CN116093203A - IBC (insulated Gate less) battery assembly and manufacturing method thereof - Google Patents
IBC (insulated Gate less) battery assembly and manufacturing method thereof Download PDFInfo
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- CN116093203A CN116093203A CN202310087138.9A CN202310087138A CN116093203A CN 116093203 A CN116093203 A CN 116093203A CN 202310087138 A CN202310087138 A CN 202310087138A CN 116093203 A CN116093203 A CN 116093203A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000003466 welding Methods 0.000 claims abstract description 79
- 229910000679 solder Inorganic materials 0.000 claims abstract description 61
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 17
- 238000003475 lamination Methods 0.000 claims description 5
- 238000011179 visual inspection Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 14
- 230000000712 assembly Effects 0.000 abstract description 2
- 238000000429 assembly Methods 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
The invention relates to the technical field of photovoltaic cell assemblies, and particularly discloses an IBC (insulated gate bipolar transistor) main-grid-free battery assembly and a manufacturing method thereof. The manufacturing method of the IBC battery component without the main grid comprises the following steps: providing a group of a plurality of IBC non-main-grid battery pieces which are arranged in sequence and are upward in back face; solder paste bonding pads are respectively arranged on each solder strip arrangement path on the back of each IBC non-main grid battery piece; placing a plurality of welding strips with preset lengths on each IBC non-main-grid battery piece along a welding strip arrangement path, and pressing and holding the positions of the welding strips which are opposite to each solder paste bonding pad so as to pre-fix each welding strip on the corresponding IBC non-main-grid battery piece; welding each welding strip and each corresponding solder paste welding disc to form a battery string; the battery strings were laminated to produce IBC no-main-grid battery packs. The IBC battery component without the main grid and the manufacturing method thereof can reduce the manufacturing cost and solve the problem that glue dispensing in the prior art has negative influence on battery pieces.
Description
Technical Field
The invention relates to the technical field of photovoltaic cell assemblies, in particular to an IBC (insulated gate bipolar transistor) main-grid-free battery assembly and a manufacturing method thereof.
Background
The conventional battery piece is provided with a main grid line, an auxiliary grid line and a bonding pad, wherein the main grid line and the bonding pad are made of silver paste. The IBC battery piece has no main grid line and no bonding pad, and only has auxiliary grid lines, so that silver paste is not required, and the cost is reduced. Although IBC cells without primary grids have no primary grid lines, in order to conduct current between the cells to form a battery string, a solder strip is typically placed on the cells to replace the function of the primary grid lines on the cells. How to effectively fix the solder tape to the battery sheet and perform the packaging operation by using the laminator is a subject of continuous study by those skilled in the art.
In the prior art, the common manufacturing methods of the battery assembly include the following steps:
firstly, a plurality of glue points (2 or more) are firstly arranged at the blank positions of adjacent secondary grid lines on a battery piece without a main grid, and the glue adopts conductive glue or non-conductive glue; then placing the welding strip on the glue point, bonding the welding strip through the viscosity of glue, and connecting the welding strip with the battery piece after the glue is solidified; the battery sheet is then moved into a lamination apparatus to complete the low temperature welding.
The second is to spot a plurality of glue points (2 or more) on the welding strip, then place the welding strip at the blank of the adjacent secondary grid line on the battery piece without the main grid, stick the welding strip through the viscosity of glue, after the glue is solidified, the welding strip is connected with the battery piece, and then move the battery piece into the laminating device to finish the low-temperature welding.
And thirdly, arranging a plurality of silver paste bonding PADs (or PAD points) on the back surface of the IBC non-main-grid battery piece, and bonding and curing the bonding tape and the bonding PAD of the battery piece through high-temperature welding, so as to fix the bonding tape and the battery piece.
However, in the former two manufacturing methods, when the conductive adhesive is used, the cost is high; when the non-conductive adhesive is used, the bonding position of the welding strip and the battery piece has negative influence on the battery piece. In the third manufacturing method, in order to ensure the reliability of soldering, the PAD spot or PAD is usually larger in size, so that the silver paste is lost greatly, and thus, there is still a large room for improvement in cost.
Disclosure of Invention
The invention aims to provide an IBC (insulated gate bipolar transistor) battery assembly without a main grid and a manufacturing method thereof, which can reduce manufacturing cost and solve the problem that glue dispensing in the prior art has negative influence on battery pieces.
To achieve the purpose, the invention adopts the following technical scheme:
the manufacturing method of the IBC battery component without the main grid comprises the following steps:
s1: providing a group of a plurality of IBC non-main-grid battery pieces which are arranged in sequence and are upward in back face;
s2: solder paste bonding pads are respectively arranged on each solder strip arrangement path on the back of each IBC non-main grid battery piece;
s3: placing a plurality of welding strips with preset lengths on each IBC non-main-grid battery piece along a welding strip arrangement path, and pressing and holding the positions of the welding strips which are opposite to each solder paste bonding pad so as to pre-fix each welding strip on the corresponding IBC non-main-grid battery piece;
s4: welding each welding strip and each corresponding solder paste welding disc to form a battery string;
s5: the battery strings were laminated to produce IBC no-main-grid battery packs.
In the preferred embodiment of the present invention, in the step S1, the placement position of each IBC cell without main grid meets the technological requirement of forming the IBC cell string without main grid.
In the preferred embodiment of the present invention, in S2, at least two solder pads are disposed at intervals on each solder strip arrangement path by using a method of printing solder paste or spot solder paste.
In the preferred embodiment of the present invention, in S2, before and after the solder paste pads are provided, visual inspection is performed on each IBC cell without main grid.
In the preferred embodiment of the present invention, in S3, the tape pulling and tape manufacturing operations are performed on the plurality of rolled solder tapes, so as to obtain a plurality of solder tapes with preset lengths.
In the preferred embodiment of the present invention, in S4, the welding is performed by a point-to-point high-speed scanning welding method or a DOE lattice type whole-piece projection welding method.
In S5, the EVA film is preferably coated in the tape direction before the lamination of the battery string, so that each tape is coated in a multi-stage or full-scale manner.
The invention also provides an IBC battery component without the main grid, which is manufactured by adopting the manufacturing method.
The beneficial effects of the invention are as follows: according to the IBC non-main-grid battery assembly and the manufacturing method thereof, the solder paste or the spot solder paste is printed, the solder paste pads are arranged on each solder strip arrangement path on the back surface of the IBC non-main-grid battery piece, and the solder strips are tightly and firmly fixed on the IBC non-main-grid battery piece through the solder paste pads, so that the manufacturing cost is low, and the problem that the spot adhesive has negative influence on the battery piece in the prior art is solved.
Drawings
Fig. 1 is a block flow diagram of a method for manufacturing an IBC no-main-grid battery assembly according to the present invention.
Fig. 2 is a schematic structural diagram of a plurality of IBC non-main grid battery stacks in S1 in fig. 1 arranged on a printing platform in sequence.
Fig. 3 is a schematic structural diagram of each IBC no-main-gate battery piece in S2 in fig. 1 after a solder paste pad is disposed on the battery piece.
Fig. 4 is a schematic structural diagram of each solder strip pre-fixed on a corresponding IBC non-main grid battery cell in S3 in fig. 1.
Detailed Description
As shown in fig. 1, a method for manufacturing an IBC battery assembly without a main grid includes the following steps:
s1: a plurality of IBC non-main grid battery pieces which are arranged in sequence and are upward in back face are provided.
S2: and solder paste pads are respectively arranged on each solder strip arrangement path on the back surface of each IBC non-main grid battery piece.
S3: and respectively placing a plurality of welding strips with preset lengths on each IBC non-main-grid battery piece along a welding strip arrangement path, and pressing and holding the positions of the welding strips which are opposite to each solder paste bonding pad, so that each welding strip is pre-fixed on the corresponding IBC non-main-grid battery piece.
S4: and welding each welding strip and each corresponding solder paste welding disc to form a battery string.
S5: the battery strings were laminated to produce IBC no-main-grid battery packs.
Further, in the above step S1, the placement position of each IBC non-main-grid battery piece meets the technological requirement of forming the IBC non-main-grid battery string. In the step S2, at least two solder paste pads are arranged on each solder strip arrangement path at intervals by adopting a solder paste printing or solder paste dispensing mode; before and after setting up the solder paste pad, carry out visual inspection to each IBC no main grid battery piece to ensure that the solder paste pad accurately sets up in the preset position of IBC no main grid battery piece. In the step S3, the plurality of rolled welding strips are subjected to the operations of drawing and making the strips, so as to obtain a plurality of welding strips with preset lengths. In the step S4, the welding is performed by a point-to-point high-speed scanning welding method or a DOE lattice type whole-piece projection welding method. In S5, before the lamination operation is performed on the battery string, the EVA film is covered in the tape direction so as to cover each tape in a multi-stage or full-coverage manner.
The invention also provides an IBC battery component without the main grid, which is manufactured by adopting the manufacturing method.
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
Example 1
The manufacturing method of the IBC battery component without the main grid comprises the following steps:
s1: a plurality of IBC cells without main grid with back up are arranged in sequence on the printing platform 1 as shown in fig. 2.
S2: visual detection is carried out on the positions of the IBC non-main grid battery pieces 2 positioned on the printing platform 1; after the detection is qualified, three solder paste pads 3 are respectively arranged on each solder strip arrangement path on the back surface of each IBC non-main grid battery piece 2 at intervals in a solder paste printing mode, as shown in fig. 3; visual detection is carried out on the position, shape and external dimension of each solder paste bonding pad 3 on the IBC non-main-grid battery piece 2; and after the detection is qualified, all the IBC non-main grid battery pieces 2 on the printing platform 1 are jointly moved to the belt manufacturing platform 4. All the IBC non-main grid battery pieces 2 are required to be provided with a plurality of main grid lines by using a plurality of welding strips, so that the number of corresponding solder paste welding pads 3 is large; the most optimal working time is to form the solder pads 3 by printing the solder paste.
S3: carrying out a drawing operation and a tape manufacturing operation on a plurality of coiled welding tapes to obtain a plurality of welding tapes 5 with preset lengths; placing each welding strip 5 on each IBC non-main grid battery piece 2 positioned on the strip manufacturing platform 4 along a welding strip arrangement path, and pressing and holding each welding strip position opposite to each solder paste welding plate 3 so that each welding strip 5 is pre-fixed on the corresponding IBC non-main grid battery piece 2, as shown in fig. 4; the welding strips 5 comprise a plurality of positive electrode welding strips 51 and a plurality of negative electrode welding strips 52 which are alternately staggered.
S4: and (3) jointly moving each IBC cell 2 with the pre-fixed welding strips 5 on the strip manufacturing platform 4 to the welding platform, and pre-welding each welding strip 5 and each corresponding solder paste bonding pad 3 by adopting a DOE lattice type whole-piece projection welding mode, so as to form a cell string. Furthermore, the DOE lattice type whole-piece projection welding mode adopts a DOE optical slide provided with diffraction patterns, wherein the diffraction patterns are in a regular lattice shape and correspond to the bonding pad arrangement patterns on the battery piece; during welding, the whole surface pattern is projected onto the battery piece, so that high-speed, accurate and effective welding between the welding strip and the battery piece is realized. In the case where there are many welding points, it is preferable to use a DOE lattice type whole-piece projection welding method.
S5: covering EVA films along the welding strip direction of the battery strings to enable each welding strip 5 to be subjected to multi-section or full-coverage film covering; and (3) placing the battery string with the film coating in a laminating machine, and carrying out vacuumizing, heating and laminating treatment, so that the battery string is packaged and manufactured into the IBC non-main-grid battery assembly. The EVA coating treatment is performed first, and the welding belt 5 can be further fixed, so that the welding quality of the IBC non-main-grid battery assembly can be improved. After the battery string is subjected to lamination treatment, the lower surface of the welding strip 5 is in close contact or alloy connection with the secondary grid line of the IBC non-main grid battery piece 2, so that the IBC non-main grid battery piece 2 is connected with the welding strip 5 more stably, current derivation of the battery string is facilitated, and structural stability of the IBC non-main grid battery assembly is improved.
The glue points are insulators, so that the glue points of the existing battery piece without the main grid can not be placed on the auxiliary grid lines and can only be arranged in gaps between the adjacent auxiliary grid lines, and the current conduction is not facilitated. In the embodiment 1, the solder paste bonding pad 3 is arranged on the secondary grid line of the IBC battery piece 2 without the main grid, and the solder strip 5 is welded and connected with the battery piece 2 without the main grid through the solder paste bonding pad 3, so that the current is conductive, and the problem that the adhesive tape in the prior art has negative influence on the battery piece is solved.
In the embodiment, the solder paste bonding pad 3 is adopted to replace the silver paste bonding pad, so that the product cost is saved.
Example 2
An IBC cell module without a main grid was fabricated by the fabrication method of example 1.
The technical principle of the present invention is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the invention and should not be taken in any way as limiting the scope of the invention. Other embodiments of the invention will be apparent to those skilled in the art from consideration of this specification without undue burden.
Claims (8)
1. The manufacturing method of the IBC battery component without the main grid is characterized by comprising the following steps of:
s1: providing a group of a plurality of IBC non-main-grid battery pieces which are arranged in sequence and are upward in back face;
s2: solder paste bonding pads are respectively arranged on each solder strip arrangement path on the back of each IBC non-main grid battery piece;
s3: placing a plurality of welding strips with preset lengths on each IBC non-main-grid battery piece along a welding strip arrangement path, and pressing and holding the positions of the welding strips which are opposite to each solder paste bonding pad so as to pre-fix each welding strip on the corresponding IBC non-main-grid battery piece;
s4: welding each welding strip and each corresponding solder paste welding disc to form a battery string;
s5: the battery strings were laminated to produce IBC no-main-grid battery packs.
2. The method for manufacturing an IBC no-main-grid battery assembly according to claim 1, wherein in S1, the placement position of each IBC no-main-grid battery sheet meets the technological requirements of forming an IBC no-main-grid battery string.
3. The method for manufacturing an IBC no-main-grid battery assembly according to claim 1, wherein in S2, at least two solder paste pads are disposed at intervals on each solder tape arrangement path by printing solder paste or spot solder paste.
4. The method for manufacturing an IBC no-main-grid battery assembly according to claim 1, wherein in S2, before and after the solder paste pads are disposed, visual inspection is performed on each IBC no-main-grid battery piece.
5. The method for manufacturing an IBC battery module without a main grid according to claim 1, wherein in S3, the tape pulling and tape manufacturing operations are performed on a plurality of rolled solder tapes, so as to obtain a plurality of solder tapes with preset lengths.
6. The method for manufacturing an IBC cell module without main grid according to claim 1, wherein in S4, the welding is performed by using a point-to-point high-speed scanning welding method or a DOE lattice type integral projection welding method.
7. The method according to claim 1, wherein in S5, before the lamination operation is performed on the battery strings, the EVA film is covered along the solder strip direction, so as to perform multi-stage or full-coverage film covering on each solder strip.
8. An IBC cell module without a main grid, characterized in that it is manufactured by the manufacturing method according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310087138.9A CN116093203A (en) | 2023-02-08 | 2023-02-08 | IBC (insulated Gate less) battery assembly and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310087138.9A CN116093203A (en) | 2023-02-08 | 2023-02-08 | IBC (insulated Gate less) battery assembly and manufacturing method thereof |
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|---|---|
| CN116093203A true CN116093203A (en) | 2023-05-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310087138.9A Pending CN116093203A (en) | 2023-02-08 | 2023-02-08 | IBC (insulated Gate less) battery assembly and manufacturing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117374165A (en) * | 2023-12-04 | 2024-01-09 | 正泰新能科技股份有限公司 | Preparation method of photovoltaic module without main grid, photovoltaic cell without main grid and module |
| CN117637890A (en) * | 2023-11-28 | 2024-03-01 | 江苏海博瑞光伏科技有限公司 | Main gate-free assembly and preparation method thereof |
| CN118610317A (en) * | 2024-08-08 | 2024-09-06 | 浙江求是半导体设备有限公司 | Preparation method of battery string |
-
2023
- 2023-02-08 CN CN202310087138.9A patent/CN116093203A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117637890A (en) * | 2023-11-28 | 2024-03-01 | 江苏海博瑞光伏科技有限公司 | Main gate-free assembly and preparation method thereof |
| CN117374165A (en) * | 2023-12-04 | 2024-01-09 | 正泰新能科技股份有限公司 | Preparation method of photovoltaic module without main grid, photovoltaic cell without main grid and module |
| CN118610317A (en) * | 2024-08-08 | 2024-09-06 | 浙江求是半导体设备有限公司 | Preparation method of battery string |
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