiation starts in the scribe line L.
- This is a phenomenon in which, when heated, a crack K is formed in a direction that cannot be controlled from the heating area by the beam spot BS toward the front of the beam spot.
- the initial crack may be formed by pressing a grooved cutter wheel having a periodic groove formed on the blade edge.
- a periodic grooved cutter wheel specifically, a high-penetration cutting edge “Penette” (registered trademark) or “APIO” (registered trademark) manufactured by Samsung Diamond Industrial Co., Ltd. can be used.
- the blade edge is less likely to slip with respect to the substrate surface, and a short distance (about 1 mm to 2 mm) is required when forming an initial crack at a position separated from the substrate edge.
- a stable initial crack can be formed by simply rolling.
- the laser breaking step (c) when the beam spot of the second laser irradiation is relatively moved in the reverse direction from the second substrate end to the first substrate end along the scribe line, the front through which the beam spot passes. You may make it cool by spraying a refrigerant
- a large temperature difference between the substrate surface and the inside of the substrate can generate a strong compressive stress on the substrate surface and a tensile stress on the inside of the substrate, and a tearing force in the depth direction can be generated.
- Working, deep cracks can penetrate deeper.
- substrate processing method of this invention The figure which shows the structure of a cutter wheel with a periodic groove.
- FIG. 1 is a schematic configuration diagram of a substrate processing apparatus LS1 that can implement the processing method of the present invention.
- a case where a glass substrate is processed will be described as an example, but the same applies to a brittle material substrate such as a silicon substrate.
- a slide table 2 is provided that reciprocates in the front-rear direction (hereinafter referred to as the Y direction) of FIG. 1 along a pair of guide rails 3 and 4 arranged in parallel on a horizontal base 1.
- a screw screw 5 is disposed between the guide rails 3 and 4 along the front-rear direction, and a stay 6 fixed to the slide table 2 is screwed to the screw screw 5.
- the slide table 2 is formed so as to reciprocate in the Y direction along the guide rails 3 and 4 by forward and reverse rotation (not shown).
- a horizontal pedestal 7 is arranged so as to reciprocate in the left-right direction (hereinafter referred to as X direction) in FIG. 1 along the guide rail 8.
- a screw screw 10 that is rotated by a motor 9 is threaded through a stay 10a fixed to the pedestal 7, and the pedestal 7 is moved along the guide rail 8 in the X direction by rotating the screw screw 10a forward and backward. Move back and forth.
- a rotating table 12 that is rotated by a rotating mechanism 11 is provided on the base 7, and the glass substrate A is mounted on the rotating table 12 in a horizontal state.
- the glass substrate A is a mother substrate for cutting out a small unit substrate, for example.
- the rotation mechanism 11 is configured to rotate the rotary table 12 around a vertical axis, and is configured to be rotated at an arbitrary rotation angle with respect to a reference position. Further, the glass substrate A is fixed to the rotary table 12 by a suction chuck.
- a laser device 13 and an optical holder 14 are held by an attachment frame 15.
- the laser device 13 a general device for processing a brittle material substrate may be used. Specifically, an excimer laser, a YAG laser, a carbon dioxide gas laser, a carbon monoxide laser, or the like is used.
- a carbon dioxide gas laser that oscillates light having a wavelength with high energy absorption efficiency of the glass material.
- the laser beam emitted from the laser device 13 is irradiated with a beam spot having a preset shape onto the glass substrate A by an optical holder 14 incorporating a lens optical system for adjusting the beam shape.
- shapes with long axes are excellent in that they can be efficiently heated along the scribe line, but they should be heated at a temperature lower than the softening temperature.
- the shape of the beam spot is not particularly limited as long as it can be formed. In the present embodiment, an elliptical beam spot is formed.
- the mounting frame 15 is provided with a cooling nozzle 16 adjacent to the optical holder 14.
- a coolant is injected from the cooling nozzle 16.
- the refrigerant cooling water, compressed air, He gas, carbon dioxide gas, or the like can be used. In this embodiment, compressed air is injected.
- the cooling medium ejected from the cooling nozzle 16 is directed to a position slightly away from the left end of the beam spot so as to form a cooling spot on the surface of the glass substrate A.
- a cutter wheel 18 with a periodic groove is attached to the attachment frame 15 via an elevating mechanism 17.
- the cutter wheel 18 is used so as to temporarily descend from above the glass substrate A when the initial crack Tr is formed in the glass substrate A.
- FIG. 2 is a schematic diagram of a cutter wheel with a periodic groove
- FIG. 2 (a) is a front view
- FIG. 2 (b) is a side view.
- the periodic grooved cutter wheel 18 has grooves 18b periodically cut out along the blade edge 18a (in FIG. 2, for convenience of explanation, the size of the groove 18b with respect to the blade edge 18 is exaggerated from the actual one. Is drawn).
- the groove pitch is set in the range of 20 ⁇ m to 200 ⁇ m according to the wheel diameter of 1 to 20 mm.
- the groove depth is 2 ⁇ m to 2500 ⁇ m.
- the substrate processing apparatus LS1 is equipped with a camera 20 capable of detecting a positioning alignment mark engraved in advance on the glass substrate A. From the position of the alignment mark detected by the camera 20, the substrate is processed. A corresponding positional relationship between the position of the scheduled scribe line set on A and the rotary table 12 is obtained so that the lowered position of the cutter wheel 18 and the irradiation position of the laser beam can be accurately positioned so as to be on the scheduled scribe line. It is.
- FIG. 3 is a diagram showing a processing operation procedure of laser scribing until a scribe line is formed by the first laser irradiation
- FIG. 4 is a diagram showing a processing operation procedure for performing laser break processing by the second laser irradiation. is there. 3 and 4 show only the main part of FIG.
- the glass substrate A is placed on the rotary table 12 and fixed by a suction chuck.
- An alignment mark engraved on the glass substrate A is detected by the camera 20 (FIG. 1), and the positions of the scheduled scribe line and the rotary table 12, the slide table 2, and the base 7 are related based on the detection result. .
- the rotary table 12 and the slide table 2 are operated, and the position is adjusted so that the cutting edge direction of the cutter wheel 18 is aligned with the direction of the scribe line.
- the pedestal 7 is operated to move the turntable 12, and in the vicinity of the first substrate end A1 where the initial crack Tr is to be formed in the glass substrate A and the first substrate.
- the cutter wheel 18 is positioned above the position separated from the end A1.
- the lifting mechanism 17 is operated to lower the cutter wheel 18. Then, an initial crack Tr is formed so that the blade edge is pressed against the substrate A. At this time, the pedestal 7 is moved by about 2 mm to roll the cutter wheel 18 on the substrate, so that a stable initial crack Tr is reliably formed.
- the lifting mechanism 17 and the rotary table 12 are returned to their original positions (positions shown in FIG. 3A), and the laser device 13 is operated to irradiate the laser beam. Further, the coolant is injected from the cooling nozzle 16. At this time, the heating conditions and cooling conditions such as the laser output and the refrigerant injection amount are set within a range in which a through crack does not occur at the position of an initial crack Tr described later (that is, a full cut does not occur). As in the present embodiment, the initial crack Tr is separated from the substrate end (first substrate end A1) and formed at the inner position of the substrate, so that the first substrate end A1 has a force to tear left and right (full cut).
- the first substrate end A1 without an initial crack is in a state in which cracks are difficult to generate even if the initial force) is exerted. It is hard to become.
- the heating condition and the cooling condition such as the laser output to be irradiated and the refrigerant injection amount
- the process window in which the condition that does not cause a full cut can be selected is widened. Therefore, as the heating condition and cooling condition to be set, a condition that is more radical than when the initial crack is formed at the substrate end, that is, a condition capable of forming a deep scribe line may be selected.
- the pedestal 7 (FIG. 1) is moved, and the beam spot of the laser beam formed on the substrate A and the cooling spot by the coolant from the cooling nozzle 16 are scribed. Scan along the planned line.
- a scribe line made of crack Cr having a finite depth starting from the position of the initial crack Tr is formed on the substrate A.
- a laser heating condition or a cooling condition with a coolant within a range that does not cause a through crack a scribe line having a depth that has been difficult until now can be formed.
- a region where the crack Cr is not formed exists at the substrate end (first substrate end A1) of the substrate A on the initial crack Tr side.
- FIG. 5 is a photograph showing a cross section of a scribe line
- FIG. 5 (a) is a central portion of the substrate
- FIG. 5 (b) is a terminal portion.
- the depth of the crack Cr is 0.48 mm in the central portion of the substrate, whereas the terminal crack Cr1 penetrates to 1.6 mm.
- the laser device 13 is operated to irradiate the laser beam.
- the heating conditions at this time will be described later.
- the base 7 is moved, and the beam spot formed on the substrate A is reversed from the second substrate end A2 toward the first substrate end A1 along the scribe line. Scan in the direction.
- the deep crack Cr1 starts as a starting point and proceeds along the scribe line, a deeper scribe line is formed up to the first substrate end A1.
- region where the crack Cr is not formed exists in the 1st board
- the heating conditions for the laser break process will be described.
- the heating conditions such as laser output may be the same as in the first laser irradiation, but are preferably set as follows.
- the scanning speed is increased compared to the first laser irradiation, the heating time at each point on the scribe line is shortened (laser output is set high), and the surface layer of the scribe line is heated only for a short time.
- FIG. 6 is a cross-sectional view schematically showing a stress gradient to be formed during the laser break process.
- the substrate surface layer is heated for a short time to form a heating region H.
- a large compressive stress HR is formed on the surface layer of the substrate, and a tensile stress CR is generated inside the substrate in response to the influence. If the crack Cr exists inside the substrate, the tensile stress is concentrated at the tip of the crack Cr, and as a result, the crack Cr penetrates deeper.
- the temperature difference generated in the depth direction is reduced by transferring heat inside the substrate.
- the stress gradient in the depth direction is weakened. Therefore, in laser break processing, in order to set heating conditions and cooling conditions in which compressive stress is easily formed on the surface layer of the substrate and tensile stress is formed inside the substrate, heating conditions that heat strongly in a short time within a temperature range where the substrate does not soften Is preferably selected.
- the temperature difference in the depth direction may be increased by preliminarily blowing the coolant before cooling to increase the tensile stress in the substrate.
- a deeper scribe line is formed by using the deep crack Cr1 as a starting point.
- the initial position of the crack tip where the tensile stress is concentrated can be set to the deep position of the substrate.
- laser irradiation is performed to give a strong compressive stress to the substrate surface layer.
- tensile stress concentrates on the crack tip at a deep position, and the longer the distance from the substrate surface to the crack tip, the greater the force (moment) to spread the crack in the direction to tear the crack tip. As it comes to work, the cracks penetrate deeply.
- FIG. 7 is a cross-sectional view schematically showing the state of progress of the partial cross section when the laser break treatment is performed with the deep crack Cr1 as the starting end.
- the crack Cr2 advances by the laser break process while maintaining the depth of the deep crack Cr1. Go.
- the initial crack Tr is formed at a position separated from the first substrate end A1 during the laser scribing process.
- the initial crack Tr is formed from the first substrate end A1. Also good.
- the scribe line formed by the first laser irradiation is the same as the conventional case.
- the second laser irradiation is scanned from the second substrate end A2 toward the first substrate end A1, so that the deep crack Cr1 is used as the starting end.
- a scribe line made of the deep crack Cr2 can be formed.
- the presence or depth of cracks may be detected by an optical sensor.
- Two sensors may be provided at positions corresponding to the two inspection ranges, or one sensor may be movably provided at positions corresponding to the two inspection ranges by an air cylinder or the like.
- the present invention can be used for a process of forming a deep scribe line or completely dividing a brittle material substrate such as a glass substrate.
Abstract
Description
ここで、脆性材料基板とは、ガラス基板、焼結材料のセラミックス、単結晶シリコン、半導体ウエハ、サファイア基板、セラミック基板等をいう。
そのため、フラットパネルディスプレイをはじめ、ガラス基板等を分断することが必要な種々の製造工程等でレーザスクライブ加工が採用されている。
前者の「有限深さのクラック」により形成される切筋をスクライブラインと呼び、後者の貫通クラックによる分断ラインをフルカットラインと呼ぶ。これらは異なるメカニズムにより形成される。
また、レーザブレイク処理で基板を完全分断しない場合であっても、レーザスクライブ加工において少しでも深いスクライブラインを形成しておく方が、後のレーザブレイク処理でさらに深いスクライブラインにすることが簡単にできるようになるので望ましい。
また、本発明は、加工端面の端面品質が優れた分断加工を安定して行える脆性材料基板の加工方法を提供することを目的とする。
(a)まず、前記第一基板端近傍のスクライブ予定ライン上に初期亀裂を形成する初期亀裂形成工程を行う。このとき、従来のレーザスクライブ加工時における初期亀裂と同様に、基板端(第一基板端)に形成することもできるが、基板端近傍のスクライブ予定ライン上で基板内側に形成してもよい。
(b)続いて、第一回目のレーザ照射のビームスポットを第一基板端側からスクライブ予定ラインに沿って第二基板端まで相対移動させて基板を軟化温度以下で加熱するとともに、ビームスポットの通過直後の部位に冷媒を吹き付けて冷却し、スクライブ予定ラインに生じる深さ方向の応力勾配を利用して、スクライブ予定ラインに沿って有限深さのスクライブラインを形成するレーザスクライブ工程を行う。
このとき、ビームスポットによる加熱条件、冷却スポットによる冷却条件を、適切に選択することにより、深さ方向の応力勾配に基づいて形成される有限深さのクラックからなるスクライブラインを形成するようにし、フルカットラインにならないようにする。具体的には、基板表面の温度差が激しくなる加熱条件(例えばレーザ出力増大)や冷却条件(例えば冷媒噴射量増大)にしすぎると、スクライブラインよりもフルカットラインになりやすい傾向があるので、従来と同程度の条件、すなわち加熱条件や冷却条件があまり過激な条件にならないようにする。
(c)さらに、第二回目レーザ照射のビームスポットを、スクライブラインに沿って第二基板端から前記第一基板端まで逆方向に相対移動させてスクライブラインをさらに深く浸透させるレーザブレイク工程を行う。あるいは、スクライブラインをさらに深く浸透させて完全に分断されるレーザブレイク工程を行う。
また、局所的に深いクラックを起点としてレーザブレイク処理を実行できるので、レーザブレイク処理の際に、設定可能なプロセスウインドウ(加工条件として設定できる範囲)を広くすることができる。
上記発明の(a)の初期亀裂形成工程において、初期亀裂は第一基板端から離隔するように形成するのが好ましい。
初期亀裂を第一基板端から離隔させることにより、(b)のレーザスクライブ工程のときにフルカットラインが形成されにくくなる。よってレーザスクライブ工程の際の加熱条件や冷却条件を、従来よりも温度差が大きくなる条件(従来より過激な条件)に変更することが可能になり、設定可能なプロセスウインドウが広まり、これまでよりも深いスクライブラインを形成することができるようになる。
第一基板端に初期亀裂を形成した場合、深いスクライブラインを形成しようとして、加熱条件や冷却条件をこれまでよりも過激な加熱条件や冷却条件にシフトさせた場合に、このような「先走り」の発生する頻度が高まる傾向があるが、初期亀裂を第一基板端から離隔させることにより、多少過激な加熱条件や冷却条件にシフトさせた場合であっても先走りは発生しなくなる。
ここで周期溝付カッターホイールとしては、具体的には三星ダイヤモンド工業株式会社製の高浸透刃先「ぺネット」(登録商標)や「APIO」(登録商標)を用いることができる。
刃先に周期溝が形成されたカッターホイールを用いることにより、基板面に対して刃先が滑りにくくなり、基板端から離隔した位置に初期亀裂を形成する際に、短い距離(1mm~2mm程度)を転動させるだけで確実に安定した初期亀裂を形成することができる。
これにより、レーザブレイク工程の際に、基板表面と基板内部との間の大きな温度差により、基板表面に圧縮応力、基板内部に引張応力を強く発生させることができ、深さ方向に引き裂く力が働いて、深いクラックをさらに深く浸透させることができる。
7 台座
12 回転テーブル
13 レーザ装置
16 冷却ノズル
17 昇降機構
18 周期溝付カッターホイール
A ガラス基板(脆性材料基板)
BS ビームスポット
CS 冷却スポット
Cr クラック
Cr1 深いクラック
Cr2 クラック
Tr 初期亀裂
最初に、本発明の加工方法を実施する際に用いる基板加工装置の一例について説明する。
図1は本発明の加工方法を実施することができる基板加工装置LS1の概略構成図である。ここではガラス基板を加工する場合を例に説明するが、シリコン基板等の脆性材料基板であっても同様である。
レーザ装置13は、脆性材料基板の加工用として一般的なものを使用すればよく、具体的にはエキシマレーザ、YAGレーザ、炭酸ガスレーザ又は一酸化炭素レーザなどが使用される。ガラス基板Aの加工には、ガラス材料のエネルギー吸収効率が大きい波長の光を発振する炭酸ガスレーザを使用することが好ましい。
酸ガス等を用いることができるが、本実施形態では圧縮空気を噴射するようにしてある。冷却ノズル16から噴射される冷却媒体は、ビームスポットの左端から少し離れた位置に向けられ、ガラス基板Aの表面に冷却スポットを形成するようにしてある。
本実施形態のように初期亀裂Trを基板端(第一基板端A1)から離隔させて基板内側位置に形成しておくことにより、第一基板端A1に左右に裂こうとする力(フルカット状態にする力)が働いたとしても、初期亀裂のない第一基板端A1は、クラック発生が困難な状態になっているので、基板端A1に初期亀裂を形成した場合に比べて、フルカットになりにくい。また、照射するレーザ出力や冷媒噴射量等の加熱条件、冷却条件については、フルカットにならない条件を選択できるプロセスウインドウが広くなっている。したがって、設定する加熱条件や冷却条件としては、初期亀裂を基板端に形成したときよりも過激な条件、すなわちスクライブラインを深く形成することができる条件を選択してもよい。
第二基板端A2に形成された深いクラックCr1をレーザブレイク処理の開始端とすることにより、引張応力が集中するクラック先端の初期位置を基板の深い位置にすることができる。この状態で、レーザ照射を行うことにより、基板表層に強い圧縮応力を与える。これにより、深い位置のクラック先端に引張応力が集中するようになり、さらに、基板表面からクラック先端までの距離が長いほど、クラックを広げようとする大きな力(モーメント)がクラック先端を引き裂く方向に働くようになるので、クラックが深く浸透するようになる。
このメカニズムにより形成された分断面は、非常に美しく、しかも直進性に優れており、加工端面として理想的な状態となっている。
Claims (4)
- 脆性材料基板に設定した第一の基板端から第二の基板端までのスクライブ予定ラインに沿って二度のレーザ照射を行うことにより前記基板を加工する脆性材料基板の加工方法であって、
(a)前記第一基板端近傍のスクライブ予定ライン上に初期亀裂を形成する初期亀裂形成工程と、
(b)第一回目のレーザ照射のビームスポットを前記第一基板端側から前記スクライブ予定ラインに沿って前記第二基板端まで相対移動させて前記基板を軟化温度以下で加熱するとともに、前記ビームスポットの通過直後の部位に冷媒を吹き付けて冷却し、前記スクライブ予定ラインに生じる深さ方向の応力勾配を利用して前記スクライブ予定ラインに沿って有限深さのスクライブラインを形成するレーザスクライブ工程と、
(c)第二回目レーザ照射のビームスポットを前記スクライブラインに沿って前記第二基板端から前記第一基板端までレーザスクライブ工程とは逆方向に相対移動させて前記スクライブラインをさらに深く浸透させるか、または、完全に分断させるレーザブレイク工程とからなる脆性材料基板の加工方法。 - (a)の初期亀裂形成工程において、前記初期亀裂は第一基板端から離隔するように形成する請求項1に記載の脆性材料基板の加工方法。
- (a)の初期亀裂形成工程において、前記初期亀裂は刃先に周期溝が形成された溝付きカッターホイールを圧接することにより形成する請求項2に記載の脆性材料基板の加工方法。
- (c)のレーザブレイク工程において、第二回目レーザ照射のビームスポットを前記スクライブラインに沿って前記第二基板端から前記第一基板端まで逆方向に相対移動させる際に、ビームスポットが通過する前方の部位に冷媒を吹き付けて冷却する請求項1~請求項4のいずれかに記載の脆性材料基板の加工方法。
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JP5237318B2 (ja) * | 2010-03-19 | 2013-07-17 | 三星ダイヤモンド工業株式会社 | 基板分断装置 |
JP5271393B2 (ja) * | 2011-07-20 | 2013-08-21 | 三星ダイヤモンド工業株式会社 | レーザスクライブ装置 |
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JP2013136074A (ja) * | 2011-12-28 | 2013-07-11 | Mitsuboshi Diamond Industrial Co Ltd | 分断装置、被加工物の分断方法、および光学素子パターン付き基板の分断方法 |
JP6154713B2 (ja) * | 2013-09-30 | 2017-06-28 | 三星ダイヤモンド工業株式会社 | 脆性材料基板のブレイク方法並びにブレイク装置 |
KR101650076B1 (ko) * | 2014-06-10 | 2016-08-22 | 한국미쯔보시다이아몬드공업(주) | 취성 재료 기판의 가공방법 |
JP6303861B2 (ja) * | 2014-06-25 | 2018-04-04 | 三星ダイヤモンド工業株式会社 | 単結晶基板の分断方法 |
KR101691933B1 (ko) * | 2016-05-24 | 2017-01-02 | 유원기 | 조류 발전기 |
CN106830658B (zh) * | 2016-12-26 | 2019-04-16 | 上海科弦精密工具有限公司 | 一种平面镜刀具 |
CN107414317B (zh) * | 2017-08-31 | 2018-12-11 | 杭州富阳富宝仪表机床厂 | 一种便于调节的大理石用激光器切割装置 |
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