CN102821545B - 多层布线板、其制造方法以及半导体装置 - Google Patents

多层布线板、其制造方法以及半导体装置 Download PDF

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Publication number
CN102821545B
CN102821545B CN201210167121.6A CN201210167121A CN102821545B CN 102821545 B CN102821545 B CN 102821545B CN 201210167121 A CN201210167121 A CN 201210167121A CN 102821545 B CN102821545 B CN 102821545B
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CN
China
Prior art keywords
layer
dielectric layer
metal foil
film capacitor
mooring portion
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210167121.6A
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English (en)
Chinese (zh)
Other versions
CN102821545A (zh
Inventor
冈修
冈修一
柳川周作
足立研
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Sony Corp
Original Assignee
Sony Corp
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Publication date
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Publication of CN102821545A publication Critical patent/CN102821545A/zh
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Publication of CN102821545B publication Critical patent/CN102821545B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201210167121.6A 2011-06-02 2012-05-25 多层布线板、其制造方法以及半导体装置 Expired - Fee Related CN102821545B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011124604A JP5757163B2 (ja) 2011-06-02 2011-06-02 多層配線基板およびその製造方法、並びに半導体装置
JP2011-124604 2011-06-02

Publications (2)

Publication Number Publication Date
CN102821545A CN102821545A (zh) 2012-12-12
CN102821545B true CN102821545B (zh) 2018-02-02

Family

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Family Applications (1)

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CN201210167121.6A Expired - Fee Related CN102821545B (zh) 2011-06-02 2012-05-25 多层布线板、其制造方法以及半导体装置

Country Status (3)

Country Link
US (1) US9672983B2 (https=)
JP (1) JP5757163B2 (https=)
CN (1) CN102821545B (https=)

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JP2012182437A (ja) * 2011-02-09 2012-09-20 Ngk Spark Plug Co Ltd 配線基板及びその製造方法
MY175520A (en) * 2014-02-21 2020-07-01 Mitsui Mining & Smelting Co Ltd Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board
KR20160004090A (ko) * 2014-07-02 2016-01-12 삼성전기주식회사 박막 인덕터용 코일 유닛, 박막 인덕터용 코일 유닛의 제조방법, 박막 인덕터 및 박막 인덕터의 제조방법
JP2016219737A (ja) * 2015-05-26 2016-12-22 ソニー株式会社 電子機器
CN106658964A (zh) * 2015-10-28 2017-05-10 碁鼎科技秦皇岛有限公司 电路板及其制作方法
WO2017183135A1 (ja) * 2016-04-20 2017-10-26 富士通株式会社 回路基板、回路基板の製造方法及び電子装置
JP6704129B2 (ja) * 2016-04-21 2020-06-03 富士通インターコネクトテクノロジーズ株式会社 回路基板、回路基板の製造方法及び電子装置
KR101813374B1 (ko) * 2016-05-13 2017-12-28 삼성전기주식회사 박막 커패시터 및 그 제조방법
CN107613642B (zh) * 2017-08-31 2019-06-07 江苏普诺威电子股份有限公司 含阶梯槽埋容线路板的制作方法
JP7063019B2 (ja) * 2018-03-09 2022-05-09 Tdk株式会社 薄膜コンデンサの製造方法及び薄膜コンデンサ
JP6932289B2 (ja) * 2019-04-02 2021-09-08 三菱電機株式会社 複合プリント配線板およびその製造方法
CN114650662B (zh) * 2020-12-21 2025-10-10 中兴通讯股份有限公司 一种印制电路板及其制造方法
WO2025117214A1 (en) * 2023-11-29 2025-06-05 KYOCERA AVX Components Corporation Multilayer electronic component including at least one via connected to a capacitor outside its capacitive area

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CN1829420A (zh) * 2005-03-02 2006-09-06 三星电机株式会社 其中具有嵌入式电容器的印刷电路板及其制造方法
CN101653053A (zh) * 2008-01-25 2010-02-17 揖斐电株式会社 多层线路板及其制造方法

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EP1500638B1 (de) * 2003-07-21 2008-05-07 Abb Research Ltd. Laserbestrahlte metallisierte Elektrokeramik
US7056800B2 (en) * 2003-12-15 2006-06-06 Motorola, Inc. Printed circuit embedded capacitors
KR100619367B1 (ko) * 2004-08-26 2006-09-08 삼성전기주식회사 고유전율을 갖는 커패시터를 내장한 인쇄회로기판 및 그제조 방법
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JP3816508B2 (ja) 2004-11-04 2006-08-30 三井金属鉱業株式会社 キャパシタ層形成材及びそのキャパシタ層形成材を用いて得られる内蔵キャパシタ層を備えたプリント配線板
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Also Published As

Publication number Publication date
JP5757163B2 (ja) 2015-07-29
US9672983B2 (en) 2017-06-06
US20120307469A1 (en) 2012-12-06
CN102821545A (zh) 2012-12-12
JP2012253195A (ja) 2012-12-20

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Granted publication date: 20180202