CN210208984U

CN210208984U - Feeding mechanism

Info

Publication number: CN210208984U
Application number: CN201920879677.5U
Authority: CN
Inventors: Xinhong Li; 李新宏; Huaiyu Sheng; 盛怀宇; Xifu Xia; 夏熙富
Original assignee: Dongguan Ali Automation Co Ltd
Current assignee: Dongguan Ali Automation Co Ltd
Priority date: 2019-06-12
Filing date: 2019-06-12
Publication date: 2020-03-31
Anticipated expiration: 2029-06-12

Abstract

The utility model discloses a feeding mechanism, which comprises a first feeding device and a second feeding device and is applied to a diode welding separator, wherein the diode welding separator comprises a welding system and a separation system, and the welding system is connected with the separation system through a flat plate; the welding system comprises a material conveying device, a first CCD (charge coupled device) detection device, a turntable device, a probe detection device, a screening device, a belt transmission device, a laser welding device and a quality testing device; and a sponge sucking disc is arranged at the bottom of the second feeding device. The embodiment of the utility model provides a pair of feed mechanism sets up the sponge sucking disc in second loading attachment's bottom, and every sponge sucking disc can directly absorb the positive central point position of diode, realizes a sponge sucking disc and absorbs a diode, and is applicable in different length dimension's diode transfer.

Description

Feeding mechanism

Technical Field

The utility model belongs to the technical field of the diode welding, especially, relate to a feed mechanism.

Background

In the production of photovoltaic panels, one of the processes is the soldering of diodes to the photovoltaic panel.

During the soldering process, the loading of the diode is involved. The feeding process comprises the following steps: the diode is transferred to the rotary table from the material conveying device and transferred to the substrate from the rotary table. The feeding mechanism comprises a first feeding device for first transfer and a second feeding device for second transfer.

Because the quantity of the diode that needs the welding on the base plate is more, when containing the diode of different length size, second loading attachment need satisfy and can absorb the diode of different length.

The second feeding device provided in the prior art usually adopts two common suckers corresponding to one diode to adapt to diodes with different lengths. Therefore, the distance between the two common suckers needs to be adjusted every time the diode with different lengths is sucked, the feeding speed of the diode is reduced, and the welding efficiency of the diode is further reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a feed mechanism to solve above technical problem.

To achieve the purpose, the utility model adopts the following technical proposal:

a feeding mechanism comprises a first feeding device and a second feeding device and is applied to a diode welding sorting machine, wherein the diode welding sorting machine comprises a welding system and a sorting system, and the welding system is connected with the sorting system through a flat plate;

the welding system comprises a material conveying device, a first CCD (charge coupled device) detection device, the first feeding device, a turntable device, a probe detection device, a screening device, the second feeding device, a belt transmission device, a laser welding device and a quality testing device;

and a sponge sucking disc is arranged at the bottom of the second feeding device.

Optionally, a common suction cup is arranged at the bottom of the first feeding device.

Optionally, a sponge sucker is arranged at the bottom of the first feeding device.

Optionally, the flat plate is provided with steel balls.

Optionally, the screening device comprises a discharging manipulator and a diode recycling box, and two common suckers are arranged at the bottom of the discharging manipulator.

Optionally, the screening device comprises a discharging manipulator and a diode recycling box, and a sponge sucker is arranged at the bottom of the discharging manipulator.

Compared with the prior art, the embodiment of the utility model provides a following beneficial effect has:

the embodiment of the utility model provides a pair of feed mechanism sets up the sponge sucking disc in second loading attachment's bottom, and every sponge sucking disc can directly absorb the positive central point position of diode, realizes a sponge sucking disc and absorbs a diode, and is applicable in different length dimension's diode transfer.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.

Fig. 1 is a structural diagram of a diode soldering sorter according to the present embodiment.

Fig. 2 is a structural diagram of a welding system according to the present embodiment.

Fig. 3 is a structural diagram of a material conveying device according to this embodiment.

Fig. 4 is a structural diagram of the first CCD detecting device provided in this embodiment.

Fig. 5 is a structural diagram of the first feeding device provided in this embodiment.

Fig. 6 is a partially enlarged view of a in fig. 5.

Fig. 7 is a structural diagram of the turntable device provided in this embodiment.

Fig. 8 is a structural diagram of the probe detection apparatus according to the present embodiment.

Fig. 9 is a structural view of the screening apparatus according to the present embodiment.

Fig. 10 is a partial enlarged view of B in fig. 9.

Fig. 11 is a structural diagram of a second feeding device provided in this embodiment.

Fig. 12 is a partial enlarged view of C in fig. 11.

Fig. 13 is a structural view of the belt conveying apparatus provided in this embodiment.

Fig. 14 is a structural view of the adsorption assembly provided in this embodiment.

Fig. 15 is a partial enlarged view of D in fig. 14.

Fig. 16 is a structural diagram of a laser welding apparatus according to the present embodiment.

Fig. 17 is a structural diagram of the quality testing apparatus according to the present embodiment.

Fig. 18 is a structural view of the sorting system provided in the present embodiment.

Fig. 19 is a structural view of the sorting apparatus according to the present embodiment.

Fig. 20 is a structural diagram of a dual-mode group structure and a dual-servo motor structure provided in this embodiment.

Illustration of the drawings:

welding system 100, sorting system 200, flat panel 300;

the device comprises a material conveying device 101, a first CCD detection device 102, a light source 1021 and a CCD camera 1022;

a first feeding device 103, a common suction cup 1031;

a turntable device 104, a probe detection device 105, an electrical detection probe 1051;

the screening device 106, the blanking manipulator 1061 and the diode recovery box 1062;

a second feeding device 107, a sponge sucker 1071;

the belt conveying device 108, the adsorption component 1081, the upper support plate 1082, the lower support plate 1083 and the magnet 1084;

a laser welding device 109 and a quality testing device 110;

the device comprises a fixed frame 201, a sorting device 202, a dual-module structure 203, a dual-servo motor structure 204, a moving frame 205, a first module 206, a second module 207, a first servo motor 208, a second servo motor 209 and a substrate chuck 210.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1 and 2, the present embodiment provides a diode welding sorter, which includes a welding system 100 and a sorting system 200.

The welding system 100 is connected with the sorting system 200 through the flat plate 300, steel balls are arranged on the flat plate 300, substrates welded with diodes can be conveniently transmitted to the sorting system 200 from the welding system 100, and stable transfer of the substrates is achieved.

The welding system 100 comprises a material conveying device 101, a first CCD (charge coupled device) detecting device 102, a first feeding device 103, a turntable device 104, a probe detecting device 105, a screening device 106, a second feeding device 107, a belt conveying device 108, a laser welding device 109 and a quality testing device 110.

Wherein, the feeding device 101, the first CCD detecting device 102, the first feeding device 103, the turntable device 104, the probe detecting device 105, the screening device 106 and the second feeding device 107 are respectively provided with two sets.

Two sets of the turntable devices 104 are respectively located at two sides of the laser welding device 109.

The two sets of turntable devices 104 can transfer the diodes from both sides to the substrate simultaneously, which speeds up the production efficiency.

Referring to fig. 3 to 6, the feeding device 101 is used for transporting diodes, and when the diodes need to be loaded onto the turntable device 104, the first CCD detecting device 102 is used for assisting in determining whether the diodes reach the material loading position, and then the first feeding device 103 picks up the diodes and places the diodes on the turntable device 104.

The first CCD detecting device 102 includes two light sources 1021 and a CCD camera 1022.

Two light sources 1021 illuminate the output end of the feeding device 101, and a CCD camera 1022 detects whether there is a diode on the output end.

Further, the bottom of the first feeding device 103 is provided with a common suction cup 1031 for picking up the diode from the output terminal and placing the diode on the turntable device 104. The first feeding device 103 can drive the common suction cup 1031 to move along three axes X, Y, Z.

Specifically, every two common suction cups 1031 are used to suck one diode.

In order to prevent the diode from being damaged by the general suction cups 1031, the general suction cups 1031 cannot be attached to the exact center of the diode, but only to the sides of the diode, so that the two general suction cups 1031 are required to stably and balancedly transfer the diode.

Referring to fig. 7, after the diodes are transferred to the turntable device 104, the turntable device 104 drives the diodes thereon to rotate, so as to implement the next process.

Referring to fig. 8, specifically, when the diode rotates to a position below the probe detection device 105, the electrical detection is started. Specifically, the probe detection device 105 detects the conductivity of the diode, thereby determining whether the diode is good or not.

The probe detection device 105 includes an electrical detection probe 1051, and the electrical detection probe 1051 can move up and down.

Referring to fig. 9, the screening device 106 includes a feeding robot 1061 and a diode recycling bin 1062. When the probe inspection apparatus 105 detects that the conduction performance of the diode is poor, the diode is transferred to the diode recovery box 1062 by the feeding robot 1061.

Referring to fig. 10, two general suction cups 1031 are disposed at the bottom of the discharging manipulator 1061, and are consistent with the first feeding device 103, and the discharging manipulator 1061 is also used for transferring one diode for every two general suction cups 1031.

Referring to fig. 11, after the testing by the probe testing device 105 and the screening by the screening device 106, the diodes on the turntable device 104 are transferred to the substrate by the second loading device 107.

Specifically, a sponge suction cup 1071 is arranged at the bottom of the second feeding device 107, and the diode is transferred through the sponge suction cup 1071.

Referring to fig. 12, compared with the common suction cup 1031, the sponge suction cup 1071 can be directly attached to the center of the diode, and each diode only needs one sponge suction cup 1071. Therefore, when the length of the diode is different, the distance between the two general suction cups 1031 needs to be adjusted to be suitable, and the sponge suction cups 1071 can be compatible with diodes with different lengths.

Referring to fig. 13 to 16, the substrate is transported to the lower side of the laser welding apparatus 109 by the belt transport apparatus 108, and then stops, and waits for the diode to be welded.

Specifically, the belt conveying device 108 includes a conveying belt and a conveying motor, and the conveying motor drives the conveying belt to roll, so as to convey the substrate on the conveying belt.

An adsorption component 1081 is further disposed below the conveyor belt, and the adsorption component 1081 includes an upper support plate 1082, a lower support plate 1083, and a magnet 1084 therebetween.

Referring to fig. 14 and 15, the magnets 1084 are evenly spaced on the lower support plate 1083.

Wherein, go up backup pad 1082 and be used for supporting the conveyer belt, magnet 1084 separates last backup pad 1082 and conveyer belt and produces the adsorption to the base plate above that for the base plate falls on the conveyer belt all the time, and does not produce jolting, with the assurance base plate can not produce the displacement deviation.

Thus, the substrate needs to include magnetic material to enable the magnet 1084 to function. In this embodiment, the substrate is a photovoltaic panel containing a magnetic material.

Further, before diode welding, it is necessary to fix the diode and then start the laser welding apparatus 109.

Referring to fig. 16, the substrate is located below the laser welding device 109.

When laser welding is completed, the belt conveyor 108 is restarted to transfer the welded substrate to the sorting system 200.

Referring to fig. 17, before the substrate is transferred, a performance test, i.e., a soldering quality test, is performed on the soldered substrate. In the performance testing step, the performance testing is performed by the quality testing apparatus 110.

Referring to fig. 18, the sorting system 200 includes a fixing frame 201 and a sorting device 202.

Specifically, the sorting device 202 is fixed to the fixing frame 201, and the sorting device 202 transfers the substrates to both sides of the fixing frame 201 according to the lengths of the substrates.

When the length of the substrate is equal to or greater than a preset length, the substrate is transferred to a long substrate collection cassette. When the length of the substrate is less than the preset length, the substrate is transferred to the short substrate collection box.

In this embodiment, the preset length is equal to 2 meters.

Referring to fig. 19 and 20, the sorting apparatus 202 includes a dual module structure 203, a dual servo motor structure 204, and a moving frame 205.

Dual-mode set structure 203 includes a first module 206 and a second module 207. The dual servomotor configuration 204 includes a first servomotor 208 and a second servomotor 209.

The two ends of the movable frame 205 are slidably connected to the first module 206 and the second module 207, respectively.

A first servomotor 208 and a second servomotor 209 are respectively mounted on the moving frame 205.

The bottoms of the first servo motor 208 and the second servo motor 209 are respectively provided with a plurality of substrate suction cups 210 for grabbing substrates.

After the substrate is transferred from the bonding system 100, the moving gantry 205 slides over the substrate on the dual module. The first servo 208 and the second servo 209 work simultaneously, and according to the length and position of the substrate, the magnet 1084 under the substrate moves down to eliminate the magnetic force, and the corresponding substrate chuck 210 opens the vacuum switch to suck the substrate to move to the corresponding position.

And finally, placing the substrate in a long substrate collecting box or a short substrate collecting box according to the length of the substrate.

In summary, the diode welding sorter provided in the present application includes a welding system 100 and a sorting system 200, and a substrate is smoothly transferred between the welding system 100 and the sorting system 200 through a flat plate 300 provided with steel balls. The feeding device 101, the first CCD detecting device 102, the first feeding device 103, the turntable device 104, the probe detecting device 105, the screening device 106 and the second feeding device 107 are respectively provided with two sets, so that the feeding speed of the diode is increased, and the production efficiency is improved. In the welding system 100, the second feeding device 107 uses a sponge sucker 1071, which is suitable for grabbing diodes with different lengths; the suction unit 1081 is disposed under the conveyor belt, so that the substrate can be firmly sucked to the surface of the conveyor belt without generating bumpiness. In the sorting system 200, the substrate is sorted by the dual-module structure 203 and the dual-servo motor structure 204, and the structure is simple and practical.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. A feeding mechanism comprises a first feeding device and a second feeding device and is applied to a diode welding sorting machine, and is characterized in that the diode welding sorting machine comprises a welding system and a sorting system, and the welding system is connected with the sorting system through a flat plate;

2. A loading mechanism according to claim 1, wherein the bottom of said first loading device is provided with a common suction cup.

3. The feeding mechanism as claimed in claim 1, wherein a sponge suction cup is arranged at the bottom of the first feeding device.

4. A loading mechanism as claimed in claim 1, wherein said plate is provided with steel balls.

5. The feeding mechanism as claimed in claim 1, wherein the screening device comprises a feeding manipulator and a diode recycling bin, and two common suckers are arranged at the bottom of the feeding manipulator.

6. The feeding mechanism as claimed in claim 5, wherein the screening device comprises a feeding manipulator and a diode recycling bin, and a sponge sucker is arranged at the bottom of the feeding manipulator.