CN108630796A - 用于建立键合连接的方法 - Google Patents

用于建立键合连接的方法 Download PDF

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CN108630796A
CN108630796A CN201810229523.1A CN201810229523A CN108630796A CN 108630796 A CN108630796 A CN 108630796A CN 201810229523 A CN201810229523 A CN 201810229523A CN 108630796 A CN108630796 A CN 108630796A
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wire rod
component
support portion
bonding
connection position
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CN108630796B (zh
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E.埃的林格
R.费林格
B.德拉戈斯特斯
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ZKW Group GmbH
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Abstract

本发明涉及一种带有电联接部位的电子构件，在其中至少键合线材从至少一个第一联接部位经由构件表面引导到至少一个第二联接部位，其中，在至少第一联接部位处以及在至少第二联接部位处建立线材与联接部位的接触面的键合连接，其中，在构件上设置有至少一个用于至少一个键合线材的支撑部，并且在第一联接部位与第二联接部位之间的至少一个键合线材由支撑部与构件的表面区段保持在预设的间距中，并且本发明涉及一种用于制造这样的构件的方法，在该方法中，在将键合线材从第一联接部位引导到第二联接部位之前在构件上设立至少一个用于键合线材的支撑部，所述支撑部使键合线材与构件的表面区段保持在预设的间距中。

Description

用于建立键合连接的方法
技术领域
本发明涉及一种用于在电子构件上的电联接部位之间建立键合连接(Bondverbindung)的方法，在该方法中，借助于键合工具将键合线材从第一联接部位(Anschlussstelle)经由构件表面引导到第二联接部位，其中，在第一联接部位处以及在第二联接部位处建立键合线材与联接部位的接触面的键合连接，并且在将键合线材从第一联接部位引导到第二联接部位之前在构件上设立至少一个用于键合线材的支撑部(Abstützung)，所述支撑部将键合线材与构件的表面区段保持在预设的间距中。
同样，本发明涉及一种带有电联接部位的电子构件，在其中，至少键合线材从至少一个第一联接部位经由构件表面引导到至少一个第二联接部位，其中，在至少第一联接部位处以及在至少第二联接部位处建立线材与联接部位的接触面的键合连接，并且在该构件上设置有至少一个用于至少一个键合线材的支撑部，并且在第一联接部位与第二联接部位之间的至少一个键合线材由支撑部与构件的表面区段保持在预设的间距中。
背景技术
线材键合(Drahtbonden)是连接技术的对于本领域专业人员而言已知的方法，该方法大规模地尤其用于电端口在电路板和芯片构造(Chipaufbauten)上的连接。在大多数情况下，借助于超声波将连接线材安置在电路板的接触面上，其中，通常由铝、铜、银或金构成的连接线材(键合线材)借助于线材键合头部(也被称为键合工具或楔工具(WedgeTool))压靠在接触面上。常见的线材键合头部具有基本上楔形的带有压靠面的顶部以及用于键合线材的供应部。为了建立键合连接，将经由压靠面引导的键合线材挤压抵靠电路板的接触面，并且同时在键合头部中产生超声波振动，由此使线材与接触面在原子的平面上连接。在键合过程结束时，也能够利用键合头部进行完成键合的线材与储备卷筒(Vorratsrolle)的分离。例如文件US 3,934,783公开了带有键合头部的这种键合装置。
尽管键合对于许多应用情况而言是第一选择的连接技术，然而经常存在有以下几何结构，在所述几何结构的情况下，不能够使用标准键合工艺，因为键合线材的引导是不可行的和/或键合工具仅仅能够受限制地使用。如果例如应该在两个彼此正交地布置的、放置在模块上的电路板之间建立连接，则整个模块必须在键合过程期间以90°转动，以便能够成功地进行键合。如果键合线材在宽的路程上张紧，则可能不能够维持相对于构件或机械部件的最小需要的绝缘间距。如果在布局中使用带有复杂几何结构的大量键合线材，则几乎不能够找到对于张紧的键合线材而言合适的设计。
这种支撑部在不同的实施方案中可由文件US 2012145446 A1、DE 102005036324A1、DE 102004018434 A1和US 5847445 A得知，其中，对于这些支撑部而言共同的是，它们在制造的情形中带来附加的耗费，因为例如电路板之类的初始产品必须专门地成型或者后期(通常在装备工艺之前)需要特别的工作步骤连同相应的辅助器件。
发明内容
由此，本发明的任务在于，即使在复杂地布置的构件的情形中也实现一种可靠的键合，其中，支撑部的提供能够在没有高耗费的情况下进行。
该任务利用开头所提及的类型的方法来解决，在该方法中，根据本发明至少一个支撑部以金属的、可钎焊的足部区段(Fußabschnitt)在SMT技术下进行表面装备。
由于本发明，能够简单且便宜地制造以下支撑部，所述支撑部实现了键合线材的实践中任意的线路引导(Leitungsführung)并且减轻键合部位的负担。
在合乎目的的构造方案中设置成，钎焊焊盘构造在构件的电路板上。
还能够值得推荐的是，至少一个支撑部由板材部件通过冲压和/或弯曲来制造。
在另一适宜的变型方案中设置成，至少一个支撑部由线材区段通过弯曲来制造。
还能够有利地设置成，键合线材经由有弹性的区段引入到容纳部中，该有弹性的区段在键合线材的引入之后使该键合线材保持受拘束。由此可防止键合线材从支撑部意外地脱出以及防止发生由此产生的结果性损伤(Folgeschäden)、例如短路。
所提出的任务也利用上面所说明的类型的电子构件来解决，其中，根据本发明，至少一个支撑部以金属的、可钎焊的足部区段焊上到构件的钎焊焊盘上并且在SMT技术下进行表面装备。
一种有利的变型方案设置成，钎焊焊盘构造在构件的电路板上。
在另一价格适宜的改进方案中能够设置成，至少一个支撑部由板材部件通过冲压和/或弯曲来制造。
另一方面，能够是有利的是，至少一个支撑部由线材区段通过弯曲来制造。
最后，再另一适宜的变型方案设置成，容纳部具有有弹性的区段，该有弹性的区段实现了键合线材的引入并且在键合线材的引入之后使该键合线材保持受拘束。由此可防止键合线材从支撑部意外地脱出以及防止发生由此产生的结果性损伤、例如短路。
附图说明
在下面根据附图中表明的实施例更详细地阐释本发明。在其中：
图1示出根据现有技术的带有两个电路板的冷却体模块，这两个电路板可相互电连接，
图2示意性地示出带有两个彼此正交地放置的电路板的冷却体模块，
图3a和3b示出朝装备有不同的构件和两个LED元件的电路板的俯视图，其中，在图3a中示出通过键合的传统的连接，并且在图3a中示出在支撑部的使用下的键合连接，以及
图4a至4f示出对于SMT技术中的弯曲部件和冲压部件的示例，所述弯曲部件和冲压部件在本发明的范围内可被用作为支撑元件。
参考标记列表
1 构件
2 电路板
3 电路板
4 键合线材
5o 第一联接部位
5u 第二联接部位
6 支撑部
7 凹口
8 构件
9o 模块
9u 模块
10 LED元件
11 键合线材
12 支撑部
13 钎焊焊盘
14 足部区段
15 指部
16 茎杆(Stängel)
17 容纳部
18 支撑翼部(Stützflügel)
19 足部区段
20 凹口
21 切入部(Einschnitt)。
具体实施方式
现在参考图1阐释在建立在带有两个布置在构件的彼此正交地取向的侧面上的电路板2,3的构件1(例如冷却体模块)的示例处的键合连接的情形中的问题。所键合的线路(也就是说键合线材4)在电子构件(在此电路板)上的电联接部位之间借助于已知的、然而未示出的键合工具来建立。在此，键合线材4从第一联接部位5o处经由构件1的表面引导到第二联接部位5u，其中，在第一联接部位5o处以及在第二联接部位5u处建立线材4与相应的联接部位的接触面的键合连接。
在这些且类似的情况中，键合线材通过键合工具所进行的引导是不可行或仅仅难以实现。必须将整个构件1在键合过程期间以90°转动，以便实现键合过程。然而如果键合线材在相对长的路程上张紧，则不能够维持相对于电子或机械部件特别是在绝缘方面的最小必要间距。当在布局中使用大量键合线材和复杂的几何结构的情况下，那么几乎不能够找到对于键合线材的张紧而言适合的设计。
“构件”或“电子构件”这样的所使用的概念应该在所描述的发明范围内不仅包含构件的基体，而且包含布置在该基体上的部件、例如电路板、电子部件或还仅一个这样的电路板。此外，在本发明的范围内，构件不必必然地含有“电子”部件，基本上仅仅是以下电联接部位，一般地，电连接从所述电联接部位伸延到构件的其它部位。
为了在这样的情况下简化或完全地实现键合过程，能够设置成，在将键合线材从第一联接部位引导到第二联接部位之前在构件上设立至少一个用于键合线材的支撑部，所述支撑部使键合线材与构件的表面区段保持在预设的间距中。这现在在图2中示出的第一示例处阐释。在此，可与图1相比较地，又示意性地示出构件1，在该构件的情况下，在两个彼此正交取向的侧面上布置有电路板2,3。在此，键合线材4也从第一联接部位5o经由构件1的表面引导到第二联接部位5u，其中，在第一联接部位5o处以及在第二联接部位5u处建立线材4与相应的联接部位5o,5u的接触面的键合连接。
现在看出的是，从在附图中前方的电路板3的在附图中上方的边缘处突起有桥接部形的支撑部6，经由所述支撑部的端部能够引导键合线材，其中，这些支撑部6使键合线材与构件(包括属于该构件的电路板2,3)的表面区段保持在预设的间距中。
如在细节图A中能够看到的，在所示出的示例中在支撑部6的端部中成型出各一个倒圆的凹口7，该凹口防止键合线材4发生滑脱。支撑部6在该实施例中与电路板是一件式的并且因此由和这些电路板一样的材料、例如FR4构成。在此，支撑部也能够设置在两个电路板处，并且所述支撑部也不必与电路板是一件式的，而是能够与这些电路板通过粘接连接来连接。
根据图2的构造方案基本上属于现有技术。
根据图3a和3b，示出构件8、即电路板的另一实施方式，其装备有多个模块和两个LED元件10，所述模块中，两个模块以9o和9u来表示，其中，在图3a中示出通过键合所实现的没有支撑部的连接，并且在图3a中示出带有支撑部的键合连接。详细地看出，键合连接应该通过两个模块9o,9u之间的键合线材来建立，这两个模块在附图中处于左上方和右下方。在此如果根据图3a来进行，则借助于键合工具将键合线材11笔直地从模块9o的联接部位8a引导到模块9u的相应的联接部位8b，其中，该键合线材在该情况下与这两个LED元件10的放射区域相交并且至少妨碍了放射。此外，键合线材与另外的模块相交并且能够以不期望的方式贴靠在这些另外的模块处。
根据图3b，在构件8上以更下面更详细地阐释的方式设立有支撑部12，并且键合线材11由键合工具以经编程的方式如此引导，使得该键合线材从附图中左上方的放置在构件8上的模块9o经由总共六个支撑部12如此引导到右下方的模块9u，使得该键合线材与全部的模块或构件8的表面处于适合的预设的间距中，并且也不妨碍LED元件10的放射。
在图3b的情况下，支撑部12与构件8的电路板不是一件式地构造，而是所述支撑部以足部区段焊上到构造为电路板的构件8的钎焊焊盘13上。在此，必须考虑的是，用于所引导的键合线材的支撑部12应该通常显示出在其它构件和导轨(Leiterzüge)方面的绝缘功能。如果支撑部12完全由金属构成，则钎焊焊盘13必须通常相对其它导体绝缘。另一方面，支撑部12也能够由绝缘材料构成并且例如粘上到构件8上，或所述支撑部能够部分地由绝缘材料构成并且根据本发明具有金属的足部区段，利用该足部区段使所述支撑部焊上到钎焊焊盘上。然而，支撑部12也能够是金属的或由起传导作用的材料构成。
在图3b的俯视图中，示意性地示出带有较小的环的支撑部，一些可行的具体的实施方案现在在以下的图4a至4f中示出，其中，为了简化对于支撑部的所有实施方案使用参考标记12，并且对于其足部区段使用参考标记14。在图4a至4f中对于相同的或可比较的部件也使用相同的参考标记。
图4a示出支撑部12，该支撑部由线材或板材条构成，其中，从足部区段14，该足部区段在此具有三个在一角度下相对彼此布置的指部15，利用所述指部使该足部区段能够焊上到钎焊焊盘上或否则焊上到金属的面上。茎杆16从足部区段14向上突起，在该茎杆的上方端部处联接有用于在此未示出的键合线材的容纳部17。容纳部17在其上方端部处具有优选地有弹性的区段18，该有弹性的区段实现了键合线材的引入，但是然后弹回并且使键合线材保持受拘束。类似的实施方案在图4b中示出，而在此设置有两个有弹性的区段18。
图4c同样示出与之前描述的两个实施方案相类似的变型方案，在该变型方案中，茎杆16从带有三个指部15的足部区段14处向上伸延，该茎杆在其上方的端部区域中承载用于键合线材的环形容纳部17。然而，该容纳部的例如由线材或由线材条构成的环不是闭合的，而是在安放键合线材时能够有弹性地打开并且在这之后至少部分地又关闭，从而在该情况下键合线材也保持受拘束并受保持。
在根据图4d的变型方案中(这样如在前述实施方式中那样)，存在有带有向上伸出的茎杆16的足部区段14，该茎杆在上方承载在侧视图中杯形的用于在此画入的键合线材11的容纳部17。
支撑部12的另外两个变型方案在图4e和4f中示出。在两个情况下，初始点是例如矩形的板材件，在冲出或切入之后由该板材件向上弯曲出支撑翼部18。板材件的其余部分用作足部区段19，该足部区段能够例如焊上到电路板上。为了在一定程度上固定键合线材，在根据图4e的支撑翼部18的上方的端部处例如通过冲压来构造倒圆的凹口20，该凹口呈现为用于键合线材的支承部(Auflage)，并且在每个情况下只要没有较大的力作用于该键合线材或键合线材相应地张紧，则防止该键合线材发生侧向上的滑动。该凹口20(和图2、细节图A的凹口7一样)也确保了键合线材在其通过键合工具进行安置(Verlegen)期间的一定的定心。在根据图4f的变型方案中，在支撑翼部18中例如通过冲压构造有侧向上的切入部21。当支撑部应该形成对于键合线材而言的转向点、即以下点，在该点处键合线材侧向上转向时(如这在对于键合线材11的图3b的多个部位处所示出的那样)，键合线材那么能够有利地保持在这样的切入部21中。
如果至少相应的足部区段14或19由可钎焊的金属构成，则根据本发明的支撑部能够以有利的方式在电路板的装备期间与其它部件一起尤其通过SMT钎焊技术焊上到该电路板上。带有常用的缩写SMT的“表面装备技术(Surface Mounted Technology)”理解为“经表面装备的”结构元件的技术。
键合工艺(如以下示例应该示出的那样)在根据本发明的构件的制造方面可简单地集成到两个步骤中。这些步骤是用于可进行表面装备的构件的装备和钎焊的SMD工艺以及接着这个的组装，在该组装中，在专用机器上例如将电路板与冷却体连接。在该组装中，键合线材的放置能够按顺序集成。在SMD线上，首先将设置成用于SMD部件的连接的这样的金属焊盘印刷以焊料，在这之后将SMD结构元件装备在该金属焊盘上，并且通过共同的熔化来进行钎焊。键合焊盘(在接下来的键合工艺中，键合线材应该被放置到所述键合焊盘上)没有被印刷并且应该在钎焊过程的提高的温度的情形下在表面处不进一步氧化。为此，一方面在带有约500ppm的剩余氧气含量的氮气气氛下进行钎焊，另一方面，能够将带有约7µm的Ni厚度和低于100nm的Au厚度的Ni/Au焊盘用于进行键合。

Claims (10)

1.一种用于在电子构件(8)上的电联接部位之间建立键合连接的方法，在所述方法中，借助于键合工具将键合线材(11)从第一联接部位经由构件表面引导到第二联接部位，其中，在所述第一联接部位(8a)处以及在所述第二联接部位(8b)处建立所述键合线材与所述联接部位的接触面的键合连接，并且在将所述键合线材(11)从第一联接部位引导到第二联接部位之前在所述构件(8)上设立至少一个用于所述键合线材的支撑部(12)，所述支撑部使所述键合线材与所述构件的表面区段保持在预设的间距中，
其特征在于，
所述至少一个支撑部(12)以金属的、可钎焊的足部区段(14,19)以SMT技术进行表面装备。
2.根据权利要求2所述的方法，其特征在于，所述钎焊焊盘(13)构造在所述构件(8)的电路板上。
3.根据权利要求1或2所述的方法，其特征在于，所述至少一个支撑部(12)由板材部件通过冲压和/或弯曲来制造。
4.根据权利要求1或2所述的方法，其特征在于，所述至少一个支撑部(12)由线材区段通过弯曲来制造。
5.根据权利要求1至4中任一项所述的方法，其特征在于，所述键合线材(11)经由有弹性的区段(18)引入到所述容纳部(17)中，所述有弹性的区段在所述键合线材的引入之后使该键合线材保持受拘束。
6.一种带有电联接部位的电子构件(8)，在其中，至少键合线材(11)从至少一个第一联接部位经由所述构件表面引导到至少一个第二联接部位，其中，在所述至少第一联接部位处以及在所述至少第二联接部位处建立所述线材与所述联接部位的接触面的键合连接，并且在所述构件(8)上设置有至少一个用于所述至少一个键合线材(11)的支撑部(12)，并且在第一联接部位与第二联接部位之间的至少一个键合线材由所述支撑部与所述构件的表面区段保持在预设的间距中，
其特征在于，
所述至少一个支撑部(12)以金属的、可钎焊的足部区段(14,19)焊上到所述构件(8)的钎焊焊盘(13)上并且以SMT技术进行表面装备。
7.根据权利要求6所述的电子构件，其特征在于，所述钎焊焊盘(13)构造在所述构件(8)的电路板上。
8.根据权利要求6或7所述的电子构件，其特征在于，所述至少一个支撑部(12)由板材部件通过冲压和/或弯曲来制造。
9.根据权利要求6或7所述的电子构件，其特征在于，所述至少一个支撑部(12)由线材区段通过弯曲来制造。
10.根据权利要求6至9中任一项所述的电子构件，其特征在于，所述容纳部(17)具有有弹性的区段(18)，所述有弹性的区段实现了所述键合线材(11)的引入并且在所述键合线材的引入之后使该键合线材保持受拘束。
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