CN102664219B - Led壳体 - Google Patents

Led壳体 Download PDF

Info

Publication number
CN102664219B
CN102664219B CN201210124304.XA CN201210124304A CN102664219B CN 102664219 B CN102664219 B CN 102664219B CN 201210124304 A CN201210124304 A CN 201210124304A CN 102664219 B CN102664219 B CN 102664219B
Authority
CN
China
Prior art keywords
housing
led
led housing
connection
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210124304.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN102664219A (zh
Inventor
S·科勒
S·格罗特希
H·布伦纳
R·休伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN102664219A publication Critical patent/CN102664219A/zh
Application granted granted Critical
Publication of CN102664219B publication Critical patent/CN102664219B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • H01R13/113—Resilient sockets co-operating with pins or blades having a rectangular transverse section
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CN201210124304.XA 2007-08-30 2008-08-06 Led壳体 Expired - Fee Related CN102664219B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007041136.9 2007-08-30
DE102007041136A DE102007041136A1 (de) 2007-08-30 2007-08-30 LED-Gehäuse

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2008801045110A Division CN101790802B (zh) 2007-08-30 2008-08-06 Led壳体

Publications (2)

Publication Number Publication Date
CN102664219A CN102664219A (zh) 2012-09-12
CN102664219B true CN102664219B (zh) 2016-07-06

Family

ID=40085583

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201210124304.XA Expired - Fee Related CN102664219B (zh) 2007-08-30 2008-08-06 Led壳体
CN2008801045110A Expired - Fee Related CN101790802B (zh) 2007-08-30 2008-08-06 Led壳体

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2008801045110A Expired - Fee Related CN101790802B (zh) 2007-08-30 2008-08-06 Led壳体

Country Status (8)

Country Link
US (1) US8487323B2 (enExample)
EP (1) EP2183794B1 (enExample)
JP (1) JP2010537437A (enExample)
KR (1) KR20100047339A (enExample)
CN (2) CN102664219B (enExample)
DE (1) DE102007041136A1 (enExample)
TW (1) TW200917533A (enExample)
WO (1) WO2009026876A1 (enExample)

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US8748915B2 (en) * 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
CN101388161A (zh) * 2007-09-14 2009-03-18 科锐香港有限公司 Led表面安装装置和并入有此装置的led显示器
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8791471B2 (en) * 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US7956546B2 (en) * 2009-05-15 2011-06-07 Bridgelux, Inc. Modular LED light bulb
WO2011124689A1 (de) * 2010-04-09 2011-10-13 Ledon Oled Lighting Gmbh & Co. Kg Leuchtmodul und leuchte
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DE102010038251A1 (de) 2010-10-18 2012-04-19 Koninklijke Philips Electronics N.V. OLED-Leuchtmittel für eine Leuchte
DE102010038252A1 (de) * 2010-10-18 2012-04-19 Koninklijke Philips Electronics N.V. Fassung für eine Leuchte mit OLED-Leuchtmittel
US9285089B2 (en) * 2010-12-21 2016-03-15 Bridgelux, Inc. Automatic electrical connection assembly for light modules
JP5841802B2 (ja) * 2011-10-24 2016-01-13 パナソニックＩｐマネジメント株式会社 照明器具
US8564004B2 (en) * 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US8759847B2 (en) * 2011-12-22 2014-06-24 Bridgelux, Inc. White LED assembly with LED string and intermediate node substrate terminals
US20130175704A1 (en) * 2012-01-05 2013-07-11 Ixys Corporation Discrete power transistor package having solderless dbc to leadframe attach
KR101933189B1 (ko) 2012-01-31 2019-04-05 서울반도체 주식회사 발광다이오드 패키지
CN102937270B (zh) * 2012-11-23 2015-01-21 昆山博爱模具开发有限公司 一种led壳体
TWI598665B (zh) * 2013-03-15 2017-09-11 隆達電子股份有限公司 發光元件、長條狀發光元件及其應用
CN103236483A (zh) * 2013-03-15 2013-08-07 达亮电子（苏州）有限公司 发光二极管封装结构及封装方法
DE102013226721A1 (de) 2013-12-19 2015-06-25 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit asymmetrischen Trägerarmen
CH709337B1 (fr) * 2014-03-04 2016-12-30 Robert Alderton Unité d'éclairage LED et procédé de fabrication d'une telle unité.
JP6190746B2 (ja) * 2014-03-25 2017-08-30 エムテックスマツムラ株式会社 半導体素子実装用中空パッケージ
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
KR102233038B1 (ko) * 2014-07-30 2021-03-30 엘지이노텍 주식회사 광원 모듈
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
JP6484588B2 (ja) 2016-05-19 2019-03-13 日亜化学工業株式会社 発光装置及び発光装置用パッケージ
JP6880725B2 (ja) * 2016-12-27 2021-06-02 日亜化学工業株式会社 発光装置
RU172080U1 (ru) * 2017-01-09 2017-06-28 федеральное государственное бюджетное образовательное учреждение высшего образования "Новгородский государственный университет имени Ярослава Мудрого" Корпус светодиода для поверхностного монтажа
CN108879242B (zh) * 2017-05-12 2022-03-29 中兴通讯股份有限公司 传输线及其发光线缆
DE102018214059A1 (de) * 2018-08-21 2020-02-27 Robert Bosch Gmbh Gehäuserahmen für ein Steuergerät, welcher zur elektrischen Außenkontaktierung eines Schaltungsträgers des Steuergeräts geeignet ist

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CN1917731A (zh) * 2005-08-15 2007-02-21 安华高科技Ecbuip(新加坡)私人有限公司 校准的led光模块
JP2007208203A (ja) * 2006-02-06 2007-08-16 Matsushita Electric Ind Co Ltd 発光光源及び発光システム
DE102006018668A1 (de) * 2006-04-21 2007-10-25 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Modulares Beleuchtungssystem und Beleuchtungsanordnung

Also Published As

Publication number Publication date
EP2183794B1 (de) 2017-04-05
CN102664219A (zh) 2012-09-12
US20110186880A1 (en) 2011-08-04
CN101790802A (zh) 2010-07-28
DE102007041136A1 (de) 2009-03-05
EP2183794A1 (de) 2010-05-12
KR20100047339A (ko) 2010-05-07
CN101790802B (zh) 2012-06-20
JP2010537437A (ja) 2010-12-02
WO2009026876A1 (de) 2009-03-05
US8487323B2 (en) 2013-07-16
TW200917533A (en) 2009-04-16

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