CN104752283A - Chip flip bonding device - Google Patents

Abstract

The invention relates to the technical field of integrated circuit packaging, detection and sorting, and discloses a chip flip-chip device, which includes a wafer carrier and a chip receiving carrier, the wafer carrier and the chip receiving carrier are arranged face to face, and the Two rotation mechanisms are arranged between the carrier and the chip receiver, the line connecting the rotation centers of the two rotation mechanisms is perpendicular to the wafer carrier and the chip receiver, and at least two suction nozzles are arranged on the rotation mechanism mechanism, the suction nozzle of the suction nozzle mechanism can be moved. The two groups of rotating mechanisms of the present invention realize the flipping operation in the packaging or sorting process of chips. The face-to-face wafer carrier and chip carrier have a compact structure and a short motion stroke, which reduces error sources and improves packaging or sorting efficiency.

Description

flip chip device

technical field

The invention relates to the technical fields of integrated circuit packaging, detection and sorting, in particular to a chip flip-chip device.

Background technique

After the wafer is cut into multiple chips, it needs to be flip-chip bonded or sorted according to its appearance characteristics.

Referring to Figure 1, the wafer carrier 101 of the traditional flip-chip device is arranged in parallel with the chip receiving carrier 102, and the chip pick-up nozzles 104, 105 are installed on the rotating disk 103, and the nozzles pick up the chip and then rotate to the top to be lifted by the horizontal pick-up arm. The suction nozzle 106 on the 107 picks up the chip, and the position of the chip on the wafer and the position on the carrier are respectively detected by the camera 109 and the camera 110, and the state of the suction nozzle 106 is adjusted in real time, and the horizontal feeding ratio 107 is moving Moving up the axis 108 makes the suction nozzle 106 move horizontally to mount the chip on the chip receiving carrier 102 .

Because the wafer carrier 101 and the chip receiving carrier 102 are arranged in parallel in this structure, it occupies a large space, and the horizontal movement axis has a relatively large movement stroke, resulting in large errors in motion and low production efficiency.

Contents of the invention

In order to solve the above technical problems, the present invention provides a chip flip-chip device, which arranges the wafer carrier and the chip carrier face to face, and uses two sets of rotating structures in the middle to realize chip picking, transfer and installation.

The technical scheme that the present invention takes is:

A flip-chip device, comprising a wafer carrier and a chip receiver, characterized in that the wafer carrier and the chip receiver are arranged face to face, and two chips are arranged between the wafer carrier and the chip receiver. Rotary mechanism, the line connecting the rotation centers of the two rotary mechanisms is perpendicular to the wafer carrier and the chip carrier, and at least two suction nozzle mechanisms are arranged on the rotary mechanism, and the suction nozzles of the suction nozzle mechanism can be mobile settings.

Further, a prism is also set on each of the rotating mechanisms, and a camera corresponding to the prism is set on the flip-chip device, and the camera scans the chip on the wafer and the carrier through the prism. Imaging analysis can be performed on the mounting position of the chip to obtain position information, and defects on the chip surface can be checked.

Further, the wafer carrier and the chip receiver are arranged up and down, the wafer carrier is located at the top, the chip receiver is located at the bottom, and the upper wafer of the wafer carrier is fixed by glue.

Further, a camera is installed at the horizontal position of the lower rotating mechanism, and when the chip on the suction nozzle rotates to the horizontal position, the camera performs imaging analysis on the chip, obtains position information of the chip before mounting, and inspects defects on the chip surface.

Further, the suction nozzle mechanism includes an adjustment component, which adjusts and aligns the chip on the suction nozzle with the corresponding suction nozzle or chip carrier, and has a driving mechanism to drive the suction nozzle to move linearly.

Further, the wafer carrier and the chip receiver are all arranged on respective motion mechanisms, and the movement mechanism moves the wafer and the receiver to the bottom of the suction nozzle, and the movement of the motion mechanism passes through the prism and Realization of video system control composed of cameras.

Further, there are 2 to 4 suction nozzle mechanisms on each rotating mechanism.

The beneficial effects of the present invention are:

(1) Two sets of rotating mechanisms realize the flipping operation during the chip packaging process;

(2) The face-to-face wafer carrier and chip carrier have a compact structure and a short motion stroke, which reduces error sources and improves packaging or sorting efficiency;

(3) The suction nozzle mechanism and visual mechanism can easily adjust the deviation of chips and improve the quality of chip packaging.

Description of drawings

Accompanying drawing 1 is the structure schematic diagram of the chip flip-chip mechanism in the prior art;

Accompanying drawing 2 is the structural diagram of the chip flip-chip mechanism of the present invention.

The labels in the accompanying drawings are respectively:

1. Wafer carrier; 2. Chip carrier;

3. Rotary mechanism; 4. Rotary mechanism;

5. Camera; 6. Camera;

7. Prism; 8. Prism;

9. Nozzle mechanism; 10. Nozzle mechanism;

11. Nozzle mechanism; 12. Nozzle mechanism;

13. Camera; 101. Wafer carrier;

102. Chip receiving carrier; 103. Rotating disk;

104. Suction nozzle; 105. Suction nozzle;

106. Suction nozzle; 107. Pick-up arm;

108. Horizontal movement axis; 109. Camera;

110. Camera.

Detailed ways

The flip-chip device of the present invention will be described in detail below in conjunction with the accompanying drawings.

Referring to FIG. 2 , the flip-chip device includes a wafer carrier 1 and a chip receiver 2 , and the wafer carrier 1 and the chip receiver 2 are arranged in a face-to-face arrangement, which can be arranged horizontally or vertically. When arranged horizontally, the wafer carrier 1 and the chip carrier 2 can be fixedly arranged on the workbench. When arranged vertically, the chip carrier 2 is fixed on the workbench, and the wafer carrier 1 is fixed above by the bracket. The positions of both the wafer carrier 1 and the chip receiver 2 can be interchanged.

Two rotation mechanisms 3 and 4 are arranged between the wafer carrier 1 and the chip receiver 2 , and the line connecting the rotation centers of the two rotation mechanisms 3 and 4 is perpendicular to the wafer carrier 1 and the chip receiver 2 . At least two suction nozzle mechanisms 9, 10, 11, 12 are set on each rotary mechanism 3, 4, the number of suction nozzle mechanisms 9, 10, 11, 12 is generally 2 to 4, and the two rotary mechanisms 3, 4 The positions and quantities of the suction nozzle mechanisms 9, 10, 11, 12 on the top correspond to each other. When the two rotating mechanisms 3, 4 work and rotate, the suction nozzle mechanisms 9, 10, 11, 12 on them are located in the opposite positions within the cycle time. The positions meet, and the suction nozzle mechanism on the two rotating mechanisms transfers the chips at the meeting point. Taking the wafer carrier and chip carrier arranged up and down as an example, the chip transfer process is that after the suction nozzle mechanisms 9 and 10 on the upper rotary mechanism 3 suck the chips from the wafer carrier 1, they are combined with the lower rotary mechanism The suction nozzle mechanisms 11 and 12 on the 4 meet and transfer the chip to the suction nozzle mechanism 11 and 12 below. During the transfer process, the chip is turned upside down.

The suction nozzles on the two suction nozzle mechanisms can realize axial movement and radial fine-tuning through control, and the adjustment method can be a mechanical adjustment device or a numerical control adjustment device in the prior art.

Prisms 7 and 8 are also set on each rotating mechanism, cameras 5 and 6 corresponding to the prisms are set on the flip-chip device, and cameras 5 and 6 perform imaging analysis on the chip position on the wafer through prisms 7 and 8, and The flip-chip device is also provided with a camera 13 for image analysis of the position of the chip before installation and inspection of defects on the chip surface. The control unit of the flip-chip device controls the rotation mechanism and the suction nozzle mechanism in real time to adjust the position and state of the chip according to the position imaging information of the camera.

Both the wafer carrier 1 and the chip receiving carrier 2 are arranged on their respective conveying mechanisms. According to the movement of the conveying mechanism, the chips on the wafer are moved above the suction nozzles, and the mounting position of the chips on the receiving carriers is moved below the suction nozzles. The control unit realizes the movement of the movement mechanism through the control of the image system composed of prisms and cameras.

Taking the wafer carrier and chip receiving carrier arranged up and down as an example, the working process of the chip flip-chip device of the present invention is as follows, the wafer carrier moves at a certain speed, and the two rotating mechanisms move in the same direction or in the opposite direction Rotate, the upper rotary mechanism sucks the chip from the wafer carrier through the suction nozzle mechanism, and when it continues to turn to a certain position, it meets the suction nozzle mechanism of the lower rotary mechanism, and the lower suction nozzle mechanism sucks the chip from the upper suction nozzle mechanism. At this time, the chip has been turned over, and the lower suction nozzle mechanism is turned to the position of the chip receiving carrier, and the chip is installed on the chip receiving carrier. After the chip at one position is full, the chip is transported by the carrier to the finished product.

The above are only preferred embodiments of the present invention. It should be pointed out that those skilled in the art can make some improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as the present invention. protection scope of the invention.

Claims (7)

1. a flip-chip device, comprise wafer carrying body and chip by carrier, it is characterized in that: described wafer carrying body and chip are by carrier side arranged on opposite sides, at described wafer carrying body and chip, two rotating mechanisms are set by between carrier, the line of the pivot of described two rotating mechanisms is vertical by carrier with chip with described wafer carrying body, described rotating mechanism is arranged at least two suction nozzle bodies, the removable setting of suction nozzle of described suction nozzle body.

2. flip-chip device according to claim 1, it is characterized in that: on described each rotating mechanism, also prism is set, described flipped device arranges the camera corresponding with described prism, described camera to the chip on described wafer and carry out imaging analysis by the chip mounting location on carrier and obtain positional information, and can check the defect of chip surface by described prism.

3. flip-chip device according to claim 1 and 2, it is characterized in that: described wafer carrying body and chip are arranged up and down by carrier, described wafer carrying body is positioned at top, and described chip stand under load body is positioned at below, and the upper wafer of described wafer carrying body is fixed by viscose glue.

4. flip-chip device according to claim 3, it is characterized in that: at the horizontal level of bottom rotating mechanism, camera is installed, the chip of described camera on suction nozzle rotates and carries out imaging analysis to during horizontal level to chip, obtain the positional information before chip installation, and check the defect of chip surface.

5. flip-chip device according to claim 1 and 2, it is characterized in that: described suction nozzle body comprises adjustment member, chip on suction nozzle is carried out adjustment with corresponding suction nozzle or chip carrier and aims at by described adjustment member, and has driving mechanism to drive suction nozzle rectilinear motion.

6. flip-chip device according to claim 1 and 2, it is characterized in that: described wafer carrying body and chip are all arranged on respective motion by carrier, described motion by wafer and the below moving to suction nozzle by carrier, described motion move through described prism and camera composition image system control realization.

7. flip-chip device according to claim 1 and 2, is characterized in that: the suction nozzle body on each described rotating mechanism is 2 to 4.