CN102782832A - 接地的卡盘 - Google Patents

接地的卡盘 Download PDF

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CN102782832A
CN102782832A CN2011800113837A CN201180011383A CN102782832A CN 102782832 A CN102782832 A CN 102782832A CN 2011800113837 A CN2011800113837 A CN 2011800113837A CN 201180011383 A CN201180011383 A CN 201180011383A CN 102782832 A CN102782832 A CN 102782832A
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chuck
pin assemblies
main shaft
inlay
bearing element
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CN102782832B (zh
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迈克尔·布鲁格
奥托·洛奇
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Lam Research Corp
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    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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    • H01—ELECTRIC ELEMENTS
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    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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Abstract

通过提供一个或多个销组件实现对旋转卡盘中的静电荷减少的改善，所述销组件由化学惰性材料制成，并且包括导电嵌体。

Description

接地的卡盘
技术领域
本发明涉及用于诸如半导体晶片等物件的表面处理，适于减少静电电荷积聚的方法和装置。
背景技术
在集成电路的制造过程中，半导体晶片经过各种湿法工艺过程。为了配合这样的工艺，通过与可旋转或者不可旋转的载体关联的卡盘，可以相对于一个或者多个处理流体喷嘴支撑单晶片。例如，美国专利No.4,903,717、No.5,153,668、No.6,435,200以及No.6,536,454描述了支撑晶片的卡盘。
众所周知，在半导体处理过程中会在晶片表面产生有害的净电荷的积聚。例如，欧洲专利申请No.1,077,473描述了：通过将二氧化碳引入到去离子水处理流体中以使该处理流体导电，从而可以减少静电荷的积聚。该方法没有直接说明对未接触导电处理流体的晶片处理部件上的静电荷积聚的潜在问题，结果，排除了对诸如去离子水和2-丙醇等相对不导电处理流体的使用。美国专利7,335,090述及了有紧固销的旋转卡盘，该紧固销由导电树脂制成，并且与不锈钢轴相关联，该不锈钢轴进而由径向的金属轴承支撑。然而，不锈钢轴承的存在会导致半导体晶片有被铁污染的风险，这应当避免。另外，该不锈钢轴与该树脂销之间的连接也没有具体描述，由于轴承润滑油等的存在，通过径向轴承的连接可能是不可靠的电接触。
发明内容
本发明人已发现，现有的用于限制晶片处理设备中的静电荷积聚的技术不是令人十分满意。例如，当设备部件包含相对不导电材料时，静电荷会积聚在这些部件以及晶片自身上面，这些不导电材料如聚偏氟乙烯（PVDF）、聚醚醚酮（PEEK）或者聚四氟乙烯（PTFE）。使用诸如去离子水或者2-丙醇等作为相对不导电处理流体也可能促成静电荷的积聚。
静电荷积聚会导致非期望的颗粒物与空气污染物的积累。在一些情况下，静电荷放电可能在晶片上或者晶片附近发生，从而会损坏或者损毁晶片上的集成电路的部件。
已发现，在工艺中通过提供穿过卡盘，特别是穿过支撑晶片的销组件的导电通路，使得卡盘和晶片接地，可以减少或者基本消除有害的静电荷，这在下文将更详细阐述。
本发明的方法和装置不限于在半导体晶片工艺设备上使用，也可以应用于其他材料表面处理的设备以及对上述衬底的处理中所使用的处理室的设备表面进行清洁，所述其他材料如在制造光盘和LCD显示板时所使用的玻璃主盘和母板。
附图说明
参照附图，阅读本发明下面的优选实施方式的详细的描述后，本发明的其它目的、特征和优点将变得更加明显。
图1为根据本发明的实施方式所示的透视的、部分截面的图解接地卡盘的视图。
图2为图1中的区域II的放大的细节图。
图3为根据本发明的实施方式所示的透视的、部分截面的销组件的放大视图。
图4为根据本发明的另一实施方式所示的透视的、部分截面的销组件的透视图。
图5为图4的销组件的透视的、部分截面的视图。
具体实施方式
图1中，卡盘（1）安装在主轴（10）上，该卡盘（1）用于托持晶片状物件，特别是在使用处理流体的处理过程中托持晶片状物件。主轴（10）优选是可旋转的，使得卡盘（1）设置成通过主轴（10）旋转。这样的可旋转卡盘（“旋转卡盘”）可以由处理室包绕以用于半导体晶片的单晶片湿法处理。
在该实施方式中，卡盘（1）包括：含有通常为杯状基体（4）的卡盘主体、环形盖（2）以及轴套（6）。
基体（4）包括容纳轴套（6）的中央孔。轴套（6）也包含有中央孔，选择该中央孔的形状以与主轴（10）可操作地啮合。在图1所示的实施方式中，轴套（6）截头圆锥形中央孔与互补的截头圆锥形主轴（10）相对应。
盖（2）通过在其外周缘的环形肋条设置在基体（4）的外边缘上，使得在基体（4）的上表面和盖（2）的下表面之间形成内部间隙。
盖（2）其横截面通常为C形，使得其包含基本连续的上部和环形的下部。盖（2）的上部和下部彼此分离，从而形成内部气体分布室（45）。
盖（2）的环形下部通过旋转盘（5）与轴套（6）一端的周缘区啮合。因此，当卡盘（1）定位于主轴（10）上时，主轴（10）的末端延伸通过轴套（6）的中央孔并且进入气体分布室（45）。
主轴（10）优选是中空的，并且在其末端包含多个径向贯穿的通孔（42）。因此，传输通过中空的主轴（10）的加压气体可以通过这些通孔（42）导入至气体分布室（45）中。
盖（2）还包括环形分布的多个孔（48），该多个孔（48）从所述气体分布室延伸至盖（2）的表面。因此，可以通过主轴（10）、通孔（42）、气体分布室（45）和孔（48）传输气体，使得在工艺处理中，如有晶片，可以浮置于气垫上。根据伯努利（Bernoulli）原理，此种气体也可用于辅助晶片固定到卡盘（1）上。
齿轮缘（22）位于在基体（4）的上表面和盖（2）的下表面之间形成的间隙中。该齿轮缘（22）与轴套（6）耦合，并且通过其径向向外延伸的周缘齿而与多个销组件（18）中的每一个的齿轮（20）啮合。
例如，如图2所示，每个销组件（18）还包括从齿轮（20）延伸的轴，该轴可旋转地容纳在盖（2）的孔中，并且其配置有相对于该轴的旋转轴线偏心地设置的啮合销（19）。通过滚针轴承（16）以及相关联的螺旋弹簧（15）向上朝盖（2）推压每个销组件（18），滚针轴承（16）以及相关联的螺旋弹簧（15）都位于凹槽内，该凹槽形成于基体（4）的外部的向上延伸的外周边缘中。
借助于齿轮缘（22）使销组件（18）的轴转动，可以改变啮合销（19）至卡盘（1）的旋转轴线的径向距离。用于提供齿轮缘与卡盘主体之间的相对运动以使偏心地设置的销旋转的机制，例如在美国专利No.4,903,717与No.5,513,668等中已得到描述。啮合销（19）作为止动件使用，用于使被托持在卡盘（1）的晶片状物件（例如半导体晶片，未图示）横向固定。
众所周知，卡盘部件例如晶片支撑销等，是由对晶片处理工艺中有时使用的高腐蚀性化学品相对惰性的材料制成的。这些材料包括聚偏氟乙烯（PVDF）、聚醚醚酮（PEEK）或者聚四氟乙烯（PTFE）等。应注意，这些不导电材料会造成静电荷的有害的积聚，导致污染物累积的风险，或者由于静电荷放电而损坏晶片上的集成电路的电子元件。
根据本发明，一个或者多个的销组件（18）是由静电耗散材料或导电材料制成，如由导电塑料制成。因此，静电荷能通过导电销组件（18）耗散。
应理解，可以使用任何具有充分导电性能的相对导电塑料材料。例如，合适的导电塑料材料包括导电碳注入的聚偏氟乙烯，例如以品名SIMONA PVDF-EL市售的聚偏氟乙烯，据报道根据测试方法DIN IEC60093，其所显示的体积电阻率和表面电阻率分别为≤106欧姆＊厘米和≤106欧姆。其他相对导电的塑料包括诸如以品名LM-ETFE A-3000市售的碳填充乙烯-四氟乙烯共聚物，以及诸如由杜邦（Dupont）以品名VESPEL CR-6110市售的碳纤维填充过氟烷氧基，其包含碳纤维片材和聚合物层的合成物，并且在沿层的方向上分别显示出约10-1欧姆＊厘米和10-1欧姆的体积电阻率和表面电阻率，以及在沿垂直于层的方向上分别显示出约100欧姆＊厘米和101欧姆的体积电阻率和表面电阻率。
如图2所示，提供了从销组件（18）延伸，通过卡盘（1）并且到达主轴（10）的导电通路。
参考图2，导电弹簧座（14）位于螺旋弹簧（15）的下面，并且与螺旋弹簧（15）电接触。螺旋弹簧（15）和滚针轴承也由导电材料制成。
导电环（13）与弹簧座（14）电连接（例如通过金属螺丝）。另外，一个或多个径向延伸的导体（12）与基体（4）的上表面连接，并且与导电环（13）电连接（例如通过金属螺丝）。如从图2所示，弹簧座（14）、导电环（13）与径向延伸的导体（12）都位于由基体（4）的上表面和盖（2）的下表面之间形成的内部间隙里。
优选地由金属形成的导电部件（11）从径向延伸的导体（12）延伸通过基体（4）和轴套（6）。导电部件（11）优选包含金属弹簧，使得当卡盘（1）位于主轴（10）上时，上述的卡盘（1）的导电通路也是与导体的主轴进行电连接。
因此，卡盘（1）提供引导通过销组件（18）、滚针轴承（16）、螺旋弹簧（15）、弹簧座（14）、导电环（13）、径向导体（12）和导电部件（11）的导电通路。当位于主轴（10）上时，上述导电通路通过导电部件（11）延续到主轴（10），主轴（10）通过与相关联的工具框或者其他合适的导电片（sink）相应电接地。
销组件（18）还包括优选由金属制成的导电嵌体（17），其位于销组件（18）的中央孔内，并且延伸到销组件（18）的低端，以便与滚针轴承（16）通过物理方式电（physically and electrically）接触，如图3所示。嵌体（17）还包括用于容纳滚针轴承（16）的滚针轴承座（17s），因而进一步加强了销组件（18）和滚针轴承（16）之间的电接触。
在替代的实施方式中，销组件（218）可以如图4和图5所示设置。除了啮合销（219）包括弧形的缩小的腰部外，销组件（218）基本类似于图3所示的销组件，其包括齿轮和导电嵌体（217）。应理解，啮合销（219）对晶片可以提供横向的和竖直方向的两种支撑，这在未提供按伯努利原理运行的气垫的卡盘的连接很有用处。
本发明的上述特征提供了建立导电通路的意想不到的且此前未知的优点，该导电通路不需要过度紧固诸如齿轮等移动零部件进而分散静电荷，否则为了建立安全的电接触需要，紧固移动部件会带来摩擦和磨损的显著增加。
尽管本发明已根据其各种示例性的实施方式进行了描述，但是应理解，不应将这些实施方式用作限制由所附权利要求的实质范围和主旨所确定的保护范围的借口。

Claims (15)

1.用于处理晶片状物件的装置，其包括卡盘，所述卡盘适于在将在晶片状物件上执行的处理操作期间将所述晶片状物件保持在预定的方位，所述卡盘包括卡盘主体和多个销组件，该多个销组件适应于所述卡盘主体并且相对于所述卡盘主体定位以便支撑将被处理的晶片状物件，其中，所述销组件中的至少一个销组件由化学惰性材料制成，并在一端包含导电嵌体，所述嵌体适于与轴承元件通过物理方式电啮合。
2.如权利要求1所述的装置，其中，所述卡盘是由处理室包绕的旋转卡盘，用于半导体晶片的单晶片湿法处理。
3.如权利要求1所述的装置，其中，所述轴承元件是导电滚针轴承。
4.如权利要求1所述的装置，其中，所述卡盘适于与主轴啮合并由所述主轴支撑，所述卡盘还包括导电通路，该导电通路从所述至少一个销组件引导通过所述轴承元件到达所述主轴。
5.如权利要求4所述的装置，其中，所述卡盘主体包含连接到下部的上部，从而在两者之间形成内部间隙，所述导电通路被设置在所述内部间隙内。
6.如权利要求5所述的装置，其中，所述导电通路包括位于所述内部间隙中的一个或者多个导电元件。
7.如权利要求1所述的装置，其中，所述销组件以环形系列的方式绕着在所述卡盘上的将放置晶片状物件的区域设置，每一个所述销组件由化学惰性材料制成，并在一端包含导电嵌体，每一个所述嵌体适于与轴承元件通过物理方式电啮合。
8.如权利要求7所述的装置，其中，所述卡盘适于与主轴啮合并由所述主轴支撑，所述卡盘还包括导电通路，该导电通路从所述至少一个销组件引导通过所述轴承元件到达所述主轴。
9.如权利要求8所述的装置，其中，所述导电通路包括：与所述轴承元件电气连接的导电座、与所述导电座电气连接的径向导体、以及与所述径向导体电气连接并且适于在所述卡盘啮合所述主轴时电气连接到所述主轴上的导电部件。
10.一种使用在处理晶片状物件的装置中的构件，其包括销组件，其中，所述销组件由化学惰性材料制成，并在一端包含导电嵌体。
11.如权利要求10所述的构件，其中，所述嵌体适于与轴承元件通过物理方式电啮合。
12.如权利要求11所述的构件，其中，所述轴承元件是导电滚针轴承。
13.如权利要求10所述的构件，其中，所述销组件包括偏心设置在轴的一端的啮合销。
14.如权利要求13所述的构件，其中，所述销组件还包括位于所述啮合销的相对端的齿轮环。
15.一种使用在处理晶片状物件的装置中的销组件，其中，所述销组件由化学惰性导电聚合物材料制成，并在一端包含导电嵌体。
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