CN102700237B - A kind of full-automatic vision silicon chip printing equipment with Double tabletop - Google Patents

Abstract

The invention discloses a double-platform fully automatic visual silicon wafer printing device, which includes two silicon wafer bearing platforms, two in-out plate detection cameras, a screen lifting device, a screen attitude adjustment mechanism, and two screen reference points Camera, one scraping device, two sets of silicon wafer loading devices, two sets of silicon wafer unloading devices, two sets of buffer transportation lines; two silicon wafer carrying platforms are installed on a laterally moving base, which can alternately enter the printing station to realize Ink scraping operation, the silicon wafer carrying platform that is not in the printing station can simultaneously load and unload silicon wafers; the printing device adopts a double silicon wafer carrying platform structure, which can realize parallel wafer replacement and printing process, improve production efficiency, and the device The structure is compact and the equipment occupies a small area.

Description

A fully automatic visual silicon wafer printing device with dual platforms

technical field

The invention relates to a silicon chip printing device, in particular to a fully automatic visual silicon chip printing device capable of realizing double-platform printing in turn.

Background technique

With the increasing tension of global energy, solar energy has been widely valued by countries all over the world with its unique advantages such as no pollution and large market space. Many large companies in the world have invested in the research and development and production of solar cells. Obtaining electricity from solar energy requires photoelectric conversion through solar cells. Silicon solar cells are semiconductor electronic devices that effectively absorb solar radiation and convert it into electrical energy. They are widely used in various lighting and power generation systems.

The challenges facing solar cell manufacturers today are beginning to polarize into two main priorities: increasing the power of solar cells to increase power generation per unit area, and second, the desire or need to increase productivity with existing processes without corresponding additional investment.

Solar cell printing is an important process in the cell production line and plays an important role in the quality of the cell. Solar cell printing technology is an organic whole and a combination of various technologies. Solar cells are divided into crystalline silicon cells and thin-film cells. At present, thin-film cell technology has a comparative advantage in cost, but it is difficult to compare with crystalline silicon cells in terms of technology maturity, lifespan and conversion efficiency. With an absolute monopoly position, the cost per unit of power generation is still higher than that of traditional power generation methods. Therefore, cost reduction is a key factor for the sustainable development of the crystalline silicon solar energy industry, and the production efficiency of crystalline silicon cells constitutes an important factor in the cost of cells.

Existing printing devices generally adopt a single carrying platform structure, as shown in Figure 1, the printing device has only one carrying platform, silicon wafers are passed into the silicon wafer loading device 101 from the upstream, and the silicon wafer loading device 101 has the function of adjusting the attitude of the silicon wafers. The attitude of the wafer is initially corrected. Then, the silicon wafer continues to be forwarded along the silicon wafer loading device 101 . The silicon wafer is delivered to the center of the silicon wafer carrying platform 103, and the vacuum suction on the silicon wafer carrying platform 103 fixes the silicon wafer. The board-in attitude camera 107 and the board-out attitude camera 105 are movable, enter from both sides of the silicon wafer carrying platform 103, take images of two edge parts of the silicon wafer diagonally, and after taking pictures, the board-in attitude camera 107 and the board-out attitude camera 105 move out . The screen fiducial point camera 102 takes pictures, acquires images of two fiducial points at the bottom of the screen of the screen printing machine 106, and adjusts the screen to align the pattern on the screen with the silicon wafer. Screen printing machine 106 lifting platform descends, and starts scraping ink printing. After the printing is completed, the screen printing machine 106 lifting platform rises, the vacuum suction on the silicon wafer carrying platform 103 is closed, and the silicon wafer carrying platform 103 cooperates with the conveyor belt on the silicon wafer unloading device 104 to remove the silicon wafer from the silicon wafer carrying platform 103 Move to the silicon wafer unloading device 104, and then pass to the downstream along the silicon wafer unloading device 104. It is not difficult to see that when the printing device has only one silicon wafer carrying platform, the loading, photographing, adjustment, lifting, printing, and unloading processes are connected in series, and it takes a lot of time to print a silicon wafer, which limits the improvement of production efficiency.

Some printing machines also adopt a turntable structure, through the rotation of the station, to realize the parallel operation of film change and printing, but first, the cost of the turntable is high, and second, the turntable is large, which is not conducive to reducing the floor area of the machine.

Contents of the invention

The purpose of the present invention is to overcome the shortcomings of the prior art, and provide a fully automatic visual silicon wafer printing device with dual platforms, which has a compact structure, high production efficiency, less floor space, and can realize parallel operation of wafer changing and printing processes. For realizing the purpose of the present invention, the technical scheme that the present invention adopts is as follows.

A fully automatic visual silicon wafer printing device with double platforms, including two silicon wafer carrying platforms, two in-and-out plate detection cameras, a screen lifting device, a screen attitude adjustment mechanism, two screen reference point cameras, One scraping device, two sets of silicon wafer loading devices, two sets of silicon wafer unloading devices, two sets of buffer transportation lines; two silicon wafer carrying platforms are installed on a horizontally moving base, and alternately enter the printing station to realize the ink scraping operation ; The board-in and out inspection camera is installed above the wafer-changing station on the silicon wafer carrying platform to obtain images of the silicon wafer; the screen lifting device is installed on the four support columns of the printing machine to make the screen close to the silicon wafer and Leave the silicon wafer in order to realize silicon wafer printing, demoulding and cleaning the bottom of the screen; the screen attitude adjustment mechanism is installed on the screen lifting device of the printing machine, which is used to make the screen realize XY parallel movement and rotational positioning; two screens The fiducial point camera is installed under the screen attitude adjustment mechanism, and is symmetrically distributed on both sides of the silicon wafer carrying platform at the printing station, and is used to obtain images of two fiducial points at the bottom of the screen; the ink scraping device is installed on the screen Above the attitude adjustment mechanism, the paint is imprinted on the silicon wafer through the up and down movement and back and forth movement of the scraper; two sets of silicon wafer loading devices are aligned with the silicon wafer carrying platform that is not in the printing station, and are symmetrically distributed on both sides of the printing machine. side, can adjust the angle and lateral offset of the silicon wafer; the silicon wafer unloading device and the silicon wafer loading device are symmetrically distributed on both sides of the silicon wafer carrying platform; two sets of buffer transportation lines are perpendicular to the silicon wafer loading device and the silicon wafer unloading device Arrangement for receiving silicon wafers to be printed from upstream, or delivering printed silicon wafers to downstream.

Further, in the above-mentioned fully automatic visual silicon wafer printing device with double platforms, a conveyor belt is installed above each silicon wafer carrying platform, and there are a plurality of evenly distributed small holes in the middle of the platform, and a plurality of evenly distributed small holes on the conveyor belt. Small holes, these small holes absorb the silicon wafers on the platform through the vacuum suction function; the conveyor belt covers the plane on the platform for supporting the silicon wafers, so that the bottom of the silicon wafers can be evenly supported during printing, thereby reducing the damage of the silicon wafers . There are slide rails that can realize lateral movement under the platform. This structure can realize the parallel process of film changing and printing process.

Further, in the above-mentioned fully automatic visual silicon wafer printing device with dual platforms, the screen attitude adjustment mechanism is a plane three-degree-of-freedom series mechanism, which can realize XY parallel movement and rotational positioning.

Further, in the above-mentioned fully automatic vision silicon wafer printing device with double platforms, the ink scraping device includes a scraper, a scraper back and forth movement mechanism, a scraper up and down movement mechanism and an ink return mechanism, the scraper back and forth movement mechanism makes the scraper move back and forth, and the scraper The up and down movement mechanism makes the scraper move up and down, and the up and down and back and forth movements of the scraper realize embossing the paint onto the silicon wafer.

Further, in the above-mentioned fully automatic visual silicon wafer printing device with double platforms, two conveyor belts for adjusting the angle of silicon wafers are installed above each set of silicon wafer loading devices, and there are sensors for sensing silicon wafers near the conveyor belts. There are three light sensors in the position, and there is a bottom platform under the silicon wafer loading device for translational movement to adjust the lateral displacement of the silicon wafer.

Further, in the above-mentioned fully automatic visual silicon wafer printing device with double platforms, the buffer transport line is composed of three straight-through transport belts and two corner transfer transport belts, the cooperation of the straight-through transport belts and the corner transfer transport belts can transfer silicon Distribute wafers to two wafer loading devices or gather printed wafers from two independent wafer unloading devices to the same output conveyor line.

In the above-mentioned fully automatic visual silicon wafer printing device with dual platforms, the high-precision alignment of the silicon wafer and the screen is realized according to the attitude information of the silicon wafer and the silk screen attitude adjustment mechanism obtained by the in-out board detection camera and the screen reference point camera.

The present invention innovates the design of printing equipment on the basis of the existing single-carrying platform technology, and adopts a double-carrying platform structure, so that when one carrying platform is changing silicon wafers, the other carrying platform is printing silicon wafers, ensuring that the printing device can Realize chip replacement and ink scraping operations on two silicon wafers at the same time, even if the chip replacement is parallel to the printing process.

Compared with the prior art, the present invention has the following advantages and beneficial effects:

(1) Both the entry and exit plates of the present invention adopt belt transmission, with simple structure, stable movement, simple manufacture and installation, and convenient maintenance;

(2) The present invention adopts a double-carrying platform structure, so that the film change and the printing process are parallel, thereby reducing the production time and greatly improving the production efficiency per unit time of the production line;

(3) The structure of the present invention is compact, and the equipment occupies a small area.

Description of drawings

FIG. 1 is a schematic diagram of an existing printing device adopting a single-carrying platform structure.

Fig. 2 is a schematic structural diagram of a fully automatic visual silicon wafer printing device with dual platforms of the present invention.

Fig. 3 is a schematic diagram of the left side of the fully automatic visual silicon wafer printing device with double platforms of the present invention.

Fig. 4 is a schematic diagram of the right side of the fully automatic visual silicon wafer printing device with double platforms of the present invention.

Fig. 5 is a schematic diagram of the board feeding device of the present invention.

Fig. 6 is a schematic diagram of the plate ejecting device of the present invention.

Fig. 7 is a schematic diagram of the silicon chip carrying platform of the present invention.

Fig. 8 is a front view of the silicon wafer carrying platform of the present invention.

Fig. 9 is a schematic diagram of the screen posture adjustment mechanism of the present invention.

Fig. 10 is a schematic diagram of the ink wiping device of the present invention.

Fig. 11 is a schematic diagram of a silicon wafer loading device of the present invention.

Fig. 12 is an assembly diagram of the straight-through conveyor belt and the corner transfer conveyor belt of the present invention.

Fig. 13 is a schematic flow chart of the present invention.

Figure 14 is the control system of the present invention.

Shown in the figure: 1 - the first silicon wafer carrying platform; 2 - the second silicon wafer carrying platform; 3 - screen attitude adjustment mechanism; 4 - screen lifting device; 5 - ink scraping device; 6 - first silicon wafer Loading device; 7-second silicon wafer loading device; 8-first silicon wafer unloading device; 9-second silicon wafer unloading device; 10-first silk screen fiducial point camera; 11-second silk screen fiducial point camera; 12 - The first detection camera for board entry and exit; 13 - The second detection camera for board entry and exit; 14 - The first straight conveyor belt; 15 - The first corner transfer conveyor belt; 16 - The second straight conveyor belt; 17 - The second corner Transfer conveyor belt; 18-third straight conveyor belt; 19-fourth straight conveyor belt; 20-third corner transfer conveyor belt; 21-fifth straight conveyor belt; 22-fourth corner transfer conveyor belt; 23 - the sixth through-conveyor; 24 - the base. 24-base; 25-silicon chip; 26-conveyor belt; 27-motor; 28-sliding rail. 29-wire screen fixed frame; 30-guiding wheel; 31-guiding block; 32-transmission plate; 33-screen locking cylinder; 34-wire screen. 35-scraper; 36-scraper forward and backward movement mechanism; 37-ink return mechanism; 38-scraper up and down movement mechanism. 39-silicon chip; 40-first light sensor; 41-second light sensor; 42-third light sensor; 43-first motor; 44-second motor; 45-sliding rail. 46-straight conveyor belt; 47-corner transfer conveyor belt; 48-lifting device.

Detailed ways

In order to better understand the present invention, the present invention will be further described below in conjunction with the accompanying drawings and examples, but the embodiments of the present invention are not limited thereto.

As shown in Figures 2 to 4, the fully automatic visual silicon wafer printing device with double platforms includes a first silicon wafer carrying platform 1, a second silicon wafer carrying platform 2, a screen posture adjustment mechanism 3, a scraping ink device 5, and a silk screen. Web lifting device 4, first wafer loading device 6, second wafer loading device 7, first wafer unloading device 8, second wafer unloading device 9, first screen fiducial point camera 10, second screen Reference point camera 11, first in-out board inspection camera 12, second in-out board inspection camera 13, first straight-through conveyor belt 14, first corner transfer conveyor belt 15, second straight-through conveyor belt 16, second corner transfer Conveyor belt 17, the third straight conveyor belt 18, the fourth straight conveyor belt 19, the third corner transfer conveyor belt 20, the fifth straight conveyor belt 21, the fourth corner transfer conveyor belt 22, and the sixth straight conveyor belt 23. Wherein, the first straight-through conveyor belt 14, the second straight-through conveyor belt 16, the third straight-through conveyor belt 18, the first corner transfer conveyor belt 15, and the second corner transfer conveyor belt 17 form the first buffer conveyor line; The straight-through conveyor belt 19, the fifth straight-through conveyor belt 21, the sixth straight-through conveyor belt 23, the third corner transfer conveyor belt 20, and the fourth corner transfer conveyor belt 22 form the second buffer conveyor line.

The composition and effect of each device are as follows:

(1) The first silicon wafer carrying platform 1 and the second silicon wafer carrying platform 2

The role of the silicon wafer carrying platform is to provide a flat support for the silicon wafer when coating and printing on the silicon wafer. The printing device adopts a double silicon chip carrying platform structure: the first silicon chip carrying platform 1 and the second silicon chip carrying platform 2, which can realize the parallel process of chip replacement and printing process.

As shown in Fig. 7 and Fig. 8, the silicon wafer carrying platform is a flat platform, and above the platform is a wide and thin flat conveyor belt 26, and the driving wheels and driven wheels of the flat conveyor belt 26 are distributed on both sides of the platform, driven by motor 27 drives. There are many uniformly distributed small holes in the middle of the platform, and there are also many uniformly distributed small holes on the conveyor belt 26, and these small holes adsorb the silicon wafers on the platform through the vacuum suction function. The transport belt 26 covers the plane of the platform supporting the silicon wafer 25, so that the bottom of the silicon wafer 25 can be evenly supported during printing, thereby reducing damage to the silicon wafer 25. There are slide rails 28 below the platform, which can realize the lateral movement of the platform. The first silicon wafer carrying platform 1 and the second silicon wafer carrying platform 12 are identical, and are symmetrically distributed on the base 24 .

When the first silicon wafer carrying platform 1 or the second silicon wafer carrying platform 2 was below the ink scraping device 5, it was called that the platform was at the printing station (as the second silicon wafer carrying platform 2 was at the printing station as in Fig. 2); and The first silicon wafer carrying platform 1 (or the second silicon wafer carrying platform 2) is aligned with the conveyor belt of the first silicon wafer loading device 6 (or the second silicon wafer loading device 7) and the position where the chip can be changed is called changing. Wafer station (as shown in Figure 2, the first silicon wafer carrying platform 1 is at the wafer changing station). The first silicon wafer carrying platform 1 and the second silicon wafer carrying platform 2 are installed on the same base 24 that can move laterally, so when the first silicon wafer carrying platform 1 enters the printing station, the second silicon wafer carrying platform 2 Move out to the wafer changing station; similarly, when the second silicon wafer carrying platform 2 enters the printing station, the first silicon wafer carrying platform 1 moves out to the wafer changing station.

When loading new silicon wafers, the first silicon wafer loading device 6 (or the second silicon wafer loading device 7) cooperates with the conveyor belt on the first silicon wafer carrying platform 1 (or the second silicon wafer carrying platform 2), and the unused The printed silicon wafer is transferred to the first silicon wafer carrying platform 1 (or the second silicon wafer carrying platform 2). When the silicon wafer is transferred to the center of the platform, the vacuum suction on the platform is turned on to suck the silicon wafer to prevent the platform from moving. Or the silicon wafer moves when scraping the ink; when unloading the printed silicon wafer, it passes through the first silicon wafer carrying platform 1 (or the second silicon wafer carrying platform 2) and the first silicon wafer unloading device 8 (or the second silicon wafer unloading device 9) Cooperate with the conveyor belt on the top, and transfer the printed silicon wafer to the first silicon wafer unloading device 8 (or the second silicon wafer unloading device 9).

(2) Screen attitude adjustment mechanism 3

The function of the screen posture adjustment mechanism 3 is to adjust the posture of the screen according to the posture of the silicon wafer, so that the pattern on the screen is aligned with the silicon wafer, so that the paint can be correctly transferred to the screen.

As shown in FIG. 9 , the screen posture adjustment mechanism 3 is composed of a screen fixing frame 29 , a guide wheel 30 , a guide block 31 , a transmission plate 32 and the like. The guide block 31 is fixed on the wire mesh fixing frame 29, and the transmission plate 32 is connected with the wire mesh fixing frame 29 by bolts. The location of guide wheel 30 is constant, but rotatable. The cooperation between the guide block 31 and the guide wheel 30 is shown in the partial view on the upper right side of FIG. 9 . The drive is transmitted to the screen holder 29 through the transmission plate 32, so that the screen holder 29 can move in XY translation and rotation.

The screen posture adjustment mechanism 3 shown in FIG. 9 is only one representative mechanism, and there are other forms of screen posture adjustment mechanisms, which will not be described too much here.

Because the screen 34 is installed on the screen attitude adjustment mechanism 3 , the screen 34 can realize XY parallel movement and rotational positioning. After the wire mesh 34 is adjusted, the wire mesh 34 is locked on the wire mesh attitude adjustment mechanism 3 by the wire mesh locking cylinder 33 .

(3) Wiping device 5

The ink scraping device 5 imprints the paint onto the silicon wafer through the up and down movement and back and forth movement of the scraper. As shown in FIG. 10 , the ink scraping device 5 includes a scraper 35 , a mechanism for moving the scraper up and down 38 , a mechanism for moving the scraper back and forth 36 , and an ink return mechanism 37 . Wherein, the scraper forward and backward movement mechanism 36 is driven by a motor, and the scraper up and down movement mechanism 38 is promoted by a cylinder.

(4) Wire mesh lifting device 4

As shown in Figure 2, the screen posture adjustment mechanism 3 and the ink scraping device 5 are installed on the screen lifting device 4, and the screen lifting device 4 is driven by a motor. When the first silicon wafer carrying platform 1 (or the second silicon wafer carrying platform 1 Platform 2) When the printing station is at the printing station, the screen 34 is brought close to and away from the silicon wafer on the first silicon wafer carrying platform 1 (or the second silicon wafer carrying platform 2) through the screen lifting device 4, so as to realize silicon wafer printing or Clean the bottom of the net.

(5) The first silicon wafer loading device 6 and the second silicon wafer loading device 7

The first silicon wafer loading device 6 (or the second silicon wafer loading device 7 ) is aligned with the first silicon wafer carrying platform 1 (or the second silicon wafer carrying platform 2 ) at the wafer changing station, and the first silicon wafer loading device 6 (or the second silicon wafer loading device 7) and the transport belt on the first silicon wafer carrying platform 1 (or the second silicon wafer carrying platform 2) cooperate to carry the silicon wafer from the first silicon wafer loading device 6 (or the second silicon wafer The loading device 7 ) is transported to the first silicon wafer carrying platform 1 (or the second silicon wafer carrying platform 2 ).

The silicon wafer loading device also has the function of adjusting the attitude of the silicon wafer. When it is detected that the posture of the silicon wafer deviates seriously, the posture of the silicon wafer can be adjusted within a certain range through the independent movement of the two conveyor belts on the silicon wafer loading device and the lateral movement of the bottom platform. This posture adjustment is to make the posture of the silicon wafer not exceed the working range of the silk screen posture adjustment mechanism when it enters the silicon wafer carrying platform. As shown in FIG. 11 , if the second light sensor 41 and the third light sensor 42 cannot sense the silicon wafer 39 at the same time, then the silicon wafer 39 needs to be adjusted in angle. If the second light sensor 41 first senses the silicon chip 39, then the second motor 44 is stopped, and the first motor 43 is reversed (the motor rotates forward, and the silicon chip advances) a little, and then the two motors rotate forward with the same speed; The third light sensor 42 first senses the silicon chip 39, then the first motor 43 is stopped, and the second motor 44 is reversed (the motor rotates forward, and the silicon chip advances) a little, and then the two motors rotate forward with the same speed. See if the second light sensor 41 and the third light sensor 42 can sense the silicon chip 39 at the same time, if not, then make corresponding adjustments, and cycle like this until the second light sensor 41 and the third light sensor 42 can simultaneously sense the silicon chip 39. If the first light sensor 40 cannot sense the silicon wafer 39, the silicon wafer loading device approaches the first light sensor 40 along the slide rail 45, and as soon as the first light sensor 40 senses the silicon wafer 39, the silicon wafer loading device stops moving . Based on the above principles, the silicon wafer loading device can not only fine-tune the angle of the silicon wafer, but also adjust the lateral offset of the silicon wafer. In order to simplify the adjustment process, the angle adjustment of the silicon wafer is performed first, and then the lateral offset adjustment is performed.

(6) The first silicon wafer unloading device 8 and the second silicon wafer unloading device 9

As shown in Figure 2, the first silicon wafer unloading device 8 (or the second silicon wafer unloading device 9) and the first silicon wafer loading device 6 (or the second silicon wafer loading device 7) are symmetrically distributed on the first silicon wafer carrying platform 1 and the second silicon wafer carrying platform 2 sides, the first silicon wafer unloading device 8 (or the second silicon wafer unloading device 9 ) and the transportation on the first silicon wafer carrying platform 1 (or the second silicon wafer carrying platform 2 ) The belt cooperates to transfer the silicon wafer from the first silicon wafer carrying platform 1 (or the second silicon wafer carrying platform 2 ) to the first silicon wafer unloading device 8 (or the second silicon wafer unloading device 9 ).

(7) The first screen fiducial camera 10 and the second screen fiducial camera 11

The first silk screen fiducial point camera 10 and the second silk screen fiducial point camera 11 are installed below the silk screen attitude adjustment mechanism 3, as shown in Figure 9, there are two Mark points on the silk screen 34, the first silk screen fiducial point The camera 10 and the second screen fiducial point camera 11 are used to acquire the images of the two Mark points at the bottom of the screen 34 , so as to calculate the posture of the screen 34 .

(8) The first detection camera 12 and the second detection camera 13

As shown in Figure 2, the first in-out board inspection camera 12 (or the second in-out board inspection camera 13) is installed above the first silicon wafer carrying platform 1 (or the second silicon wafer carrying platform 2) when it is at the wafer changing station , used to obtain the image of the silicon wafer. According to the image of the silicon wafer, the posture and damage of the silicon wafer can be analyzed when entering the board, and whether the silicon wafer is damaged when the board is discharged.

(9) The first buffer transport line and the second buffer transport line

The first buffer transport line is vertically arranged with the first silicon wafer unloading device 8 and the second silicon wafer unloading device 9, and consists of the first straight conveyor belt 14, the second straight conveyor belt 16, the third straight conveyor belt 18 and the first The corner transfer conveyer belt 15 and the second corner transfer conveyer belt 17 constitute. Wherein, the first straight conveyor belt 14, the second straight conveyor belt 16, and the third straight conveyor belt 18 are collinear; the first corner transfer conveyor belt 15 is perpendicular to the first straight conveyor belt 14, and is perpendicular to the first silicon wafer The unloading device 8 is collinear; the second corner transfer conveyor belt 17 is perpendicular to the third straight-through conveyor belt 18 and is collinear with the second silicon wafer unloading device 9 .

The second buffer transportation line is vertically arranged with the first silicon wafer loading device 6 and the second silicon wafer loading device 7. The transfer conveyor belt 20 and the fourth corner transfer conveyor belt 22 constitute. Among them, the fourth straight conveyor belt 19, the fifth straight conveyor belt 21, and the sixth straight conveyor belt 23 are collinear; the third corner transfer conveyor belt 20 is perpendicular to the fourth straight conveyor belt 19, and is connected to the first silicon wafer loading device 6 are collinear; the fourth corner transfer conveyor belt 22 is perpendicular to the sixth straight-through conveyor belt 23 and is collinear with the second silicon wafer loading device 7 .

The second buffer transport line receives the silicon wafers to be printed from the upstream of the printing machine, and the first buffer transport line transports the printed silicon wafers to the downstream of the printing machine.

As shown in FIG. 12 , the straight-through conveyor belt 46 and the corner transfer conveyor belt 47 are vertically arranged. There is a hoisting device 48 below the corner transfer conveyor belt 47, which is combined with the conveyor belt above to make the corner transfer conveyor belt 47 rise and fall within a certain range. The middle position of the corner transfer conveyor belt 47 is symmetrically provided with two small grooves, so that the two conveyor belts of the straight-through conveyor belt 46 can pass without interference, and the depth of the groove should meet the lifting range of the corner transfer conveyor belt 47. The rise and fall of the corner transfer conveyor belt 47 can make the silicon wafers on the straight-through conveyor belt 46 and the corner transfer conveyor belt 47 transfer mutually: when the corner transfer conveyor belt 47 was above the straight conveyor belt 46, the corner transfer conveyor When the belt 47 descends, the silicon wafers on the corner transfer conveyor belt 47 can be dropped onto the straight conveyor belt 46; The silicon wafer on the conveyor belt 46 is supported on the corner transfer conveyor belt 47 .

As shown in Figures 5 and 6, the initial positions of the four corner transfer conveyor belts are: the third corner transfer conveyor belt 20 is below the fourth straight-through conveyor belt 19, and the fourth corner transfer conveyor belt 22 is under the sixth through-pass conveyor belt. Below the conveyor belt 23 , the first corner transfer conveyor belt 15 is above the first straight conveyor belt 14 , and the second corner transfer conveyor belt 17 is below the third straight conveyor belt 18 .

Fully automatic visual silicon wafer printing device with dual platforms, the specific action process is as follows:

1. Board feeding process

As shown in Figure 5, the fourth straight-through conveyor belt 19 receives silicon wafers to be printed from the upstream of the printing machine, and the silicon wafers are forwarded along the fourth straight-through conveyor belt 19. When the silicon wafers are transferred to the third corner transfer conveyor belt 20 When directly above, the silicon wafer can continue to pass in two directions.

(1) The first silicon wafer carrying platform 1 enters the board

When the silicon wafer was transferred to the first silicon wafer loading device 6, the fourth straight-through conveyor belt 19 stopped rotating, and the third corner transfer conveyor belt 20 rose to lift the silicon wafer until the third corner transfer conveyor belt 20 and When the first silicon wafer loading device 6 is at the same height, it stops rising; the motor on the third corner transfer conveyor belt 20 and the first silicon wafer loading device 6 rotates, and the silicon wafer is transferred from the third corner transfer conveyor belt 20 to the first silicon wafer loading device 6. Silicon wafer loading device 6; when the silicon wafer is delivered to the first silicon wafer loading device 6, the third corner transfer conveyor belt 20 descends to the initial position; while the third corner transfer conveyor belt 20 descends, the silicon wafer continues to Front transfer, when transferring to the middle position of the first silicon wafer loading device 6, if the silicon wafer has a certain angle and lateral offset, the first silicon wafer loading device 6 makes corresponding adjustments to arrange the silicon wafer; after the silicon wafer is corrected, Continue to transport the silicon wafers to the first silicon wafer carrying platform 1 .

(2) The second wafer carrying platform 2 enters the board

When the silicon wafer was transferred to the fifth straight-through conveyor belt 21, the third corner transfer conveyor belt 20 did not rise, and the silicon wafer continued to pass forward along the fourth straight-through conveyor belt 19, and passed through the fifth straight-through conveyor belt 21 to The sixth straight-through conveyor belt 23; when the silicon wafer is directly above the fourth corner transfer conveyor belt 22, the sixth straight-through conveyor belt 23 stops rotating, and the fourth corner transfer conveyor belt 22 rises to lift the silicon wafer until The fourth corner transfer conveyor belt 22 and the second silicon wafer loading device 7 stop rising; the fourth corner transfer conveyor belt 22 and the motor rotation on the second silicon wafer loading device 7, the silicon wafer is moved from the fourth corner The transfer conveyor belt 22 is transferred to the second silicon wafer loading device 7; when the silicon wafer is transferred to the second silicon wafer loading device 7, the fourth corner transfer conveyor belt 22 descends to the initial position; the fourth corner transfer conveyor belt 22 while descending, the silicon wafer continues to pass forward, and when it is transferred to the middle position of the second silicon wafer loading device 7, if the silicon wafer has a certain angle and lateral deviation, the second silicon wafer loading device 7 will make corresponding adjustments. The silicon wafer is placed; after the silicon wafer is calibrated, continue to transport the silicon wafer to the second silicon wafer carrying platform 2 .

When the first silicon chip carrying platform 1 entered the printing station, the second silicon chip carrying platform 2 moved out to the chip changing station; similarly, when the second silicon chip carrying platform 2 entered the printing station, the first silicon chip carrying platform 1 Move out to the film changing station.

2. Printing process

The first silicon wafer carrying platform 1 and the second silicon wafer carrying platform 2 alternately enter the printing station to realize ink scraping operation, and accordingly the control system alternately loads silicon wafers on the first silicon wafer carrying platform 1 and the second silicon wafer carrying platform 2 . As shown in Figure 2, the printing process is as follows:

(1) The silicon wafer is transferred to the first silicon wafer carrying platform 1 through the first silicon wafer carrying platform 1. At this time, the first silicon wafer carrying platform 1 is at the wafer changing station. There is no silicon chip on the second silicon chip carrying platform 2. When the silicon chip reaches the center of the first silicon chip carrying platform 1, the vacuum suction is opened to suck the silicon chip, and the first in and out plate detection camera 12 takes pictures to obtain the silicon chip At the same time, analyze whether the silicon wafer is damaged, if not, proceed to the next operation;

(2) The first screen reference point camera 10 and the second screen reference point camera 11 take pictures of the Mark points of the screen 34 of the printing machine, and adjust the posture of the screen 34 through the screen adjustment mechanism 3 so that the position on the screen 34 The pattern is aligned with the silicon wafer, and at the same time, the first silicon wafer carrying platform 1 moves from the wafer changing station to the printing station. When the first silicon wafer carrying platform 1 reaches the printing station, the screen lifting device 4 descends to make the screen 34 Close to the silicon wafer, the scraper device 5 coats the tin paste or silver paste on the silicon wafer through the screen 34. After the ink scraping is completed, the screen lifting device 4 rises, and the silicon wafer on the first silicon wafer carrying platform 1 While being printed, the silicon wafer is transferred from the second silicon wafer loading device 7 to the second silicon wafer carrying platform 2. When the silicon wafer reaches the center of the second silicon wafer carrying platform 2, the vacuum suction sheet is opened to suck the silicon wafer , the second in-out plate detection camera 13 takes pictures to obtain the attitude of the silicon wafer, and simultaneously analyze whether the silicon wafer is damaged, if not, proceed to the next operation;

(3) The first screen reference point camera 10 and the second screen reference point camera 11 take pictures of the Mark points of the screen 34 of the printing machine, and adjust the posture of the screen 34 through the screen adjustment mechanism 3 so that the position on the screen 34 The pattern is aligned with the silicon wafer, and the second silicon wafer carrying platform 2 moves from the wafer changing station to the printing station at the same time. When the second silicon wafer carrying platform 2 reaches the printing station, the screen lifting device 4 descends to make the screen 34 Close to the silicon wafer, the scraper device 5 coats tin paste or silver paste on the silicon wafer through the screen 34. After the ink scraping is completed, the screen lifting device 4 rises, and the silicon wafer on the second silicon wafer carrying platform 2 While being printed, the printed silicon wafers are transferred from the first wafer loading platform 1 to the first wafer unloading device 8, and the unprinted silicon wafers on the first wafer loading device 6 are moved into the first wafer loading device 6. Platform 1, when the silicon wafer reaches the center of the first silicon wafer carrying platform 1, the vacuum suction piece is opened to suck the silicon wafer, and the first in-out board detection camera 12 takes pictures to obtain the posture of the silicon wafer, and at the same time analyze whether the silicon wafer is damaged, If not, proceed to the next operation;

(4) The first screen reference point camera 10 and the second screen reference point camera 11 take pictures of the Mark points of the screen 34 of the printing machine, and adjust the posture of the screen 34 through the screen adjustment mechanism 3 so that the position on the screen 34 The pattern is aligned with the silicon wafer, and at the same time, the first silicon wafer carrying platform 1 moves from the wafer changing station to the printing station. When the first silicon wafer carrying platform 1 reaches the printing station, the screen lifting device 4 descends to make the screen 34 Close to the silicon wafer, the scraper device 5 coats the tin paste or silver paste on the silicon wafer through the screen 34. After the ink scraping is completed, the screen lifting device 4 rises, and the silicon wafer on the first silicon wafer carrying platform 1 While being printed, the printed silicon wafers are transferred from the second wafer loading platform 2 to the second wafer unloading device 9, while the unprinted silicon wafers on the second wafer loading device 7 are moved into the second wafer loading device 7. Platform 2, when the silicon wafer reaches the center of the second silicon wafer carrying platform 2, the vacuum suction piece is opened to suck the silicon wafer, and the second in-out board detection camera 13 takes pictures to obtain the posture of the silicon wafer, and at the same time analyze whether the silicon wafer is damaged, If not, proceed to the next operation;

(5) After that, the first silicon wafer carrying platform 1 and the second silicon wafer carrying platform 2 alternately enter the printing station, and the cycle process is as described in (3) and (4).

3. Board out process

As shown in FIG. 6 , the plate unloading device is composed of a first buffer transportation line, a first silicon wafer unloading device 8 and a second silicon wafer loading device 9 . The printed silicon wafers are delivered to the unloading device from two directions.

(1) The first silicon wafer carrying platform 1 out of the board

When the printed silicon wafer is transferred to the first silicon wafer unloading device 8 from the first silicon wafer carrying platform 1, the silicon wafer is transferred to the first corner transfer conveyor belt 15 along the first silicon wafer unloading device 8; When it is directly above the first straight conveyor belt 14, the first corner transfer conveyor belt 15 stops rotating, and the first corner transfer conveyor belt 15 descends; when the silicon wafer falls on the first straight conveyor belt 14 , the first corner transfer conveyor belt 15 continues to descend for a certain distance and then stops falling, while the first straight conveyor belt 14 rotates; silicon wafers continue to pass forward along the first straight conveyor belt 14, and pass through the second straight conveyor belt 16 Transfer to the third straight-through conveyor belt 18, and then send the silicon wafer printed by this equipment to the downstream of the printing machine, while the first corner transfer conveyor belt 15 rises and returns to the initial position.

It should be noted that when the printed silicon wafer is transferred from the first silicon wafer carrying platform 1 to the first silicon wafer unloading device 8, it is followed by the first silicon wafer loading device 6 loading the unprinted silicon wafer to the first silicon wafer unloading device 8. A silicon wafer is placed on a platform 1 .

(2) The second wafer carrying platform 2 out of the board

When the printed silicon wafer is transferred from the second silicon wafer carrying platform 2 to the second silicon wafer unloading device 9, the silicon wafer continues to be forwarded along the second silicon wafer unloading device 9, while the second corner transfers the conveyor belt 17 Rise until the second corner transfer conveyor belt 17 is at the same height as the second silicon wafer unloading device 9 and stop rising; the second corner transfer conveyor belt 17 rotates, and the silicon wafer is transferred from the second silicon wafer unloading device 9 to the second corner Transfer conveyor belt 17; the silicon wafer is transported along the second corner transfer conveyor belt 17, and when the silicon wafer is directly above the third straight-through conveyor belt 18, the second corner transfer conveyor belt 17 stops rotating, while the second The corner transfer conveyer belt 17 descends; when the silicon wafer falls on the third straight conveyer belt 18, the second corner transfer conveyer belt 17 continues to descend for a certain distance and then stops descending, descending to the initial position, while the third direct conveyer belt 18 Rotate; silicon chip continues to pass forward along the 3rd through conveyor belt 18, and the silicon chip that this equipment is printed is delivered to the downstream of printing machine.

At the second corner transfer conveyor belt 17, silicon wafers in two directions are transferred here, and the transfer in the two directions should be staggered. A sensor is installed at the appropriate position of the plate-out device. According to the logic design method of the PLC control system, when the silicon wafer is transferred along the second straight-through conveyor belt 16 to the second corner transfer conveyor belt 17, the second corner transfer conveyor Belt 17 is located below a third through conveyor belt 18 . When the silicon wafer is transferred along the second silicon wafer unloading device 9 to the direction of the second corner transfer conveyor belt 17 , the second corner transfer conveyor belt 17 rises to the same height as the second silicon wafer unloading device 9 . It should be noted that when the printed silicon wafer is transferred from the second silicon wafer carrying platform 2 to the second silicon wafer unloading device 9, it is followed by the second silicon wafer loading device 7 loading the unprinted silicon wafer to the first silicon wafer. Two silicon wafers are placed on platform 2.

To sum up, this printing device adopts a double bearing platform structure, and the two bearing platforms alternately enter the printing station to realize ink scraping operation, so that one bearing platform is performing wafer replacement while the other bearing platform is printing silicon wafers, ensuring The printing device can realize the film change and ink scraping operation at the same time, even if the film change is parallel to the printing process, thereby reducing the production time and greatly improving the production efficiency per unit time of the production line. Moreover, both the incoming and outgoing boards are conveyed by the conveyor belt, with simple structure and stable movement. The incoming and outgoing board detection camera can also realize the damage detection of the outgoing board.

As shown in Figure 14, in order to cooperate with the work of the printing device of the present invention, the high-precision alignment of the silicon wafer and the silk screen is realized according to the attitude information of the silicon wafer and the silk screen attitude adjustment mechanism obtained by the in-out board detection camera and the screen reference point camera . The fully automatic visual silicon wafer printing device with dual platforms also needs a positioning device, an image acquisition device, a camera controller, an image acquisition card, a positioning device controller, image processing, a general-purpose computer, and a motion controller when working. Wherein, the positioning device includes a first light sensor 40, a second light sensor 41 and a third light sensor 42; the image acquisition device includes a first screen fiducial point camera 10, a second screen fiducial point camera 11, a first in-out plate detection The camera 12 and the third camera 13 for detecting boards in and out; the camera controller controls the image acquisition of the image acquisition device; the image acquisition card sends the image signal to the CPU for processing or saves it in the memory; the motion controller controls the action of the printing device.

For a more intuitive understanding of the workflow of the printing device, reference may be made to FIG. 13 .

The invention has the characteristics of compact structure, stable transmission, simple manufacture and installation, convenient maintenance, high printing quality, high production efficiency, small occupied area, etc., and can be used for various printing of silicon wafers.

The specific implementations described above are only preferred implementations of the present invention, and are not intended to limit the specific implementation scope of the present invention. All equivalent changes made according to the shape and structure of the present invention are within the protection scope of the present invention.

Claims (1)

1. one kind has the full-automatic vision silicon chip printing equipment of Double tabletop, it is characterized in that comprising two silicon chip carrying platforms, two turnover plate detection camera, a silk screen lowering or hoisting gear, a silk screen attitude-adjusting system, two silk screen datum mark cameras, an ink-scraping device, two cover silicon chip loading devices, two cover silicon chip unloading devices, two cover buffering supply lines; Two silicon chip carrying platforms are arranged on the pedestal of a transverse shifting, alternately enter printing station and realize wiping operation; What turnover plate detection camera was arranged on silicon chip carrying platform changes above sheet station, for obtaining the image of silicon chip; Silk screen lowering or hoisting gear is arranged on four support columns of printing machine, for making silk screen press close to silicon chip and leave silicon chip, to realize silicon chip printing, the demoulding and cleaning net bottom; Silk screen attitude-adjusting system is arranged on the silk screen lowering or hoisting gear of printing machine, realizes XY move in parallel and rotate location for making silk screen; Two silk screen datum mark cameras are arranged on the below of silk screen attitude-adjusting system, and are symmetrically distributed in the both sides of the silicon chip carrying platform at printing station, are used for obtaining the image of wire mesh bottom two datum marks; Ink-scraping device is arranged on the top of silk screen attitude-adjusting system, moving up and down and seesawing coating is impressed on silicon chip by scraper; Two cover silicon chip loading devices align with the silicon chip carrying platform not at printing station, and are symmetrically distributed in the both sides of printing machine, can adjust angle and the lateral shift of silicon chip; Silicon chip unloading device and silicon chip loading device are symmetrically distributed in silicon chip carrying platform both sides; Two cover buffering supply lines all with silicon chip loading device and silicon chip unloading device in being arranged vertically, for receiving the silicon chip that needs print from upstream, and the silicon chip printed is sent to downstream; Above each silicon chip carrying platform, conveyer belt is housed, there is multiple equally distributed aperture platform middle part, also has multiple equally distributed aperture above conveyer belt, and these apertures are inhaled function by vacuum and silicon chip is adsorbed on platform; Conveyer belt covers the plane for supporting silicon chip on platform; The slide rail that can realize transverse shifting is had below platform; Often overlap above silicon chip loading device and be equipped with two for adjusting the conveyer belt of silicon chip angle, these two conveyer belts respectively by two driven by motor, and are equipped with three light sensations for responding to position of silicon wafer near conveyer belt; Have below silicon chip loading device for translational motion to adjust the bottom platform of silicon chip lateral displacement; Cover buffering supply line is made up of three straight-through conveyer belts and two corner transfer conveyer belts, the cooperation of straight-through conveyer belt and corner transfer conveyer belt, is assigned to silicon chip two silicon chip loading devices and the silicon chip through printing is overlapped independently silicon chip unloading device from two and focus on same ejecting plate supply line;

Described silk screen attitude-adjusting system is a planar three freedom serial mechanism, can realize XY and moves in parallel and rotate location;

Described ink-scraping device comprises scraper, scraper seesaws mechanism, scraper up-down mechanism and Hui Mo mechanism, the scraper mechanism that seesaws makes scraper seesaw, scraper up-down mechanism makes scraper move up and down, and moving up and down and seesawing of scraper realizes coating to be impressed on silicon chip.