CN104752283A - Chip flip bonding device - Google Patents
Chip flip bonding device Download PDFInfo
- Publication number
- CN104752283A CN104752283A CN201510159819.7A CN201510159819A CN104752283A CN 104752283 A CN104752283 A CN 104752283A CN 201510159819 A CN201510159819 A CN 201510159819A CN 104752283 A CN104752283 A CN 104752283A
- Authority
- CN
- China
- Prior art keywords
- chip
- suction nozzle
- carrier
- wafer carrying
- carrying body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 39
- 230000033001 locomotion Effects 0.000 claims abstract description 15
- 238000004458 analytical method Methods 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims description 6
- 230000007547 defect Effects 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 3
- 229920000297 Rayon Polymers 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract 3
- 235000012431 wafers Nutrition 0.000 description 34
- 238000000034 method Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000007306 turnover Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of integrated circuit packaging, detecting and separating and discloses a chip flip bonding device. The chip flip bonding device comprises a wafer support and a chip carrier which are arranged face to face. Two rotary mechanisms are arranged between the wafer support and the chip carrier. A connecting line of rotation centers of the rotary mechanisms is perpendicular to the wafer support and the chip carrier. At least two suction nozzle mechanisms are arranged at each rotary mechanism. Suction nozzles of the suction nozzle mechanisms are movable. By the aid of the rotary mechanisms, the chip is flipped during packaging or separating; the wafer support and the chip carrier are arranged face to face, leading to compact structure and short movement stroke, in this way, error sources are reduced, and packaging or separating efficiency is improved.
Description
Technical field
The present invention relates to integrated antenna package, grouping system technical field, particularly relate to a kind of flip-chip device.
Background technology
After wafer cuts into multiple chip, upside-down mounting bond technique need be carried out, or give sorting according to its appearance characteristics.
See accompanying drawing 1, the wafer carrying body 101 of Conventional flip device is arranged in parallel by carrier 102 with chip, chip pickup suction nozzle 104,105 are arranged on rotating disk 103, rotate after nozzle pick chip and access chip to top by the suction nozzle 106 on horizontal arm for taking material 107, and detected to the chip position on wafer and by the position on carrier respectively by camera 109, camera 110, and adjusting the state of suction nozzle 106 in real time, horizontal feeding moves than 107 and makes suction nozzle 106 be moved horizontally to chip by chip above carrier 102 on shifting axle 108.
This structure because wafer carrying body 101 with chip by carrier 102 in arranged in parallel, take up space comparatively large, and move horizontally axle and have larger movement travel, cause producing larger error in motion, and make production efficiency lower.
Summary of the invention
In order to solve the problems of the technologies described above, the invention provides a kind of flip-chip device, by wafer carrying body and chip by carrier side arranged on opposite sides, middle use two cover rotational structures to realize chip pickup, transmission and installation.
The technical scheme that the present invention takes is:
A kind of flip-chip device, comprise wafer carrying body and chip by carrier, it is characterized in that, described wafer carrying body and chip are by carrier side arranged on opposite sides, at described wafer carrying body and chip, two rotating mechanisms are set by between carrier, the line of the pivot of described two rotating mechanisms is vertical by carrier with chip with described wafer carrying body, described rotating mechanism is arranged at least two suction nozzle bodies, the removable setting of suction nozzle of described suction nozzle body.
Further, described each rotating mechanism also arranges prism, described flipped device arranges the camera corresponding with described prism, described camera to the chip on described wafer and carry out imaging analysis by the chip mounting location on carrier and obtain positional information, and can check the defect of chip surface by described prism.
Further, described wafer carrying body and chip are arranged up and down by carrier, and described wafer carrying body is positioned at top, and described chip stand under load body is positioned at below, and the upper wafer of described wafer carrying body is fixed by viscose glue.
Further, be provided with camera at the horizontal level of bottom rotating mechanism, the chip of described camera on suction nozzle rotates and carries out imaging analysis to during horizontal level to chip, obtains the positional information before chip installation, and checks the defect of chip surface.
Further, described suction nozzle body comprises adjustment member, and the chip on suction nozzle is carried out adjustment with corresponding suction nozzle or chip carrier and aims at by described adjustment member, and has driving mechanism to drive suction nozzle rectilinear motion.
Further, described wafer carrying body and chip are all arranged on respective motion by carrier, described motion by wafer and the below moving to suction nozzle by carrier, described motion move through described prism and camera composition image system control realization.
Further, the suction nozzle body on each described rotating mechanism is 2 to 4.
The invention has the beneficial effects as follows:
(1) two group of rotating mechanism realizes the turn-over operation in point process of assembling of chip;
(2) the wafer carrying body arranged face-to-face and chip are subject to carrier structure compact, and movement travel is short, decrease source of error and improve encapsulation or the efficiency of separation;
(3) suction nozzle body and visual mechanisms conveniently can adjust the deviation of chip, improve chip and divide packing quality.
Accompanying drawing explanation
Accompanying drawing 1 is flip-chip mechanism structure schematic diagram of the prior art;
Accompanying drawing 2 is flip-chip mechanism structure schematic diagram of the present invention.
Label in accompanying drawing is respectively:
1. wafer carrying body; 2. chip is by carrier;
3. rotating mechanism; 4. rotating mechanism;
5. camera; 6. camera;
7. prism; 8. prism;
9. suction nozzle body; 10. suction nozzle body;
11. suction nozzle bodies; 12. suction nozzle bodies;
13. cameras; 101. wafer carrying bodies;
102. chips are by carrier; 103. rotating disk;
104. suction nozzle; 105. suction nozzle;
106. suction nozzle; 107. arm for taking material;
108. move horizontally axle; 109. camera;
110. camera.
Embodiment
Below in conjunction with accompanying drawing, flip-chip device of the present invention is elaborated.
See accompanying drawing 2, flip-chip device comprises wafer carrying body 1 and chip is subject to carrier 2, and wafer carrying body 1 and chip are by carrier 2 spread configuration face-to-face, and set-up mode can be horizontal arrangement or vertically arrange.During horizontal arrangement, wafer carrying body 1 and chip can be fixedly installed on the table by carrier 2, and when vertically arranging, chip is fixing on the table by carrier 2, and wafer carrying body 1 is fixed on top by support.Wafer carrying body 1 and chip can be exchanged by the position of both carriers 2.
Arrange two rotating mechanisms 3,4 at wafer carrying body 1 and chip by between carrier 2, the line of the pivot of two rotating mechanisms 3,4 is vertical by carrier 2 with chip with wafer carrying body 1.Each rotating mechanism 3,4 arranges at least two suction nozzle bodies 9,10,11,12, the quantity of suction nozzle body 9,10,11,12 is generally 2 to 4, suction nozzle body 9,10,11,12 position on two rotating mechanisms 3,4 is corresponding with quantity, when two rotating mechanisms 3,4 work rotation, suction nozzle body 9,10,11,12 on it is positioned at relative position and joins within cycle time, and the suction nozzle body on two rotating mechanisms implements transfer in meeting point to chip.Carrier is subject to for the wafer carrying body arranged up and down and chip, the transfer process of chip is, suction nozzle body 9,10 on the rotating mechanism 3 of top is after absorption chip wafer carrying body 1, join with the suction nozzle body 11,12 on the rotating mechanism 4 of below, chip is transferred to the suction nozzle body 11,12 of below, in transfer process, chip is implemented turn-over upside-down mounting.
Suction nozzle on two suction nozzle bodies moves axially by control realization and radial fine setting, and regulative mode can adopt in prior art and mechanical type adjusting device or digital control type adjusting device.
Each rotating mechanism also arranges prism 7,8, flipped device arranges the camera 5,6 corresponding with prism, camera 5,6 carries out imaging analysis by the chip position on prism 7,8 pairs of wafers, flipped device is also provided with camera 13, imaging analysis is carried out to the chip position before installing, and checks the defect of chip surface.The control unit of flipped device controls position and the state of rotating mechanism and suction nozzle body adjustment chip in real time according to the position image-forming information of camera.
Wafer carrying body 1 and chip are all arranged on respective connecting gear by carrier 2, and the chip on wafer moves to above suction nozzle by the motion according to connecting gear, will move to below suction nozzle by chip mounting location on carrier.The motion of the image system control realization motion that control unit consists of prism and camera.
Carrier is subject to below for the wafer carrying body arranged up and down and chip, as follows to the workflow of flip-chip device of the present invention, wafer carrying body moves with certain speed, two rotating mechanisms rotate with identical direction or contrary direction, top rotating mechanism by suction nozzle body from absorption chip wafer carrying body, when continuing to go to certain position and the suction nozzle body of the rotating mechanism of below join, below suction nozzle body is from absorption chip the suction nozzle body of top, at this moment chip completes turn-over, below suction nozzle body goes to chip by carrier positions, chip is arranged on chip by carrier.After the chip of a position is covered with, chip transmits to finished product direction by carrier.
Below be only the preferred embodiment of the present invention, it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (7)
1. a flip-chip device, comprise wafer carrying body and chip by carrier, it is characterized in that: described wafer carrying body and chip are by carrier side arranged on opposite sides, at described wafer carrying body and chip, two rotating mechanisms are set by between carrier, the line of the pivot of described two rotating mechanisms is vertical by carrier with chip with described wafer carrying body, described rotating mechanism is arranged at least two suction nozzle bodies, the removable setting of suction nozzle of described suction nozzle body.
2. flip-chip device according to claim 1, it is characterized in that: on described each rotating mechanism, also prism is set, described flipped device arranges the camera corresponding with described prism, described camera to the chip on described wafer and carry out imaging analysis by the chip mounting location on carrier and obtain positional information, and can check the defect of chip surface by described prism.
3. flip-chip device according to claim 1 and 2, it is characterized in that: described wafer carrying body and chip are arranged up and down by carrier, described wafer carrying body is positioned at top, and described chip stand under load body is positioned at below, and the upper wafer of described wafer carrying body is fixed by viscose glue.
4. flip-chip device according to claim 3, it is characterized in that: at the horizontal level of bottom rotating mechanism, camera is installed, the chip of described camera on suction nozzle rotates and carries out imaging analysis to during horizontal level to chip, obtain the positional information before chip installation, and check the defect of chip surface.
5. flip-chip device according to claim 1 and 2, it is characterized in that: described suction nozzle body comprises adjustment member, chip on suction nozzle is carried out adjustment with corresponding suction nozzle or chip carrier and aims at by described adjustment member, and has driving mechanism to drive suction nozzle rectilinear motion.
6. flip-chip device according to claim 1 and 2, it is characterized in that: described wafer carrying body and chip are all arranged on respective motion by carrier, described motion by wafer and the below moving to suction nozzle by carrier, described motion move through described prism and camera composition image system control realization.
7. flip-chip device according to claim 1 and 2, is characterized in that: the suction nozzle body on each described rotating mechanism is 2 to 4.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510159819.7A CN104752283B (en) | 2015-04-07 | 2015-04-07 | Flip-chip device |
| PCT/CN2015/081754 WO2016161703A1 (en) | 2015-04-07 | 2015-06-18 | Device for flip-chip mounting chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510159819.7A CN104752283B (en) | 2015-04-07 | 2015-04-07 | Flip-chip device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104752283A true CN104752283A (en) | 2015-07-01 |
| CN104752283B CN104752283B (en) | 2018-02-13 |
Family
ID=53591772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510159819.7A Active CN104752283B (en) | 2015-04-07 | 2015-04-07 | Flip-chip device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104752283B (en) |
| WO (1) | WO2016161703A1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783717A (en) * | 2016-12-23 | 2017-05-31 | 合肥矽迈微电子科技有限公司 | Flip-chip patch device and method |
| CN108155124A (en) * | 2017-12-25 | 2018-06-12 | 北京中电科电子装备有限公司 | A kind of chip attachment device and method |
| WO2018188731A1 (en) * | 2017-04-11 | 2018-10-18 | Muehlbauer GmbH & Co. KG | Component receiving device with optical sensor |
| CN109588036A (en) * | 2018-11-30 | 2019-04-05 | 江门市三兴照明科技有限公司 | A kind of lamp bead mounting device |
| WO2019210626A1 (en) * | 2018-05-03 | 2019-11-07 | 苏州艾科瑞思智能装备股份有限公司 | Long-distance, accurate and rapid chip loading and unloading device |
| CN111739834A (en) * | 2020-04-30 | 2020-10-02 | 甬矽电子(宁波)股份有限公司 | Chip flip-chip apparatus, system and method |
| TWI709727B (en) * | 2019-08-12 | 2020-11-11 | 京元電子股份有限公司 | Ic chip appearance inspection module |
| CN112394030A (en) * | 2019-08-15 | 2021-02-23 | 京元电子股份有限公司 | IC chip appearance inspection module |
| CN114678321A (en) * | 2022-05-27 | 2022-06-28 | 山东睿芯半导体科技有限公司 | Chip mounting device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1613146A (en) * | 2002-01-07 | 2005-05-04 | 先进系统自动化有限公司 | Flip chip bonder and method therefor |
| US20070020801A1 (en) * | 2005-07-20 | 2007-01-25 | Fujitsu Limited | IC chip mounting method |
| CN100481318C (en) * | 2004-02-16 | 2009-04-22 | 米尔鲍尔股份公司 | Electronic component testing and rotating device and method |
| CN204632732U (en) * | 2015-04-07 | 2015-09-09 | 嘉兴景焱智能装备技术有限公司 | Flip-chip device |
Family Cites Families (4)
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| DE10203601A1 (en) * | 2002-01-30 | 2003-08-14 | Siemens Ag | Chip removal device, chip removal system, placement system and method for removing chips from a wafer |
| US6861608B2 (en) * | 2002-05-31 | 2005-03-01 | Texas Instruments Incorporated | Process and system to package residual quantities of wafer level packages |
| CH698718B1 (en) * | 2007-01-31 | 2009-10-15 | Oerlikon Assembly Equipment Ag | A device for mounting a flip chip on a substrate. |
| CN102201357B (en) * | 2011-04-19 | 2013-04-17 | 上海微松工业自动化有限公司 | Equipment for extracting, turning and setting wafer-level packaged microchip |
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2015
- 2015-04-07 CN CN201510159819.7A patent/CN104752283B/en active Active
- 2015-06-18 WO PCT/CN2015/081754 patent/WO2016161703A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1613146A (en) * | 2002-01-07 | 2005-05-04 | 先进系统自动化有限公司 | Flip chip bonder and method therefor |
| CN100481318C (en) * | 2004-02-16 | 2009-04-22 | 米尔鲍尔股份公司 | Electronic component testing and rotating device and method |
| US20070020801A1 (en) * | 2005-07-20 | 2007-01-25 | Fujitsu Limited | IC chip mounting method |
| CN204632732U (en) * | 2015-04-07 | 2015-09-09 | 嘉兴景焱智能装备技术有限公司 | Flip-chip device |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783717A (en) * | 2016-12-23 | 2017-05-31 | 合肥矽迈微电子科技有限公司 | Flip-chip patch device and method |
| WO2018188731A1 (en) * | 2017-04-11 | 2018-10-18 | Muehlbauer GmbH & Co. KG | Component receiving device with optical sensor |
| US11217465B2 (en) | 2017-04-11 | 2022-01-04 | Muehlbauer GmbH & Co. KG | Component receiving device with optical sensor |
| CN108155124A (en) * | 2017-12-25 | 2018-06-12 | 北京中电科电子装备有限公司 | A kind of chip attachment device and method |
| WO2019210626A1 (en) * | 2018-05-03 | 2019-11-07 | 苏州艾科瑞思智能装备股份有限公司 | Long-distance, accurate and rapid chip loading and unloading device |
| CN110444498A (en) * | 2018-05-03 | 2019-11-12 | 苏州艾科瑞思智能装备股份有限公司 | A kind of long range precisely quickly takes cored sheet devices |
| CN109588036A (en) * | 2018-11-30 | 2019-04-05 | 江门市三兴照明科技有限公司 | A kind of lamp bead mounting device |
| TWI709727B (en) * | 2019-08-12 | 2020-11-11 | 京元電子股份有限公司 | Ic chip appearance inspection module |
| CN112394030A (en) * | 2019-08-15 | 2021-02-23 | 京元电子股份有限公司 | IC chip appearance inspection module |
| CN111739834A (en) * | 2020-04-30 | 2020-10-02 | 甬矽电子(宁波)股份有限公司 | Chip flip-chip apparatus, system and method |
| CN114678321A (en) * | 2022-05-27 | 2022-06-28 | 山东睿芯半导体科技有限公司 | Chip mounting device |
| CN114678321B (en) * | 2022-05-27 | 2022-08-23 | 山东睿芯半导体科技有限公司 | Chip mounting device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016161703A1 (en) | 2016-10-13 |
| CN104752283B (en) | 2018-02-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Chip flip chip device Effective date of registration: 20230526 Granted publication date: 20180213 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2023980041808 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20180213 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2023980041808 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Chip flip device Granted publication date: 20180213 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2024980018023 |