CN102487025A - 用于长结合导线的支撑体 - Google Patents

用于长结合导线的支撑体 Download PDF

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CN102487025A
CN102487025A CN201010590311XA CN201010590311A CN102487025A CN 102487025 A CN102487025 A CN 102487025A CN 201010590311X A CN201010590311X A CN 201010590311XA CN 201010590311 A CN201010590311 A CN 201010590311A CN 102487025 A CN102487025 A CN 102487025A
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lead
combines
long
bond pads
die bond
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CN102487025B (zh
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杨洁
贺青春
张汉民
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NXP USA Inc
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Freescale Semiconductor Inc
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Abstract

本发明涉及用于长结合导线的支撑体。一种电连接结构包括第一导线和第二导线，所述第一导线结合到管芯的边沿附近的相邻的结合焊盘，而所述第二导线的一端结合到远离管芯的边沿的管芯结合焊盘，而第二端结合到引线框的引线指或基板的连接焊盘。第二导线与第一导线交叉，并被第一导线支撑。第一导线用作支撑体，其防止第二导线与管芯的边沿接触。第一导线还防止第二导线在封装期间过度地横向移动。

Description

用于长结合导线的支撑体
技术领域
本发明总体涉及半导体封装，并且更具体地，涉及用于长结合导线以防止所述结合导线短路的支撑体。
背景技术
导线结合通常涉及通过结合导线将集成电路(IC)管芯上的结合焊盘连接到引线框的引线指(lead finger)。参照图1，示出了传统导线结合连接结构10，其中结合导线12的一端通过球形结合16附接到集成电路管芯14的结合焊盘，而第二端通过针脚式结合(stitch bond)20附接到引线框的引线指18(或基板的连接焊盘)。
随着管芯尺寸缩小，管芯上的结合焊盘(传统上仅沿着管芯顶面的周边设置)现在通常以阵列的形式设置在管芯顶面上，既可能位于管芯边沿的附近，又可能远离管芯的边沿。因此，某些结合导线(如图1所示的导线12)相对较长，从管芯14的中部或中央区域延伸到引线指18。
当管芯上的结合焊盘接近于管芯的边沿时，导线的环路高度防止导线与管芯的边沿接触，导线与管芯的边沿接触将导致短路。然而，将这些较为远离边沿的管芯焊盘连接到引线框的长结合导线易受下陷或下垂的影响，如图1所示，在这种情况下，它们非有意地接触管芯14的边沿。
此外，在封装处理期间，在管芯和结合导线覆盖有模塑化合物的情况下，在模塑化合物在管芯的表面上流动时，这种长导线易受横向移动(称为导线偏移)的影响，导致它们与其它导线接触。随着结合导线直径的减小，这些问题已经变得越发严重。
因此，具有不与管芯的边沿接触或不与其它结合导线接触的结合导线将是有利的。
附图说明
当结合附图进行阅读时，对本发明优选的实施方式的以下详细描述将更好理解。本发明通过示例的方式进行说明，并且不被附图所限制，在附图中，相同的附图标记指示类似的元件。应当理解，附图并不按比例绘制，并且为了便于本发明的理解已经被简化。
图1是传统管芯到引线框结合导线连接结构的放大侧视图；
图2是根据本发明的实施方式的管芯到引线框结合导线连接结构的放大侧视图；
图3是图2的管芯到引线框结合导线连接结构的放大顶视图；以及
图4是根据本发明的实施方式的管芯到引线框结合导线连接结构的放大照片。
具体实施方式
以下结合附图给出的详细描述意图作为对本发明当前优选的实施方式的描述，并且不意图表示可以实现本发明的唯一形式。应当理解，相同或等同的功能可以通过意图被涵盖在本发明的精神和范围内的不同的实施方式实现。
本发明提供一种防止长结合导线与半导体管芯的边沿接触的方法，其中所述长结合导线的一端附接到管芯结合焊盘，所述管芯结合焊盘大致居中地设置在管芯的表面上，而所述长结合导线的另一端附接到基板的连接焊盘。所述方法包括，在将所述长结合导线附接到所述管芯结合焊盘和所述连接焊盘之前，将短结合导线的第一端附接到位于管芯的边沿附近的第一管芯结合焊盘，以及将所述短结合导线的第二端附接到接近所述第一管芯结合焊盘的第二管芯结合焊盘，其中所述短结合导线从所述第一管芯结合焊盘延伸到所述第二管芯结合焊盘，使得所述短结合导线基本上平行于管芯的边沿，以及将所述长结合导线的一端附接到大致居中地设置的管芯结合焊盘，而另一端附接到所述基板连接焊盘，其中所述长结合导线大致垂直于所述短结合导线，并且所述短结合导线在管芯的边沿附近支撑所述长结合导线，使得所述长结合导线与管芯的边沿分开。
本发明还提供一种从大致居中地设置在半导体管芯表面上的管芯结合焊盘到与管芯的周边分开的基板连接焊盘的电连接结构。所述电连接结构包括：长结合导线，所述长结合导线的一端附接到所述管芯结合焊盘，而另一端附接到所述基板连接焊盘；以及用于长结合导线的支撑体，所述支撑体位于所述管芯结合焊盘和所述基板连接焊盘之间的管芯的边沿附近，其中所述长结合导线由所述支撑体支撑，并且所述支撑体防止所述长结合导线与管芯的边沿接触。
现在参照图2、3和4，图中示出了从大致居中地设置在半导体管芯34的表面上的管芯结合焊盘32到与管芯34的周边分开的基板连接焊盘36的电连接结构30。所述电连接结构30包括长结合导线38，所述长结合导线38的一端附接到所述管芯结合焊盘32，而另一端附接到所述基板连接焊盘36。管芯34是本技术领域公知的具有集成电路的半导体管芯。管芯34具有结合焊盘，包括位于第一或顶部主表面上的管芯结合焊盘32。在一种实施方式中，所述管芯结合焊盘以阵列的形式布置在管芯34的顶面上，从而使得管芯结合焊盘中的一些大致居中地设置在顶面上，使得它们与管芯边沿分开。所述基板连接焊盘36可以是多层基板的连接焊盘、引线框的引线指或用于方便到集成电路的外部电连接的其它导电焊盘。
所述电连接结构30还包括用于支撑所述长结合导线38的支撑体40。所述支撑体40位于所述管芯结合焊盘32和所述基板连接焊盘36之间的管芯34的边沿附近。所述支撑体40支撑所述长结合导线38，并且防止所述长结合导线38与管芯34的边沿接触。优选地，所述支撑体40将所述长结合导线38与管芯边沿分开所述长结合导线38的直径的至少两倍。
在一种实施方式中，所述支撑体40包括第二结合导线，所述第二结合导线大致平行于管芯34的边沿且大致垂直于所述长结合导线38延伸。在一种实施方式中，支撑体或第二结合导线40具有附接到第一和第二管芯结合焊盘的第一和第二端。第一和第二管芯结合焊盘优选地位于管芯34的边沿附近，此外，第一和第二管芯结合焊盘还优选地彼此相邻。例如，如果在管芯34的表面上存在结合焊盘的阵列，那么第一和第二管芯焊盘应当位于阵列的靠外的行中。当第二结合导线连接到第一和第二管芯结合焊盘(这可以利用可商业获得的导线结合设备使用已知的导线结合技术来进行)时，第二结合导线以其大致平行于管芯34的边沿的方式延伸。在本发明的一种实施方式中，第一和第二结合焊盘包括空焊盘(dummy pad)。即，第一和第二结合焊盘不设置成传送电信号往来于外部源和集成电路之间。
当支撑体40包括结合导线时，结合导线38可以是任意可商业获得的结合导线，例如金或铜导线，并且可以与长结合导线相同，即材料和直径相同。因此，如果长结合导线38是1.3mil的金导线，那么支撑体40优选地是1.3mil的金导线。
现在特别地参照图3和图4，在一种实施方式中，支撑体40包括导线40中的凹部或弯折(kink)42，所述长结合导线38放置在该凹部或弯折42中。凹部42防止长结合导线在封装期间过度地横向移动。凹部42可以在可商业获得的导线结合设备上使用预定的设置形成。
根据前面的讨论，显然，本发明提供了支撑结合导线使得所述结合导线不与管芯边沿接触的方法。
尽管已经例示并描述了本发明的优选实施方式，但应当清楚，本发明不仅仅局限于这些实施方式。在不脱离权利要求中所描述的本发明的精神和范围的情况下，各种修改、改变、变化、替换和等同方式对于本领域技术人员而言是显而易见的。

Claims (19)

1.一种防止长结合导线与半导体管芯的边沿接触的方法，其中所述长结合导线的一端附接到管芯结合焊盘，所述管芯结合焊盘大致居中地设置在管芯的表面上，而所述长结合导线的另一端附接到基板连接焊盘，所述方法包括：
在将所述长结合导线附接到所述管芯结合焊盘和所述连接焊盘之前，
将短结合导线的第一端附接到位于管芯的边沿附近的第一管芯结合焊盘，以及
将所述短结合导线的第二端附接到接近所述第一管芯结合焊盘的第二管芯结合焊盘，其中所述短结合导线从所述第一管芯结合焊盘延伸到所述第二管芯结合焊盘，使得所述短结合导线基本上平行于管芯的边沿，以及
将所述长结合导线的一端附接到大致居中地设置的管芯结合焊盘，而另一端附接到所述基板连接焊盘，其中所述长结合导线大致垂直于所述短结合导线，并且所述短结合导线在管芯的边沿附近支撑所述长结合导线，使得所述长结合导线与管芯的边沿分开。
2.如权利要求1所述的方法，其中所述第二管芯结合焊盘接近于所述第一管芯结合焊盘。
3.如权利要求1所述的方法，其中所述第一管芯结合焊盘和所述第二管芯结合焊盘是空结合焊盘。
4.如权利要求1所述的方法，其中所述长结合导线与管芯的边沿分开所述长结合导线的直径的至少两倍。
5.如权利要求1所述的方法，还包括在所述短结合导线中形成弯折的步骤，其中所述长结合导线放置在所述弯折中。
6.一种在大致居中地设置在集成电路管芯的主表面上的管芯结合焊盘和基板连接焊盘之间附接长结合导线的方法，所述方法包括：
将短结合导线的第一端附接到位于管芯的边沿附近的第一管芯结合焊盘，
将所述短结合导线的第二端附接到接近所述第一管芯结合焊盘的第二管芯结合焊盘，其中所述短结合导线大致平行于管芯的边沿，以及
将所述长结合导线的一端附接到大致居中地设置的管芯结合焊盘，而另一端附接到所述基板连接焊盘，其中所述长结合导线大致垂直于所述短结合导线，并且所述短结合导线在管芯的边沿附近支撑所述长结合导线，使得所述长结合导线与管芯的边沿分开。
7.如权利要求6所述的方法，其中所述第二管芯结合焊盘接近于所述第一管芯结合焊盘。
8.如权利要求7所述的方法，其中所述第一管芯结合焊盘和所述第二管芯结合焊盘是空结合焊盘。
9.如权利要求6所述的方法，其中所述长结合导线与管芯的边沿分开所述长结合导线的直径的至少两倍。
10.如权利要求6所述的方法，还包括在所述短结合导线中形成弯折的步骤，其中所述长结合导线放置在所述弯折中。
11.一种从大致居中地设置在半导体管芯的表面上的管芯结合焊盘到与管芯的周边分开的基板连接焊盘的电连接结构，所述电连接结构包括：
长结合导线，所述长结合导线的一端附接到所述管芯结合焊盘，而另一端附接到所述基板连接焊盘；以及
用于所述长结合导线的支撑体，所述支撑体位于所述管芯结合焊盘和所述基板连接焊盘之间的管芯的边沿附近，其中所述长结合导线由所述支撑体支撑，并且所述支撑体防止所述长结合导线与管芯的边沿接触。
12.如权利要求11所述的电连接结构，其中所述支撑体包括凹部，所述长结合导线放置在所述凹部中，并且所述凹部防止所述长结合导线在封装期间过度地横向移动。
13.如权利要求11所述的电连接结构，其中所述支撑体包括第二结合导线。
14.如权利要求13所述的电连接结构，其中所述第二结合导线大致垂直于所述长结合导线延伸。
15.如权利要求14所述的电连接结构，其中所述第二结合导线具有附接到第一和第二管芯结合焊盘的第一和第二端。
16.如权利要求15所述的电连接结构，其中所述第一和第二管芯结合焊盘包括空焊盘。
17.如权利要求11所述的电连接结构，其中所述第二结合导线是金导线和铜导线中的一种。
18.如权利要求11所述的电连接结构，其中所述基板连接焊盘包括引线框的引线指。
19.如权利要求11所述的电连接结构，其中所述支撑体将所述长结合导线与管芯的边沿分开所述长结合导线的直径的至少两倍。
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