CN102844976B - 电力转换装置 - Google Patents

电力转换装置 Download PDF

Info

Publication number
CN102844976B
CN102844976B CN201180016865.1A CN201180016865A CN102844976B CN 102844976 B CN102844976 B CN 102844976B CN 201180016865 A CN201180016865 A CN 201180016865A CN 102844976 B CN102844976 B CN 102844976B
Authority
CN
China
Prior art keywords
module
terminal
capacitor
flow path
power semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180016865.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN102844976A (zh
Inventor
前田建
中嶋贤市郎
加瀬政道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Automotive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd
Publication of CN102844976A publication Critical patent/CN102844976A/zh
Application granted granted Critical
Publication of CN102844976B publication Critical patent/CN102844976B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L50/00—Electric propulsion with power supplied within the vehicle
    • B60L50/10—Electric propulsion with power supplied within the vehicle using propulsion power supplied by engine-driven generators, e.g. generators driven by combustion engines
    • B60L50/16—Electric propulsion with power supplied within the vehicle using propulsion power supplied by engine-driven generators, e.g. generators driven by combustion engines with provision for separate direct mechanical propulsion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L50/00—Electric propulsion with power supplied within the vehicle
    • B60L50/50—Electric propulsion with power supplied within the vehicle using propulsion power supplied by batteries or fuel cells
    • B60L50/60—Electric propulsion with power supplied within the vehicle using propulsion power supplied by batteries or fuel cells using power supplied by batteries
    • B60L50/61—Electric propulsion with power supplied within the vehicle using propulsion power supplied by batteries or fuel cells using power supplied by batteries by batteries charged by engine-driven generators, e.g. series hybrid electric vehicles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2210/00—Converter types
    • B60L2210/40—DC to AC converters
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/076—Connecting or disconnecting of strap connectors
    • H10W72/07631—Techniques
    • H10W72/07636—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/62—Hybrid vehicles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/72—Electric energy management in electromobility

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
CN201180016865.1A 2010-04-01 2011-03-30 电力转换装置 Active CN102844976B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010084785A JP5422468B2 (ja) 2010-04-01 2010-04-01 電力変換装置
JP2010-084785 2010-04-01
PCT/JP2011/058097 WO2011125781A1 (ja) 2010-04-01 2011-03-30 電力変換装置

Publications (2)

Publication Number Publication Date
CN102844976A CN102844976A (zh) 2012-12-26
CN102844976B true CN102844976B (zh) 2015-03-18

Family

ID=44762721

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180016865.1A Active CN102844976B (zh) 2010-04-01 2011-03-30 电力转换装置

Country Status (5)

Country Link
US (1) US20130094269A1 (https=)
EP (1) EP2555408A4 (https=)
JP (1) JP5422468B2 (https=)
CN (1) CN102844976B (https=)
WO (1) WO2011125781A1 (https=)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4580997B2 (ja) 2008-03-11 2010-11-17 日立オートモティブシステムズ株式会社 電力変換装置
JP5273488B2 (ja) * 2010-11-05 2013-08-28 本田技研工業株式会社 電力変換装置
JP5417314B2 (ja) * 2010-12-27 2014-02-12 日立オートモティブシステムズ株式会社 電力変換装置
JP5506740B2 (ja) * 2011-05-31 2014-05-28 日立オートモティブシステムズ株式会社 電力変換装置
JP5508357B2 (ja) * 2011-07-29 2014-05-28 日立オートモティブシステムズ株式会社 電力変換装置
JP5855899B2 (ja) 2011-10-27 2016-02-09 日立オートモティブシステムズ株式会社 Ｄｃ−ｄｃコンバータ及び電力変換装置
JP5846854B2 (ja) * 2011-10-31 2016-01-20 日立オートモティブシステムズ株式会社 一体型電力変換装置及びそれに用いられるｄｃｄｃコンバータ装置
JP2013099213A (ja) * 2011-11-04 2013-05-20 Aisin Aw Co Ltd インバータ装置
JP5738794B2 (ja) * 2012-03-30 2015-06-24 日立オートモティブシステムズ株式会社 電力変換装置
JP5634429B2 (ja) * 2012-03-30 2014-12-03 日立オートモティブシステムズ株式会社 パワー半導体モジュール
JP6012330B2 (ja) * 2012-08-03 2016-10-25 日立オートモティブシステムズ株式会社 Ｄｃｄｃコンバータ
JP5941787B2 (ja) * 2012-08-09 2016-06-29 日立オートモティブシステムズ株式会社 パワーモジュールおよびパワーモジュールの製造方法
MX338272B (es) * 2012-08-24 2016-04-11 Nissan Motor Unidad electrica de alimentacion integrada montada en vehiculo electrico.
JP5753829B2 (ja) * 2012-09-28 2015-07-22 日立オートモティブシステムズ株式会社 電力変換装置
JP5914290B2 (ja) 2012-10-15 2016-05-11 日立オートモティブシステムズ株式会社 電力変換装置
JP6097557B2 (ja) 2012-12-26 2017-03-15 日立オートモティブシステムズ株式会社 電力変換装置
JP6098402B2 (ja) * 2013-07-03 2017-03-22 株式会社デンソー 電力変換装置
JP6117361B2 (ja) * 2013-08-23 2017-04-19 日立オートモティブシステムズ株式会社 電力変換装置
WO2015053139A1 (ja) * 2013-10-07 2015-04-16 日立オートモティブシステムズ株式会社 電力変換装置
US20150138734A1 (en) * 2013-11-18 2015-05-21 Magna Electronics Inc. 360 degree direct cooled power module
JP5858058B2 (ja) * 2014-01-10 2016-02-10 ダイキン工業株式会社 モータ制御装置
KR102220897B1 (ko) * 2014-09-03 2021-02-26 삼성에스디아이 주식회사 전기 이동수단
WO2016080068A1 (ja) 2014-11-18 2016-05-26 日立オートモティブシステムズ株式会社 電力変換装置
JP6168082B2 (ja) * 2015-02-27 2017-07-26 トヨタ自動車株式会社 電力変換装置
JP6399602B2 (ja) * 2015-03-23 2018-10-03 三菱重工サーマルシステムズ株式会社 電力変換用回路基板及び電動圧縮機
JP6571358B2 (ja) * 2015-03-24 2019-09-04 三菱重工サーマルシステムズ株式会社 電力変換用回路基板及び電動圧縮機
CN111162060B (zh) * 2015-06-17 2024-01-05 富士电机株式会社 功率半导体模块、流路部件及功率半导体模块结构体
FR3049120B1 (fr) * 2016-03-15 2023-12-08 Inst Vedecom Barre omnibus comportant une pluralite de manchons coaxiaux pourvus de bras dotes de pistes electriques
JP6631463B2 (ja) * 2016-10-17 2020-01-15 株式会社デンソー 電力変換装置
JP6723142B2 (ja) 2016-11-11 2020-07-15 三菱重工サーマルシステムズ株式会社 コンデンサユニット、電動圧縮機
EP3609066B1 (en) * 2018-08-07 2021-02-24 Mahle International GmbH Electric power inverter
JP6642753B1 (ja) * 2018-09-28 2020-02-12 株式会社明電舎 コンデンサ
CN111415909B (zh) 2019-01-07 2022-08-05 台达电子企业管理（上海）有限公司 多芯片封装功率模块
CN111415908B (zh) 2019-01-07 2022-02-22 台达电子企业管理（上海）有限公司 电源模块、芯片嵌入式封装模块及制备方法
US11676756B2 (en) 2019-01-07 2023-06-13 Delta Electronics (Shanghai) Co., Ltd. Coupled inductor and power supply module
US11063525B2 (en) 2019-01-07 2021-07-13 Delta Electronics (Shanghai) Co., Ltd. Power supply module and manufacture method for same
CN111415813B (zh) 2019-01-07 2022-06-17 台达电子企业管理（上海）有限公司 具有竖直绕组的电感的制备方法及其压注模具
JP7135930B2 (ja) 2019-02-20 2022-09-13 株式会社デンソー 半導体モジュールとそれを用いた電力変換装置
JP7003964B2 (ja) * 2019-04-05 2022-01-21 株式会社デンソー 電力変換装置
JP7306279B2 (ja) * 2020-01-24 2023-07-11 株式会社デンソー コンデンサモジュールおよび電力変換装置
JP6965461B1 (ja) * 2020-04-23 2021-11-10 東芝三菱電機産業システム株式会社 電力変換装置
JP7611794B2 (ja) * 2021-09-29 2025-01-10 本田技研工業株式会社 電力変換装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308266A (ja) * 2000-04-21 2001-11-02 Denso Corp 半導体モジュール装置
CN101110555A (zh) * 2006-07-21 2008-01-23 株式会社日立制作所 电力变换装置
US20080251909A1 (en) * 2007-04-02 2008-10-16 Hitachi, Ltd. Power Semiconductor Module for Inverter Circuit System

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6414867B2 (en) * 2000-02-16 2002-07-02 Hitachi, Ltd. Power inverter
JP3642012B2 (ja) * 2000-07-21 2005-04-27 株式会社日立製作所 半導体装置，電力変換装置及び自動車
JP4859443B2 (ja) * 2005-11-17 2012-01-25 日立オートモティブシステムズ株式会社 電力変換装置
JP4895968B2 (ja) * 2007-10-05 2012-03-14 日立オートモティブシステムズ株式会社 電力変換装置
JP4580997B2 (ja) 2008-03-11 2010-11-17 日立オートモティブシステムズ株式会社 電力変換装置
JP4657329B2 (ja) * 2008-07-29 2011-03-23 日立オートモティブシステムズ株式会社 電力変換装置および電動車両
JP4708459B2 (ja) * 2008-07-29 2011-06-22 日立オートモティブシステムズ株式会社 電力変換装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308266A (ja) * 2000-04-21 2001-11-02 Denso Corp 半導体モジュール装置
CN101110555A (zh) * 2006-07-21 2008-01-23 株式会社日立制作所 电力变换装置
US20080251909A1 (en) * 2007-04-02 2008-10-16 Hitachi, Ltd. Power Semiconductor Module for Inverter Circuit System

Also Published As

Publication number Publication date
US20130094269A1 (en) 2013-04-18
WO2011125781A1 (ja) 2011-10-13
EP2555408A1 (en) 2013-02-06
EP2555408A4 (en) 2018-01-24
CN102844976A (zh) 2012-12-26
JP5422468B2 (ja) 2014-02-19
JP2011217550A (ja) 2011-10-27

Similar Documents

Publication Publication Date Title
CN102844976B (zh) 电力转换装置
CN102835013B (zh) 电力转换装置
JP5557585B2 (ja) パワーモジュール
JP5624875B2 (ja) 電力変換装置
JP5455888B2 (ja) 車両用電力変換装置
JP5417314B2 (ja) 電力変換装置
JP5973026B2 (ja) パワー半導体装置
JP5506749B2 (ja) 電力変換装置
WO2012120594A1 (ja) 半導体モジュール、および半導体モジュールの製造方法
WO2012090666A1 (ja) 電力変換装置
WO2011162241A1 (ja) 電力変換装置
JP5378293B2 (ja) パワーモジュール及びそれを用いた電力変換装置
JP5978324B2 (ja) 電力変換装置
JP5568511B2 (ja) 電力用変換装置
JP5687786B2 (ja) 電力変換装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Ibaraki

Patentee after: Hitachi astemo Co.,Ltd.

Address before: Ibaraki

Patentee before: HITACHI AUTOMOTIVE SYSTEMS, Ltd.

CP01 Change in the name or title of a patent holder