CN106024980B - Full-automatic inserting machine - Google Patents
Full-automatic inserting machine Download PDFInfo
- Publication number
- CN106024980B CN106024980B CN201610520372.6A CN201610520372A CN106024980B CN 106024980 B CN106024980 B CN 106024980B CN 201610520372 A CN201610520372 A CN 201610520372A CN 106024980 B CN106024980 B CN 106024980B
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- Prior art keywords
- silicon wafer
- jacking
- sucker
- supporting rod
- basket
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- 229910052710 silicon Inorganic materials 0.000 claims abstract description 81
- 239000010703 silicon Substances 0.000 claims abstract description 81
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 78
- 238000001514 detection method Methods 0.000 claims abstract description 16
- 238000007664 blowing Methods 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 67
- 239000000463 material Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 5
- 238000009826 distribution Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Abstract
The invention discloses a full-automatic inserting machine which comprises an equipment rack, a basket rotating device, a silicon wafer lifting device, an air blowing port, a silicon wafer box, a fixed bottom plate, a sucking disc taking device and a silicon wafer basket entering device, wherein the equipment rack is provided with a clamping device; the basket rotating device is arranged on the equipment rack and comprises a hollow turntable, a conductive slip ring, a rotating disk, a button switch, a micro switch, a bearing box and a bearing box positioning block. The conductive slip ring is connected with the hollow rotary table, the hollow rotary table is connected with the rotary table, and the bearing box positioning block is fixed on the rotary table through a bolt; the silicon wafer lifting device comprises a jacking servo sliding table, a jacking supporting rod, a jacking block and a first detection switch. The ejection servo sliding table is connected with an ejection supporting rod, and the ejection supporting rod is connected with an ejection block; after the equipment is used, the basic de-handwork of the silicon wafer can be realized, the manual wafer-by-wafer operation is not required, the breakage rate of the silicon wafer is reduced, and the production efficiency is greatly improved.
Description
Technical Field
The invention relates to the technical field of monocrystalline silicon production, in particular to the technical field of solar silicon wafer processing equipment.
Background
The processing of the monocrystalline silicon piece comprises the steps of squaring and slicing the monocrystalline silicon rod, the processing of the polycrystalline silicon piece comprises the steps of cutting and slicing the polycrystalline silicon ingot, and the processing of the quasi-monocrystalline silicon piece comprises the steps of cutting and slicing the quasi-monocrystalline silicon ingot. In summary, dicing is one of the indispensable processes in the solar crystalline silicon wafer processing process. The silicon wafers obtained after slicing are stacked together, the silicon wafers are required to be sliced and then are inserted into a bearing box for transportation, and because of the characteristics of thinness and brittleness of the silicon wafers, the manual slicing and loading of the silicon wafers is extremely easy to damage and the inserting sheets, so that the manual operation is difficult, high in risk and low in efficiency.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a full-automatic inserting machine, which completely realizes the functions of automatic material distribution, automatic material loading, automatic basket feeding, full material shortage alarming and the like; after the equipment is used, the basic de-handwork of the silicon wafer can be realized, and the manual operation of the silicon wafer after the upper material and the lower material are removed is not needed; the hollow turntable is connected with the conductive slip ring, so that the problem of winding of wires in the running process of the rotating disk is effectively solved; the silicon wafer lifting and distributing device and the silicon wafer basket feeding device are arranged deep into the frame, so that the volume of the device is effectively reduced.
In order to achieve the aim, the invention provides a full-automatic inserting machine which comprises an equipment rack, a basket rotating device, a silicon wafer basket entering device, an air blowing port, a sucking disc taking device, a silicon wafer box, a fixed bottom plate and a silicon wafer lifting device; the left side of the end face of the upper end of the equipment rack is provided with a basket rotating device, the basket rotating device comprises a rotating disc, a conductive slip ring, a bearing box positioning block, a hollow turntable, a micro switch and a button switch, the conductive slip ring is connected with the hollow turntable, the hollow turntable is connected with the rotating disc, and the bearing box positioning block is fixed on the rotating disc through bolts; the silicon wafer lifting device is arranged at the right lower end of the equipment rack, the bottom plate is arranged at the right upper end face of the equipment rack, the silicon wafer box is placed on the bottom plate, the sucker material taking device is arranged on the end face of the equipment rack on the right side of the silicon wafer box, the silicon wafer basket feeding device is arranged on the end face of the equipment rack on the front side of the silicon wafer box, and the air blowing port is arranged at the position, close to the silicon wafer box, of the support frame of the silicon wafer basket feeding device; the silicon wafer lifting device comprises a jacking servo sliding table, a jacking supporting rod, a first detection switch and a jacking block, wherein the jacking servo sliding table is connected with the jacking supporting rod, the jacking supporting rod is connected with the jacking block, and the jacking block is provided with the first detection switch; the sucker taking device is arranged above the equipment rack and comprises a first air cylinder, a second air cylinder and a buffer sucker, wherein the first air cylinder is connected with the second air cylinder, and the second air cylinder is connected with the buffer sucker; the silicon wafer basket feeding device comprises a feeding servo sliding table, a feeding supporting rod, a second detection switch, a plane sucker, a sucker fixing seat, a cylinder connecting block, a linear guide rail and a third cylinder, wherein the feeding servo sliding table is connected with the feeding supporting rod, the linear guide rail and the third cylinder are arranged on a table top at the upper end of the feeding supporting rod, the second detection switch is arranged at the top end of the third cylinder, the cylinder connecting block is arranged on the third cylinder, the sucker fixing seat is fixedly connected on the cylinder connecting block, the bottom of the sucker fixing seat is matched with the linear guide rail, and the upper end of the sucker fixing seat is fixedly connected with the plane sucker.
Preferably, a bearing box is arranged on the rotary disc at intervals of 45 degrees, so that the rotary disc is provided with 8 stations, 8 bearing boxes can be placed at the same time, and the working efficiency is greatly improved.
Preferably, the bearing box is 3-6 inches, and the bearing box positioning blocks can simultaneously position the bearing box of 3-6 inches, so that the bearing box has strong compatibility and quick and convenient mould changing.
Preferably, the micro switch and the button switch are both fixed on the rotary disk.
Preferably, the servo sliding table of liftout is connected through 4 liftout bracing pieces with the liftout piece, under the circumstances of weight loss, increases stability.
The invention has the beneficial effects that: the invention completely realizes the functions of automatic material distribution, automatic material loading, automatic basket feeding, material shortage alarming and the like; after the equipment is used, the basic de-handwork of the silicon wafer can be realized, and the manual operation of the silicon wafer after the upper material and the lower material are removed is not needed; the hollow turntable is connected with the conductive slip ring, so that the problem of winding of wires in the running process of the rotating disk is effectively solved; the silicon wafer lifting and distributing device and the silicon wafer basket feeding device are arranged deep into the frame, so that the volume of the device is effectively reduced.
The characteristic advantages of the present invention will be described in detail by way of an example of a fully automatic tab machine in conjunction with the accompanying drawings.
Drawings
FIG. 1 is a schematic view of the overall structure of a fully automatic tab machine of the present invention;
FIG. 2 is a schematic diagram of a basket rotation device of a fully automatic tab machine according to the present invention;
FIG. 3 is a schematic view of a silicon wafer lifting device of a fully automatic wafer inserting machine according to the present invention;
FIG. 4 is a schematic view of a suction cup pick-up device of a fully automatic tab machine according to the present invention;
FIG. 5 is a schematic view of a silicon wafer basket loading device of a fully automatic wafer insertion machine according to the present invention.
In the figure: 1-equipment rack, 2-basket rotating device, 3-silicon wafer basket entering device, 4-air blowing port, 5-sucker taking device, 6-silicon wafer box, 7-fixed bottom plate, 8-silicon wafer lifting device, 9-rotating disk, 10-conductive slip ring, 11-bearing box, 12-bearing box positioning block, 13-hollow turntable, 14-micro switch, 15-button switch, 16-liftout servo sliding table, 17-liftout supporting rod, 18-first detecting switch, 19-liftout block, 20-first cylinder, 21-second cylinder, 22-buffer sucker, 23-feeding servo sliding table, 24-feeding supporting rod, 25-second detecting switch, 26-plane sucker, 27-sucker fixing seat, 28-cylinder connecting block, 29-linear guide rail and 30-third cylinder.
Detailed Description
Referring to fig. 1, 2, 3, 4 and 5, the invention comprises an equipment rack 1, a basket rotating device 2, a silicon wafer basket entering device 3, an air blowing port 4, a sucker taking device 5, a silicon wafer box 6, a fixed bottom plate 7 and a silicon wafer lifting device 8; the left side of the end face of the upper end of the equipment rack 1 is provided with a basket rotating device 2, the basket rotating device 2 comprises a rotating disc 9, a conductive slip ring 10, a bearing box 11, a bearing box positioning block 12, a hollow rotating table 13, a microswitch 14 and a button switch 15, the conductive slip ring 10 is connected with the hollow rotating table 13, the hollow rotating table 13 is connected with the rotating disc 9, and the bearing box positioning block 12 is fixed on the rotating disc 9 through bolts; the silicon wafer lifting device 8 is arranged at the right lower end of the equipment rack 1, the bottom plate 7 is arranged at the right upper end face of the equipment rack 1, the silicon wafer box 6 is placed on the bottom plate 7, the sucker material taking device 5 is arranged at the end face of the equipment rack 1 on the right side of the silicon wafer box 6, the silicon wafer basket feeding device 3 is arranged at the end face of the equipment rack 1 on the front side of the silicon wafer box 6, and the air blowing port 4 is arranged at the position, close to the silicon wafer box 6, of the support frame of the silicon wafer basket feeding device 3; the silicon wafer lifting device 8 comprises a jacking servo sliding table 16, a jacking supporting rod 17, a first detection switch 18 and a jacking block 19, wherein the jacking servo sliding table 16 is connected with the jacking supporting rod 17, the jacking supporting rod 17 is connected with the jacking block 19, and the jacking block 19 is provided with the first detection switch 18; the sucker taking device 5 is arranged above the equipment rack 1, the sucker taking device 5 comprises a first air cylinder 20, a second air cylinder 21 and a buffer sucker 22, the first air cylinder 20 is connected with the second air cylinder 21, and the second air cylinder 21 is connected with the buffer sucker 22; the silicon wafer basket feeding device 3 comprises a feeding servo sliding table 23, a feeding supporting rod 24, a second detection switch 25, a plane sucker 26, a sucker fixing seat 27, a cylinder connecting block 28, a linear guide 29 and a third cylinder 30, wherein the feeding servo sliding table 23 is connected with the feeding supporting rod 24, the linear guide 29 and the third cylinder 30 are installed on the table top at the upper end of the feeding supporting rod 24, the second detection switch 25 is installed at the top end of the third cylinder 30, the cylinder connecting block 28 is arranged on the third cylinder 30, the sucker fixing seat 27 is fixedly connected on the cylinder connecting block 28, the bottom of the sucker fixing seat 27 is matched with the linear guide 29, and the upper end of the sucker fixing seat 27 is fixedly connected with the plane sucker 26.
Specifically, the rotary disk 9 is provided with one bearing box 11 at intervals of 45 degrees, so that the rotary disk 9 has 8 stations, and 8 bearing boxes 11 can be placed at the same time, thereby greatly improving the working efficiency.
Specifically, the bearing box 11 is a bearing box 11 with 3-6 inches, the bearing box positioning blocks 12 can simultaneously position the bearing box 11 with 3-6 inches, the compatibility is strong, and the mold changing is quick and convenient.
Specifically, the micro switch 14 and the push button switch 15 are both fixed on the rotating disc 9.
Specifically, the jacking servo sliding table 16 is connected with the jacking block 19 through 4 jacking supporting rods 17, so that stability is improved under the condition of weight reduction.
The working process of the invention comprises the following steps: in the working process of the full-automatic inserting machine, the bearing box 11 is firstly placed on the working position of the rotary disk 9 according to the position of the positioning block 12 of the bearing box. At this point the carrier box 11 presses against the microswitch 14, showing that the station has a carrier box 11, and then pressing the push button switch 15 indicates that the station is operational. The placement of the 8-station carrier boxes 11 is completed according to the above steps. Next, the silicon wafer stack height 150mm was placed centrally in the silicon wafer cassette 6, and then the silicon wafer cassette 6 was placed on the fixing base plate 7 according to the position of the registration pin holes. At the moment, the jacking servo sliding table 16 is started to drive the jacking block 19 to push the silicon wafer to vertically move upwards. After the silicon wafer is pushed to the designated height, the first air cylinder 20 is started to push the buffer sucker 22 to be right above the silicon wafer, the second air cylinder 21 is started to push the buffer sucker 22 to be pressed down, then the buffer sucker 22 is started to suck the silicon wafer, the jacking servo sliding table 16 is started again to drive the jacking block 19 to enable the silicon wafer to vertically move downwards, the jacking servo sliding table 16 is started, meanwhile, the air blowing port 4 is started to blow compressed air between two layers of silicon wafers, and at the moment, the second air cylinder 21 is started again to drive the buffer sucker 22 to be lifted up, and one silicon wafer is sucked. The first cylinder 20 is activated to bring the wafer directly over the planar chuck 26. Then starting the feeding servo sliding table 23, driving the plane sucker 26 to vertically move upwards to a designated position, closing the buffer sucker 22 to release the silicon wafer, simultaneously starting the plane sucker 26 to suck the silicon wafer, then starting the feeding servo sliding table 23 again, and lifting to the designated position to be highly aligned with the bearing box 11. Then, the third air cylinder 30 is started to push the plane sucker 26 to drive the silicon wafer bearing box 11, and in the pushing process of the third air cylinder 30, the second detection switch 25 is started to sense whether the silicon wafer is in the basket.
The above operation is repeated until the second detection switch 25 counts up to 25 times, and then one carrying box 11 is full, at this time, the hollow turntable 13 is started, and the rotary disk 9 is driven to rotate to the next station. Repeating all the above actions until the 8 stations are fully filled, automatically stopping the machine to give an alarm and reminding the replacement of the bearing box 11. When the silicon wafer in the silicon wafer box 6 is used up, the first detection switch 18 is started to display that the silicon wafer is used up, and the machine automatically stops alarming to remind feeding.
The invention completely realizes the functions of automatic material distribution, automatic material loading, automatic basket feeding, material shortage alarming and the like; after the equipment is used, the basic de-handwork of the silicon wafer can be realized, and the manual operation of the silicon wafer after the upper material and the lower material are removed is not needed; the hollow turntable is connected with the conductive slip ring, so that the problem of winding of wires in the running process of the rotating disk is effectively solved; the silicon wafer lifting and distributing device and the silicon wafer basket feeding device are arranged deep into the frame, so that the volume of the device is effectively reduced.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the foregoing embodiments, but rather, the foregoing embodiments and description illustrate the principles of the invention, and that various changes and modifications may be effected therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
Claims (1)
1. A full-automatic tab inserting machine is characterized in that: the device comprises an equipment rack (1), a basket rotating device (2), a silicon wafer basket entering device (3), an air blowing port (4), a sucker taking device (5), a silicon wafer box (6), a fixed bottom plate (7) and a silicon wafer lifting device (8); the device comprises a device frame (1), wherein a basket rotating device (2) is arranged on the left side of the end face of the upper end of the device frame (1), the basket rotating device (2) comprises a rotating disc (9), a conductive slip ring (10), a bearing box (11), a bearing box positioning block (12), a hollow rotating table (13), a micro switch (14) and a button switch (15), the conductive slip ring (10) is connected with the hollow rotating table (13), the hollow rotating table (13) is connected with the rotating disc (9), and the bearing box positioning block (12) is fixed on the rotating disc (9) through bolts; the silicon wafer lifting device (8) is arranged at the right lower end of the equipment rack (1), the bottom plate (7) is arranged at the right upper end face of the equipment rack (1), the silicon wafer box (6) is placed on the bottom plate (7), the sucking disc taking device (5) is arranged on the end face of the equipment rack (1) on the right side of the silicon wafer box (6), the silicon wafer basket entering device (3) is arranged on the end face of the equipment rack (1) on the front side of the silicon wafer box (6), and the air blowing port (4) is arranged at the position, close to the silicon wafer box (6), of the support frame of the silicon wafer basket entering device (3); the silicon wafer lifting device (8) comprises a jacking servo sliding table (16), a jacking supporting rod (17), a first detection switch (18) and a jacking block (19), wherein the jacking servo sliding table (16) is connected with the jacking supporting rod (17), the jacking supporting rod (17) is connected with the jacking block (19), and the jacking block (19) is provided with the first detection switch (18); the sucker taking device (5) is arranged above the equipment rack (1), the sucker taking device (5) comprises a first air cylinder (20), a second air cylinder (21) and a buffer sucker (22), the first air cylinder (20) is connected with the second air cylinder (21), and the second air cylinder (21) is connected with the buffer sucker (22); the silicon wafer basket feeding device (3) comprises a feeding servo sliding table (23), a feeding supporting rod (24), a second detection switch (25), a plane sucker (26), a sucker fixing seat (27), a cylinder connecting block (28), a linear guide rail (29) and a third cylinder (30), wherein the feeding servo sliding table (23) is connected with the feeding supporting rod (24), the linear guide rail (29) and the third cylinder (30) are arranged on the table top at the upper end of the feeding supporting rod (24), the second detection switch (25) is arranged at the top end of the third cylinder (30), the cylinder connecting block (28) is arranged on the third cylinder (30), the sucker fixing seat (27) is fixedly connected on the cylinder connecting block (28), the bottom of the sucker fixing seat (27) is matched with the linear guide rail (29), and the upper end of the sucker fixing seat (27) is fixedly connected with the plane sucker (26); a bearing box (11) is arranged on the rotating disc (9) at intervals of 45 degrees; the bearing box (11) is 3-6 inches of the bearing box (11); the micro switch (14) and the button switch (15) are fixed on the rotary disk (9); the jacking servo sliding table (16) is connected with the jacking block (19) through 4 jacking supporting rods (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610520372.6A CN106024980B (en) | 2016-06-29 | 2016-06-29 | Full-automatic inserting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610520372.6A CN106024980B (en) | 2016-06-29 | 2016-06-29 | Full-automatic inserting machine |
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| Publication Number | Publication Date |
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| CN106024980A CN106024980A (en) | 2016-10-12 |
| CN106024980B true CN106024980B (en) | 2023-09-29 |
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| CN201610520372.6A Active CN106024980B (en) | 2016-06-29 | 2016-06-29 | Full-automatic inserting machine |
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| CN108453385A (en) * | 2018-03-29 | 2018-08-28 | 东莞市力星激光科技有限公司 | A kind of the turntable laser-beam welding machine and method for laser welding of battery cover board |
| CN109018801B (en) * | 2018-08-16 | 2024-04-30 | 矽电半导体设备(深圳)股份有限公司 | Movable material rack, material taking method and material discharging method |
| CN109637963B (en) * | 2018-12-13 | 2021-04-09 | 阜宁阿特斯阳光电力科技有限公司 | Temporary storage device and conveying system |
| CN110534468A (en) * | 2019-08-26 | 2019-12-03 | 常州时创能源科技有限公司 | The film frequency device and guide card method of silicon chip flower basket |
| CN112103219B (en) * | 2020-11-03 | 2021-02-12 | 宁波丞达精机股份有限公司 | Wafer supply mechanism for silicon wafer inserting machine |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000009255A (en) * | 1998-07-22 | 2000-02-15 | 강영국 | Device for wrapping tape reel containing wrapped and wound up semiconductor |
| CN102295164A (en) * | 2011-06-21 | 2011-12-28 | 中国电子科技集团公司第二研究所 | Multi-station full-automatic silicon wafer loading machine |
| CN202888336U (en) * | 2012-08-31 | 2013-04-17 | 惠州园方电池设备有限公司 | Automatic lamination stacking machine for lithium battery |
| WO2013166837A1 (en) * | 2012-05-09 | 2013-11-14 | 华南理工大学 | Fully-automatic vision silicon wafer printing device with double platforms |
| CN105047594A (en) * | 2015-08-20 | 2015-11-11 | 无锡先导自动化设备股份有限公司 | Device for loading and carrying battery pieces |
| DE102014216562A1 (en) * | 2014-08-20 | 2016-02-25 | Krones Ag | Mold filling machine and method for molding and filling containers |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205920984U (en) * | 2016-06-29 | 2017-02-01 | 浙江科技学院 | Full -automatic insert machine |
-
2016
- 2016-06-29 CN CN201610520372.6A patent/CN106024980B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000009255A (en) * | 1998-07-22 | 2000-02-15 | 강영국 | Device for wrapping tape reel containing wrapped and wound up semiconductor |
| CN102295164A (en) * | 2011-06-21 | 2011-12-28 | 中国电子科技集团公司第二研究所 | Multi-station full-automatic silicon wafer loading machine |
| WO2013166837A1 (en) * | 2012-05-09 | 2013-11-14 | 华南理工大学 | Fully-automatic vision silicon wafer printing device with double platforms |
| CN202888336U (en) * | 2012-08-31 | 2013-04-17 | 惠州园方电池设备有限公司 | Automatic lamination stacking machine for lithium battery |
| DE102014216562A1 (en) * | 2014-08-20 | 2016-02-25 | Krones Ag | Mold filling machine and method for molding and filling containers |
| CN105047594A (en) * | 2015-08-20 | 2015-11-11 | 无锡先导自动化设备股份有限公司 | Device for loading and carrying battery pieces |
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| CN106024980A (en) | 2016-10-12 |
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Effective date of registration: 20231030 Address after: 310000 No. 318, Liu He road, Hangzhou, Zhejiang Patentee after: ZHEJIANG University OF SCIENCE AND TECHNOLOGY Address before: 318 Liuhe Road, Xihu District, Hangzhou City, Zhejiang Province Patentee before: ZHEJIANG University OF SCIENCE AND TECHNOLOGY Patentee before: Hou Jiwei |