CN217293879U

CN217293879U - Solar cell accurate alignment printing device

Info

Publication number: CN217293879U
Application number: CN202221199752.1U
Authority: CN
Inventors: 许明现; 蔡涔; 洪昀; 胡林; 代涛
Original assignee: Dongfang Risheng Changzhou New Energy Co ltd
Current assignee: Dongfang Risheng Jiangsu New Energy Co ltd
Priority date: 2022-05-17
Filing date: 2022-05-17
Publication date: 2022-08-26
Anticipated expiration: 2032-05-17

Abstract

The embodiment of the application provides a solar cell accurate alignment printing device, and relates to the field of solar cell manufacturing. The solar cell accurate alignment printing device comprises: the silicon wafer transfer platform can simultaneously bear all silicon wafers and circularly transfer the silicon wafers along the detection fine adjustment station, the printing station and the detection station, a conveying end of the silicon wafer input mechanism is arranged in parallel with the detection fine adjustment station, the silicon wafer input mechanism is used for conveying the silicon wafers to the detection fine adjustment station, a front end visual recognition mechanism and a fine adjustment mechanism are arranged above the detection fine adjustment station, a printing head is arranged above the printing station, and a rear end visual recognition mechanism is arranged above the detection station. The solar cell accurate alignment printing device can carry out accurate adjustment alignment and simultaneously transfer and print all silicon chips to every silicon chip respectively, can adjust the position of the silicon chip in real time according to the position of the silicon chip before and after printing and the printing effect, and achieves the effect of accurately placing the silicon chip and printing.

Description

Solar cell accurate alignment printing device

Technical Field

The application relates to the field of solar cell manufacturing, in particular to a solar cell accurate alignment printing device.

Background

In recent years, solar cell production technology is continuously improved, production cost is continuously reduced, conversion efficiency is continuously improved, and photovoltaic power generation is increasingly widely applied and becomes an important energy source for power supply. On the way of pursuing high-efficiency solar cells, the technical route of high-efficiency heterojunction cells attracts great attention. Because the printing thick liquids of high-efficient heterojunction battery compare the printing thick liquids of other batteries more thick, printing speed and feed back speed when printing the grid line can't accelerate, consequently the whole line equipment area of printing is very big. In order to improve the overall printing efficiency in a limited space, each screen printing manufacturer has proposed a method of printing two solar cells at a time. However, the solar cell biplate printing method has the following problems to be solved:

the printing method generally aims at two standard silicon chips to carry out alignment adjustment and positioning, namely one of the silicon chips is used as a reference, the other silicon chip refers to the reference silicon chip to carry out alignment adjustment, and once the reference silicon chip has a positioning position problem, the silicon chip to be calibrated also has the positioning position problem. Particularly, the alignment effect of two silicon wafers with size deviation is poor, and inaccurate positioning is easily caused, so that poor printing is caused; the sizes of different silicon wafers are different, the size of the silicon wafer provided by a silicon wafer manufacturer can be controlled to be about +/-0.25 mm, and the size difference of the silicon wafer directly influences the alignment effect and the printing effect.

Even if the accurate alignment of the silicon wafer is realized in the early stage, the position deviation is inevitably generated in the process of transferring to the printing position, and the double-wafer printing effect is also influenced. And the screen printing plate is difficult to avoid deformation in the continuous printing process, once the screen printing plate is deformed, the positioning of the silicon wafer in the early stage is not correspondingly adjusted, so that poor printing can be caused, and especially, the printing effect of two silicon wafers can be directly influenced by printing the two silicon wafers once.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide a solar cell accurate alignment printing device, can carry out accurate adjustment counterpoint respectively to every silicon chip and all silicon chips transport simultaneously and print, can adjust the silicon chip position in real time according to the silicon chip position around the printing and printing effect, reach the accurate piece printing effect of putting.

In a first aspect, a solar cell precision alignment printing apparatus includes:

the silicon wafer transferring platform is used for simultaneously carrying at least two silicon wafers to be circularly transferred along the detection fine adjustment station, the printing station and the detection station;

the silicon wafer input mechanism is used for synchronously conveying at least two silicon wafers to the detection fine adjustment station;

the front-end visual recognition mechanism is arranged above the fine adjustment station and is used for recognizing the conveying end, adjacent to the fine adjustment station, of the silicon wafer input mechanism and the position of each silicon wafer on the fine adjustment station;

the fine adjustment mechanism is arranged above the fine adjustment station and is used for adjusting the conveying end of the silicon wafer input mechanism, which is adjacent to the fine adjustment station, the position of each silicon wafer on the fine adjustment station and transferring the silicon wafers;

the printing head is arranged above the printing station;

and the rear-end visual recognition mechanism is arranged above the detection station and is used for recognizing the position and the printing effect of each silicon wafer.

In the above-mentioned realization in-process, transport the platform through fine-tuning mechanism and silicon chip and can carry out the accurate adjustment counterpoint respectively to every silicon chip and all silicon chips transport simultaneously and print, can adjust the silicon chip position in real time according to the silicon chip position around the printing and printing effect through front end vision identification mechanism and rear end vision identification mechanism, reach the accuracy and put the piece and print the effect repeatedly.

Specifically, the silicon wafer input mechanism is used for synchronously conveying at least two silicon wafers to the detection fine adjustment station, the front-end visual identification mechanism can identify the position of each silicon wafer before the wafers are placed, and once the position of each silicon wafer is found to have deviation, the position of the silicon wafer is adjusted through the fine adjustment mechanism. After the silicon wafers are transferred and placed to the detection fine adjustment station of the silicon wafer transfer platform, the front-end visual recognition mechanism can recheck the position of each silicon wafer, if necessary, the position of each silicon wafer is adjusted through the fine adjustment mechanism, the problem of position deviation caused by the fact that the silicon wafers are placed after the silicon wafer position is finely adjusted is solved, all the silicon wafers are accurately aligned and transferred to the printing station through the silicon wafer transfer platform, all the silicon wafers are accurately aligned and printed through the printing head, and therefore printing accuracy is guaranteed.

After one-time printing is finished, all the silicon wafers are transferred to a detection station through a silicon wafer transfer platform, a rear-end visual recognition mechanism can recognize the position and the printing effect of each silicon wafer, and whether the silicon wafers deviate or not and whether the silicon wafers need to be adjusted in the transferring and printing processes can be judged by combining the position of each silicon wafer recognized by a front-end visual recognition mechanism after the silicon wafers are transferred to a detection fine adjustment station next time; the position of the silicon wafer is readjusted through the fine adjustment mechanism according to requirements, so that the position of the silicon wafer is matched with the accurate alignment requirement of repeated printing, the alignment problem generated after the screen printing plate of the printing station is deformed is avoided, and the repeated printing effect is ensured.

In a possible implementation manner, the front-end visual recognition mechanism is divided into a first CCD camera with a fixed frame arranged above the conveying end and a second CCD camera with a fixed frame arranged above the fine adjustment detection station, and the rear-end visual recognition mechanism is a third CCD camera with a fixed frame arranged above the fine adjustment detection station.

In the above implementation, at different positions: the conveying end, the detection fine adjustment station and the detection station are respectively and fixedly provided with different CCD cameras, so that silicon wafers at different positions are identified, and the positions of the silicon wafers are adjusted according to identification results.

In one possible implementation mode, the silicon wafer transferring platform is a rotary table, the front end visual recognition mechanism, the printing head and the rear end visual recognition mechanism are arranged at different positions above the edge of the rotary table, the position of the rotary table corresponding to the front end visual recognition mechanism is a detection fine adjustment station, the position of the rotary table corresponding to the printing head is a printing station, and the position of the rotary table corresponding to the rear end visual recognition mechanism is a detection station.

In the implementation process, the turntable can bear the silicon wafers to sequentially carry out corresponding processing through each station, the whole occupied area is small, and the silicon wafers are convenient to transport.

In a possible implementation mode, at least one silicon wafer bearing table is arranged at the edge of the rotary disc; optionally, the table top of the silicon wafer bearing table is provided with an anti-slip layer.

In the implementation process, the silicon wafer bearing table is used for bearing the silicon wafer to sequentially pass through each station.

In a possible implementation manner, each group of fine adjustment mechanisms comprises an x-direction adjustment shaft, a y-direction adjustment shaft movably arranged on the x-direction adjustment shaft, and a sucker movably arranged on the y-direction adjustment shaft, wherein the sucker can rotate and move up and down relative to the y-direction adjustment shaft.

In the implementation process, the sucker is lifted to suck the silicon wafer, the silicon wafer moves along the x-direction adjusting shaft, the x-direction precise adjustment is achieved, the silicon wafer moves along the y-direction adjusting shaft, the y-direction precise adjusting device is achieved, the sucker rotates to achieve the theta angle precise adjustment, and therefore the precise alignment adjustment of the position of the silicon wafer is achieved.

In a possible implementation mode, the y-direction adjusting shaft is connected with the sucker through a connecting piece, the sucker is located on one side of the y-direction adjusting shaft, the rotating shaft of the sucker passes through the connecting position of the sucker and the connecting piece, and the sucker can be lifted relative to the connecting piece.

In the implementation process, the suction cup can be arranged side by side with the y-phase adjusting shaft through the connecting piece, so that the fine adjusting mechanism is arranged conveniently.

In a possible implementation mode, the connecting piece is L-shaped, and two ends of the connecting piece are respectively connected with the y-direction adjusting shaft and the sucker.

In the implementation process, the moving range of the sucker can be adjusted according to the situation through the L-shaped connecting piece.

In a possible implementation manner, the silicon wafer input mechanism comprises at least two conveyer belts arranged side by side, and each conveyer belt is used for continuously conveying a column of silicon wafers to the detection fine adjustment station.

In the implementation process, continuous conveying of at least two rows of silicon wafers is achieved through the conveying belt, so that one group of silicon wafers are placed and printed continuously, and the overall printing efficiency is improved.

In a possible implementation mode, the silicon wafer output mechanism further comprises a silicon wafer output mechanism which is used for synchronously conveying all the silicon wafers on the detection station.

In the implementation process, the silicon wafers in the same group after the precise printing are automatically conveyed through the silicon wafer conveying mechanism.

In a possible implementation manner, the silicon wafer transferring platform is a cross transferring platform, the cross transferring platform can move along a cross track, the front end visual identification mechanism, the printing head and the rear end visual identification mechanism are respectively arranged at different end parts of the cross track, the end part of the cross track, which is provided with the front end visual identification mechanism, is a detection fine adjustment station, the end part of the cross track, which is provided with the printing head, is a printing station, and the end part of the cross track, which is provided with the rear end visual identification mechanism, is a detection station.

In the implementation process, the crossed carrying platform moving along the cross-shaped track can bear the silicon wafers to reach each station for corresponding processing.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a solar cell precise alignment printing apparatus according to a first embodiment of the present disclosure;

FIG. 2 is a schematic view of the structure of FIG. 1 from another perspective;

FIG. 3 is a schematic diagram of the first CCD camera portion of FIG. 1;

fig. 4 is a schematic structural diagram of the fine adjustment mechanism in fig. 1.

An icon: 110-a silicon wafer input mechanism; 120-a silicon wafer output mechanism; 130-a workbench; 140-a turntable; 141-a silicon wafer bearing table; 151-a first CCD camera; 152-a second CCD camera; 153-third CCD camera; 154-a first mounting frame; 155-a second mounting frame; 156-a third mount; 160-fine adjustment mechanism; a 161-x direction adjusting shaft; 162-y direction adjustment axis; a 163-z adjustment axis; 164-a connector; 165-a suction cup; 170-print head.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it is to be noted that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally laid out when products of the application are used, and are only for convenience in describing the application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

First embodiment

Referring to fig. 1 to 3, the precise alignment printing device for a solar cell according to the present embodiment is used for simultaneously aligning and printing two silicon wafers, and includes a worktable 130, a silicon wafer input mechanism 110 for synchronously conveying the two silicon wafers, a silicon wafer output mechanism 120, and a silicon wafer transfer platform for simultaneously transferring all the silicon wafers, where the silicon wafer input mechanism 110, the silicon wafer output mechanism 120, and the silicon wafer transfer platform are all disposed on the worktable 130.

Wherein, the platform is transported to silicon chip can bear all silicon chips simultaneously and transport to detecting accurate adjustment station, printing station and detection station in order and can circulate and transport, gets back to the detection accurate adjustment station again by detecting the station promptly. In this embodiment, a conveying end of the silicon wafer input mechanism 110 and the detection fine adjustment station are arranged in parallel and used for synchronously conveying two silicon wafers to the detection fine adjustment station, and a conveying end of the silicon wafer output mechanism 120 and the detection station are arranged in parallel and used for synchronously conveying the two silicon wafers on the detection station. The silicon wafer input mechanism 110 is provided with a front visual recognition mechanism for recognizing the conveying end of the silicon wafer input mechanism and the position of each silicon wafer on the fine adjustment station, and a fine adjustment mechanism 160 for adjusting the conveying end of the silicon wafer input mechanism and the position of each silicon wafer on the fine adjustment station and transferring the silicon wafers from the conveying end to the fine adjustment station. A printing head 170 is arranged above the printing station, and a rear-end visual recognition mechanism for recognizing the position and the printing effect of each silicon wafer is arranged above the detection station.

In this embodiment, the silicon wafer transferring platform is a horizontally disposed rotating disc 140, the rotating disc 140 can rotate around a vertically disposed rotating shaft with respect to the worktable 130, and the front end visual recognition mechanism, the printing head 170 and the rear end visual recognition mechanism are disposed at different positions above the edge of the rotating disc 140. Specifically, the turntable 140 is circular, the front visual recognition mechanism, the print head 170 and the rear visual recognition mechanism are respectively located at three ends of two mutually perpendicular intersecting diameters of the turntable 140, the front visual recognition mechanism and the rear visual recognition mechanism are located at two ends of the same diameter, and the print head 170 is located at one end of the other diameter. In other embodiments, the front visual recognition mechanism, the print head 170 and the rear visual recognition mechanism may be disposed at the edge of the turntable 140 in other arrangements, such as uniformly or non-uniformly arranged around the rotation axis of the turntable 140, which is not limited in this application. The turntable 140 may have other shapes as long as it can rotate around the rotation axis at the middle portion thereof.

In this embodiment, the rotation of the turntable 140 to the position corresponding to the front visual recognition mechanism is a detection fine adjustment station, the rotation of the turntable 140 to the position corresponding to the print head 170 is a printing station, and the rotation of the turntable 140 to the position corresponding to the rear visual recognition mechanism is a detection station. The detection fine adjustment station, the printing station, and the detection station corresponding to the turntable 140 are not fixed regions on the turntable 140, but may be considered as fixed regions on the table 130, and refer to a position on the turntable 140 below the front-end visual recognition mechanism, a position below the print head 170, and a position below the rear-end visual recognition mechanism, respectively.

In this embodiment, the edge of the turntable 140 is provided with four silicon wafer bearing tables 141, and the top surfaces of the silicon wafer bearing tables 141 may be provided with an anti-slip layer. The silicon wafer bearing tables 141 are fixed on the rotary table 140 and can rotate along with the rotary table 140, the four silicon wafer bearing tables 141 are uniformly distributed at four positions at the edge of the rotary table 140 relative to the rotating shaft, and each silicon wafer bearing table 141 can rotate along with the rotary table 140 and is sequentially transferred to the detection fine adjustment station, the printing station and the detection station. In other embodiments, only one wafer stage 141, or two, three, five or even more wafer stages 141 may be disposed on the turntable 140.

In this embodiment, the silicon wafer input mechanism 110 includes two parallel conveyer belts, each conveyer belt is used for continuously conveying a column of silicon wafers to the detection fine adjustment station; the silicon wafer output mechanism 120 includes two parallel conveyer belts, and each conveyer belt is used for continuously outputting the silicon wafers at the detection station in a row. The arrangement of the conveyor belt of the silicon wafer input mechanism 110 and the conveyor belt of the silicon wafer output mechanism 120 is based on the fact that the conveyor belts of the silicon wafer input mechanism 110 and the silicon wafer output mechanism 120 do not interfere with the operation of other components, in this embodiment, the silicon wafer input mechanism 110 and the silicon wafer output mechanism 120 are respectively located on two opposite sides of the turntable 140, the conveyor belts of the two are corresponding, one conveying end (output end) of the silicon wafer input mechanism 110 is adjacent to the detection fine adjustment station, and one conveying end (input end) of the silicon wafer output mechanism 120 is adjacent to the detection station.

It should be noted that the number of the conveyor belts in the silicon wafer input mechanism 110 and the silicon wafer output mechanism 120 generally corresponds to the number of silicon wafers to be printed simultaneously, and in other embodiments, the number of the conveyor belts may also be three, four or more, so as to simultaneously convey three, four or more silicon wafers to the turntable 140 for simultaneous transfer and printing.

In this embodiment, the front visual recognition mechanism is divided into a first CCD camera 151 with a fixed mount disposed above the conveying end of the silicon wafer input mechanism 110 and a second CCD camera 152 with a fixed mount disposed above the fine adjustment detection station, and the rear visual recognition mechanism is a third CCD camera 153 with a fixed mount disposed above the fine adjustment detection station. First CCD camera 151, second CCD camera 152 and third CCD camera 153 adopt the mounting bracket that corresponds respectively to be fixed in the different positions on workstation 130, in order not to hinder other part operation as the standard, the transport end of locating silicon chip input mechanism 110 is striden to first mounting bracket 154 that first CCD camera 151 corresponds, the marginal portion position of locating carousel 140 is striden to second mounting bracket 155 that second CCD camera 152 corresponds, the marginal portion position of locating carousel 140 is striden to third mounting bracket 156 that third CCD camera 153 corresponds, and the second mounting bracket 155 that first mounting bracket 154 that first CCD camera 151 corresponds and second CCD camera 152 correspond, the third mounting bracket 156 that third CCD camera 153 corresponds sets up side by side.

Referring to fig. 4, in the present embodiment, the number of the fine adjustment mechanisms 160 is two, and all the fine adjustment mechanisms 160 are arranged side by side, and each fine adjustment mechanism 160 is responsible for a silicon wafer on a conveyor belt of the silicon wafer input mechanism 110. Each group of fine adjustment mechanisms 160 comprises an x-direction adjustment shaft 161 fixed on work, a y-direction adjustment shaft 162 movably arranged on the x-direction adjustment shaft 161, and a z-direction adjustment shaft 163 movably arranged on the z-direction adjustment shaft 163, wherein a sucker 165 is also connected to the z-direction adjustment shaft 163 in a telescopic manner, the suckers 165 can rotate, the x-direction adjustment shaft 161 and the y-direction adjustment shaft 162 are horizontally arranged and are perpendicular to each other, the z-direction adjustment shaft 163 is vertically arranged, the y-direction adjustment shaft 162 can move along the x-direction adjustment shaft 161, the z-direction adjustment shaft 163 can move along the y-direction adjustment shaft 162, and the z-direction adjustment shaft 163 can stretch out and retract. The z-direction adjustment shaft 163 is connected to the chuck 165 through the connector 164, the connector 164 is L-shaped and disposed at the uppermost position, and both ends thereof are connected to the y-direction adjustment shaft 162 and the chuck 165, respectively, so that the chuck 165 is positioned at one side of the x-direction adjustment shaft 161 and the y-direction adjustment shaft 162, the chuck 165 can be moved up and down with respect to the connector 164, and the rotation shaft of the chuck 165 can rotate on its axis through the connection between the chuck 165 and the connector 164, that is, the chuck 165, thereby adjusting the deflection angle of the wafer to be adsorbed.

The embodiment also provides a solar cell accurate alignment printing method, which is implemented by using the solar cell accurate alignment printing method and specifically comprises the following steps:

and S1, conveying at least two silicon wafers needing to be simultaneously printed in an aligned mode to a position adjacent to the detection fine adjustment station, identifying the position of each silicon wafer, comparing the position of each silicon wafer with that of a standard silicon wafer, and adjusting the positions of the silicon wafers according to requirements.

In this embodiment, two silicon wafers are synchronously conveyed to the direction of detecting the fine adjustment station through the silicon wafer input mechanism 110, the first CCD camera 151 identifies the position of the two silicon wafers below the first CCD camera 151 and is located at the position of the two silicon wafers on the silicon wafer output mechanism 120, specifically, the edge of the silicon wafer, the MARK point and the central point are identified through the first CCD camera 151, the position comparison is performed with the respective corresponding standard silicon wafers respectively, the center alignment mode is adopted, the silicon wafer is compared with the respective images of the standard silicon wafers, the accurate adjustment is performed again, and therefore the accurate alignment effect is achieved: when the position of the silicon chip is found to have deviation, the data of the silicon chip to be adjusted is fed back to the corresponding fine adjustment mechanism 160, and the fine adjustment mechanism 160 carries out X, Y, Z fine adjustment on the silicon chip in the theta direction according to the data information fed back by the first CCD camera 151.

And S2, transferring all the silicon wafers to a detection fine adjustment station, identifying the position of each silicon wafer and adjusting the position of each silicon wafer as required.

In this embodiment, all the silicon wafers subjected to position recognition and adjustment by the silicon wafer input mechanism 110 are precisely transferred and placed on the silicon wafer bearing table 141 which is just rotated to the detection fine adjustment station by the rotating disc 140 through the fine adjustment mechanism 160, the silicon wafer placement positions are rechecked through the second CCD camera 152, specifically, the edges, MARK points and central points of two silicon wafers below the silicon wafer placement positions are recognized through the second CCD camera 152 and are respectively compared with the corresponding standard silicon wafers in position, and if a position problem occurs, the positions of the silicon wafers are finely adjusted through the fine adjustment mechanism 160, so that the accuracy of the silicon wafers on the silicon wafer bearing table 141 is ensured.

And S3, after the two silicon wafers are accurately aligned, the rotating disc 140 rotates, all the silicon wafers are simultaneously transferred to the printing station to perform normal printing work, and the printing head 170 of the printing station is used for simultaneously printing the two silicon wafers at one time.

And S4, after one-time printing is finished, the rotating disc 140 rotates, all the silicon wafers are transferred to the detection station at the same time, the position and the printing effect of each silicon wafer are identified through the third CCD camera 153, and the position and the printing effect are fed back to the second CCD camera 152 in time.

And S5, repeating the steps S2-S4, feeding back the printing effect identified in the step S4 to the next step S2, and adjusting the positions of the silicon wafers according to the positions of all the silicon wafers identified in the step S2, so that the poor batch printing caused by factors such as printing position deviation, deformation of printing screens of the printing head 170 and the like is avoided until the printing of all the silicon wafers on the silicon wafer bearing table 141 is completed.

And S6, synchronously conveying the silicon wafers printed on the detection station to the next node through the silicon wafer output mechanism 120 and the matched transfer mechanism.

It should be noted that, in the process of transferring the silicon wafer by the silicon wafer carrying table 141, the other silicon wafer carrying tables 141 can also transfer the silicon wafer at the same time, so that the silicon wafers on all the silicon wafer carrying tables 141 can be sequentially and accurately aligned and printed, and the overall printing efficiency can be greatly improved.

Second embodiment

The difference between the solar cell precise alignment printing apparatus provided in this embodiment and the first embodiment is that: the device of this embodiment is used for counterpointing two silicon chips of printing simultaneously, and silicon chip input mechanism is three conveyer belts that set up side by side, and the quantity of fine tuning is three groups, can place three silicon chips side by side on every silicon chip plummer, and silicon chip output mechanism is three conveyer belts that set up side by side.

Third embodiment

The difference between the solar cell precise alignment printing apparatus provided in this embodiment and the first embodiment is that: this platform is transported to silicon chip is alternately the transport platform, and alternately the transport platform can follow cross track and remove, and front end vision recognition mechanism, print head and rear end vision recognition mechanism set up in the orbital different tip of cross, and cross track is provided with the tip of front end vision recognition mechanism and is detecting the accurate station of transferring, and cross track is provided with the tip of print head and is printing the station, and cross track is provided with the tip of rear end vision recognition mechanism and is detecting the station.

To sum up, the solar cell accurate alignment printing method and device provided by the embodiment of the application can be used for accurately adjusting alignment of each silicon wafer and simultaneously transferring and printing all the silicon wafers, and can be used for adjusting the positions of the silicon wafers in real time according to the positions of the silicon wafers before and after printing and the printing effect, so that the accurate wafer placing and printing effect is achieved.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A solar cell accurate alignment printing device is characterized by comprising:

a print head disposed above the print station;

2. The solar cell precise alignment printing device according to claim 1, wherein the front visual recognition mechanism is divided into a first CCD camera fixed above the conveying end and a second CCD camera fixed above the fine inspection station, and the rear visual recognition mechanism is a third CCD camera fixed above the inspection station.

3. The solar cell precise alignment printing device according to claim 1, wherein the silicon wafer transfer platform is a turntable, the front end visual recognition mechanism, the printing head and the rear end visual recognition mechanism are disposed at different positions above the edge of the turntable, the position of the turntable corresponding to the front end visual recognition mechanism is the detection fine adjustment station, the position of the turntable corresponding to the printing head is the printing station, and the position of the turntable corresponding to the rear end visual recognition mechanism is the detection station.

4. The solar cell precise alignment printing device according to claim 3, wherein at least one silicon wafer bearing table is arranged at the edge of the turntable.

5. The solar cell precise alignment printing device according to claim 1, wherein each set of the fine adjustment mechanisms comprises an x-direction adjustment shaft, a y-direction adjustment shaft movably disposed on the x-direction adjustment shaft, and a suction cup movably disposed on the y-direction adjustment shaft, and the suction cup is capable of rotating and moving up and down relative to the y-direction adjustment shaft.

6. The solar cell accurate alignment printing device according to claim 5, wherein the y-direction adjustment shaft is connected with the suction cup through a connecting member, the suction cup is located on one side of the y-direction adjustment shaft, a rotation shaft of the suction cup passes through a connection position of the suction cup and the connecting member, and the suction cup can be lifted relative to the connecting member.

7. The solar cell precise alignment printing device according to claim 6, wherein the connecting member is L-shaped, and two ends of the connecting member are respectively connected to the y-axis and the suction cup.

8. The solar cell accurate alignment printing device according to claim 1, wherein the silicon wafer input mechanism comprises at least two conveyor belts arranged side by side, and each conveyor belt is used for continuously conveying a column of silicon wafers to the detection fine adjustment station.

9. The solar cell accurate alignment printing device according to claim 1, further comprising a silicon wafer output mechanism for synchronously delivering all the silicon wafers on the inspection station.

10. The solar cell precise alignment printing device according to claim 1, wherein the silicon wafer transferring platform is a cross transferring platform, the cross transferring platform can move along a cross track, the front end visual recognition mechanism, the printing head and the rear end visual recognition mechanism are respectively disposed at different ends of the cross track, an end portion of the cross track where the front end visual recognition mechanism is disposed is the detection fine adjustment station, an end portion of the cross track where the printing head is disposed is the printing station, and an end portion of the cross track where the rear end visual recognition mechanism is disposed is the detection station.