CN102714165B - 液体材料的涂布方法以及涂布装置 - Google Patents

液体材料的涂布方法以及涂布装置 Download PDF

Info

Publication number
CN102714165B
CN102714165B CN201080045483.7A CN201080045483A CN102714165B CN 102714165 B CN102714165 B CN 102714165B CN 201080045483 A CN201080045483 A CN 201080045483A CN 102714165 B CN102714165 B CN 102714165B
Authority
CN
China
Prior art keywords
coating
liquid material
nozzle
area
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201080045483.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN102714165A (zh
Inventor
生岛和正
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Musashi Engineering Inc
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of CN102714165A publication Critical patent/CN102714165A/zh
Application granted granted Critical
Publication of CN102714165B publication Critical patent/CN102714165B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01055—Cesium [Cs]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Spray Control Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN201080045483.7A 2009-08-11 2010-08-06 液体材料的涂布方法以及涂布装置 Active CN102714165B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009-186349 2009-08-11
JP2009186349A JP5783670B2 (ja) 2009-08-11 2009-08-11 液体材料の塗布方法、塗布装置およびプログラム
PCT/JP2010/063346 WO2011018988A1 (ja) 2009-08-11 2010-08-06 液体材料の塗布方法、塗布装置およびプログラム

Publications (2)

Publication Number Publication Date
CN102714165A CN102714165A (zh) 2012-10-03
CN102714165B true CN102714165B (zh) 2015-04-15

Family

ID=43586165

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080045483.7A Active CN102714165B (zh) 2009-08-11 2010-08-06 液体材料的涂布方法以及涂布装置

Country Status (7)

Country Link
US (1) US8703601B2 (enExample)
EP (1) EP2466630B1 (enExample)
JP (1) JP5783670B2 (enExample)
KR (1) KR101700255B1 (enExample)
CN (1) CN102714165B (enExample)
TW (1) TWI497613B (enExample)
WO (1) WO2011018988A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5280702B2 (ja) * 2008-02-18 2013-09-04 武蔵エンジニアリング株式会社 液体材料の塗布方法、その装置およびそのプログラム
WO2010147052A1 (ja) * 2009-06-15 2010-12-23 武蔵エンジニアリング株式会社 液体材料の塗布方法、その装置およびそのプログラム
JP6452147B2 (ja) * 2015-01-19 2019-01-16 武蔵エンジニアリング株式会社 液体材料吐出装置
JP2016131947A (ja) * 2015-01-21 2016-07-25 三菱電機株式会社 液剤塗布方法および電子装置の製造方法ならびに液剤塗布装置
US9653325B2 (en) * 2015-02-17 2017-05-16 Powertech Technology Inc. Underfill process and processing machine thereof
JP6684397B2 (ja) * 2015-04-02 2020-04-22 エムテックスマート株式会社 流体の噴出方法および流体の成膜方法
CN106094271A (zh) * 2016-06-22 2016-11-09 深圳市华星光电技术有限公司 一种显示面板切割方法
JP6778426B2 (ja) * 2016-09-20 2020-11-04 武蔵エンジニアリング株式会社 液体材料吐出装置
JP6991475B2 (ja) * 2017-05-24 2022-01-12 協立化学産業株式会社 加工対象物切断方法
MX2019013915A (es) 2017-05-25 2020-01-21 Musashi Engineering Inc Aparato de aplicacion de material liquido y metodo de aplicacion de material liquido.
JP6471258B2 (ja) * 2018-06-04 2019-02-13 武蔵エンジニアリング株式会社 液体材料塗布装置および液体材料塗布方法
CN108906508B (zh) * 2018-08-06 2020-11-27 Oppo（重庆）智能科技有限公司 胶量控制方法及胶量控制装置
JP7426198B2 (ja) * 2019-04-17 2024-02-01 株式会社ジャノメ 塗布装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1976761A (zh) * 2005-04-28 2007-06-06 芝浦机械电子株式会社 溶液的涂敷装置及涂敷方法
JP2007173621A (ja) * 2005-12-22 2007-07-05 Sharp Corp 基板に対する液膜材料の塗布方法
JP2007194403A (ja) * 2006-01-19 2007-08-02 Sony Corp 電子デバイスの製造装置及び電子デバイスの製造方法、並びに、アンダーフィル材充填状態の検査装置及びアンダーフィル材充填状態の検査方法
JP2008071883A (ja) * 2006-09-13 2008-03-27 Seiko Epson Corp 半導体装置の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2571024B2 (ja) * 1994-09-28 1997-01-16 日本電気株式会社 マルチチップモジュール
US6066509A (en) * 1998-03-12 2000-05-23 Micron Technology, Inc. Method and apparatus for underfill of bumped or raised die
JP3431406B2 (ja) * 1996-07-30 2003-07-28 株式会社東芝 半導体パッケージ装置
JPH1050769A (ja) 1996-07-30 1998-02-20 Toshiba Corp 半導体パッケージの製造装置および製造方法
US7015592B2 (en) * 2004-03-19 2006-03-21 Intel Corporation Marking on underfill
JP4868515B2 (ja) * 2006-11-01 2012-02-01 武蔵エンジニアリング株式会社 液体材料の充填方法、装置およびプログラム
JP4871093B2 (ja) * 2006-11-01 2012-02-08 武蔵エンジニアリング株式会社 液体材料の充填方法、装置およびプログラム
JP5019900B2 (ja) * 2007-02-08 2012-09-05 武蔵エンジニアリング株式会社 液体材料の充填方法、装置およびプログラム
JP4962413B2 (ja) * 2008-05-28 2012-06-27 セイコーエプソン株式会社 液状体吐出装置、及び液状体吐出方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1976761A (zh) * 2005-04-28 2007-06-06 芝浦机械电子株式会社 溶液的涂敷装置及涂敷方法
JP2007173621A (ja) * 2005-12-22 2007-07-05 Sharp Corp 基板に対する液膜材料の塗布方法
JP2007194403A (ja) * 2006-01-19 2007-08-02 Sony Corp 電子デバイスの製造装置及び電子デバイスの製造方法、並びに、アンダーフィル材充填状態の検査装置及びアンダーフィル材充填状態の検査方法
JP2008071883A (ja) * 2006-09-13 2008-03-27 Seiko Epson Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
HK1171573A1 (en) 2013-03-28
EP2466630B1 (en) 2019-10-02
EP2466630A4 (en) 2014-02-26
US20120313276A1 (en) 2012-12-13
KR101700255B1 (ko) 2017-02-13
JP2011036800A (ja) 2011-02-24
TWI497613B (zh) 2015-08-21
JP5783670B2 (ja) 2015-09-24
EP2466630A1 (en) 2012-06-20
WO2011018988A1 (ja) 2011-02-17
CN102714165A (zh) 2012-10-03
TW201119752A (en) 2011-06-16
KR20120054629A (ko) 2012-05-30
US8703601B2 (en) 2014-04-22

Similar Documents

Publication Publication Date Title
CN102714165B (zh) 液体材料的涂布方法以及涂布装置
CN103391820B (zh) 液体材料的涂布方法及涂布装置
EP2246125B1 (en) Method for applying liquid material and application device
US8809075B2 (en) Method for applying liquid material utilizing capillary phenomenon
KR101445583B1 (ko) 액체 재료의 충전 방법, 장치 및 프로그램을 기록한 기록 매체
KR101411449B1 (ko) 액체 재료의 충전 방법, 장치 및 프로그램을 기록한 기록 매체
HK1171573B (en) Method for applying liquid material and application device
HK1153426B (en) Method for applying liquid material and device therefor
HK1134799B (en) Method and apparatus for filling liquid material
HK1174304A (en) Method for applying liquid material
HK1174304B (en) Method for applying liquid material
HK1189193B (en) Application method of liquid material and application device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1171573

Country of ref document: HK

C14 Grant of patent or utility model
GR01 Patent grant
REG Reference to a national code

Ref country code: HK

Ref legal event code: GR

Ref document number: 1171573

Country of ref document: HK