CN102700237B - A kind of full-automatic vision silicon chip printing equipment with Double tabletop - Google Patents
A kind of full-automatic vision silicon chip printing equipment with Double tabletop Download PDFInfo
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- CN102700237B CN102700237B CN201210141614.2A CN201210141614A CN102700237B CN 102700237 B CN102700237 B CN 102700237B CN 201210141614 A CN201210141614 A CN 201210141614A CN 102700237 B CN102700237 B CN 102700237B
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 442
- 239000010703 silicon Substances 0.000 title claims abstract description 442
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 439
- 238000007639 printing Methods 0.000 title claims abstract description 101
- 238000001514 detection method Methods 0.000 claims abstract description 22
- 230000007306 turnover Effects 0.000 claims abstract description 22
- 238000007790 scraping Methods 0.000 claims abstract description 15
- 230000003139 buffering effect Effects 0.000 claims abstract description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000012546 transfer Methods 0.000 claims description 89
- 230000007246 mechanism Effects 0.000 claims description 23
- 230000035807 sensation Effects 0.000 claims description 19
- 230000033001 locomotion Effects 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 230000006870 function Effects 0.000 claims description 5
- 238000011144 upstream manufacturing Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 41
- 230000008569 process Effects 0.000 abstract description 23
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0881—Machines for printing on polyhedral articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
- B41F15/18—Supports for workpieces
- B41F15/26—Supports for workpieces for articles with flat surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Screen Printers (AREA)
Abstract
The invention discloses the full-automatic vision silicon chip printing equipment with Double tabletop, comprise two silicon chip carrying platforms, two turnover plate detection camera, a silk screen lowering or hoisting gear, a silk screen attitude-adjusting system, two silk screen datum mark cameras, an ink-scraping device, two cover silicon chip loading devices, two cover silicon chip unloading devices, two cover buffering supply lines; Two silicon chip carrying platforms are arranged on the pedestal of a transverse shifting, alternately can enter printing station and realize wiping operation, synchronously can not load at the silicon chip carrying platform of printing station, unload silicon chip; This printing equipment adopts two silicon chip carrying platform structure, and can realize changing sheet and printing process concurrent process, enhance productivity, and this apparatus structure is compact, hold facility area is little.
Description
Technical field
The present invention relates to a kind of silicon chip printing equipment, be specifically related to the full-automatic vision silicon chip printing equipment printed in turn that can realize Double tabletop.
Background technology
Along with the day of global energy is becoming tight, solar energy is subject to the extensive attention of countries in the world with the exclusive advantage such as pollution-free, the market space is large, and numerous major companies drop into solar cell research and development and production industry in the world.Obtain electric power from solar energy, need carry out light-to-current inversion to realize by solar cell, silicon solar cell is a kind of absorption solar radiation effectively and makes it to be converted into the semi-conductor electronic device of electric energy, is widely used in various illumination and electricity generation system.
The current facing challenges of solar cell manufacturer is starting to produce a polarization into two large emphasis: improve the power of solar cell to increase the generated energy of unit are; Next is without the need to increasing corresponding investment and the hope increased productivity with existing technique or demand.
Solar cell printing is the important procedure of cell piece production line, plays an important role to the quality of cell piece, and solar cell printing technology is an organic whole, is the combination of various technology.Solar cell divides crystal silicon battery and hull cell, current thin film battery technology has relative advantage on cost, but be all difficult to mention in the same breath with crystal silicon battery in technology maturity, life-span and conversion efficiency, crystal silicon battery account for absolute monopoly position in solar cell market, the cost of unit generated energy is still higher than traditional generation mode, therefore reducing costs is the key factor of crystal silicon solar industry value chain, and crystal-silicon battery slice production efficiency forms a key factor of cell piece cost.
Existing printing equipment generally adopts single carrying platform structure, as shown in Figure 1, this printing equipment only has a carrying platform, and silicon chip imports silicon chip loading device 101 into from upstream, silicon chip loading device 101 has silicon chip pose adjustment function, does preliminary corrections to silicon chip attitude.Then, silicon chip continues to front transfer along silicon chip loading device 101.Silicon chip is delivered to the central authorities of silicon chip carrying platform 103, and the vacuum on silicon chip carrying platform 103 inhales silicon chip surely to live.Enter plate attitude camera 107 and ejecting plate attitude camera 105 removable, enter from silicon chip carrying platform 103 both sides, clap the image of two edge portions at silicon chip diagonal angle, take pictures laggard plate attitude camera 107 and ejecting plate attitude camera 105 shift out.Silk screen datum mark camera 102 is taken pictures, and obtains the image of screen process press 106 wire mesh bottom two datum marks, and adjustment silk screen makes the pattern on silk screen aim at silicon chip.Screen process press 106 lifting platform declines, and starts to scrape ink print.After finishing printing, screen process press 106 lifting platform rises, vacuum on silicon chip carrying platform 103 is inhaled and is closed, conveyer belt on silicon chip carrying platform 103 and silicon chip unloading device 104 coordinates, silicon chip is moved on to silicon chip unloading device 104 from silicon chip carrying platform 103, then is delivered to downstream along silicon chip unloading device 104.Be not difficult to find out, when printing equipment only has a silicon chip carrying platform, load, take pictures, adjust, be elevated, print, unload the series connection such as operation and be connected, be completed for printing the time that a silicon chip consumes many, limit the lifting of production efficiency.
Some printing machines also adopt turntable type structure, by station rotary, realize changing sheet and printing parallel work-flow, but one are that turntable cost is higher, and two is that turntable is comparatively large, is unfavorable for reducing machine floor space.
Summary of the invention
The object of the invention is to the shortcoming overcoming prior art, provide a kind of compact conformation, production efficiency high, floor space is few, can realize the full-automatic vision silicon chip printing equipment with Double tabletop changing sheet and printing process parallel work-flow.For realizing object of the present invention, the technical solution used in the present invention is as follows.
A kind of full-automatic vision silicon chip printing equipment with Double tabletop, comprise two silicon chip carrying platforms, two turnover plate detection camera, a silk screen lowering or hoisting gear, a silk screen attitude-adjusting system, two silk screen datum mark cameras, an ink-scraping device, two cover silicon chip loading devices, two cover silicon chip unloading devices, two cover buffering supply lines; Two silicon chip carrying platforms are arranged on the pedestal of a transverse shifting, alternately enter printing station and realize wiping operation; What turnover plate detection camera was arranged on silicon chip carrying platform changes above sheet station, for obtaining the image of silicon chip; Silk screen lowering or hoisting gear is arranged on four support columns of printing machine, for making silk screen press close to silicon chip and leave silicon chip, to realize silicon chip printing, the demoulding and cleaning net bottom; Silk screen attitude-adjusting system is arranged on the silk screen lowering or hoisting gear of printing machine, realizes XY move in parallel and rotate location for making silk screen; Two silk screen datum mark cameras are arranged on the below of silk screen attitude-adjusting system, and are symmetrically distributed in the both sides of the silicon chip carrying platform at printing station, are used for obtaining the image of wire mesh bottom two datum marks; Ink-scraping device is arranged on the top of silk screen attitude-adjusting system, moving up and down and seesawing coating is impressed on silicon chip by scraper; Two cover silicon chip loading devices align with the silicon chip carrying platform not at printing station, and are symmetrically distributed in the both sides of printing machine, can adjust angle and the lateral shift of silicon chip; Silicon chip unloading device and silicon chip loading device are symmetrically distributed in silicon chip carrying platform both sides; Two cover buffering supply lines all with silicon chip loading device and silicon chip unloading device in being arranged vertically, for receiving the silicon chip that needs print from upstream, or the silicon chip printed is sent to downstream.
Further, above-mentioned have in the full-automatic vision silicon chip printing equipment of Double tabletop, above each silicon chip carrying platform, conveyer belt is housed, there is multiple equally distributed aperture platform middle part, also have multiple equally distributed aperture above conveyer belt, these apertures are inhaled function by vacuum and silicon chip are adsorbed on platform; Conveyer belt covers the plane for supporting silicon chip on platform, obtains even support, thus can reduce the breakage of silicon chip when can make printing like this bottom silicon chip.The slide rail that can realize transverse shifting is had below platform.This structure can realize changing sheet and printing process concurrent process.
Further, above-mentioned have in the full-automatic vision silicon chip printing equipment of Double tabletop, and described silk screen attitude-adjusting system is a planar three freedom serial mechanism, can realize XY and moves in parallel and rotate location.
Further, above-mentioned have in the full-automatic vision silicon chip printing equipment of Double tabletop, described ink-scraping device comprises scraper, scraper seesaws mechanism, scraper up-down mechanism and Hui Mo mechanism, the scraper mechanism that seesaws makes scraper seesaw, scraper up-down mechanism makes scraper move up and down, and moving up and down and seesawing of scraper realizes coating to be impressed on silicon chip.
Further, above-mentioned have in the full-automatic vision silicon chip printing equipment of Double tabletop, often overlap above silicon chip loading device and be equipped with two for adjusting the conveyer belt of silicon chip angle, and three light sensations be equipped with near this conveyer belt for responding to position of silicon wafer, have below silicon chip loading device for translational motion to adjust the bottom platform of silicon chip lateral displacement.
Further, above-mentioned have in the full-automatic vision silicon chip printing equipment of Double tabletop, cover buffering supply line is made up of three straight-through conveyer belts and two corner transfer conveyer belts, the cooperation of straight-through conveyer belt and corner transfer conveyer belt, is assigned to silicon chip two silicon chip loading devices or the silicon chip through printing is overlapped independently silicon chip unloading device from two and focus on same ejecting plate supply line.
Above-mentioned have in the full-automatic vision silicon chip printing equipment of Double tabletop, and according to turnover plate detection camera, silk screen datum mark camera gained silicon chip, silk screen attitude-adjusting system attitude information, the high accuracy realizing silicon chip and silk screen is aimed at.
The present invention is to printing equipment innovative design on the basis of existing single plummer technique, adopt two carrying platform structure, make a carrying platform when changing silicon chip, another one carrying platform is carrying out silicon chip printing, ensure that printing equipment can realize changing sheet and wiping operation, even if change sheet and printing process concurrent process to two panels silicon chip simultaneously.
Compared with prior art, tool has the following advantages and beneficial effect in the present invention:
(1) turnover plate of the present invention all adopts band transmission, and structure is simple, stable movement, manufactures and install simple, easy to maintenance;
(2) the present invention adopts two carrying platform structure, makes to change sheet and printing process concurrent process, thus decreases the production time, significantly improve the production efficiency of production line unit interval;
(3) compact conformation of the present invention, hold facility area is little.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the printing equipment of the single carrying platform structure of existing employing.
Fig. 2 is the full-automatic vision silicon chip printing equipment structural representation with Double tabletop of the present invention.
Fig. 3 is schematic diagram on the left of the full-automatic vision silicon chip printing equipment with Double tabletop of the present invention.
Fig. 4 is the full-automatic vision silicon chip printing equipment right side schematic view with Double tabletop of the present invention.
Fig. 5 be of the present invention enter the schematic diagram of panel assembly.
Fig. 6 is the schematic diagram of board discharging device of the present invention.
Fig. 7 is the schematic diagram of silicon chip carrying platform of the present invention.
Fig. 8 is the front view of silicon chip carrying platform of the present invention.
Fig. 9 is the schematic diagram of silk screen attitude-adjusting system of the present invention.
Figure 10 is the schematic diagram of ink-scraping device of the present invention.
Figure 11 is the schematic diagram of silicon chip loading device of the present invention.
Figure 12 is the installation diagram of straight-through conveyer belt of the present invention and corner transfer conveyer belt.
Figure 13 is schematic flow sheet of the present invention.
Figure 14 is control system of the present invention.
Shown in figure: 1-first silicon chip carrying platform; 2-second silicon chip carrying platform; 3-silk screen attitude-adjusting system; 4-silk screen lowering or hoisting gear; 5-ink-scraping device; 6-first silicon chip loading device; 7-second silicon chip loading device; 8-first silicon chip unloading device; 9-second silicon chip unloading device; 10-first silk screen datum mark camera; 11-second silk screen datum mark camera; 12-first passes in and out plate detection camera; 13-second passes in and out plate detection camera; 14-first leads directly to conveyer belt; 15-first corner transfer conveyer belt; 16-second leads directly to conveyer belt; 17-second corner transfer conveyer belt; The straight-through conveyer belt of 18-the 3rd; The straight-through conveyer belt of 19-the 4th; 20-method of three turning angles transfer conveyer belt; The straight-through conveyer belt of 21-the 5th; 22-the 4th corner transfer conveyer belt; The straight-through conveyer belt of 23-the 6th; 24-pedestal.24-pedestal; 25-silicon chip; 26-conveyer belt; 27-motor; 28-slide rail.29-silk screen fixed mount; 30-directive wheel; 31-guide pad; 32-driver plate; 33-silk screen locking cylinder; 34-silk screen.35-scraper; 36-scraper seesaws mechanism; 37-Hui Mo mechanism; 38-scraper up-down mechanism.39-silicon chip; 40-first light sensation; 41-second light sensation; 42-the 3rd light sensation; 43-first motor; 44-second motor; 45-slide rail.46-leads directly to conveyer belt; 47-corner transfer conveyer belt; 48-lowering or hoisting gear.
Detailed description of the invention
In order to understand the present invention better, below in conjunction with drawings and Examples, the present invention is further described, but embodiments of the present invention are not limited thereto.
As shown in Figure 2 to 4, the full-automatic vision silicon chip printing equipment with Double tabletop comprises the first silicon chip carrying platform 1, second silicon chip carrying platform 2, silk screen attitude-adjusting system 3, ink-scraping device 5, silk screen lowering or hoisting gear 4, first silicon chip loading device 6, second silicon chip loading device 7, first silicon chip unloading device 8, second silicon chip unloading device 9, first silk screen datum mark camera 10, second silk screen datum mark camera 11, first turnover plate detection camera 12, second turnover plate detection camera 13, first straight-through conveyer belt 14, first corner transfer conveyer belt 15, second straight-through conveyer belt 16, second corner transfer conveyer belt 17, 3rd straight-through conveyer belt 18, 4th straight-through conveyer belt 19, method of three turning angles transfer conveyer belt 20, 5th straight-through conveyer belt 21, 4th corner transfer conveyer belt 22, 6th straight-through conveyer belt 23.Wherein, the straight-through conveyer belt 16 of the first straight-through conveyer belt 14, second, the 3rd straight-through conveyer belt 18 and the first corner transfer conveyer belt 15, second corner transfer conveyer belt 17 form the first buffering supply line; 4th straight-through conveyer belt 19, the 5th straight-through conveyer belt 21, the 6th straight-through conveyer belt 23 and method of three turning angles transfer conveyer belt the 20, the 4th corner transfer conveyer belt 22 form the second buffering supply line.
Formation and the effect of each device described are as follows:
(1) first silicon chip carrying platform 1 and the second silicon chip carrying platform 2
The effect of silicon chip carrying platform is providing smooth support to silicon chip toward on silicon chip during application to printed.This printing equipment adopts two silicon chip carrying platform structure: the first silicon chip carrying platform 1 and the second silicon chip carrying platform 2, can realize changing sheet and printing process concurrent process.
As shown in Figure 7, Figure 8, silicon chip carrying platform is a smooth platform, and be a wide and thin transported flat band 26 above platform, the driving wheel of transported flat band 26 and driven pulley are distributed in platform both sides, are driven by motor 27.There are many equally distributed apertures platform middle part, and conveyer belt 26 also has many equally distributed apertures above, and these apertures are inhaled function by vacuum and silicon chip is adsorbed on platform.Conveyer belt 26 covers that plane of platform silicon chip 25, obtains even support, thus can reduce the breakage of silicon chip 25 when can make printing like this bottom silicon chip 25.Slide rail 28 is had below platform, can the transverse shifting of implementation platform.First silicon chip carrying platform 1 is identical with the second silicon chip carrying platform 12, is symmetrically distributed on pedestal 24.
When the first silicon chip carrying platform 1 or the second silicon chip carrying platform 2 are below ink-scraping device 5, be called that platform is at printing station (the second silicon chip carrying platform 2 is at printing station in as Fig. 2); And the first silicon chip carrying platform 1 (or second silicon chip carrying platform 2) aims at the position can implementing to change sheet with the conveyer belt of the first silicon chip loading device 6 (or second silicon chip loading device 7), be called and change sheet station (as in Fig. 2, the first silicon chip carrying platform 1 is changing sheet station).First silicon chip carrying platform 1 and the second silicon chip carrying platform 2 be arranged on same can on the pedestal 24 of transverse shifting, therefore when the first silicon chip carrying platform 1 enters printing station, the second silicon chip carrying platform 2 is moved out to and changes sheet station; Equally, when the second silicon chip carrying platform 2 enters printing station, the first silicon chip carrying platform 1 is moved out to and changes sheet station.
When loading new silicon chip, by the first silicon chip loading device 6(or the second silicon chip loading device 7) and the first silicon chip carrying platform 1(or the second silicon chip carrying platform 2) on conveyer belt coordinate, the silicon chip do not printed is sent to the first silicon chip carrying platform 1(or the second silicon chip carrying platform 2) on, when silicon chip is delivered to platform central, the vacuum of opening on platform is inhaled and silicon chip is held, in case silicon chip moves when Platform movement or wiping; When unloading the silicon chip printed, by the first silicon chip carrying platform 1(or the second silicon chip carrying platform 2) and the first silicon chip unloading device 8(or the second silicon chip unloading device 9) on conveyer belt coordinate, the silicon chip printed is sent to the first silicon chip unloading device 8(or the second silicon chip unloading device 9) on.
(2) silk screen attitude-adjusting system 3
The effect of silk screen attitude-adjusting system 3 is attitudes of the pose adjustment silk screen according to silicon chip, makes the pattern on silk screen align with silicon chip, makes coating correctly be transferred on silk screen.
As shown in Figure 9, silk screen attitude-adjusting system 3 is made up of silk screen fixed mount 29, directive wheel 30, guide pad 31 and driver plate 32 etc.Guide pad 31 is fixed on silk screen fixed mount 29, and driver plate 32 and silk screen fixed mount 29 pass through bolt-connection.Directive wheel 30 is located constant, but rotatably.Coordinating as shown in the Local map of Fig. 9 upper right side between guide pad 31 with directive wheel 30.Be driven through driver plate 32 and be delivered to silk screen fixed mount 29, make silk screen fixed mount 29 can in XY translation and rotary motion.
Silk screen attitude-adjusting system 3 shown in Fig. 9 is only a kind of representative organization wherein, also has other forms of silk screen attitude-adjusting system, does not do too much explanation here.
Because silk screen 34 is arranged on silk screen attitude-adjusting system 3, thus silk screen 34 can realize XY moves in parallel and rotate location.Silk screen 34 is locked at silk screen 34 on silk screen attitude-adjusting system 3 by silk screen locking cylinder 33 after adjusting.
(3) ink-scraping device 5
Ink-scraping device 5 to be impressed into coating on silicon chip by moving up and down and seesawing of scraper.As shown in Figure 10, ink-scraping device 5 comprises scraper 35, scraper up-down mechanism 38, scraper seesaw mechanism 36 and Hui Mo mechanism 37 etc.Wherein, the scraper mechanism 36 that seesaws is driven by motor, and scraper up-down mechanism 38 is by cylinder-pushed.
(4) silk screen lowering or hoisting gear 4
As shown in Figure 2, silk screen attitude-adjusting system 3 and ink-scraping device 5 are arranged on silk screen lowering or hoisting gear 4, silk screen lowering or hoisting gear 4 is driven by motor, when the first silicon chip carrying platform 1(or the second silicon chip carrying platform 2) at printing station time, by silk screen lowering or hoisting gear 4, silk screen 34 pressed close to and leave the first silicon chip carrying platform 1(or the second silicon chip carrying platform 2) on silicon chip so that realize silicon chip printing or cleaning net bottom.
(5) first silicon chip loading device 6 and the second silicon chip loading devices 7
First silicon chip loading device 6(or the second silicon chip loading device 7) with the first silicon chip carrying platform 1(or the second silicon chip carrying platform 2) align when changing sheet station, the first silicon chip loading device 6(or the second silicon chip loading device 7) and the first silicon chip carrying platform 1(or the second silicon chip carrying platform 2) on conveyer belt coordinate silicon chip from the first silicon chip loading device 6(or the second silicon chip loading device 7) be transported to the first silicon chip carrying platform 1(or the second silicon chip carrying platform 2).
Silicon chip loading device also has silicon chip pose adjustment function.When detecting that silicon chip pose deviation is serious, by the self-movement of two conveyer belts on silicon chip loading device and the transverse shifting of bottom platform, can silicon chip pose adjustment in certain scope.This pose adjustment is that when making silicon chip enter silicon chip carrying platform, attitude can not exceed silk screen attitude-adjusting system working range.As shown in figure 11, if the second light sensation 41 and the 3rd light sensation 42 can not respond to silicon chip 39 simultaneously, so need to carry out angle adjustment to silicon chip 39.If the second light sensation 41 first responds to silicon chip 39, then make the second motor 44 stall, make the first motor 43 reverse (motor rotates forward, and silicon chip advances) a bit, then two motors rotate forward with same rotational speed simultaneously; If the 3rd light sensation 42 first responds to silicon chip 39, then make the first motor 43 stall, make the second motor 44 reverse (motor rotates forward, and silicon chip advances) a bit, then two motors rotate forward with same rotational speed simultaneously.See whether the second light sensation 41 and the 3rd light sensation 42 can respond to silicon chip 39 simultaneously, if can not, then do corresponding adjustment, circulate with this, until the second light sensation 41 and the 3rd light sensation 42 can respond to silicon chip 39 simultaneously.If the first light sensation 40 can not respond to silicon chip 39, then silicon chip loading device is close to the first light sensation 40 along slide rail 45, and when the first light sensation 40 1 senses silicon chip 39, silicon chip loading device just stops mobile.Based on above principle, silicon chip loading device can not only finely tune the angle of silicon chip, can also adjust the lateral shift of silicon chip.In order to make adjustment process simplify, first angle adjustment is carried out to silicon chip, then carry out lateral shift adjustment.
(6) first silicon chip unloading device 8 and the second silicon chip unloading devices 9
As shown in Figure 2, first silicon chip unloading device 8(or the second silicon chip unloading device 9) with the first silicon chip loading device 6(or the second silicon chip loading device 7) be symmetrically distributed in the first silicon chip carrying platform 1 and the second silicon chip carrying platform 2 both sides, the first silicon chip unloading device 8(or the second silicon chip unloading device 9) and the first silicon chip carrying platform 1(or the second silicon chip carrying platform 2) on conveyer belt coordinate silicon chip from the first silicon chip carrying platform 1(or the second silicon chip carrying platform 2) transfer to the first silicon chip unloading device 8(or the second silicon chip unloading device 9).
(7) first silk screen datum mark camera 10 and the second silk screen datum mark cameras 11
First silk screen datum mark camera 10 and the second silk screen datum mark camera 11 are arranged on the below of silk screen attitude-adjusting system 3, as shown in Figure 9, silk screen 34 there are two Mark points, first silk screen datum mark camera 10 and the second silk screen datum mark camera 11 are just used to the image obtaining these two Mark points bottom silk screen 34, thus calculate the attitude of silk screen 34.
(8) first turnover plate detection camera 12 and the second turnover plate detection camera 13
As shown in Figure 2, first turnover plate detection camera 12(or second turnover plate detection camera 13) be arranged on the first silicon chip carrying platform 1(or the second silicon chip carrying platform 2) when changing sheet station above, for obtaining the image of silicon chip, according to silicon chip image, the attitude of silicon chip and whether damaged can be analyzed when entering plate, during ejecting plate, check that whether silicon chip is damaged.
(9) first buffering supply lines and the second buffering supply line
First cushions supply line and the first silicon chip unloading device 8 and the second silicon chip unloading device 9 in being arranged vertically, and is made up of the straight-through conveyer belt 16 of the first straight-through conveyer belt 14, second, the 3rd straight-through conveyer belt 18 and the first corner transfer conveyer belt 15, second corner transfer conveyer belt 17.Wherein, the straight-through conveyer belt 16 of the first straight-through conveyer belt 14, second, the 3rd straight-through conveyer belt 18 conllinear; First corner transfer conveyer belt 15 and the first straight-through conveyer belt 14 vertical, and with the first silicon chip unloading device 8 conllinear; Second corner transfer conveyer belt 17 and the 3rd straight-through conveyer belt 18 vertical, and with the second silicon chip unloading device 9 conllinear.
Second cushions supply line and the first silicon chip loading device 6 and the second silicon chip loading device 7 in being arranged vertically, and is made up of the 4th straight-through conveyer belt 19, the 5th straight-through conveyer belt 21, the 6th straight-through conveyer belt 23 and method of three turning angles transfer conveyer belt the 20, the 4th corner transfer conveyer belt 22.Wherein, the 4th straight-through conveyer belt 19, the 5th straight-through conveyer belt 21, the 6th straight-through conveyer belt 23 conllinear; Method of three turning angles transfer conveyer belt 20 and the 4th straight-through conveyer belt 19 vertical, and with the first silicon chip loading device 6 conllinear; 4th corner transfer conveyer belt 22 and the 6th straight-through conveyer belt 23 vertical, and with the second silicon chip loading device 7 conllinear.
Second buffering supply line receives the silicon chip needing printing from printing machine upstream, the first buffering supply line is sent to printing machine downstream the silicon chip printed.
As shown in figure 12, straight-through conveyer belt 46 and corner transfer conveyer belt 47 are in being arranged vertically.There is lowering or hoisting gear 48 below corner transfer conveyer belt 47, combine with conveyer belt above, make corner transfer conveyer belt 47 rise within the specific limits and decline.The centre position symmetry of corner transfer conveyer belt 47 have two sulculuses, make two conveyer belts of straight-through conveyer belt 46 by and do not interfere, and groove depth should meet the range of corner transfer conveyer belt 47.The rising of corner transfer conveyer belt 47 and the mutual transfer of silicon chip that can make above straight-through conveyer belt 46 and corner transfer conveyer belt 47 that declines: when corner transfer conveyer belt 47 is above straight-through conveyer belt 46, corner transfer conveyer belt 47 declines, and the silicon chip above corner transfer conveyer belt 47 can be made to fall above straight-through conveyer belt 46; When corner transfer conveyer belt 47 is below straight-through conveyer belt 46, corner transfer conveyer belt 47 rises, can above the silicon chip holder above straight-through conveyer belt 46 to corner transfer conveyer belt 47.
As shown in Figure 5, Figure 6, article four, the initial position of corner transfer conveyer belt is: method of three turning angles transfer conveyer belt 20 is in the below of the 4th straight-through conveyer belt 19,4th corner transfer conveyer belt 22 is in the below of the 6th straight-through conveyer belt 23, first corner transfer conveyer belt 15 is above the first straight-through conveyer belt 14, and the second corner transfer conveyer belt 17 is in the below of the 3rd straight-through conveyer belt 18.
Have the full-automatic vision silicon chip printing equipment of Double tabletop, concrete course of action is as follows:
1. enter plate process
As shown in Figure 5, the 4th straight-through conveyer belt 19 receives the silicon chip needing printing from printing machine upstream, and silicon chip is along the 4th straight-through conveyer belt 19 to front transfer, and when silicon chip is delivered to directly over method of three turning angles transfer conveyer belt 20, silicon chip can have both direction to continue to transmit.
(1) first silicon chip carrying platform 1 enters plate
When silicon chip transmits to the first silicon chip loading device 6 direction, the 4th straight-through conveyer belt 19 stops operating, and method of three turning angles transfer conveyer belt 20 rises, and silicon chip is held up, until method of three turning angles transfer conveyer belt 20 and the first silicon chip loading device 6 neat high time stop rising; Electric machine rotation on method of three turning angles transfer conveyer belt 20 and the first silicon chip loading device 6, transfers to the first silicon chip loading device 6 silicon chip from method of three turning angles transfer conveyer belt 20; When silicon chip is delivered to the first silicon chip loading device 6, method of three turning angles transfer conveyer belt 20 declines, and drops to initial position; While method of three turning angles transfer conveyer belt 20 declines, silicon chip continues to front transfer, and when being delivered to the centre position of the first silicon chip loading device 6, if silicon chip has certain angle and lateral shift, then the first silicon chip loading device 6 is done to adjust accordingly silicon chip is set; Silicon chip after correcting continues silicon chip to be transported to the first silicon chip carrying platform 1.
(2) second silicon chip carrying platforms 2 enter plate
When silicon chip transmits to the 5th straight-through conveyer belt 21 direction, method of three turning angles transfer conveyer belt 20 does not rise, and silicon chip continues to front transfer along the 4th straight-through conveyer belt 19, is delivered to the 6th straight-through conveyer belt 23 through the 5th straight-through conveyer belt 21; When silicon chip is in directly over the 4th corner transfer conveyer belt 22,6th straight-through conveyer belt 23 stops operating, 4th corner transfer conveyer belt 22 rises, and silicon chip is held up, until the 4th corner transfer conveyer belt 22 and the second silicon chip loading device 7 neat high time stop rising; Electric machine rotation on 4th corner transfer conveyer belt 22 and the second silicon chip loading device 7, transfers to the second silicon chip loading device 7 silicon chip from the 4th corner transfer conveyer belt 22; When silicon chip is delivered to the second silicon chip loading device 7, the 4th corner transfer conveyer belt 22 declines, and drops to initial position; While 4th corner transfer conveyer belt 22 declines, silicon chip continues to front transfer, and when being delivered to the centre position of the second silicon chip loading device 7, if silicon chip has certain angle and lateral shift, then the second silicon chip loading device 7 is done to adjust accordingly silicon chip is set; Silicon chip after correcting continues silicon chip to be transported to the second silicon chip carrying platform 2.
When the first silicon chip carrying platform 1 enters printing station, the second silicon chip carrying platform 2 is moved out to and changes sheet station; Equally, when the second silicon chip carrying platform 2 enters printing station, the first silicon chip carrying platform 1 is moved out to and changes sheet station.
2. printing process
First silicon chip carrying platform 1 and the second silicon chip carrying platform 2 alternately enter printing station and realize wiping operation, and correspondingly control system alternately loads silicon chip to the first silicon chip carrying platform 1 and the second silicon chip carrying platform 2.As shown in Figure 2, printing process is as follows:
(1) silicon chip enters plate by the first silicon chip carrying platform 1 and is delivered to the first silicon chip carrying platform 1, now the first silicon chip carrying platform 1 is in and changes sheet station, and the first silicon chip carrying platform 1 has silicon chip, and the second silicon chip carrying platform 2 does not have, when silicon chip arrives the first silicon chip carrying platform 1 central, vacuum is inhaled and is opened, and holds silicon chip, and the first turnover plate detection camera 12 is taken pictures, obtain the attitude of silicon chip, whether damaged analyze silicon chip simultaneously, if do not had, then carry out next operation;
(2) first silk screen datum mark cameras 10 and the second silk screen datum mark camera 11 take the Mark point of the silk screen 34 of printing machine, the attitude being adjusted silk screen 34 by silk screen guiding mechanism 3 makes the pattern on silk screen 34 aim at silicon chip, first silicon chip carrying platform 1 moves from changing sheet station to printing station simultaneously, when the first silicon chip carrying platform 1 arrives printing station, silk screen lowering or hoisting gear 4 declines, silk screen 34 and silicon chip are pressed close to, doctor blade device 5 is coated in tin slurry or silver slurry on silicon chip through silk screen 34, after wiping completes, silk screen lowering or hoisting gear 4 rises, while silicon chip on the first silicon chip carrying platform 1 is printed, silicon chip is transmitted to the second silicon chip carrying platform 2 from the second silicon chip loading device 7, when silicon chip arrives the second silicon chip carrying platform 2 central, vacuum is inhaled sheet and is opened, hold silicon chip, second turnover plate detection camera 13 is taken pictures, obtain the attitude of silicon chip, whether damagedly analyze silicon chip simultaneously, if do not had, then carry out next operation,
(3) first silk screen datum mark cameras 10 and the second silk screen datum mark camera 11 take the Mark point of the silk screen 34 of printing machine, the attitude being adjusted silk screen 34 by silk screen guiding mechanism 3 makes the pattern on silk screen 34 aim at silicon chip, second silicon chip carrying platform 2 moves from changing sheet station to printing station simultaneously, when the second silicon chip carrying platform 2 arrives printing station, silk screen lowering or hoisting gear 4 declines, silk screen 34 and silicon chip are pressed close to, doctor blade device 5 is coated in tin slurry or silver slurry on silicon chip through silk screen 34, after wiping completes, silk screen lowering or hoisting gear 4 rises, while silicon chip on the second silicon chip carrying platform 2 is printed, the silicon chip printed is delivered to the first silicon chip unloading device 8 from the first silicon chip carrying platform 1, and the silicon chip that the first silicon chip loading device 6 does not print is moved into the first silicon chip carrying platform 1, when silicon chip arrives the first silicon chip carrying platform 1 central, vacuum is inhaled sheet and is opened, hold silicon chip, first turnover plate detection camera 12 is taken pictures, obtain the attitude of silicon chip, whether damagedly analyze silicon chip simultaneously, if do not had, then carry out next operation,
(4) first silk screen datum mark cameras 10 and the second silk screen datum mark camera 11 take the Mark point of the silk screen 34 of printing machine, the attitude being adjusted silk screen 34 by silk screen guiding mechanism 3 makes the pattern on silk screen 34 aim at silicon chip, first silicon chip carrying platform 1 moves from changing sheet station to printing station simultaneously, when the first silicon chip carrying platform 1 arrives printing station, silk screen lowering or hoisting gear 4 declines, silk screen 34 and silicon chip are pressed close to, doctor blade device 5 is coated in tin slurry or silver slurry on silicon chip through silk screen 34, after wiping completes, silk screen lowering or hoisting gear 4 rises, while silicon chip on the first silicon chip carrying platform 1 is printed, the silicon chip printed is delivered to the second silicon chip unloading device 9 from the second silicon chip carrying platform 2, and the silicon chip that the second silicon chip loading device 7 does not print is moved into the second silicon chip carrying platform 2, when silicon chip arrives the second silicon chip carrying platform 2 central, vacuum is inhaled sheet and is opened, hold silicon chip, second turnover plate detection camera 13 is taken pictures, obtain the attitude of silicon chip, whether damagedly analyze silicon chip simultaneously, if do not had, then carry out next operation,
(5) after this, the first silicon chip carrying platform 1 and the second silicon chip carrying platform 2 alternately enter printing station, and cyclic process is as described in (3), (4).
3. ejecting plate process
As shown in Figure 6, board discharging device is made up of the first buffering supply line, the first silicon chip unloading device 8 and the second silicon chip loading device 9.The silicon chip printed passes to board discharging device from both direction.
(1) first silicon chip carrying platform 1 ejecting plate
When the silicon chip printed is delivered to the first silicon chip unloading device 8 from the first silicon chip carrying platform 1, silicon chip passes to the first corner transfer conveyer belt 15 along the first silicon chip unloading device 8; When silicon chip is in directly over the first straight-through conveyer belt 14, the first corner transfer conveyer belt 15 stops operating, and the first corner transfer conveyer belt 15 declines simultaneously; When silicon chip is fallen on the first straight-through conveyer belt 14, the first corner transfer conveyer belt 15 stops declining after continuing decline one segment distance, and the first straight-through conveyer belt 14 rotates simultaneously; Silicon chip continues to front transfer along the first straight-through conveyer belt 14, the 3rd straight-through conveyer belt 18 is delivered to through the second straight-through conveyer belt 16, again the silicon chip of this equipment printing is delivered to printing machine downstream, the first corner transfer conveyer belt 15 rises simultaneously, gets back to initial position.
Should be noted that and be, after the silicon chip printed is delivered to the first silicon chip unloading device 8 from the first silicon chip carrying platform 1, follow closely be exactly the first silicon chip loading device 6 the silicon slice loading do not printed on the first silicon chip carrying platform 1.
(2) second silicon chip carrying platform 2 ejecting plates
When the silicon chip printed is delivered to the second silicon chip unloading device 9 from the second silicon chip carrying platform 2, silicon chip continues to front transfer along the second silicon chip unloading device 9, simultaneously the second corner transfer conveyer belt 17 rises, until the second corner transfer conveyer belt 17 and the second silicon chip unloading device 9 neat high time stop rising; Second corner transfer conveyer belt 17 rotates, and silicon chip is delivered to the second corner transfer conveyer belt 17 from the second silicon chip unloading device 9; Silicon chip transports along the second corner transfer conveyer belt 17, and when silicon chip is in directly over the 3rd straight-through conveyer belt 18, the second corner transfer conveyer belt 17 stops operating, and the second corner transfer conveyer belt 17 declines simultaneously; When silicon chip is fallen on the 3rd straight-through conveyer belt 18, the second corner transfer conveyer belt 17 stops declining after continuing decline one segment distance, drops to initial position, and the 3rd straight-through conveyer belt 18 rotates simultaneously; Silicon chip continues to front transfer along the 3rd straight-through conveyer belt 18, and the silicon chip of this equipment printing is delivered to printing machine downstream.
At the second corner transfer conveyer belt 17 place, there is the silicon chip of both direction hitherward to transmit, the transmission of both direction should be staggered.In the appropriate location of board discharging device, sensor is housed, according to the Logic based method of PLC control system, when silicon chip is transmitted along the second straight-through conveyer belt 16 to the second corner transfer conveyer belt 17 direction, the second corner transfer conveyer belt 17 is in the below of the 3rd straight-through conveyer belt 18.When silicon chip transmits along the second silicon chip unloading device 9 to the second corner transfer conveyer belt 17 direction, the second corner transfer conveyer belt 17 rises to again with the second silicon chip unloading device 9 contour.It should be noted that after the silicon chip printed is delivered to the second silicon chip unloading device 9 from the second silicon chip carrying platform 2, follow closely be exactly the second silicon chip loading device 7 the silicon slice loading do not printed on the second silicon chip carrying platform 2.
In sum, this printing equipment adopts two carrying platform structure, two carrying platforms alternately enter printing station and realize wiping operation, make a carrying platform while carrying out changing sheet, another one carrying platform is carrying out silicon chip printing, ensure that printing equipment can realize changing sheet and wiping operation, even if change sheet and printing process concurrent process simultaneously, thus decrease the production time, significantly improve the production efficiency of production line unit interval.And turnover plate all adopts conveyer belt transmission, structure is simple, stable movement, and turnover plate detection camera can also realize ejecting plate damage testing.
As shown in figure 14, in order to coordinate the work of printing equipment of the present invention, according to turnover plate detection camera, silk screen datum mark camera gained silicon chip, silk screen attitude-adjusting system attitude information, the high accuracy realizing silicon chip and silk screen is aimed at.Originally positioner, image collecting device, camera controller, image pick-up card, positioning device controller, image procossing, all-purpose computer and motion controller etc. are also needed when there is the full-automatic vision silicon chip printing dress work of Double tabletop.Wherein, positioner comprises the first light sensation 40, second light sensation 41 and the 3rd light sensation 42; Image collecting device comprises the first silk screen datum mark camera 10, second silk screen datum mark camera 11, first turnover plate detection camera 12 and the 3rd turnover plate detection camera 13; Camera controller controls the IMAQ of image collecting device; Picture signal is given CPU process or is saved in memory by image pick-up card; Motion controller controls the action of printing equipment.
In order to get more information about the workflow of this printing equipment, can with reference to Figure 13.
The present invention has the features such as compact conformation, stable drive, manufacture and installation are simple, easy to maintenance, printing quality is high, production efficiency is high, floor space is little, can be used for the various printings of silicon chip.
The detailed description of the invention of the above is only better embodiment of the present invention, not limits specific embodiment of the invention scope with this, and the equivalence change that all shapes according to the present invention, structure are done is all in protection scope of the present invention.
Claims (1)
1. one kind has the full-automatic vision silicon chip printing equipment of Double tabletop, it is characterized in that comprising two silicon chip carrying platforms, two turnover plate detection camera, a silk screen lowering or hoisting gear, a silk screen attitude-adjusting system, two silk screen datum mark cameras, an ink-scraping device, two cover silicon chip loading devices, two cover silicon chip unloading devices, two cover buffering supply lines; Two silicon chip carrying platforms are arranged on the pedestal of a transverse shifting, alternately enter printing station and realize wiping operation; What turnover plate detection camera was arranged on silicon chip carrying platform changes above sheet station, for obtaining the image of silicon chip; Silk screen lowering or hoisting gear is arranged on four support columns of printing machine, for making silk screen press close to silicon chip and leave silicon chip, to realize silicon chip printing, the demoulding and cleaning net bottom; Silk screen attitude-adjusting system is arranged on the silk screen lowering or hoisting gear of printing machine, realizes XY move in parallel and rotate location for making silk screen; Two silk screen datum mark cameras are arranged on the below of silk screen attitude-adjusting system, and are symmetrically distributed in the both sides of the silicon chip carrying platform at printing station, are used for obtaining the image of wire mesh bottom two datum marks; Ink-scraping device is arranged on the top of silk screen attitude-adjusting system, moving up and down and seesawing coating is impressed on silicon chip by scraper; Two cover silicon chip loading devices align with the silicon chip carrying platform not at printing station, and are symmetrically distributed in the both sides of printing machine, can adjust angle and the lateral shift of silicon chip; Silicon chip unloading device and silicon chip loading device are symmetrically distributed in silicon chip carrying platform both sides; Two cover buffering supply lines all with silicon chip loading device and silicon chip unloading device in being arranged vertically, for receiving the silicon chip that needs print from upstream, and the silicon chip printed is sent to downstream; Above each silicon chip carrying platform, conveyer belt is housed, there is multiple equally distributed aperture platform middle part, also has multiple equally distributed aperture above conveyer belt, and these apertures are inhaled function by vacuum and silicon chip is adsorbed on platform; Conveyer belt covers the plane for supporting silicon chip on platform; The slide rail that can realize transverse shifting is had below platform; Often overlap above silicon chip loading device and be equipped with two for adjusting the conveyer belt of silicon chip angle, these two conveyer belts respectively by two driven by motor, and are equipped with three light sensations for responding to position of silicon wafer near conveyer belt; Have below silicon chip loading device for translational motion to adjust the bottom platform of silicon chip lateral displacement; Cover buffering supply line is made up of three straight-through conveyer belts and two corner transfer conveyer belts, the cooperation of straight-through conveyer belt and corner transfer conveyer belt, is assigned to silicon chip two silicon chip loading devices and the silicon chip through printing is overlapped independently silicon chip unloading device from two and focus on same ejecting plate supply line;
Described silk screen attitude-adjusting system is a planar three freedom serial mechanism, can realize XY and moves in parallel and rotate location;
Described ink-scraping device comprises scraper, scraper seesaws mechanism, scraper up-down mechanism and Hui Mo mechanism, the scraper mechanism that seesaws makes scraper seesaw, scraper up-down mechanism makes scraper move up and down, and moving up and down and seesawing of scraper realizes coating to be impressed on silicon chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210141614.2A CN102700237B (en) | 2012-05-09 | 2012-05-09 | A kind of full-automatic vision silicon chip printing equipment with Double tabletop |
| PCT/CN2012/086894 WO2013166837A1 (en) | 2012-05-09 | 2012-12-19 | Fully-automatic vision silicon wafer printing device with double platforms |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210141614.2A CN102700237B (en) | 2012-05-09 | 2012-05-09 | A kind of full-automatic vision silicon chip printing equipment with Double tabletop |
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| CN102700237B true CN102700237B (en) | 2015-08-26 |
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| WO2013166837A1 (en) | 2013-11-14 |
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