CN102738010A - 一种基于喷砂的aaqfn框架产品扁平封装件制作工艺 - Google Patents
一种基于喷砂的aaqfn框架产品扁平封装件制作工艺 Download PDFInfo
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- CN102738010A CN102738010A CN2012101971865A CN201210197186A CN102738010A CN 102738010 A CN102738010 A CN 102738010A CN 2012101971865 A CN2012101971865 A CN 2012101971865A CN 201210197186 A CN201210197186 A CN 201210197186A CN 102738010 A CN102738010 A CN 102738010A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012101971865A CN102738010A (zh) | 2012-06-15 | 2012-06-15 | 一种基于喷砂的aaqfn框架产品扁平封装件制作工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012101971865A CN102738010A (zh) | 2012-06-15 | 2012-06-15 | 一种基于喷砂的aaqfn框架产品扁平封装件制作工艺 |
Publications (1)
Publication Number | Publication Date |
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CN102738010A true CN102738010A (zh) | 2012-10-17 |
Family
ID=46993268
Family Applications (1)
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CN2012101971865A Pending CN102738010A (zh) | 2012-06-15 | 2012-06-15 | 一种基于喷砂的aaqfn框架产品扁平封装件制作工艺 |
Country Status (1)
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CN (1) | CN102738010A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103094235A (zh) * | 2012-12-14 | 2013-05-08 | 华天科技(西安)有限公司 | 一种应用电镀工艺的aaqfn封装件及其制作工艺 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101697348A (zh) * | 2009-10-11 | 2010-04-21 | 天水华天科技股份有限公司 | 一种小载体四面扁平无引脚封装件及其制备方法 |
CN101859713A (zh) * | 2009-04-10 | 2010-10-13 | 日月光半导体制造股份有限公司 | 先进四方扁平无引脚封装结构及其制造方法 |
US20100285638A1 (en) * | 2008-05-19 | 2010-11-11 | Tung-Hsien Hsieh | Method for fabricating qfn semiconductor package |
US20110079888A1 (en) * | 2009-10-01 | 2011-04-07 | Henry Descalzo Bathan | Integrated circuit packaging system with protective coating and method of manufacture thereof |
US20120068318A1 (en) * | 2010-09-16 | 2012-03-22 | Zigmund Ramirez Camacho | Integrated circuit packaging system with paddle molding and method of manufacture thereof |
-
2012
- 2012-06-15 CN CN2012101971865A patent/CN102738010A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100285638A1 (en) * | 2008-05-19 | 2010-11-11 | Tung-Hsien Hsieh | Method for fabricating qfn semiconductor package |
CN101859713A (zh) * | 2009-04-10 | 2010-10-13 | 日月光半导体制造股份有限公司 | 先进四方扁平无引脚封装结构及其制造方法 |
US20110079888A1 (en) * | 2009-10-01 | 2011-04-07 | Henry Descalzo Bathan | Integrated circuit packaging system with protective coating and method of manufacture thereof |
CN101697348A (zh) * | 2009-10-11 | 2010-04-21 | 天水华天科技股份有限公司 | 一种小载体四面扁平无引脚封装件及其制备方法 |
US20120068318A1 (en) * | 2010-09-16 | 2012-03-22 | Zigmund Ramirez Camacho | Integrated circuit packaging system with paddle molding and method of manufacture thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103094235A (zh) * | 2012-12-14 | 2013-05-08 | 华天科技(西安)有限公司 | 一种应用电镀工艺的aaqfn封装件及其制作工艺 |
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C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: Luo Yuguang Inventor after: Guo Xiaowei Inventor after: Zhu Wenhui Inventor after: Chen Shiguang Inventor after: Ma Xiaobo Inventor before: Luo Yuguang Inventor before: Guo Xiaowei Inventor before: Cui Meng Inventor before: Liu Jianjun Inventor before: Liu Weidong |
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COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: LUO YUGUANG GUO XIAOWEI CUI MENG LIU JIANJUN LIU WEIDONG TO: LUO YUGUANG GUO XIAOWEI ZHU WENHUI CHEN SHIGUANG MA XIAOBO |
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C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121017 |
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RJ01 | Rejection of invention patent application after publication |