CN115770979A - Chip packaging detection machine with welding spot position fine adjustment function - Google Patents
Chip packaging detection machine with welding spot position fine adjustment function Download PDFInfo
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- CN115770979A CN115770979A CN202211485248.2A CN202211485248A CN115770979A CN 115770979 A CN115770979 A CN 115770979A CN 202211485248 A CN202211485248 A CN 202211485248A CN 115770979 A CN115770979 A CN 115770979A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
A chip packaging detection machine with a welding spot position fine adjustment function belongs to the technical field of chip packaging testing, and aims to solve the problems that a traditional chip packaging detection machine is inconvenient to transport chips and enables the chips to rotate at specified welding positions under the condition of not utilizing power, so that fixed-point welding of a welding mechanism is facilitated, and the automatic chip packaging testing process under less driving force is realized; this application transports the transportation subassembly through the frame, when transporting welding mechanism one side, pushes down through the lower compression leg that the multiunit corresponds for the chip is fixed, and is transporting welding mechanism's in-process, and the transportation subassembly can take place rotatoryly, with the welded position that changes the last chip of transportation subassembly, and welding mechanism's welded structure also can finely tune, in order to reach the better welding effect to the chip.
Description
Technical Field
The invention relates to the technical field of chip packaging test, in particular to a chip packaging detection machine with a welding spot position fine adjustment function.
Background
The detection of chip package is to carry out package test on the chip to reach the aim of making the chip normally used, the package test is the last step of chip manufacture, and the package test is to cut, weld wires and plastic package the produced qualified wafer to electrically connect the chip circuit with the external device and provide mechanical physical protection for the chip.
Traditional chip package detects machine is not convenient for carry out the transportation to the chip, and does not utilize under the condition of power for the chip takes place to rotate at appointed welding position, so that welding mechanism's fixed point welding is convenient for, realizes the automatic chip package test process under less driving force, and traditional chip package detects machine's welding machine mechanism is not convenient for finely tune the solder joint position, comes to weld a plurality of solder joint positions.
In order to solve the above problems, a chip package inspection machine with a solder joint position fine-tuning function is provided.
Disclosure of Invention
The invention aims to provide a chip packaging detection machine with a welding spot position fine adjustment function, which solves the problems that the traditional chip packaging detection machine is inconvenient to transport chips and does not use power, so that the chips rotate at the specified welding positions to facilitate the fixed-point welding of a welding mechanism, the automatic chip packaging test process under less driving force is realized, and the welding mechanism of the traditional chip packaging detection machine is inconvenient to fine adjust the welding spot positions to weld a plurality of welding spot positions.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a chip package detection machine that possesses solder joint position fine-tuning function, including encapsulation test machine case and the frame of setting in encapsulation test machine incasement portion, encapsulation test machine incasement portion one end is provided with the transportation frame, and transportation frame position is in the position under the frame, frame one end position is in the encapsulation test machine incasement portion, the frame upper end slides and is provided with the transportation subassembly, and the transportation subassembly sets up the multiunit, transportation subassembly one side is provided with welding mechanism, and welding mechanism sets up four groups, the frame upper end is provided with the orbit, and the orbit sets up in encapsulation test machine incasement portion upper end, the orbit lower extreme slides and is provided with down the compression leg, and the compression leg sets up the multiunit, the structure of rotatory is set for to the lower extreme of compression leg, frame drive multiunit transportation subassembly carries, when the transportation subassembly of same group passes through welding mechanism one side of different groups, the transportation subassembly upper end all rotates, weld the different positions of the transportation subassembly of same group through welding mechanism, the welding structure of welding mechanism can be transferred, change the solder joint.
Furthermore, grooves are formed in two sides of the inner wall of the rack, strip-shaped plates are fixedly arranged in the grooves and are arranged in two groups, a conveying belt is arranged between the two groups of strip-shaped plates, and the conveying assembly is fixedly arranged on the outer side of the conveying belt.
Furthermore, the conveying assembly comprises a rotating disk and an external device which is embedded in the upper end of the rotating disk, a chip circuit is arranged at the upper end of the external device, a fixed disk is arranged at the lower end of the rotating disk, a connecting column is arranged at the lower end of the fixed disk, and the connecting column is fixedly connected with the outer side of the conveying belt.
Furthermore, a placement groove is formed in the rotating disk, an external device is embedded in the placement groove, a tooth groove is formed in the outer side of the rotating disk, an embedding strip is arranged at the lower end of the rotating disk, and the rotating disk and the fixed disk are both embedded in the gap position of the strip-shaped plate and the groove.
Furthermore, an annular groove is formed in the fixed disc, first semicircular grooves are uniformly formed in the outer side of the annular groove, four groups of first semicircular grooves are formed in the first semicircular grooves, the four groups of first semicircular grooves are all located at the quartering point of the annular groove, and the embedding strips are embedded in the annular groove.
Further, the gomphosis strip includes the strip body and sets up the fixed slot in strip body one side, and the inside gomphosis of fixed slot is provided with the semicircle piece, and semicircle piece one end is provided with coupling spring, coupling spring one end and fixed slot inner wall fixed connection, semicircle piece and first semicircle groove phase-match.
Further, the upper end position in the groove is provided with a rack, one side of the rack is provided with an inductive electrical element, the racks and the inductive electrical element are all provided with three groups, the racks are matched with the tooth grooves, and the racks and the inductive electrical element are located at the same horizontal position.
Further, welding mechanism is including sliding the L shaped strip that sets up in frame one side, and L shaped strip one end is fixed and is provided with the telescopic link, and telescopic link one end is provided with the welding subassembly, and L shaped strip one end is fixed and is provided with reciprocating strip.
Furthermore, reciprocal strip one side is provided with hollow strip, and the activity of hollow strip one side is provided with the axis of rotation, and just hollow strip and axis of rotation all slide to set up inside the frame, and axis of rotation one end is provided with fixed motor through the hub connection, and this off-axial side is provided with the fine setting subassembly.
Further, the fine setting subassembly is including setting up the rotatory piece in the axle outside, and the rotatory piece outside is provided with outside strip, and the outside strip outside is provided with solid fixed ring, and solid fixed ring is fixed to be set up inside the frame, and solid fixed ring is inside to run through to be provided with and to run through the groove, runs through the quarter department of groove half circumference and has seted up the second half slot, and the second half slot sets up four groups, and outside strip and gomphosis strip are the component that the same structure was made.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention provides a chip packaging detection machine with a welding spot position fine adjustment function, which is characterized in that a transportation assembly is transported through a rack, when the transportation assembly is transported to one side of a welding mechanism, a plurality of groups of corresponding pressing columns are pressed downwards to fix a chip, the transportation assembly rotates in the process of transporting the chip to the welding mechanism so as to change the welding position of the chip on the transportation assembly, and the welding structure of the welding mechanism can be finely adjusted.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the frame, transport assembly and welding mechanism of the present invention;
FIG. 3 is a schematic view of the transport assembly of the present invention;
FIG. 4 is a schematic view of the structure of the engagement strip of the present invention;
FIG. 5 is a schematic view of the rack and inductive electric element structure of the present invention;
FIG. 6 is a schematic view of the welding mechanism of the present invention;
FIG. 7 is a schematic view of a trimming assembly according to the present invention.
In the figure: 1. packaging the test case; 2. a frame; 21. a groove; 211. a rack; 212. an inductive electric element; 22. a strip plate; 23. a conveyor belt; 3. a transport rack; 4. a transport assembly; 41. rotating the disc; 411. a placing groove; 412. a tooth socket; 413. a tabling strip; 4131. a strip body; 4132. fixing grooves; 4133. a connecting spring; 4134. a semicircular block; 42. an external device; 43. a chip circuit; 44. fixing the disc; 441. a first semicircular groove; 442. an annular groove; 45. connecting columns; 5. running the track; 6. pressing the column; 7. a welding mechanism; 71. l-shaped strips; 72. a telescopic rod; 73. welding the assembly; 74. fixing a motor; 75. a fine adjustment component; 751. a fixing ring; 752. rotating the block; 753. a through groove; 754. a second semi-circular groove; 755. an outer lateral strip; 76. a rotating shaft; 77. a hollow bar; 78. and (6) reciprocating strips.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to solve the technical problem that the conventional chip package detecting machine is inconvenient to rotate the chip at a specified welding position in the process of transporting the chip and does not utilize power so as to facilitate fixed-point welding of a welding mechanism, so as to realize an automatic chip package testing process under less driving force, as shown in fig. 1-5, the following preferred technical solutions are provided:
a chip packaging detection machine with a welding spot position fine adjustment function comprises a packaging test machine case 1 and a machine frame 2 arranged in the packaging test machine case 1, wherein a transportation frame 3 is arranged at one end in the packaging test machine case 1, the transportation frame 3 is positioned right below the machine frame 2, one end of the machine frame 2 is positioned at the outer side of the packaging test machine case 1, transportation assemblies 4 are arranged at the upper end of the machine frame 2 in a sliding mode, a plurality of groups of transportation assemblies 4 are arranged on the transportation assemblies 4, a welding mechanism 7 is arranged on one side of each transportation assembly 4, four groups of welding mechanisms 7 are arranged on the welding mechanism 7, a running track 5 is arranged at the upper end of the machine frame 2, the running track 5 is arranged at the upper end in the packaging test machine case 1, a lower pressing column 6 is arranged at the lower end of the running track 5 in a sliding mode, a plurality of groups of pressing columns 6 are arranged on the pressing columns 6, the lowest ends of the pressing columns 6 are set to be of a rotary structure, and the machine frame 2 drives the plurality of transportation assemblies 4 to carry out conveying, when the transportation assemblies 4 of the same group pass through one side of the welding mechanisms 7 of different groups, the upper ends of the transportation assemblies 4 rotate, the welding mechanisms 7 are used for welding different positions of the transportation assemblies 4 of the same group, the welding structure of the welding mechanisms 7 can be adjusted to change welding spots, grooves 21 are formed in two sides of the inner wall of the frame 2, strip-shaped plates 22 are fixedly arranged in the grooves 21, the strip-shaped plates 22 are arranged in two groups, a transportation belt 23 is arranged between the two groups of strip-shaped plates 22, the transportation assemblies 4 are fixedly arranged outside the transportation belt 23, each transportation assembly 4 comprises a rotating disc 41 and an external device 42 which is embedded at the upper end of the rotating disc 41, a chip circuit 43 is arranged at the upper end of the external device 42, a fixed disc 44 is arranged at the lower end of the rotating disc 41, a connecting column 45 is arranged at the lower end of the fixed disc 44, the connecting column 45 is fixedly connected with the outer side of the transportation belt 23, and a placing groove 411 is formed in the rotating disc 41, the external device 42 is embedded in the placing groove 411, the tooth groove 412 is formed on the outer side of the rotating disc 41, the embedding strip 413 is arranged at the lower end of the rotating disc 41, and the rotating disc 41 and the fixed disc 44 are both embedded in the gap position between the strip-shaped plate 22 and the groove 21.
The fixed tray 44 is provided with an annular groove 442, first semicircular grooves 441 are uniformly formed in the outer side of the annular groove 442, the first semicircular grooves 441 are provided with four groups, the first semicircular grooves 441 of the four groups are all located at the quartering point position of the annular groove 442, the embedding strip 413 is embedded in the annular groove 442, the embedding strip 413 comprises a strip body 4131 and a fixing groove 4132 formed in one side of the strip body 4131, a semicircular block 4134 is embedded in the fixing groove 4132, one end of the semicircular block 4134 is provided with a connecting spring 4133, one end of the connecting spring 4133 is fixedly connected with the inner wall of the fixing groove 4132, the semicircular block 4134 is matched with the first semicircular groove 441, the upper end of the inner portion of the groove 21 is provided with a rack 211, one side of the rack 211 is provided with an inductive electric element 212, the rack 211 and the inductive electric element 212 are provided with three groups, the rack 211 is matched with the inductive electric element 412, and the rack 211 and the inductive electric element are located at the same horizontal position.
Specifically, a group of external devices 42 are embedded in a set of placing grooves 411 arranged on a group of transporting assemblies 4, chip circuits 43 are placed at the upper ends of the external devices 42, the chip circuits 43 are fixed at the upper ends of the external devices 42 by pressing down through a pressing column 6, the outer sides of the chip circuits 43 are welded through a group of welding mechanisms 7, when the group of transporting assemblies 4 are transported to the interior of the packaging and testing machine case 1, when a tooth socket 412 is transported to the position of a rack 211, the external devices 42 and the chip circuits 43 are driven to rotate by a rotating disc 41 because the tooth socket 412 is meshed with the rack 211, at the moment, an embedding strip 413 rotates in an annular groove 442, so that the embedding strip 413 moves from the interior of a group of first semicircular grooves 441 to the interior of a next group of first semicircular grooves 441, and the connecting spring 4133 will push the semicircular block 4134 to be embedded inside the first semicircular groove 441, to limit the adjusting position of the chip circuit 43, i.e. to adjust the position of the chip circuit 43 to be welded at this time, and then weld it through the nearest set of welding mechanism 7, after the transportation assembly 4 passes through the plurality of sets of racks 211, the chip circuit 43 and the external device 42 are adjusted at different positions, until the positions where the chip circuit 43 and the external device 42 can be welded, the external device 42 and the chip circuit 43 will be conveyed to be in a downward state, and at this time will be separated from the placing groove 411, fall to the upper end of the transportation frame 3, and convey it, in the whole working process, the inside of the packaging test case 1 is provided with a camera assembly, and the whole process is monitored and whether the device is wrong or not.
In order to solve the technical problem that the welding mechanism of the conventional chip package inspection machine is not convenient to finely adjust the welding point positions to perform welding action on a plurality of welding point positions, as shown in fig. 6-7, the following preferred technical solutions are provided:
the welding mechanism 7 comprises an L-shaped strip 71 arranged on one side of the rack 2 in a sliding mode, an expansion rod 72 is fixedly arranged at one end of the L-shaped strip 71, a welding component 73 is arranged at one end of the expansion rod 72, a reciprocating strip 78 is fixedly arranged at one end of the L-shaped strip 71, a hollow strip 77 is arranged on one side of the reciprocating strip 78, a rotating shaft 76 is movably arranged on one side of the hollow strip 77, the hollow strip 77 and the rotating shaft 76 are both arranged inside the rack 2 in a sliding mode, a fixed motor 74 is arranged at one end of the rotating shaft 76 through a shaft connection, a fine adjustment component 75 is arranged on the outer side of the shaft and comprises a rotating block 752 arranged on the outer side of the shaft, an outer side strip 755 is arranged on the outer side of the outer side strip 755, the fixing ring 751 is fixedly arranged inside the rack 2, a penetrating groove 753 is arranged inside the fixing ring 751 in a penetrating mode, a second semicircular groove 754 is arranged at a quarter point of the half-side circumference of the penetrating groove 753, four groups of the second semicircular grooves 754 are arranged, and the outer side strip 755 and the embedding strip 413 are members made of the same structure.
Specifically, when the tooth socket 412 rotates through the position of the rack 211, the tooth socket 412 contacts with the inductive electric element 212 for the first time, the conveyor belt 23 stops working at this time, the position of the conveyor assembly 4 is limited, the inductive electric element 212 drives the fixed motor 74 to work, and at this time, the fixed motor 74 drives the rotating shaft 76 to rotate, so that the hollow bar 77, the reciprocating bar 78 and the L-shaped bar 71 reciprocate, because the second semicircular groove 754 is not formed inside a semicircular circle penetrating through the groove 753, and the uniformly distributed second semicircular grooves 754 are formed inside the semicircular circle, that is, when the rotating shaft 76 rotates to move the reciprocating bar 78 and the L-shaped bar 71 in the forward direction, four positions are limited by the engagement of the outer side bar 755 and the second semicircular groove 754, that is four welding positions of the welding assembly 73, the welding position of the welding assembly 73 is finely adjusted at this time, so as to perform welding work on the chip circuit 43 and the external device 42, the rotating shaft 76 rotates for one circle, and when the rotating shaft 76 rotates to move the reciprocating bar 78 and the L-shaped bar 71 in the reverse direction, there is not limited by the position, until the L-shaped bar 71 is restored to make the second semicircular groove 71 suitable for manufacturing of the plurality of the second semicircular grooves 43 and the second semicircular groove, which can be more suitable for manufacturing of the external device, and the chip.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a chip package who possesses solder joint position fine-tuning detects machine, is including encapsulating test machine case (1) and setting up frame (2) inside encapsulating test machine case (1), and the inside one end of encapsulating test machine case (1) is provided with transportation frame (3), and transports frame (3) position and be in frame (2) under the position, and frame (2) one end position is in the encapsulation test machine case (1) outside, its characterized in that: frame (2) upper end slides and is provided with transportation subassembly (4), and transportation subassembly (4) set up the multiunit, transportation subassembly (4) one side is provided with welding mechanism (7), and welding mechanism (7) set up four groups, frame (2) upper end is provided with orbit (5), and orbit (5) set up in the inside upper end of encapsulation test machine case (1), orbit (5) lower extreme slides and is provided with down compression leg (6), and it sets up the multiunit to push down column (6), it sets for rotatory structure to push down column (6) lower extreme, frame (2) drive multiunit transportation subassembly (4) are carried, when same group's transportation subassembly (4) process welding mechanism (7) one side of different groups, transportation subassembly (4) upper end all rotates, weld the different positions of same group's transportation subassembly (4) through welding mechanism (7), the welding structure of welding mechanism (7) can be transferred, change the solder joint.
2. The chip packaging detection machine with the function of fine adjustment of the position of the welding spot according to claim 1, characterized in that: frame (2) inner wall both sides are seted up recess (21), and recess (21) inside is fixed and is provided with strip shaped plate (22), and strip shaped plate (22) set up two sets ofly, two sets of strip shaped plate (22) between be provided with transportation area (23), transportation subassembly (4) are fixed to be set up in the transportation area (23) outside.
3. The chip packaging detection machine with the function of fine adjustment of the position of the welding spot according to claim 1, characterized in that: the conveying assembly (4) comprises a rotating disc (41) and an external device (42) which is embedded at the upper end of the rotating disc (41), a chip circuit (43) is arranged at the upper end of the external device (42), a fixed disc (44) is arranged at the lower end of the rotating disc (41), a connecting column (45) is arranged at the lower end of the fixed disc (44), and the connecting column (45) is fixedly connected with the outer side of the conveying belt (23).
4. The chip packaging detection machine with the function of fine adjustment of the position of the welding spot according to claim 3, characterized in that: a placing groove (411) is formed in the rotating disc (41), an external device (42) is embedded in the placing groove (411), a tooth groove (412) is formed in the outer side of the rotating disc (41), an embedding strip (413) is arranged at the lower end of the rotating disc (41), and the rotating disc (41) and the fixed disc (44) are embedded in the gap positions of the strip-shaped plate (22) and the groove (21).
5. The chip packaging detection machine with the function of fine adjustment of the position of the welding spot according to claim 4, characterized in that: the fixed disc (44) is internally provided with annular grooves (442), the outer side of each annular groove (442) is uniformly provided with first semicircular grooves (441), the four groups of first semicircular grooves (441) are arranged, the four groups of first semicircular grooves (441) are all positioned at the four-division point position of the annular grooves (442), and the embedding strips (413) are embedded in the annular grooves (442).
6. The chip packaging detection machine with the function of fine adjustment of the position of the welding spot according to claim 5, characterized in that: the embedded bar (413) comprises a bar body (4131) and a fixing groove (4132) formed in one side of the bar body (4131), a semicircular block (4134) is embedded inside the fixing groove (4132), a connecting spring (4133) is arranged at one end of the semicircular block (4134), one end of the connecting spring (4133) is fixedly connected with the inner wall of the fixing groove (4132), and the semicircular block (4134) is matched with the first semicircular groove (441).
7. The chip packaging detection machine with the function of fine adjustment of the position of the welding spot according to claim 4, characterized in that: a rack (211) is arranged at the upper end of the inside of the groove (21), an inductive electric element (212) is arranged on one side of the rack (211), three groups of racks (211) and inductive electric elements (212) are arranged, the racks (211) are matched with the tooth grooves (412), and the racks (211) and the tooth grooves (412) are located on the same horizontal position.
8. The chip packaging detection machine with the function of fine-tuning the position of the welding spot according to claim 7, characterized in that: the welding mechanism (7) comprises an L-shaped strip (71) which is arranged on one side of the rack (2) in a sliding mode, an expansion rod (72) is fixedly arranged at one end of the L-shaped strip (71), a welding assembly (73) is arranged at one end of the expansion rod (72), and a reciprocating strip (78) is fixedly arranged at one end of the L-shaped strip (71).
9. The chip packaging detection machine with the function of fine-tuning the position of the welding spot according to claim 8, characterized in that: reciprocating strip (78) one side is provided with cavity strip (77), and cavity strip (77) one side activity is provided with axis of rotation (76), and cavity strip (77) and axis of rotation (76) all slide to be set up inside frame (2), and axis of rotation (76) one end is provided with fixed motor (74) through the hub connection, and this off-axial side is provided with fine setting subassembly (75).
10. The chip packaging detection machine with the function of fine-tuning the solder joint position according to claim 9, wherein: fine setting subassembly (75) is including setting up rotatory piece (752) in the axle outside, rotatory piece (752) outside is provided with outside strip (755), outside strip (755) outside is provided with solid fixed ring (751), and solid fixed ring (751) is fixed to be set up inside frame (2), gu fixed ring (751) inside runs through and is provided with and runs through groove (753), run through groove (753) quarter point department of half side circumference and seted up second half slot (754), second half slot (754) set up four groups, outside strip (755) and gomphosis strip (413) are the component that the looks isostructure was made.
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| CN202211485248.2A CN115770979B (en) | 2022-11-24 | 2022-11-24 | Chip packaging detector with welding spot position fine adjustment function |
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| CN202211485248.2A CN115770979B (en) | 2022-11-24 | 2022-11-24 | Chip packaging detector with welding spot position fine adjustment function |
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