CN113927238A - Continuous overturning welding device for electronic chip and working method thereof - Google Patents

Abstract

The invention discloses a continuous turnover welding device and a working method of an electronic chip, belonging to the technical field of advanced production, manufacturing and automation, and comprising a fixed circular upright post, a turntable, a chip pushing assembly, a chip conveying belt, a chip welding turnover unit, a welding transfer unit, a welding gun horizontal moving unit, a welding gun rotating unit, a welding gun and a robot, wherein the welding gun horizontal moving unit can drive the welding gun to horizontally move, the welding gun rotating unit can drive the welding gun to rotate for 360 degrees, the robot is connected with the welding gun rotating unit, the welding gun is connected with the robot, and the robot can drive the welding gun to weld a chip to be welded. The continuous turnover welding device for the electronic chip can meet the requirements of automatic feeding of the chip and continuous front and back welding, can effectively improve the production efficiency particularly in mass production, can ensure the welding quality and improve the welding precision of the chip due to the adoption of numerical control accurate control.

Description

Continuous overturning welding device for electronic chip and working method thereof

Technical Field

The invention belongs to the technical field of advanced production, manufacturing and automation, and particularly relates to a continuous overturning welding device for an electronic chip. The invention also relates to a working method of the continuous overturning welding device of the electronic chip.

Background

Electronic chips, also known as microcircuits, microchips, integrated circuits, refer to silicon wafers containing integrated circuits, having a small volume, often being part of a computer or other electronic device, usually being a thin silicon wafer, on which transistors constituting a microprocessor are etched, integrated circuits, or microcircuits, microchips, chips, being a way of miniaturizing circuits in electronics, mainly comprising semiconductor devices, also comprising passive components, etc., and usually being manufactured on the surface of a semiconductor wafer. Many electronic components are welded on the chip, and along with the development of science and technology, the integration level of the electronic chip is higher and higher. Therefore, the number of electronic components on the electronic chip is increasing.

In the traditional electric chip welding, manual welding is mostly adopted, and due to the fact that the influence of human factors is large and the controllability is poor, the welding quality of a product is finally low, and the welding efficiency is low. Even though some devices capable of automatic soldering are available, many limitations exist in soldering electronic chips, and the demand for advanced soldering equipment is very urgent in many electronic chip manufacturers.

Disclosure of Invention

The purpose of the invention is as follows: in order to overcome the defects, the invention aims to provide a continuous turnover welding device for electronic chips, which solves the problems that in the welding process of the electronic chips in the prior art, the automation degree of welding is limited, so that a large amount of manual welding is still needed in the production process, the product quality cannot be ensured, and the welding efficiency is low.

The technical scheme is as follows: a continuous turnover welding device for electronic chips comprises a fixed circular stand column, a rotary table, a chip pushing assembly, a chip conveying belt, a chip welding turnover unit, a welding transfer unit, a welding gun horizontal moving unit, a welding gun rotating unit, a welding gun and a robot, wherein a through hole is formed in the center of the rotary table, a group of chips to be welded are arranged on the rotary table in an annular array mode, the fixed circular stand column penetrates through the through hole in the center of the rotary table, the chip pushing assembly is arranged on the upper end portion, penetrating through the rotary table, of the fixed circular stand column, the chip pushing assembly can push the chips to be welded on the rotary table to the chip conveying belt, the chip conveying belt is arranged in an inclined mode, the upper starting end of the chip conveying belt is located below the outer edge of the rotary table, the lower tail end of the chip conveying belt is located above the chip welding turnover unit, and the chip welding turnover unit is arranged on the welding transfer unit, and the chip welding turnover unit can clamp the chip to be welded, the welding transfer unit can drive the chip welding turnover unit to horizontally reciprocate, the welding gun rotating unit is connected with the welding gun horizontal moving unit, the welding gun horizontal moving unit can drive the welding gun to horizontally move, the welding gun rotating unit can drive the welding gun to rotate for 360 degrees, the robot is connected with the welding gun rotating unit, the welding gun is connected with the robot, and the robot can drive the welding gun to weld the chip to be welded. According to the continuous turnover welding device for the electronic chip, disclosed by the invention, automatic feeding of the chip can be met and continuous front and back welding can be realized through the cooperative work of the turntable, the chip pushing assembly, the chip conveying belt, the chip welding turnover unit, the welding transfer unit, the welding gun horizontal moving unit, the welding gun rotating unit, the welding gun and the robot, the production efficiency can be effectively improved particularly in mass production, and the welding quality and the welding precision of the chip can be improved due to the adoption of numerical control and accurate control.

Furthermore, according to the continuous turnover welding device for the electronic chip, the chip pushing assembly comprises the pushing cylinder and the pushing plate, the pushing cylinder is fixedly arranged at the upper end of the fixed round stand column, the pushing plate is connected with the piston rod of the pushing cylinder, and the pushing plate is located above the turntable.

Further, foretell electronic chip's continuous upset welding set, the both sides that the chip conveyer belt is close to the upper end of carousel are equipped with arc feeding deflector, the arc feeding deflector of chip conveyer belt both sides is "eight" font setting to the main aspects opening is towards one side of carousel between the arc feeding deflector, two bisymmetry in the both sides of chip conveyer belt direction of delivery is equipped with a set of guide roller, take welded chip to pass between guide roller.

Further, foretell electronic chip's continuous upset welding set, chip welding upset unit includes upset drive assembly, rectangle braced frame, four chip backup pads and four chip centre gripping subassemblies, upset drive assembly sets up on the welding transfer unit, rectangle braced frame and upset drive assembly connect to upset drive assembly can drive rectangle braced frame and carry out 360 rotations, four chip backup pads set up respectively in four bight positions department of rectangle braced frame, four chip centre gripping subassemblies and four chip backup pads one-to-one set up to chip centre gripping subassembly sets up in the chip backup pad, treat that four bights of welding the chip set up respectively in four chip backup pads, four chip centre gripping subassemblies can grasp four bights of waiting to weld the chip.

Further, the continuous turnover welding device of the electronic chip comprises a turnover driving component, a first rotating shaft, a first driving wheel, a second driving wheel, a first transmission gear belt, a first driven wheel, a second transmission gear belt, a second rotating shaft, a third rotating shaft and a turnover supporting frame body, wherein the turnover supporting frame body is connected with a welding transfer unit, the turnover driving motor, the first rotating shaft, the second rotating shaft and the third rotating shaft are all arranged on the turnover supporting frame body, the turnover driving motor is connected with the first rotating shaft, the first driving wheel and the first driven wheel are respectively arranged at two ends of the first rotating shaft, the first driving wheel and the first driven wheel are symmetrically arranged, the first driving wheel is connected with the second driving wheel through the second transmission gear belt, the first driven wheel is connected with the second rotating shaft, the second driven wheel is connected with the third rotating shaft, the second rotating shaft and the third rotating shaft are symmetrically arranged and are respectively connected with two opposite sides of the rectangular supporting frame.

Further, foretell electronic chip's welding set overturns in succession, chip centre gripping subassembly includes that the centre gripping drives actuating cylinder and right angle grip block, the centre gripping drives actuating cylinder and chip backup pad fixed connection, right angle grip block and centre gripping drive the piston rod of actuating cylinder and be connected to the centre gripping drives actuating cylinder and can drive right angle grip block and wait to weld the bight of chip and contact, be equipped with in the chip backup pad and remove the spout, right angle grip block and removal spout sliding connection).

Furthermore, the continuous turnover welding device for the electronic chip comprises a first horizontal driving motor, a first supporting seat, a first horizontal driving screw rod, a group of first screw nuts, a first horizontal guiding sliding plate, two first symmetrically arranged guiding columns and a first horizontal supporting plate, wherein the first horizontal driving motor and the two first symmetrically arranged guiding columns are arranged on the first supporting seat and are connected with the first horizontal driving screw rod, the group of first screw nuts and the first horizontal driving screw rod are in threaded connection, the two symmetrically arranged guiding columns are respectively arranged on two sides of the first horizontal driving screw rod, the two first symmetrically arranged guiding columns and the first horizontal driving screw rod are arranged in parallel, the first horizontal guiding sliding plate is sleeved on the first horizontal driving screw rod and is in sliding connection with the first horizontal guiding sliding plate and the first guiding column, the first horizontal supporting plate is fixedly connected with the first screw nuts and the first horizontal guiding sliding plate, the overturning driving assembly is arranged on the first horizontal supporting plate.

Further, in the continuous turnover welding device for the electronic chip, the welding gun horizontal moving unit comprises a second horizontal driving motor, a support frame, a second two horizontal guide rails, a second guiding sliding plate, a second horizontal driving screw rod, a second group of screw nuts and a second horizontal connecting plate, wherein the second horizontal driving motor and the second two horizontal guide rails are fixedly arranged on the support frame, the second horizontal driving motor is connected with the second horizontal driving screw rod, the second horizontal driving screw rod is arranged on the support frame through a screw rod support seat, the second group of screw nuts are in threaded connection with the second horizontal driving screw rod, the second guiding sliding plate is connected with one of the second group of screw nuts, the second guiding sliding plate is sleeved on the second horizontal driving screw rod, the second horizontal connecting plate is fixedly connected with the second group of screw nuts and the second guiding sliding plate, and the welding gun rotating unit is fixedly arranged on the lower end face of the second horizontal connecting plate, the two horizontal guide rails II and the horizontal driving screw rod II are arranged in parallel, the two horizontal guide rails II are respectively positioned on two sides of the horizontal driving screw rod II, and the guide sliding plate II is in sliding connection with the two horizontal guide rails II.

Further, foretell electronic chip's continuous upset welding set, welder rotary unit includes runing rest, rotatory slip table, thrust ball bearing and robot carousel, the runing rest is fixed to be set up on horizontal connecting plate two, rotatory slip table and thrust ball bearing all set up on the runing rest to rotatory slip table and thrust ball bearing are connected, robot carousel and thrust ball bearing are connected, robot and robot carousel fixed connection.

The invention provides a working method of a continuous turnover welding device of an electronic chip, which comprises the following steps:

s1, sequentially placing the chips to be welded on a turntable by a robot with a preorder station, wherein the turntable intermittently rotates within the range of 360 degrees, the chips to be welded placed on the turntable are arranged on the turntable in an annular array mode, and the turntable rotates when one chip to be welded is placed;

s2, when the chip to be welded placed on the turntable is arranged opposite to the inlet of the starting end of the chip conveying belt, the piston rod of the material pushing cylinder extends out to drive the push plate to move, the push plate is in contact with the chip to be welded arranged on the turntable opposite to the inlet of the starting end of the chip conveying belt, the chip to be welded at the position is pushed to the starting end of the chip conveying belt, and the material pushing cylinder resets;

s3, the chip conveyer belt conveys the chips to be welded, so that the chips to be welded are conveyed from the starting end to the tail end of the chip conveyer belt, and the lower end parts of the chips to be welded at the tail end of the chip conveyer belt fall on the four chip supporting plates firstly;

s4, starting the horizontal driving motor I to drive the horizontal driving screw rod I to rotate, so that the group of screw rod nuts I move along the horizontal direction to the direction far away from the chip conveying belt, and the turnover driving assembly is driven to move along the direction far away from the chip conveying belt;

s5, the movement of the four chip supporting plates drives the chips to be welded to move together, the chips to be welded are enabled to gradually move out of the chip conveying belt in cooperation with the conveying of the chip conveying belt, the chips to be welded finally fall on the four chip supporting plates and are horizontally arranged, and the chips to be welded are located in the range surrounded by the four chip clamping assemblies;

s6, starting the four chip clamping assemblies simultaneously, and enabling a piston rod of the clamping driving cylinder to extend to push the right-angle clamping block to slide along the moving sliding groove, so that the right-angle clamping block is pressed at the corner position of the chip to be welded, and the chip to be welded is clamped and fixed on the four chip supporting plates;

s7, the welding transfer unit moves the chip to be welded to the welding position;

s8, starting a horizontal driving motor II to drive a horizontal driving screw rod II to rotate, so that a group of screw rod nuts II move, and the robot is moved to a welding position;

s9, the welding gun rotating unit drives the robot to rotate, and the welding gun is matched with the robot to move so that the welding gun welds one surface of the chip to be welded clamped on the chip welding overturning unit;

s10, after the upper panel of the chip to be welded on the chip welding turnover unit is welded, starting a turnover driving motor, driving a second rotating shaft and a third rotating shaft to synchronously rotate through the transmission of a first rotating shaft, a first driving wheel, a second driving wheel, a first transmission gear belt, a first driven wheel, a second driven wheel and a second transmission gear belt, so that a turnover supporting frame body is turned over for 180 degrees, because the chip to be welded is additionally held on the turnover supporting frame body, the upper panel and the lower panel of the chip to be welded are turned over, the welded upper panel is turned over to the lower side, and the lower panel to be welded is turned over to the upper side;

s11, repeating the step S9, and welding the other surface of the chip to be welded clamped on the chip welding turnover unit by the welding gun;

s12, after all chips are welded, the first horizontal driving motor is restarted to drive the first horizontal driving screw rod to rotate, so that the first group of screw rod nuts move towards the direction far away from the chip conveying belt along the horizontal direction, and the overturning driving assembly is driven to move to one end far away from the chip conveying belt;

s13, restarting the turnover driving motor, driving the second rotating shaft and the third rotating shaft to synchronously rotate through the transmission of the first rotating shaft, the first driving wheel, the second driving wheel, the first transmission gear belt, the first driven wheel, the second driven wheel and the second transmission gear belt, so that the turnover supporting frame body is turned over for 180 degrees, the upper panel and the lower panel of the outer wall chip are turned over, the upper panel is turned over to the upper side, and the lower panel is turned over to the lower side;

s14, starting the four chip clamping assemblies simultaneously, and enabling a piston rod of the clamping driving cylinder to retract to drive the right-angle clamping block to slide along the moving sliding groove, so that the right-angle clamping block is separated from the welded chips;

s15, moving a material taking robot in the next procedure to a position right above the welded chips, and sucking away the welded chips on the four chip supporting plates by the material taking robot through a sucking disc;

s16, returning the welding transfer unit to the initial position, namely, the rectangular supporting frame is positioned below the tail end of the chip conveying belt;

and S17, continuously repeating the steps S1-S16, and continuously welding the chips to be welded.

The technical scheme shows that the invention has the following beneficial effects: the continuous overturning welding device for the electronic chip is reasonable in structural design, can realize automatic feeding, clamping and fixing, automatic transferring and welding of the chip, can realize continuous 180-degree rotation of the chip while stably clamping the chip, and can realize welding of the front side and the back side of the chip. The working method of the continuous turnover welding device for the electronic chip is simple and easy in working principle, high in automation degree of the working process, low in manpower requirement, high in production efficiency and suitable for industrial large-scale application.

Drawings

FIG. 1 is a top view of a continuous flip chip bonding apparatus for electronic chips in accordance with the present invention;

FIG. 2 is a front view of a continuous flip chip bonding apparatus for electronic chips in accordance with the present invention;

FIG. 3 is a top view of the die bonding flipping unit and the bonding transferring unit according to the present invention;

FIG. 4 is a front view of a die bonding flipping unit and a bonding transfer unit according to the present invention;

FIG. 5 is a schematic structural diagram of the tumble drive assembly according to the present invention;

FIG. 6 is a schematic structural view of a chip clamping assembly according to the present invention;

fig. 7 is a schematic structural diagram of the welding gun horizontal moving unit, the welding gun rotating unit, the welding gun and the robot according to the present invention.

In the figure: the device comprises a fixed circular upright post 1, a rotary table 2, a chip pushing assembly 3, a pushing cylinder 31, a pushing plate 32, a chip conveying belt 4, an arc-shaped feeding guide plate 41, a guide roller 42, a chip welding overturning unit 5, an overturning driving assembly 51, an overturning driving motor 511, a first rotating shaft 512, a first driving wheel 513, a second driving wheel 514, a first transmission gear belt 515, a first driven wheel 516, a second driven wheel 517, a second transmission gear belt 518, a second rotating shaft 519, a third rotating shaft 5110, an overturning supporting frame body 5111, a rectangular supporting frame 52, a chip supporting plate 53, a moving chute 531, a chip clamping assembly 54, a clamping driving cylinder 541, a right-angle clamping block 542, a welding transfer unit 6, a first horizontal driving motor 61, a first supporting seat 62, a first horizontal driving screw rod 63, a first screw nut 64, a first horizontal guiding sliding plate 65, a first guiding column 66, a first horizontal supporting plate 67, a welding gun horizontal moving unit 7, a second horizontal driving motor 71, a welding gun welding transfer unit 71, a welding transfer unit 6, a welding transfer unit, a welding unit, the welding machine comprises a support frame 72, two horizontal guide rails II 73, a guide sliding plate II 74, a horizontal driving screw rod II 75, a screw rod nut II 76, a horizontal connecting plate II 77, a welding gun rotating unit 8, a rotating support frame 81, a rotating sliding table 82, a thrust ball bearing 83, a robot turntable 84, a welding gun 9, a robot 10 and a chip 100 to be welded.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "a plurality" means two or more unless explicitly defined otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Examples

The continuous turnover welding device for the electronic chip shown in fig. 1 and 2 comprises a fixed circular column 1, a rotary table 2, a chip pushing assembly 3, a chip conveyer belt 4, a chip welding turnover unit 5, a welding transfer unit 6, a welding gun horizontal moving unit 7, a welding gun rotating unit 8, a welding gun 9 and a robot 10, wherein a through hole is formed in the center of the rotary table 2, a group of chips to be welded is arranged on the rotary table 2 in an annular array mode, the fixed circular column 1 penetrates through the through hole in the center of the rotary table 2, the chip pushing assembly 3 is arranged on the upper end portion, penetrating through the rotary table 2, of the fixed circular column 1, the chip pushing assembly 3 can push the chips to be welded on the rotary table 2 to a chip conveyer belt 4, the chip conveyer belt 4 is obliquely arranged, the upper starting end of the chip conveyer belt 4 is positioned below the outer edge of the rotary table 2, and the lower tail end of the chip conveyer belt 4 is positioned above the chip welding turnover unit 5, the chip welding turnover unit 5 is arranged on the welding transfer unit 6, the chip welding turnover unit 5 can be clamped to weld chips to be welded, the welding transfer unit 6 can drive the chip welding turnover unit 5 to horizontally reciprocate, the welding gun rotating unit 8 is connected with the welding gun horizontally moving unit 7, the welding gun horizontally moving unit 7 can drive the welding gun 9 to horizontally move, the welding gun rotating unit 8 can drive the welding gun 9 to rotate by 360 degrees, the robot 10 is connected with the welding gun rotating unit 8, the welding gun 9 is connected with the robot 10, and the robot 10 can drive the welding gun 9 to weld chips to be welded. The chip 100 to be welded produced in the previous process can be automatically transferred to the chip welding turnover unit 5 through the turntable 2, the chip pushing assembly 3 and the chip conveyer belt 4, and the two sides of the chip 100 to be welded are turned over on the chip welding turnover unit 5, so that welding is realized. The soldering transfer unit 6 is capable of transferring the chips 100 to be soldered at the chip conveyer belt 4, the soldering position and the receiving position. The cooperation of the welding gun horizontal moving unit 7, the welding gun rotating unit 8 and the robot 10 enables the welding gun 9 to move at the welding position of the chip 100 to be welded, and welding of each point position is performed.

The chip pushing assembly 3 comprises a pushing cylinder 31 and a pushing plate 32, the pushing cylinder 31 is fixedly arranged on the upper end portion of the fixed circular column 1, the pushing plate 32 is connected with a piston rod of the pushing cylinder 31, and the pushing plate 32 is located above the turntable 2. The turntable 2 is used for receiving the chips 100 to be welded, and rotating the chips 100 to be welded one by one to a position right opposite to the inlet of the chip conveyor belt 4, so that the chip conveyor belt 4 can conveniently transfer the chips 100 to be welded subsequently.

In addition, the two sides of the chip conveying belt 4 close to the upper end of the turntable 2 are provided with arc-shaped feeding guide plates 41, the arc-shaped feeding guide plates 41 on the two sides of the chip conveying belt 4 are arranged in a shape like a Chinese character 'ba', the opening of the large end between the arc-shaped feeding guide plates 41 faces one side of the turntable 2, two sides of the conveying direction of the chip conveying belt 4 are symmetrically provided with a group of guide rollers 42, and the chips with welding pass through the guide rollers 42. The chip 100 to be welded is gradually dropped on the chip conveyor belt 4 under the pushing of the pushing plate 32, and after the chip 100 to be welded contacts the chip conveyor belt 4, the chip conveyor belt 4 can convey the chip 100 to be welded. The two arc-shaped feeding guide plates 41 arranged in a zigzag shape can smoothly guide the chips 100 to be soldered onto the chip carrier tape 4.

The die bonding flipping unit 5 shown in fig. 3 and 4 includes a flipping driving module 51, a rectangular supporting frame 52, four die supporting plates 53, and four die clamping modules 54, the flipping driving module 51 is disposed on the bonding transferring unit 6, the rectangular supporting frame 52 is connected to the flipping driving module 51, the flipping driving module 51 drives the rectangular supporting frame 52 to rotate 360 °, the four die supporting plates 53 are disposed at four corner positions of the rectangular supporting frame 52, the four die clamping modules 54 and the four die supporting plates 53 are disposed in one-to-one correspondence, and the die clamping modules 54 are disposed on the die supporting plates 53, four corners of the die to be bonded are disposed on the four die supporting plates 53, respectively, and the four die clamping modules 54 clamp four corners of the die 100 to be bonded. The turnover driving assembly 51 provides a driving force for turning over 180 degrees, and drives the rectangular supporting frame 52 to rotate 180 degrees, so that the four chip clamping assemblies 54 can be clamped to turn over, and the upper surface and the lower surface of the chip 100 to be welded can be conveniently welded.

The overturning driving assembly 51 shown in fig. 5 comprises an overturning driving motor 511, a first rotating shaft 512, a first driving wheel 513, a second driving wheel 514, a first transmission gear belt 515, a first driven wheel 516, a second driven wheel 517, a second transmission gear belt 518, a second rotating shaft 519, a third rotating shaft 5110 and an overturning supporting frame body 5111, wherein the overturning supporting frame body 5111 is connected with the welding transfer unit 6, the overturning driving motor 511, the first rotating shaft 512, the second rotating shaft 519 and the third rotating shaft 5110 are all arranged on the overturning supporting frame body 5111, the overturning driving motor 511 is connected with the first rotating shaft 512, the first driving wheel 513 and the first driven wheel 516 are respectively arranged at two ends of the first rotating shaft 512, the first driving wheel 513 and the first driven wheel 516 are symmetrically arranged, the first driving wheel 513 is connected with the second driving wheel 514 through the first transmission gear belt 515, the first driven wheel 516 is connected with the second driven wheel 517 through the second transmission gear belt 518, the first driven wheel 516 is connected with the second rotating shaft 519, the second driven wheel 517 is connected with the third rotating shaft 5110, the second rotating shaft 519 and the third rotating shaft 5110 are symmetrically arranged, and the second rotating shaft 519 and the third rotating shaft 5110 are respectively connected with two opposite sides of the rectangular supporting frame 52.

The chip clamping assembly 54 shown in fig. 6 comprises a clamping driving cylinder 541 and a right-angle clamping block 542, the clamping driving cylinder 541 is fixedly connected with the chip supporting plate 53, the right-angle clamping block 542 is connected with a piston rod of the clamping driving cylinder 541, the clamping driving cylinder 541 can drive the right-angle clamping block 542 to contact with a corner of a chip to be welded, a moving chute 531 is arranged on the chip supporting plate 53, and the right-angle clamping block 542 is slidably connected with the moving chute 531. The clamp driving cylinder 541 clamps the right-angle clamp block 542 at the right-angle position of the chip 100 to be soldered, so that the chip 100 to be soldered is stably clamped on the right-angle clamp block 542.

In the structure, the welding transfer unit 6 comprises a first horizontal driving motor 61, a first supporting seat 62, a first horizontal driving screw 63, a first group of screw nuts 64, a first horizontal guiding sliding plate 65, two first guide posts 66 symmetrically arranged and a first horizontal supporting plate 67, wherein the first horizontal driving motor 61 and the first two guide posts 66 symmetrically arranged are both arranged on the first supporting seat 62, the first horizontal driving motor 61 is connected with the first horizontal driving screw 63, the first group of screw nuts 64 are in threaded connection with the first horizontal driving screw 63, the two first guide posts 66 symmetrically arranged are respectively arranged at two sides of the first horizontal driving screw 63, the two first guide posts 66 symmetrically arranged are arranged in parallel with the first horizontal driving screw 63, the first horizontal guiding sliding plate 65 is sleeved on the first horizontal driving screw 63, and the first horizontal guiding sliding plate 65 is in sliding connection with the first guide posts 66, the first horizontal supporting plate 67 is fixedly connected with the first lead screw nut 64 and the first horizontal guide sliding plate 65, and the overturning driving assembly 51 is arranged on the first horizontal supporting plate 67.

The welding gun horizontal moving unit 7 shown in fig. 7 comprises a second horizontal driving motor 71, a support frame 72, two second horizontal guide rails 73, a second guiding sliding plate 74, a second horizontal driving screw 75, a second set of screw nuts 76 and a second horizontal connecting plate 77, wherein the second horizontal driving motor 71 and the second two horizontal guide rails 73 are both fixedly arranged on the support frame 72, the second horizontal driving motor 71 is connected with the second horizontal driving screw 75, the second horizontal driving screw 75 is arranged on the support frame 72 through a screw support seat, the second set of screw nuts 76 is in threaded connection with the second horizontal driving screw 75, the second guiding sliding plate 74 is connected with one of the second set of screw nuts 76, the second guiding sliding plate 74 is sleeved on the second horizontal driving screw 75, the second horizontal connecting plate 77 is fixedly connected with the second set of screw nuts 76 and the second guiding sliding plate 74, the welding gun rotating unit 8 is fixedly arranged on the lower end face of the second horizontal connecting plate 77, the two horizontal guide rails two 73 and the horizontal driving screw rod two 75 are arranged in parallel, the two horizontal guide rails two 73 are respectively positioned at two sides of the horizontal driving screw rod two 75, and the guide sliding plate two 74 is connected with the two horizontal guide rails two 73 in a sliding manner.

In addition, welder rotary unit 8 includes rotation support frame 81, rotatory slip table 82, thrust ball bearing 83 and robot carousel 84, rotation support frame 81 is fixed to be set up on horizontal connecting plate two 77, rotatory slip table 82 and thrust ball bearing 83 all set up on rotation support frame 81 to rotatory slip table 82 and thrust ball bearing 83 are connected, robot carousel 84 and thrust ball bearing 83 are connected, robot 10 and robot carousel 84 fixed connection.

Based on the structure, the working method of the continuous overturning welding device for the electronic chip comprises the following steps:

s1, sequentially placing the chips to be welded on the turntable 2 by the robot with the preorder station, intermittently rotating the turntable 2 within the range of 360 degrees, arranging the chips to be welded on the turntable 2 in an annular array mode, and rotating the turntable 2 when one chip to be welded is placed;

s2, when the chip to be welded placed on the turntable 2 is arranged opposite to the inlet of the starting end of the chip conveyor belt 4, the piston rod of the material pushing cylinder 31 extends out to drive the push plate 32 to move, and the push plate 32 contacts the chip to be welded arranged on the turntable 2 opposite to the inlet of the starting end of the chip conveyor belt 4, so that the chip to be welded at the position is pushed to the starting end of the chip conveyor belt 4, and the material pushing cylinder 31 resets;

s3, the chip conveyor belt 4 carries out the conveyance of the chips to be soldered so that the chips to be soldered are conveyed from the start end to the end of the chip conveyor belt 4 and the lower end portions of the chips to be soldered at the end of the chip conveyor belt 4 first fall on the four chip supporting plates 53;

s4, starting the first horizontal driving motor 61, driving the first horizontal driving screw rod 63 to rotate, so that the first screw rod nut 64 moves towards the direction far away from the chip conveying belt 4 along the horizontal direction, and driving the overturning driving assembly 51 to move along the direction far away from the chip conveying belt 4;

s5, the movement of the four chip supporting plates 53 drives the chips to be welded to move together, and the chips to be welded are gradually moved out of the chip conveying belt 4 in cooperation with the conveying of the chip conveying belt 4, and finally fall on the four chip supporting plates 53 to be horizontally arranged, and at the moment, the chips to be welded are located in the range surrounded by the four chip clamping assemblies 54;

s6, the four chip clamping assemblies 54 start simultaneously, the piston rod of the clamping driving cylinder 541 extends to push the right-angle clamping block 542 to slide along the moving chute 531, so that the right-angle clamping block 542 is pressed against the corner position of the chip to be welded, and the chip to be welded is clamped and fixed on the four chip supporting plates 53;

s7, the welding transfer unit 6 moves the chip to be welded to the welding position;

s8, starting a second horizontal driving motor 71 to drive a second horizontal driving screw rod 75 to rotate, so that a second group of screw rod nuts 76 move, and the robot 10 is moved to a welding position;

s9, the welding gun rotating unit 8 drives the robot 10 to rotate, and the welding gun 9 is matched with the self-motion of the robot 10 to weld one surface of the chip to be welded clamped on the chip welding overturning unit 5;

s10, after the upper panel of the chip to be welded on the chip welding turnover unit 5 is welded, the turnover driving motor 511 is started, the rotating shaft II 519 and the rotating shaft III 5110 are driven to synchronously rotate through the transmission of the rotating shaft I512, the driving shaft I513, the driving shaft II 514, the transmission gear belt I515, the driven wheel I516, the driven wheel II 517 and the transmission gear belt II 518, so that the turnover supporting frame body 5111 is turned over for 180 degrees, the chip to be welded is additionally supported on the turnover supporting frame body 5111, the upper panel and the lower panel of the chip to be welded are turned over, the welded upper panel is turned over to the lower side, and the lower panel to be welded is turned over to the upper side;

s11, repeating the step S9, and welding the other surface of the chip to be welded clamped on the chip welding turnover unit 5 by the welding gun 9;

s12, after all chips are welded, the first horizontal driving motor 61 is restarted to drive the first horizontal driving screw rod 63 to rotate, so that the first group of screw rod nuts 64 move towards the direction far away from the chip conveying belt 4 along the horizontal direction, and the overturning driving assembly 51 is driven to move to one end far away from the chip conveying belt 4;

s13, restarting the turnover driving motor 511, driving the second rotating shaft 519 and the third rotating shaft 5110 to synchronously rotate through the transmission of the first rotating shaft 512, the first driving wheel 513, the second driving wheel 514, the first transmission gear belt 515, the first driven wheel 516, the second driven wheel 517 and the second transmission gear belt 518, so that the turnover supporting frame body 5111 is turned over for 180 degrees, the upper panel and the lower panel of the outer wall chip to be welded are turned over, the upper panel is turned over, and the lower panel is turned over to the lower side;

s14, the four chip clamping assemblies 54 are started simultaneously, and the piston rod of the clamping driving cylinder 541 retracts to drive the right-angle clamping block 542 to slide along the moving chute 531, so that the right-angle clamping block 542 is separated from the welded chip;

s15, the material taking robot in the next process moves to a position right above the welded chips, and the material taking robot sucks away the welded chips on the four chip supporting plates 53 through the suction cups;

s16, the welding transfer unit 6 returns to the initial position, that is, the rectangular supporting frame 52 is located below the end of the chip carrier tape 4;

and S17, continuously repeating the steps S1-S16, and continuously welding the chips to be welded.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that modifications can be made by those skilled in the art without departing from the principle of the present invention, and these modifications should also be construed as the protection scope of the present invention.

Claims (10)

1. The utility model provides an electronic chip's continuous upset welding set which characterized in that: the welding device comprises a fixed circular stand column (1), a rotary table (2), a chip pushing assembly (3), a chip conveying belt (4), a chip welding overturning unit (5), a welding transferring unit (6), a welding gun horizontal moving unit (7), a welding gun rotating unit (8), a welding gun (9) and a robot (10), wherein a through hole is formed in the center of the rotary table (2), a group of chips to be welded are arranged on the rotary table (2) in an annular array mode, the fixed circular stand column (1) penetrates through the through hole in the center of the rotary table (2), the chip pushing assembly (3) is arranged on the upper end portion, penetrating through the rotary table (2), of the fixed circular stand column (1), the chip pushing assembly (3) can push the chips to be welded on the rotary table (2) to the chip conveying belt (4), the chip conveying belt (4) is arranged in an inclined mode, the upper starting end of the chip conveying belt (4) is located below the outer edge of the rotary table (2), and the lower end of the chip conveyor belt (4) is positioned above the chip welding turnover unit (5), the chip welding turnover unit (5) is arranged on the welding transfer unit (6), and the chip welding turnover unit (5) can clamp the chip to be welded, the welding transfer unit (6) can drive the chip welding turnover unit (5) to horizontally reciprocate, the welding gun rotating unit (8) is connected with the welding gun horizontal moving unit (7), the welding gun horizontal moving unit (7) can drive the welding gun (9) to move horizontally, the welding gun rotating unit (8) can drive the welding gun (9) to rotate for 360 degrees, the robot (10) is connected with the welding gun rotating unit (8), the welding gun (9) is connected with the robot (10), and the robot (10) can drive the welding gun (9) to weld the chips to be welded.

2. The apparatus for continuously flip-chip bonding of electronic chips of claim 1, wherein: the chip pushes away material subassembly (3) including pushing away material cylinder (31) and push pedal (32), push away material cylinder (31) and fix the upper end that sets up on fixed circular column (1), push pedal (32) and the piston rod that pushes away material cylinder (31) are connected to push pedal (32) are located the top of carousel (2).

3. The apparatus for continuously flip-chip bonding of electronic chips of claim 1, wherein: the both sides that chip conveyer belt (4) are close to the upper end of carousel (2) are equipped with arc feeding deflector (41), arc feeding deflector (41) of chip conveyer belt (4) both sides are "eight" font setting to main aspects opening is towards one side of carousel (2) between arc feeding deflector (41), chip conveyer belt (4) direction of delivery's both sides bisymmetry is equipped with a set of guide roller (42), take welded chip to pass between guide roller (42).

4. The apparatus for continuously flip-chip bonding of electronic chips of claim 1, wherein: the chip welding turnover unit (5) comprises a turnover driving component (51), a rectangular supporting frame (52), four chip supporting plates (53) and four chip clamping components (54), the overturning driving assembly (51) is arranged on the welding transfer unit (6), the rectangular supporting frame (52) is connected with the overturning driving assembly (51), and the overturning driving component (51) can drive the rectangular supporting frame (52) to rotate for 360 degrees, the four chip supporting plates (53) are respectively disposed at four corner positions of the rectangular supporting frame (52), the four chip clamping components (54) and the four chip supporting plates (53) are arranged in a one-to-one correspondence way, and chip holding members (54) are provided on the chip supporting plates (53), four corner portions of the chips to be soldered are provided on the four chip supporting plates (53), respectively, the four chip holding assemblies (54) can hold four corners of the chip to be soldered.

5. The apparatus for continuously flip-chip bonding of electronic chips of claim 4, wherein: the overturning driving assembly (51) comprises an overturning driving motor (511), a first rotating shaft (512), a first driving wheel (513), a second driving wheel (514), a first transmission gear belt (515), a first driven wheel (516), a second driven wheel (517), a second transmission gear belt (518), a second rotating shaft (519), a third rotating shaft (5110) and an overturning supporting frame body (5111), wherein the overturning supporting frame body (5111) is connected with the welding transfer unit (6), the overturning driving motor (511), the first rotating shaft (512), the second rotating shaft (519) and the third rotating shaft (5110) are all arranged on the overturning supporting frame body (5111), the overturning driving motor (511) is connected with the first rotating shaft (512), the first driving wheel (513) and the first driven wheel (516) are respectively arranged at two ends of the first rotating shaft (512), the first driving wheel (513) and the first driven wheel (516) are symmetrically arranged, and the first driving wheel (513) is connected with the second driving wheel (514) through the first transmission gear belt (515), the driven wheel I (516) is connected with the driven wheel II (517) through a transmission gear belt II (518), the driven wheel I (516) is connected with a rotating shaft II (519), the driven wheel II (517) is connected with a rotating shaft III (5110), the rotating shaft II (519) and the rotating shaft III (5110) are symmetrically arranged, and the rotating shaft II (519) and the rotating shaft III (5110) are respectively connected with two opposite sides of the rectangular supporting frame (52).

6. The apparatus for continuously flip-chip bonding of electronic chips of claim 5, wherein: chip centre gripping subassembly (54) are including centre gripping drive actuating cylinder (541) and right angle grip block (542), centre gripping drive actuating cylinder (541) and chip supporting plate (53) fixed connection, right angle grip block (542) and centre gripping drive actuating cylinder's (541) piston rod connection to centre gripping drive actuating cylinder (541) can drive right angle grip block (542) and wait to weld the bight of chip and contact, be equipped with on chip supporting plate (53) and remove spout (531), right angle grip block (542) and removal spout (531) sliding connection.

7. The apparatus for continuously flip-chip bonding of electronic chips of claim 1, wherein: the welding transfer unit (6) comprises a first horizontal driving motor (61), a first supporting seat (62), a first horizontal driving screw rod (63), a first group of screw nuts (64), a first horizontal guiding sliding plate (65), two symmetrically arranged guide posts (66) and a first horizontal supporting plate (67), wherein the first horizontal driving motor (61) and the two symmetrically arranged guide posts (66) are arranged on the first supporting seat (62), the first horizontal driving motor (61) is connected with the first horizontal driving screw rod (63), the first group of screw nuts (64) are in threaded connection with the first horizontal driving screw rod (63), the two symmetrically arranged guide posts (66) are respectively arranged at two sides of the first horizontal driving screw rod (63), the first two symmetrically arranged guide posts (66) are arranged in parallel with the first horizontal driving screw rod (63), the first horizontal guiding sliding plate (65) is sleeved on the first horizontal driving screw rod (63), and a first horizontal guide sliding plate (65) is slidably connected with a first guide column (66), a first horizontal support plate (67) is fixedly connected with a first lead screw nut (64) and the first horizontal guide sliding plate (65), and the overturning driving assembly (51) is arranged on the first horizontal support plate (67).

8. The apparatus for continuously flip-chip bonding of electronic chips of claim 1, wherein: the welding gun horizontal moving unit (7) comprises a second horizontal driving motor (71), a support frame (72), a second two horizontal guide rails (73), a second guiding sliding plate (74), a second horizontal driving screw rod (75), a second group of screw rod nuts (76) and a second horizontal connecting plate (77), wherein the second horizontal driving motor (71) and the second two horizontal guide rails (73) are fixedly arranged on the support frame (72), the second horizontal driving motor (71) is connected with the second horizontal driving screw rod (75), the second horizontal driving screw rod (75) is arranged on the support frame (72) through a screw rod support seat, the second group of screw rod nuts (76) is in threaded connection with the second horizontal driving screw rod (75), the second guiding sliding plate (74) is connected with one of the second group of screw rod nuts (76), and the second guiding sliding plate (74) is sleeved on the second horizontal driving screw rod (75), the welding gun rotating unit (8) is fixedly arranged on the lower end face of the horizontal connecting plate II (77), the two horizontal guide rails II (73) and the horizontal driving screw rod II (75) are arranged in parallel, the two horizontal guide rails II (73) are respectively positioned on two sides of the horizontal driving screw rod II (75), and the guide sliding plate II (74) is in sliding connection with the two horizontal guide rails II (73).

9. The apparatus for continuously flip-chip bonding of electronic chips of claim 1, wherein: welder rotary unit (8) are including rotating support frame (81), rotatory slip table (82), thrust ball bearing (83) and robot carousel (84), rotating support frame (81) is fixed to be set up on horizontal connecting plate two (77), rotatory slip table (82) and thrust ball bearing (83) all set up on rotating support frame (81) to rotatory slip table (82) and thrust ball bearing (83) are connected, robot carousel (84) and thrust ball bearing (83) are connected, robot (10) and robot carousel (84) fixed connection.

10. A working method of a continuous turnover welding device of an electronic chip is characterized in that: the method comprises the following steps:

s1, sequentially placing chips to be welded on a turntable (2) by a robot with a preorder station, intermittently rotating the turntable (2) within the range of 360 degrees, arranging the chips to be welded on the turntable (2) in an annular array mode, and rotating the turntable (2) when one chip to be welded is placed;

s2, when a chip to be welded placed on the turntable (2) is arranged opposite to the inlet of the starting end of the chip conveyor belt (4), the piston rod of the material pushing cylinder (31) extends out to drive the push plate (32) to move, the push plate (32) contacts the chip to be welded arranged on the turntable (2) and opposite to the inlet of the starting end of the chip conveyor belt (4), the chip to be welded at the position is pushed to the starting end of the chip conveyor belt (4), and the material pushing cylinder (31) resets;

s3, the chip conveyor belt (4) conveys the chips to be welded, so that the chips to be welded are conveyed from the starting end to the tail end of the chip conveyor belt (4), and the lower end parts of the chips to be welded at the tail end of the chip conveyor belt (4) fall on the four chip supporting plates (53) firstly;

s4, starting a first horizontal driving motor (61), driving a first horizontal driving screw rod (63) to rotate, and enabling a group of first screw rod nuts (64) to move along the horizontal direction to the direction far away from the chip conveying belt (4), so that the overturning driving assembly (51) is driven to move along the direction far away from the chip conveying belt (4);

s5, the movement of the four chip supporting plates (53) drives the chips to be welded to move together, the chips to be welded are enabled to gradually move out of the chip conveying belt (4) in cooperation with the conveying of the chip conveying belt (4), the chips to be welded finally fall on the four chip supporting plates (53) and are horizontally arranged, and the chips to be welded are located in the range surrounded by the four chip clamping assemblies (54);

s6, starting the four chip clamping assemblies (54) simultaneously, extending a piston rod of the clamping driving cylinder (541) to push a right-angle clamping block (542) to slide along a moving sliding groove (531), so that the right-angle clamping block (542) is pressed at the corner position of the chip to be welded, and the chip to be welded is clamped and fixed on the four chip supporting plates (53);

s7, the welding transfer unit (6) moves the chip to be welded to the welding position;

s8, starting a second horizontal driving motor (71) to drive a second horizontal driving screw rod (75) to rotate, so that a second group of screw rod nuts (76) move, and the robot (10) is moved to a welding position;

s9, the welding gun rotating unit (8) drives the robot (10) to rotate, and the welding gun (9) is matched with the robot (10) to move so that one surface of a chip to be welded, which is clamped on the chip welding overturning unit (5), is welded;

s10, after the welding of the upper panel of the chip to be welded on the chip welding turnover unit (5) is finished, a turnover driving motor (511) is started, and the rotating shaft II (519) and the rotating shaft III (5110) are driven to synchronously rotate through the transmission of the rotating shaft I (512), the driving wheel I (513), the driving wheel II (514), the transmission gear belt I (515), the driven wheel I (516), the driven wheel II (517) and the transmission gear belt II (518), so that the turnover supporting frame body (5111) is turned over by 180 degrees, and the chip to be welded is additionally supported on the turnover supporting frame body (5111), so that the upper panel and the lower panel of the chip to be welded are reversed, the welded upper panel is turned over to the lower side, and the lower panel is turned over to the upper side;

s11, repeating the step S9, and welding the other surface of the chip to be welded clamped on the chip welding turnover unit (5) by the welding gun (9);

s12, after all chips are welded, the first horizontal driving motor (61) is restarted to drive the first horizontal driving screw rod (63) to rotate, so that the first group of screw rod nuts (64) move towards the direction far away from the chip conveying belt (4) along the horizontal direction, and the overturning driving assembly (51) is driven to move to one end far away from the chip conveying belt (4);

s13, restarting the turnover driving motor (511), driving the rotating shaft II (519) and the rotating shaft III (5110) to synchronously rotate through the transmission of the rotating shaft I (512), the driving wheel I (513), the driving wheel II (514), the transmission gear belt I (515), the driven wheel I (516), the driven wheel II (517) and the transmission gear belt II (518), so that the turnover supporting frame body (5111) is turned over for 180 degrees, the upper panel and the lower panel of the outer wall chip are turned over, the upper panel is turned over, and the lower panel is turned over to the lower side;

s14, the four chip clamping assemblies (54) are started simultaneously, and a piston rod of the clamping driving cylinder (541) retracts to drive the right-angle clamping block (542) to slide along the moving sliding groove (531), so that the right-angle clamping block (542) is separated from the welded chips;

s15, moving a material taking robot in the next procedure to a position right above the welded chips, and sucking the welded chips on the four chip supporting plates (53) away by the material taking robot through a sucking disc;

s16, returning the welding transfer unit (6) to the initial position, namely, the rectangular supporting frame (52) is positioned below the tail end of the chip conveying belt (4);

and S17, continuously repeating the steps S1-S16, and continuously welding the chips to be welded.

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