KR101165982B1 - 취성 재료 기판의 가공 방법 - Google Patents

취성 재료 기판의 가공 방법 Download PDF

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Publication number
KR101165982B1
KR101165982B1 KR1020107025335A KR20107025335A KR101165982B1 KR 101165982 B1 KR101165982 B1 KR 101165982B1 KR 1020107025335 A KR1020107025335 A KR 1020107025335A KR 20107025335 A KR20107025335 A KR 20107025335A KR 101165982 B1 KR101165982 B1 KR 101165982B1
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KR
South Korea
Prior art keywords
substrate
laser
substrate end
crack
scribe line
Prior art date
Application number
KR1020107025335A
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English (en)
Korean (ko)
Other versions
KR20110003531A (ko
Inventor
아츠시 이무라
켄지 후쿠하라
고오지 야마모토
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Publication of KR20110003531A publication Critical patent/KR20110003531A/ko
Application granted granted Critical
Publication of KR101165982B1 publication Critical patent/KR101165982B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
KR1020107025335A 2008-04-14 2009-03-16 취성 재료 기판의 가공 방법 KR101165982B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2008-105164 2008-04-14
JP2008105164 2008-04-14
PCT/JP2009/055059 WO2009128314A1 (ja) 2008-04-14 2009-03-16 脆性材料基板の加工方法

Publications (2)

Publication Number Publication Date
KR20110003531A KR20110003531A (ko) 2011-01-12
KR101165982B1 true KR101165982B1 (ko) 2012-07-18

Family

ID=41199014

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107025335A KR101165982B1 (ko) 2008-04-14 2009-03-16 취성 재료 기판의 가공 방법

Country Status (5)

Country Link
JP (1) JP5314674B2 (ja)
KR (1) KR101165982B1 (ja)
CN (1) CN102026925B (ja)
TW (1) TWI392550B (ja)
WO (1) WO2009128314A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5237318B2 (ja) * 2010-03-19 2013-07-17 三星ダイヤモンド工業株式会社 基板分断装置
JP5271393B2 (ja) * 2011-07-20 2013-08-21 三星ダイヤモンド工業株式会社 レーザスクライブ装置
KR101258403B1 (ko) * 2011-12-09 2013-04-30 로체 시스템즈(주) 강화유리 기판 절단방법
JP2013136074A (ja) * 2011-12-28 2013-07-11 Mitsuboshi Diamond Industrial Co Ltd 分断装置、被加工物の分断方法、および光学素子パターン付き基板の分断方法
JP6154713B2 (ja) * 2013-09-30 2017-06-28 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法並びにブレイク装置
KR101650076B1 (ko) * 2014-06-10 2016-08-22 한국미쯔보시다이아몬드공업(주) 취성 재료 기판의 가공방법
JP6303861B2 (ja) * 2014-06-25 2018-04-04 三星ダイヤモンド工業株式会社 単結晶基板の分断方法
KR101691933B1 (ko) * 2016-05-24 2017-01-02 유원기 조류 발전기
CN106830658B (zh) * 2016-12-26 2019-04-16 上海科弦精密工具有限公司 一种平面镜刀具
CN107414317B (zh) * 2017-08-31 2018-12-11 杭州富阳富宝仪表机床厂 一种便于调节的大理石用激光器切割装置
JP7076776B2 (ja) 2018-03-30 2022-05-30 三星ダイヤモンド工業株式会社 無機膜積層樹脂基板の分断方法および分断装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005054142A1 (ja) 2003-12-05 2005-06-16 Asahi Glass Company, Limited 板ガラスの切断方法及び装置
WO2006082899A1 (ja) 2005-02-02 2006-08-10 Mitsuboshi Diamond Industrial Co., Ltd. 焼結ダイヤモンドの加工方法並びに基板用カッターホイール及びその加工方法
JP2006263819A (ja) 2005-03-22 2006-10-05 Jenoptik Automatisierungstechnik Gmbh 非対称の放射線密度分布を有するレーザによる脆性材料を分断するための方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001176820A (ja) * 1999-12-15 2001-06-29 Hitachi Cable Ltd 基板の加工方法及びその加工装置
JP2002100590A (ja) * 2000-09-22 2002-04-05 Sony Corp 割断装置及びその方法
TW568809B (en) * 2001-09-21 2004-01-01 Mitsuboshi Diamond Ind Co Ltd Method for scribing substrate of brittle material and scriber
JP2006159747A (ja) * 2004-12-09 2006-06-22 Japan Steel Works Ltd:The レーザ加工方法及びその装置
JP2007099587A (ja) * 2005-10-07 2007-04-19 Kyoto Seisakusho Co Ltd 脆性材料の割断加工方法
JP2008168304A (ja) * 2007-01-09 2008-07-24 Murata Mfg Co Ltd レーザ割断方法
JP4886620B2 (ja) * 2007-07-04 2012-02-29 株式会社東芝 レーザ割断装置及び基板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005054142A1 (ja) 2003-12-05 2005-06-16 Asahi Glass Company, Limited 板ガラスの切断方法及び装置
WO2006082899A1 (ja) 2005-02-02 2006-08-10 Mitsuboshi Diamond Industrial Co., Ltd. 焼結ダイヤモンドの加工方法並びに基板用カッターホイール及びその加工方法
JP2006263819A (ja) 2005-03-22 2006-10-05 Jenoptik Automatisierungstechnik Gmbh 非対称の放射線密度分布を有するレーザによる脆性材料を分断するための方法

Also Published As

Publication number Publication date
CN102026925A (zh) 2011-04-20
WO2009128314A1 (ja) 2009-10-22
TWI392550B (zh) 2013-04-11
TW200950913A (en) 2009-12-16
JP5314674B2 (ja) 2013-10-16
JPWO2009128314A1 (ja) 2011-08-04
KR20110003531A (ko) 2011-01-12
CN102026925B (zh) 2013-06-05

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