CN114834146A - Preparation equipment and preparation method of half battery - Google Patents
Preparation equipment and preparation method of half battery Download PDFInfo
- Publication number
- CN114834146A CN114834146A CN202110138543.XA CN202110138543A CN114834146A CN 114834146 A CN114834146 A CN 114834146A CN 202110138543 A CN202110138543 A CN 202110138543A CN 114834146 A CN114834146 A CN 114834146A
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- printing
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- 238000002360 preparation method Methods 0.000 title abstract description 21
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 114
- 239000010703 silicon Substances 0.000 claims abstract description 114
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 108
- 238000007639 printing Methods 0.000 claims abstract description 91
- 230000007246 mechanism Effects 0.000 claims abstract description 10
- 235000012431 wafers Nutrition 0.000 claims description 114
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 16
- 238000007599 discharging Methods 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 abstract description 6
- 238000001459 lithography Methods 0.000 abstract description 2
- 230000032258 transport Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0804—Machines for printing sheets
- B41F15/0813—Machines for printing sheets with flat screens
- B41F15/0818—Machines for printing sheets with flat screens with a stationary screen and a moving squeegee
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F19/00—Apparatus or machines for carrying out printing operations combined with other operations
- B41F19/008—Apparatus or machines for carrying out printing operations combined with other operations with means for stamping or cutting out
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F33/00—Indicating, counting, warning, control or safety devices
- B41F33/0036—Devices for scanning or checking the printed matter for quality control
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Quality & Reliability (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a preparation device and a preparation method of a half cell. The preparation equipment of half battery includes workstation, feed mechanism, equipment of shooing, lithography apparatus and unloading mechanism. The photographing device is arranged at the photographing table top to determine the position information of the half silicon wafer, the printing device is arranged at the printing table top, and the printing device is suitable for printing the corresponding half silicon wafer. Wherein, half silicon chip gets into the workstation from the mesa of shooing to remove from the workstation on going out the board mesa, reserve the mesa and provide the reservation position for half silicon chip. According to the preparation equipment of the half-cell, the half-cell is prepared by directly printing the half-cell silicon wafer, namely, the half-cell silicon wafer is not subjected to the cutting process after printing, so that the phenomena of deformation, breakage and the like of the printed silicon wafer can be avoided, the yield of the produced silicon wafer can be improved, and the flaked design of the silicon wafer is easy to realize.
Description
Technical Field
The invention relates to the technical field of photovoltaic cells, in particular to a half cell preparation device and a half cell preparation method.
Background
Solar cells are devices that separate electrons and holes using PN junctions of semiconductor materials and that are extracted through electrodes. Printing is the most common method of making metal electrodes. The conventional solar cell uses a quasi-square silicon wafer, and the final finished cell is also quasi-square. And the quasi-square battery is divided into half or a plurality of small batteries at the end of the assembly so as to reduce the power loss caused by the heating of the assembly.
In addition, with the development of the solar industry, cost reduction is a problem that all solar enterprises have to face, and the large size and the flaking of the silicon wafer become trends of the industry development in recent years.
The cutting loss is increased when the battery is divided into half or more than two small batteries, the high-efficiency battery with high Voc is particularly not facilitated, the deformation of the large-size thin battery is large, and the yield and the efficiency are reduced due to the fact that fragments are easy to generate and the uniformity of a coating film is reduced. The battery process flow is carried out after the large-size silicon wafer is cut into halves, so that the assembly scribing process can be reduced, the power loss does not exist, and the deformation of the half silicon wafer is greatly reduced.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the half-cell preparation equipment which has the advantages of high yield and low cost.
The invention also provides a preparation method of the half-sheet battery, and the preparation method has the advantages of simple process and high yield.
According to the embodiment of the invention, the preparation equipment of the half cell comprises: the worktable comprises a photographing table top, a printing table top, a board discharging table top and a reserved table top, wherein the photographing table top is suitable for accommodating two half silicon wafers; the feeding mechanism is arranged at the photographing table top so as to convey the half silicon wafer to the photographing table top; the photographing equipment is arranged at the photographing table top so as to determine the position information of the half silicon wafer; the printing equipment is arranged on the printing table top and is suitable for printing the corresponding half silicon wafer;
the blanking mechanism is arranged at the plate outlet table top so as to take down the half silicon wafers positioned at the plate outlet table top; and the half silicon wafer enters the workbench from the photographing table top and is moved out of the workbench from the plate outlet table top, and the reserved table top provides a reserved position for the half silicon wafer.
According to the preparation equipment of the half-cell, the half-cell is prepared by directly printing the half-silicon wafer, namely, the half-silicon wafer is not subjected to the cutting process after printing, so that the phenomena of deformation, breakage and the like of the printed silicon wafer can be avoided, the yield of the produced wafer can be improved, and the wafer thinning design of the silicon wafer is easy to realize.
In some embodiments, the worktable is in a shape of a disk, the photographing table, the printing table, the plate discharging table and the reservation table are respectively disposed at edges of the worktable, and the worktable rotates to convey the half silicon wafers to the printing table, the plate discharging table and the reservation table.
In some embodiments, the distance between the two half silicon wafers on the photographing table is greater than or equal to 10 mm.
In some embodiments, the printing apparatus comprises first and second spaced apart printing apparatuses, the first printing apparatus being adapted to print one of the half-pieces of silicon wafer and the second printing apparatus being adapted to print the other of the half-pieces of silicon wafer.
In some embodiments, a first screen is disposed on a print head of the first printing apparatus, and the first screen is adapted to move according to the position information of the half silicon wafer, so that the first screen is aligned with the corresponding half silicon wafer; and a second screen printing plate is arranged on a printing head of the second printing equipment and is suitable for moving according to the position information of the half silicon wafer, so that the second screen printing plate is aligned with the corresponding half silicon wafer.
In some embodiments, the reserved table top is multiple.
In some embodiments, the photographing apparatus is a positioning camera.
According to the method for manufacturing the half cell of the embodiment of the present invention, the half cell is manufactured by the apparatus for manufacturing the half cell as described above, and the manufacturing method includes the steps of:
s10: preparing a half silicon wafer;
s20: photographing the two half silicon wafers to determine position information;
s30: and respectively printing the two half silicon wafers according to the position information of the two half silicon wafers.
According to the preparation method of the half cell provided by the embodiment of the invention, the prepared half silicon wafer is placed before the printing process, so that the phenomena of deformation, breakage and the like of the printed silicon wafer can be avoided, the yield of the produced wafer can be improved, and the wafer thinning design of the silicon wafer is easy to realize.
In some embodiments, in step S10, the half silicon wafer is prepared by a dicing process.
In some embodiments, in step S30, one of the half silicon wafers is printed first, and then the other half silicon wafer is printed; alternatively, in step S30, the two half silicon wafers are printed simultaneously.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural view of a half-cell manufacturing apparatus according to an embodiment of the present invention.
Reference numerals:
the fabrication apparatus 100, the half wafer 200,
a workbench 110, a photographing table 111, a printing table 112, a board outlet table 113, a reserved table 114,
a printing device 130, a first printing device 131, and a second printing device 132.
Detailed Description
Embodiments of the present invention will be described in detail below, the embodiments described with reference to the drawings being illustrative, and the embodiments of the present invention will be described in detail below.
A manufacturing apparatus 100 and a manufacturing method of a half cell according to an embodiment of the present invention are described below with reference to fig. 1.
The manufacturing apparatus 100 of the half cell according to the embodiment of the present invention includes: workstation 110, feed mechanism, the equipment of shooing, lithography apparatus 130 and unloading mechanism.
Specifically, as shown in fig. 1, the workbench 110 includes a photographing table 111, a printing table 112, a board outlet table 113, and a reserved table 114. The reserved table top 114 can be used as a reserved photographing table top or a reserved board table top. The photographing table 111 is suitable for containing two half silicon wafers 200, the feeding mechanism is arranged at the photographing table 111 and used for conveying the half silicon wafers 200 to the photographing table 111. The photographing device is arranged at the photographing table 111 to determine the position information of the half silicon wafer 200. In some examples, the photographing device may be a positioning camera.
It should be noted that the photographing device may obtain the position information of the half silicon wafer 200 according to the photographed position image of the half silicon wafer 200. The printing device 130 is disposed at the printing table 112, and the printing device 130 is adapted to print a pattern on the corresponding silicon wafer half 200. Here, the half silicon wafer 200 is a silicon wafer having completed a cutting process, and it should be noted that the cutting process is placed before the printing process, so that the phenomena of deformation, breakage and the like of the printed silicon wafer can be avoided, the yield of the produced silicon wafer can be improved, and the thinning design of the silicon wafer is easily realized.
As shown in fig. 1, the blanking mechanism is disposed at the plate-out table 113 to remove the half silicon wafer 200 located at the plate-out table 113. Wherein, the half silicon wafer 200 enters the workbench 110 from the photographing table 111 and moves out of the workbench 110 from the plate-out table 113, and the reserved table 114 provides a reserved position for the half silicon wafer 200.
According to the half-cell preparation equipment 100 provided by the embodiment of the invention, the half-cell is prepared by directly printing the half-cell silicon wafer, namely, the half-cell silicon wafer is not subjected to the cutting process after printing, so that the phenomena of deformation, breakage and the like of the printed silicon wafer can be avoided, the yield of the produced wafer can be improved, and the wafer thinning design of the silicon wafer is easy to realize.
In some embodiments, as shown in fig. 1, the worktable 110 is in a disk shape, the photographing table 111, the printing table 112, the plate-out table 113, and the reserve table 114 are respectively disposed at the edge of the worktable 110, and the worktable 110 rotates to transport the half silicon wafer 200 to the printing table 112, the plate-out table 113, and the reserve table 114. Therefore, the structure of the workbench 110 can be simplified, the half silicon wafers 200 can be conveniently operated on different table tops, and the production efficiency can be improved. Further, the number of the reserved table-boards 114 may be multiple, and on one hand, a reserved process procedure may be provided for the preparation process of the half-cell, so that the versatility of the preparation apparatus 100 may be improved; on the other hand, a loading or unloading position may be provided for the excess half-wafer 200. In the description of the present invention, "a plurality" means two or more.
As shown in fig. 1, in some embodiments, the printing apparatus 130 includes a first printing apparatus 131 and a second printing apparatus 132 that are spaced apart, the first printing apparatus 131 being adapted to print one of the silicon wafer halves 200, and the second printing apparatus 132 being adapted to print the other of the silicon wafer halves 200. In the actual printing process, the first printing device 131 and the second printing device 132 may print the two half silicon wafers 200 at the same time, or may print the two half silicon wafers 200 respectively.
It is understood that when the first printing device 131 and the second printing device 132 are required to print the two half silicon wafers 200 respectively, two printing tables 112 can be disposed on the working table 110. For convenience of description, the two printing table-boards 112 are respectively a first printing table-board 112 and a second printing table-board 112, and when the worktable 110 conveys two half-silicon wafers 200 onto the first printing table-board 112, the first printing device 131 prints one half-silicon wafer 200; while the worktable 110 transports the two silicon wafer halves 200 to the second printing table 112, the second printing apparatus 132 prints the other silicon wafer half 200. Therefore, the technological process of the half battery piece can be simplified, and the yield of the printing technology can be improved.
According to some embodiments of the present invention, the print head of the first printing apparatus 131 is provided with a first screen, and the first screen is adapted to move according to the position information of the half silicon wafer 200, so that the first screen is aligned with the corresponding half silicon wafer 200; the print head of the second printing apparatus 132 is provided with a second screen, and the second screen is adapted to move according to the position information of the half silicon wafer 200, so that the second screen is aligned with the corresponding half silicon wafer 200. Therefore, the yield in the printing process can be improved. In order to prevent the two printing processes from interfering with each other, in some embodiments, the distance between the two half-wafers 200 on the photo-table 111 is greater than or equal to 10 mm.
According to the manufacturing method of the half cell of the embodiment of the present invention, the half cell can be manufactured by the manufacturing apparatus 100 of the half cell as described above, and the manufacturing method includes the steps of:
s10: preparing a half silicon wafer 200;
s20: photographing two half silicon wafers 200 to determine position information;
s30: and respectively printing the two half silicon wafers 200 according to the position information of the two half silicon wafers 200.
According to the preparation method of the half cell provided by the embodiment of the invention, the prepared half silicon wafer 200 is placed before the printing process, so that the phenomena of deformation, breakage and the like of the printed silicon wafer can be avoided, the yield of the produced wafer can be improved, and the wafer thinning design of the silicon wafer is easy to realize.
Further, in step S10, the half silicon wafer 200 is prepared through a dicing process. Therefore, the preparation efficiency of the half silicon wafer 200 can be simplified, and the yield of the half silicon wafer 200 can be improved.
According to some embodiments of the present invention, in step S30, one of the silicon wafer halves 200 is printed first, and then the other silicon wafer half 200 is printed. It will be appreciated that the printing apparatus 130 includes first and second spaced apart printing apparatus 131, 132, the first printing apparatus 131 being adapted to print one of the silicon wafer halves 200 and the second printing apparatus 132 being adapted to print the other of the silicon wafer halves 200.
As shown in fig. 1, two printing decks 112 may be provided on the table 110. For convenience of description, the two printing table-boards 112 are respectively a first printing table-board 112 and a second printing table-board 112, and when the worktable 110 conveys two half-silicon wafers 200 onto the first printing table-board 112, the first printing device 131 prints one half-silicon wafer 200; while the worktable 110 transports the two silicon wafer halves 200 to the second printing table 112, the second printing apparatus 132 prints the other silicon wafer half 200. Therefore, the technical process of the half-cell can be simplified, and the yield of the printing process can be improved.
It should be noted that, in step S30, the printing sequence for the two half silicon wafers 200 is not limited to this, for example, in some examples, the two half silicon wafers 200 may be printed simultaneously.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. An apparatus for preparing a half cell, comprising:
the worktable comprises a photographing table top, a printing table top, a board discharging table top and a reserved table top, wherein the photographing table top is suitable for accommodating two half silicon wafers;
the feeding mechanism is arranged at the photographing table top so as to convey the half silicon wafer to the photographing table top;
the photographing equipment is arranged at the photographing table top so as to determine the position information of the half silicon wafer;
the printing equipment is arranged on the printing table top and is suitable for printing the corresponding half silicon wafer;
the blanking mechanism is arranged at the plate outlet table top so as to take down the half silicon wafers positioned at the plate outlet table top;
and the half silicon wafer enters the workbench from the photographing table top and is moved out of the workbench from the plate outlet table top, and the reserved table top provides a reserved position for the half silicon wafer.
2. The apparatus for preparing the half-cell according to claim 1, wherein the worktable is in a shape of a disk, the photographing table, the printing table, the discharging table and the reserving table are respectively disposed at edges of the worktable, and the worktable rotates to convey the half-cell silicon wafer to the printing table, the discharging table and the reserving table.
3. The half-cell manufacturing apparatus according to claim 1, wherein the distance between the two half-cells on the photo table is greater than or equal to 10 mm.
4. The half-cell manufacturing apparatus according to claim 1, wherein the printing apparatus comprises a first printing apparatus and a second printing apparatus which are spaced apart, the first printing apparatus being adapted to print one of the half-wafers, and the second printing apparatus being adapted to print the other of the half-wafers.
5. The half-cell manufacturing apparatus according to claim 4, wherein a first screen is disposed on a print head of the first printing apparatus, and the first screen is adapted to move according to the position information of the half-cell, so that the first screen is aligned with the corresponding half-cell;
and a second screen printing plate is arranged on a printing head of the second printing equipment and is suitable for moving according to the position information of the half silicon wafer, so that the second screen printing plate is aligned with the corresponding half silicon wafer.
6. The apparatus for manufacturing a half-cell according to claim 1, wherein the reserve table is plural.
7. The apparatus for manufacturing a half cell as claimed in claim 1, wherein the photographing apparatus is a positioning camera.
8. A method for manufacturing a half-cell, wherein the half-cell is manufactured by the apparatus for manufacturing a half-cell according to any one of claims 1 to 7, and the method comprises the steps of:
s10: preparing a half silicon wafer;
s20: photographing the two half silicon wafers to determine position information;
s30: and respectively printing the two half silicon wafers according to the position information of the two half silicon wafers.
9. The method of manufacturing a half cell according to claim 8, wherein the half silicon wafer is manufactured by a dicing process in step S10.
10. The method for manufacturing a half cell according to claim 8, wherein in step S30, one of the half silicon wafers is printed first, and then the other half silicon wafer is printed;
alternatively, in step S30, the two half silicon wafers are printed simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110138543.XA CN114834146A (en) | 2021-02-01 | 2021-02-01 | Preparation equipment and preparation method of half battery |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110138543.XA CN114834146A (en) | 2021-02-01 | 2021-02-01 | Preparation equipment and preparation method of half battery |
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| Publication Number | Publication Date |
|---|---|
| CN114834146A true CN114834146A (en) | 2022-08-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110138543.XA Pending CN114834146A (en) | 2021-02-01 | 2021-02-01 | Preparation equipment and preparation method of half battery |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040129157A1 (en) * | 2003-01-06 | 2004-07-08 | Hans Dewitte | Method and apparatus for mounting flexographic plate segments |
| US20100089260A1 (en) * | 2008-10-13 | 2010-04-15 | Machines Dubuit | Silk-screen printing machine and associated printing method |
| WO2013166837A1 (en) * | 2012-05-09 | 2013-11-14 | 华南理工大学 | Fully-automatic vision silicon wafer printing device with double platforms |
| CN107901590A (en) * | 2017-12-19 | 2018-04-13 | 南通苏民新能源科技有限公司 | A kind of sunk type rotary table top screen process press |
| CN207651505U (en) * | 2017-12-29 | 2018-07-24 | 苏州阿特斯阳光电力科技有限公司 | Cell piece and printing screen plate |
| CN110957390A (en) * | 2018-09-26 | 2020-04-03 | 苏州阿特斯阳光电力科技有限公司 | Screen printing device and back grid line alignment method of double-sided battery |
| CN211251682U (en) * | 2019-12-05 | 2020-08-14 | 无锡松煜科技有限公司 | Grouping type synchronous screen printing device |
-
2021
- 2021-02-01 CN CN202110138543.XA patent/CN114834146A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040129157A1 (en) * | 2003-01-06 | 2004-07-08 | Hans Dewitte | Method and apparatus for mounting flexographic plate segments |
| US20100089260A1 (en) * | 2008-10-13 | 2010-04-15 | Machines Dubuit | Silk-screen printing machine and associated printing method |
| WO2013166837A1 (en) * | 2012-05-09 | 2013-11-14 | 华南理工大学 | Fully-automatic vision silicon wafer printing device with double platforms |
| CN107901590A (en) * | 2017-12-19 | 2018-04-13 | 南通苏民新能源科技有限公司 | A kind of sunk type rotary table top screen process press |
| CN207651505U (en) * | 2017-12-29 | 2018-07-24 | 苏州阿特斯阳光电力科技有限公司 | Cell piece and printing screen plate |
| CN110957390A (en) * | 2018-09-26 | 2020-04-03 | 苏州阿特斯阳光电力科技有限公司 | Screen printing device and back grid line alignment method of double-sided battery |
| CN211251682U (en) * | 2019-12-05 | 2020-08-14 | 无锡松煜科技有限公司 | Grouping type synchronous screen printing device |
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