CN102626006B - 被冷却的电子系统 - Google Patents

被冷却的电子系统 Download PDF

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Publication number
CN102626006B
CN102626006B CN201080031498.8A CN201080031498A CN102626006B CN 102626006 B CN102626006 B CN 102626006B CN 201080031498 A CN201080031498 A CN 201080031498A CN 102626006 B CN102626006 B CN 102626006B
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CN
China
Prior art keywords
cooling liquid
liquid
cooling
heat
volume
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201080031498.8A
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English (en)
Chinese (zh)
Other versions
CN102626006A (zh
Inventor
丹尼尔·切斯特
彼得·霍普顿
詹森·本特
基思·迪金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atop Group Co Ltd
Original Assignee
Iceotope Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0908156A external-priority patent/GB2467805C/en
Application filed by Iceotope Ltd filed Critical Iceotope Ltd
Priority to CN201811383010.2A priority Critical patent/CN110072368B/zh
Priority to CN201610009043.5A priority patent/CN105491858B/zh
Publication of CN102626006A publication Critical patent/CN102626006A/zh
Application granted granted Critical
Publication of CN102626006B publication Critical patent/CN102626006B/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201080031498.8A 2009-05-12 2010-05-12 被冷却的电子系统 Active CN102626006B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201811383010.2A CN110072368B (zh) 2009-05-12 2010-05-12 被冷却的电子系统
CN201610009043.5A CN105491858B (zh) 2009-05-12 2010-05-12 被冷却的电子系统

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US17754809P 2009-05-12 2009-05-12
GB0908156A GB2467805C (en) 2009-05-12 2009-05-12 Cooled electronic system
GB0908156.3 2009-05-12
US61/177,548 2009-05-12
PCT/GB2010/000950 WO2010130993A2 (en) 2009-05-12 2010-05-12 Cooled electronic system

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN201610009043.5A Division CN105491858B (zh) 2009-05-12 2010-05-12 被冷却的电子系统
CN201811383010.2A Division CN110072368B (zh) 2009-05-12 2010-05-12 被冷却的电子系统

Publications (2)

Publication Number Publication Date
CN102626006A CN102626006A (zh) 2012-08-01
CN102626006B true CN102626006B (zh) 2016-02-03

Family

ID=42357687

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201080031498.8A Active CN102626006B (zh) 2009-05-12 2010-05-12 被冷却的电子系统
CN201610009043.5A Active CN105491858B (zh) 2009-05-12 2010-05-12 被冷却的电子系统
CN201811383010.2A Active CN110072368B (zh) 2009-05-12 2010-05-12 被冷却的电子系统

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201610009043.5A Active CN105491858B (zh) 2009-05-12 2010-05-12 被冷却的电子系统
CN201811383010.2A Active CN110072368B (zh) 2009-05-12 2010-05-12 被冷却的电子系统

Country Status (4)

Country Link
EP (2) EP2430893B1 (https=)
JP (3) JP5863643B2 (https=)
CN (3) CN102626006B (https=)
WO (1) WO2010130993A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681705B (zh) 2019-04-17 2020-01-01 鴻齡科技股份有限公司 散熱裝置及應用所述散熱裝置的散熱系統

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CN105491858A (zh) 2016-04-13
CN102626006A (zh) 2012-08-01
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