CN102666728B - 用于高温磨耗应用的聚酰亚胺树脂 - Google Patents

用于高温磨耗应用的聚酰亚胺树脂 Download PDF

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Publication number
CN102666728B
CN102666728B CN201080048382.5A CN201080048382A CN102666728B CN 102666728 B CN102666728 B CN 102666728B CN 201080048382 A CN201080048382 A CN 201080048382A CN 102666728 B CN102666728 B CN 102666728B
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China
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weight
polyimide
carbon
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Expired - Fee Related
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CN201080048382.5A
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English (en)
Chinese (zh)
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CN102666728A (zh
Inventor
J·G·莫拉莱斯
S·H·蒂尔福德
R·R·伯奇
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
CN201080048382.5A 2009-10-27 2010-10-27 用于高温磨耗应用的聚酰亚胺树脂 Expired - Fee Related CN102666728B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US25514709P 2009-10-27 2009-10-27
US61/255,147 2009-10-27
US61/255147 2009-10-27
PCT/US2010/054288 WO2011056651A2 (en) 2009-10-27 2010-10-27 Polyimide resins for high temperature wear applications

Publications (2)

Publication Number Publication Date
CN102666728A CN102666728A (zh) 2012-09-12
CN102666728B true CN102666728B (zh) 2015-03-25

Family

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Family Applications (1)

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CN201080048382.5A Expired - Fee Related CN102666728B (zh) 2009-10-27 2010-10-27 用于高温磨耗应用的聚酰亚胺树脂

Country Status (6)

Country Link
US (1) US20120235071A1 (enExample)
EP (1) EP2493983A4 (enExample)
JP (1) JP5701893B2 (enExample)
KR (1) KR20120101660A (enExample)
CN (1) CN102666728B (enExample)
WO (1) WO2011056651A2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6032202B2 (ja) * 2011-06-14 2016-11-24 宇部興産株式会社 ポリイミド積層体の製造方法、およびポリイミド積層体
WO2013003397A2 (en) * 2011-06-28 2013-01-03 E. I. Du Pont De Nemours And Company Polyimide-coated fillers
CN103842422B (zh) * 2011-07-21 2016-08-24 恩特格里公司 纳米管与细磨的碳纤维聚合物复合材料的组合物及其制造方法
DE102011109578B4 (de) * 2011-08-05 2015-05-28 Heraeus Noblelight Gmbh Verfahren zur Herstellung eines elektrisch leitenden Materials, elektrisch leitendes Material sowie Strahler mit elektrisch leitendem Material
KR20130137035A (ko) 2011-10-31 2013-12-13 가부시끼가이샤 리켄 피스톤 링
WO2014168979A1 (en) * 2013-04-08 2014-10-16 Vorbeck Materials Use of graphene-containing polymer composites
CN103524767B (zh) * 2013-10-30 2016-07-06 宏威高新材料有限公司 一种低线胀系数的新型电子级聚酰亚胺薄膜及其制造方法
US9890298B2 (en) * 2013-12-31 2018-02-13 Saint-Gobain Performance Plastics Corporation Composite bearings having a polyimide matrix
JP6499450B2 (ja) * 2015-01-07 2019-04-10 株式会社日本触媒 酸化グラフェン複合組成物
CN110494475B (zh) * 2017-09-04 2022-09-20 株式会社Lg化学 用于柔性显示装置基底的聚酰亚胺膜
CN110066407A (zh) * 2019-04-22 2019-07-30 东华大学 一种高阻燃性树脂薄膜及其制备方法
CN110016138B (zh) * 2019-04-22 2021-11-09 东华大学 一种高阻燃性聚酰亚胺薄膜及其制备方法
CN113258722B (zh) * 2021-05-31 2022-06-10 哈尔滨工业大学 一种用于直驱式电液伺服作动器的自旋转石墨烯散热装置
KR20240045002A (ko) * 2022-09-29 2024-04-05 주식회사 대림 내열성 및 산화 안정성이 우수한 폴리이미드 수지 및 이의 제조방법
KR20250150298A (ko) * 2024-04-11 2025-10-20 주식회사 대림 치수 안정성이 우수하고 굴곡 모듈러스가 높은 폴리이미드 수지 및 이의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5516837A (en) * 1989-11-30 1996-05-14 Mitsui Toatsu Chemicals, Inc. Polyimide based resin composition
CN1261382A (zh) * 1997-07-01 2000-07-26 纳幕尔杜邦公司 氧化稳定的刚性芳族聚酰亚胺组合物及其制备方法
CN1898753A (zh) * 2003-09-30 2007-01-17 通用电气公司 导电组合物、其制造方法以及由此种组合物衍生的制品

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4835249A (en) * 1986-12-31 1989-05-30 General Electric Company Process for preparing polyimides
JP2946510B2 (ja) * 1987-09-04 1999-09-06 東レ株式会社 ポリイミド樹脂組成物
JPH03215581A (ja) * 1990-01-19 1991-09-20 Daicel Chem Ind Ltd ポリイミド塗膜の密着性改良方法
JPH07165913A (ja) * 1993-12-17 1995-06-27 Mitsui Toatsu Chem Inc 熱酸化安定性良好なポリイミドおよびその製造方法
JPH09508161A (ja) * 1994-01-21 1997-08-19 イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー 改善された特性を有するポリイミド組成物
DE69601519T2 (de) * 1995-06-28 1999-08-19 Mitsui Chemicals Lineare Polyamidsäure, lineares Polyimid und wärmehärtbares Polyimid
JP2004123857A (ja) * 2002-10-01 2004-04-22 Teijin Ltd ポリアミド酸組成物およびポリアミド酸の製造方法
JP2008545839A (ja) * 2005-05-27 2008-12-18 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 低い熱膨張率を有する樹脂組成物およびそれから製造された物品
US7745516B2 (en) * 2005-10-12 2010-06-29 E. I. Du Pont De Nemours And Company Composition of polyimide and sterically-hindered hydrophobic epoxy
JP2009242656A (ja) * 2008-03-31 2009-10-22 Ube Ind Ltd 摩擦材及び摩擦材用樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5516837A (en) * 1989-11-30 1996-05-14 Mitsui Toatsu Chemicals, Inc. Polyimide based resin composition
CN1261382A (zh) * 1997-07-01 2000-07-26 纳幕尔杜邦公司 氧化稳定的刚性芳族聚酰亚胺组合物及其制备方法
CN1898753A (zh) * 2003-09-30 2007-01-17 通用电气公司 导电组合物、其制造方法以及由此种组合物衍生的制品

Also Published As

Publication number Publication date
KR20120101660A (ko) 2012-09-14
JP5701893B2 (ja) 2015-04-15
US20120235071A1 (en) 2012-09-20
JP2013508536A (ja) 2013-03-07
EP2493983A2 (en) 2012-09-05
WO2011056651A3 (en) 2011-09-22
EP2493983A4 (en) 2013-03-13
WO2011056651A2 (en) 2011-05-12
CN102666728A (zh) 2012-09-12

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Granted publication date: 20150325

Termination date: 20161027