CN102464862A - 热固性组合物 - Google Patents
热固性组合物 Download PDFInfo
- Publication number
- CN102464862A CN102464862A CN201010601898XA CN201010601898A CN102464862A CN 102464862 A CN102464862 A CN 102464862A CN 201010601898X A CN201010601898X A CN 201010601898XA CN 201010601898 A CN201010601898 A CN 201010601898A CN 102464862 A CN102464862 A CN 102464862A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- composition
- thermoset composition
- resin
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 77
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 56
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 52
- 239000003822 epoxy resin Substances 0.000 claims abstract description 51
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 239000004593 Epoxy Substances 0.000 claims abstract description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 7
- 150000003142 primary aromatic amines Chemical class 0.000 claims abstract description 7
- 239000004014 plasticizer Substances 0.000 claims abstract description 6
- 150000003141 primary amines Chemical class 0.000 claims abstract description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 22
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 16
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 239000004902 Softening Agent Substances 0.000 claims description 12
- -1 aromatic primary amine Chemical class 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 238000006384 oligomerization reaction Methods 0.000 claims description 11
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 claims description 9
- 229910015900 BF3 Inorganic materials 0.000 claims description 9
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 8
- 239000007822 coupling agent Substances 0.000 claims description 7
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 claims description 6
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 6
- 239000013034 phenoxy resin Substances 0.000 claims description 6
- 229920006287 phenoxy resin Polymers 0.000 claims description 6
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 5
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 4
- 239000004927 clay Substances 0.000 claims description 4
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 4
- 229920003986 novolac Polymers 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 229960001866 silicon dioxide Drugs 0.000 claims description 4
- GRFQCTQTJBMFGS-UHFFFAOYSA-N NC1=C(C=CC=C1)S(=O)(=O)N.NC1=CC=C(C=C1)S(=O)(=O)N Chemical compound NC1=C(C=CC=C1)S(=O)(=O)N.NC1=CC=C(C=C1)S(=O)(=O)N GRFQCTQTJBMFGS-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- OSJGPKXDWZYYFT-UHFFFAOYSA-N CCOC(CO[Si](CCCOCC1CO1)(OCC)OCC)(OCC)OC(C)CCCOCC2CO2 Chemical compound CCOC(CO[Si](CCCOCC1CO1)(OCC)OCC)(OCC)OC(C)CCCOCC2CO2 OSJGPKXDWZYYFT-UHFFFAOYSA-N 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 229930003836 cresol Natural products 0.000 claims description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 2
- HUUCHDRSMXGHFR-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane diethoxy(methyl)silane Chemical compound CCO[SiH](C)OCC.CCO[Si](C)(CCCOCC1CO1)OCC HUUCHDRSMXGHFR-UHFFFAOYSA-N 0.000 claims description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 claims description 2
- ILHOQKCVIFZHGS-UHFFFAOYSA-N n,n-dimethylaniline;trifluoroborane Chemical compound FB(F)F.CN(C)C1=CC=CC=C1 ILHOQKCVIFZHGS-UHFFFAOYSA-N 0.000 claims description 2
- YRZFHTRSHNGOSR-UHFFFAOYSA-N phenylmethanamine;trifluoroborane Chemical compound FB(F)F.NCC1=CC=CC=C1 YRZFHTRSHNGOSR-UHFFFAOYSA-N 0.000 claims description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 claims description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims 3
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 claims 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims 1
- QGMGHALXLXKCBD-UHFFFAOYSA-N 4-amino-n-(2-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=CC=C1N QGMGHALXLXKCBD-UHFFFAOYSA-N 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract description 5
- 125000000524 functional group Chemical group 0.000 abstract description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 15
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 9
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000001291 vacuum drying Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000002742 anti-folding effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 239000003351 stiffener Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZRYCRPNCXLQHPN-UHFFFAOYSA-N 3-hydroxy-2-methylbenzaldehyde Chemical compound CC1=C(O)C=CC=C1C=O ZRYCRPNCXLQHPN-UHFFFAOYSA-N 0.000 description 1
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- LSAMTNWZBYOWMZ-UHFFFAOYSA-N 4-methylaniline;trifluoroborane Chemical compound FB(F)F.CC1=CC=C(N)C=C1 LSAMTNWZBYOWMZ-UHFFFAOYSA-N 0.000 description 1
- OTZFCCQPIUGYIF-UHFFFAOYSA-N C1=CC=CC=C1.NC1=CC=C(OC2=CC(=CC=C2)OC2=CC=C(C=C2)N)C=C1 Chemical compound C1=CC=CC=C1.NC1=CC=C(OC2=CC(=CC=C2)OC2=CC=C(C=C2)N)C=C1 OTZFCCQPIUGYIF-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- VQKFNUFAXTZWDK-UHFFFAOYSA-N alpha-methylfuran Natural products CC1=CC=CO1 VQKFNUFAXTZWDK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920006158 high molecular weight polymer Polymers 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- FDDDEECHVMSUSB-UHFFFAOYSA-N sulfanilamide Chemical compound NC1=CC=C(S(N)(=O)=O)C=C1 FDDDEECHVMSUSB-UHFFFAOYSA-N 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/02—Applications for biomedical use
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明提供一种热固性组合物，包括以下成分：(a)寡聚合物，其中寡聚合物系由液态环氧树脂与具有4个反应氢原子之芳族伯胺反应(aromaticprimary amine)而得，该环氧树脂与该伯胺之当量摩尔比为1∶0.15～1∶2.50，且该寡聚物占该热固性组合物为约1～35重量百分比；(b)长分子链树脂，其中长分子链树脂占该热固性组合物为约5～10重量百分比；(c)具有两个或两个以上环氧官能团(epoxy functional groups)之环氧树脂，其中环氧树脂占该热固性组合物为约50～80重量百分比；以及(d)增塑剂(plasticizer)，其中增塑剂占该热固性组合物为约5～15重量百分比。
Description
【技术领域】
本发明系有关于一种电子元件的封装材料，且特别是有关于一种有机电致发光元件(organic electroluminescent device)封装用的热固性组合物(thermosetting composition)。
【背景技术】
有机电致发光元件因为轻薄、低消耗功率(low power consumption)、高响应速率(rapid response speed)、宽视角(wide viewing angle)等优点，已成为平面显示器(flat display)的明日之星。
传统的有机电致发光元件使用紫外光型环氧树脂(UV light curingepoxy)，此类的树脂较为硬脆，未来不适合于软性基材(flexible substrate)的封装。此外，使用紫外光型环氧树脂进行整面型涂布封装(entire surface-coatedsealing)时，紫外光的能量会造成元件中的有机材料劣化(degradation)，或者是硬化过程由于快速反应的应力(stress)变化造成阴极与有机层剥离(peeling)问题，或者是树脂硬化不完全的问题。
为了解决上述问题，有不少专利提出热固性树脂(thermosetting resin)。JP 10-135255提出热固性树脂，其以酸酐系(anhydride)作为硬化剂，咪唑(imidazole)作为硬化促进剂(curing accelerating agent)，然而，此方法需要较高的硬化温度。JP 2006-228708提出热固性树脂，其使用酸酐作为硬化剂，以2，4，6-三(二甲胺基甲基)苯酚(2，4，6-tris(dimethylaminomethyl)phenol)作为促进剂，然而，此成分需要在100℃1小时以上才能使树脂反应完全。
因此，业界极需发展一种有机电致发光元件封装用之热固性组合物，此组合物不但不会对元件造成不良的影响，且适用于软性基材。
【发明内容】
本发明提供一种热固性组合物，包括以下成分：(a)寡聚合物，其中该寡聚合物系由液态环氧树脂与具有4个反应氢原子之芳族伯胺反应(aromaticprimary amine)而得，该环氧树脂与该伯胺之当量摩尔比为1∶0.15～1∶2.50，且该寡聚物占该热固性组合物为约1～35重量百分比；(b)长分子链树脂，其中该长分子链树脂占该热固性组合物为约5～10重量百分比；(c)具有两个或两个以上环氧官能团(epoxy functional groups)之环氧树脂，其中该环氧树脂占该热固性组合物为约50～80重量百分比；以及(d)增塑剂(plasticizer)，其中该增塑剂占该热固性组合物为约5～15重量百分比。
为让本发明之上述和其他目的、特征、和优点能更明显易懂，下文特举出较佳实施例，并配合所附图式，作详细说明如下：
【具体实施方式】
本发明提供一种热固性组合物，其成份中包括成分(a)寡聚物(低分子量的聚合物，其分子量通常小于10,000～20,000)，此寡聚合物系由液态环氧树脂与具有4个反应氢原子的芳族伯胺反应(aromatic primary amine)而得，环氧树脂与伯胺的当量摩尔比为1∶0.15～1∶2.50，且寡聚物占热固性组合物为约1～35重量百分比。
此外，本发明热固性组合物亦包括其他成份，如成分(b)长分子链树脂(高分子量的聚合物，其分子量通常大于20,000～30,000)，其中长分子链树脂占热固性组合物为约5～10重量百分比；成分(c)具有两个或两个以上环氧官能团的环氧树脂，且环氧树脂占热固性组合物为约50～80重量百分比；以及成分(d)增塑剂(plasticizer)，其中增塑剂占热固性组合物为约5～15重量百分比。
上述成分(a)中液态环氧树脂包括双酚A系环氧树脂(bisphenol A epoxy)、或双酚F系(bisphenol F epoxy)环氧树脂、或脂肪族环氧树脂(aliphatic epoxy)、脂环族环氧树脂(cycloaliphatic epoxy)或上述之衍生物。而成分(a)中具有4个反应氢原子的芳族伯胺包括4，4′-二氨基二苯砜(4，4′-Diaminodiphenylsulfone)、氨基苯磺酰胺(4-Aminobenzenesulfonamide)、4，4′-二氨基二苯醚(4，4′-diaminodiphenyl ether)、1，3-双(4′-氨基苯氧基)苯(4，4′-(1，3-Phenylenedioxy)dianiline)、4，4′-二氨基二苯甲烷(4，4′-Diaminodiphenyl methane)或上述之衍生物。
于一实施例中，使用双酚A环氧树脂与4，4′-二氨基二苯砜(4，4′-Diaminodiphenyl sulfone)于温度为约100℃～150℃的条件下进行反应，可制得寡聚物。于另一实施例中，使用双酚A环氧树脂与氨基苯磺酰胺(4-Aminobenzenesulfonamide)于温度为约100℃～150℃的条件下进行反应，可制得另一寡聚物。
上述成分(b)长分子链树脂的平均分子量为约大于5万，其包括苯氧基树脂(phenoxy resin)、双酚A系环氧树脂、或双酚F系环氧树脂、或双酚A/双酚F系环氧树脂或上述之衍生物。
上述成分(c)之环氧树脂包括甲酚-可溶酚醛(cresol novolac)环氧树脂、或可溶可熔酚醛(phenol novolac)环氧树脂、双酚A系环氧树脂、或双酚F系环氧树脂、脂肪族环氧树脂、脂环族环氧树脂或上述之衍生物。
上述成分(d)之增塑剂的室温黏度为约20,000～52,000cps，其包括聚氨酯丙烯酸酯寡聚物(urethane acrylate oligmer)、聚酯丙烯酸酯寡聚物(polyesteracrylate oligmer)、丙烯酸类寡聚物(acrylic oligmer)、邻苯二甲酸酯类(phthalateesters)或上述之衍生物。
此处须注意的是，成分(a)作为热固性组合物的刚性部分(rigidity)，可作为热硬化剂，成分(b)与成分(c)作为热固性组合物的主要基质(matrix)，再额外搭配添加成分(d)增塑剂，以增加热固性组合物的附着力(adhesion)。
此外，本发明热固性组合物亦可加入其他添加剂，例如其他热硬化剂、填充物或偶联剂。热硬化剂包括三氟化硼乙胺(boron trifluoridemonoethylamine)、三氟化硼甲苯胺(boron trifluoride p-toluidine)、三氟化硼二甲基苯胺(boron trifluoride dimethyl aniline)、三氟化硼苄胺(boron trifluoridebenzyl amine)、或三氟化硼二甲基胺(boron trifluoride N，N-dimethyl amine)。
填充物的作用在于增加热固性组合物的阻水气、氧气之效果，其包括二氧化硅(silicon dioxide)、滑石粉(talcum powder)、氧化铝(aluminum oxide)、黏土(clay)。
偶联剂(coupling agent)的作用同样是增加热固性组合物之附着力，其中偶联剂包括3-环氧丙氧基丙基三甲氧基硅烷(3-glycidoxypropyltrimethoxysilane)、2-(3，4-环氧基环己基)乙基三甲氧基硅烷(2-(3，4epoxycyclohexyl)-ethyltrimethoxysilane)、3-环氧丙氧基丙基甲基二乙氧基硅烷(3-glycidoxypropylmethyl diethoxy silane)或3-环氧丙氧基丙基三乙氧基(3-glycidoxypropyltriethoxysilane)。
本发明热固性组合物之形成方法，系先将液态环氧树脂与具有4个反应氢原子之芳族伯胺进行反应，以合成寡聚物，再混合寡聚物、长分子链树脂、具有两个或两个以上环氧官能团之环氧树脂与增塑剂，于为约70-90℃的条件下反应约15～30分钟，即可完成硬化反应，相较于先前技术(需大于100℃且需1小时以上)，本发明之反应温度较低，且反应时间较短。
本发明之热固性组合物经由抗折测试(flexibility test)，实验结果显示此组合物可历经3000次弯折而不会有明显的裂痕，证明本发明之组合物具有良好的挠曲性(flexible ability)。另外，本发明之热固性组合物经由抗撕强度测试(peel strength)，实验结果显示抗撕强度为约2.5～3.5公斤，代表本发明之热固性组合物与基材之间具有优异的附着力，此组合物不仅可以应用于软性基材之封装，更可以应用在金属薄片或玻璃基板的封装。再者，本发明之热固性组合物亦具有抑制暗点(dark spot)的产生且具有优异的阻气能力。
【实施例】
寡聚物的合成
100份重量的液态双酚A环氧树脂(EPON 828，Shell Chemicals公司)与35份重量的4，4′-二氨基二苯砜(4，4′-diaminodiphenyl sulfone；DDS，Alfa Aesar公司)混合后(当量摩尔比为1∶1.063)，置于130℃油浴器内反应约1小时，合成EO-01寡聚合物。
100份重量的液态双酚A环氧树脂(EPON 828)与35份重量的对氨基苯磺酰胺(4-aminobenzenesulfonamide，TCI公司)混合后(当量摩尔比为1∶1.533)，置于130℃油浴器内反应约1小时，合成EO-02寡聚合物。
100份重量的液态双酚A环氧树脂(EPON 828)与5份重量的4，4′-二氨基二苯砜(4，4′-diaminodiphenyl sulfone；DDS)混合后(当量摩尔比为1∶0.152)，置于130℃油浴器内反应约1小时，合成EO-03寡聚合物。
100份重量的液态双酚A环氧树脂(EPON 828)与80份重量的4，4′-二氨基二苯砜(4，4′-diaminodiphenyl sulfone；DDS)混合后(当量摩尔比为1∶2.429)，置于130℃油浴器内反应约1小时，合成EO-04寡聚合物。
(2)热固性组合物的形成
将上述寡聚物(EO-01、EO-02、EO-03、或EO-04)；
长分子链树脂(PKHH(苯氧基树脂，phenoxy resin，InChem公司)、EPIKOTE 1256(双酚A型环氧树脂，bisphenol A type epoxy resin，Mw＞51,000，Japan Epoxy Resins公司)、EPIKOTE 4250(双酚A/F(50/50)型环氧树脂，bisphenol A/F(50/50)type epoxy resin，Mw＞59,000，Japan Epoxy Resins公司))；
具有两个或两个以上环氧官能团之环氧树脂(ECN 1299(甲基酚醛环氧树脂，cresol formaldehyde novolac epoxy resin，Ciba公司)、EPON 828(双酚A环氧树脂，bisphenol A epoxy resin，Shell Chemicals公司))；
增塑剂(CN997(聚氨酯丙烯酸酯寡聚物(urethane acrylate oligmer，Sartomer公司)，于25℃下的黏度为25,000cps)、CN2200(聚酯丙烯酸酯寡聚物(polyester acrylate oligmer，Sartomer公司)，于25℃下的黏度为52,000cps)、DOUBLEMER 3710(丙烯酸寡聚物(acylic oligmer，Sartomer公司)，于25℃下的黏度为52,000cps)；
以及有机溶剂丙二醇甲醚醋酸酯(propylene glycol mono-methyl etheracetate，Aldrich公司)于100～130℃进行融熔混合，接着降至室温后额外再分别加入滑石粉与热硬化剂(BF3-MEA，boron trifluoride monoethylamine，三氟化硼乙胺，TCI公司)，再经由三滚筒研磨，即可制得实施例1-实施例13。
(3)物理性质测量
(i)抗折测试(flexibility test)：将组合物涂布于60μm金属箔上(4×4.5cm2)，先于烘箱70℃烘烤1小时，然后置于真空烘箱45℃烘烤15小时，再弯折3000次，以显微镜观察直径5公分范围内的裂痕，其中表示无裂痕，而×表示有裂痕。
(ii)抗撕强度测试(peel strength test)：将组合物涂布于金属箔上(4×4.5cm2)，先于烘箱70℃烘烤1小时，再于真空烘箱45℃烘烤15小时，然后此封装盖先置放90℃环境5～15分钟预反应，接着在60～90℃下与聚酰亚胺(PI)塑胶基材进行贴合，之后置于90℃环境30分钟完成硬化反应，使用双柱式拉力机(QC Teck)测试上述完成之样品，当测试所得数值越高，表示附着力越好。
(iii)水气测试(WVTR test(water vapor transmission rate test))：将组合物涂布于PET离型膜上(15×15cm2)，先于烘箱70℃烘烤1小时，再于真空烘箱45℃烘烤15小时，然后此封装盖先置放90℃环境30分钟完成硬化反应，于40℃下，90％湿度的条件下使用水气渗透仪测试上述完成之样品，当测试所得数值越低，表示抗水气效果越好。
(iv)暗点测试：将组合物涂布于金属箔上(4×4.5cm2)，先于烘箱70℃烘烤1小时，再于真空烘箱45℃烘烤15小时，然后此封装盖先置放90℃环境5～15分钟预反应，接着将此封装盖与已蒸镀完成之有机电致发光元件(OLED)在60～90℃下进行压合，之后置于90℃环境30分钟完成硬化反应。
将此OLED元件放置在高温高湿60℃/90％湿度环境下120小时，观察元件暗点产生情形：
表示暗点增加率＜5％；
表示暗点增加率＜10％；×表示暗点增加率＞10％。
表1显示实施例1～实施例13之热固性组合物各成分之组成与其物性结果。
表1
注1：phr(parts per hundreds of resin)：每100单位树脂中，某物质所添加的量。
接续表1
接续表1
由表1之数据可得知，热固性组合物用于有机电致发光元件封止时，除了拥有优异的抑制暗点(Dark Spots)与阻气能力之外，更有良好的挠曲性与基材附着力的表现。
表2显示比较例1～比较例4之热固性组合物各成分之组成与其物性结果。
表2
由表2的数据可得知，当组合物仅有寡聚合物(EO-01Oligmer)时，其对基材之附着力几乎为零；而当组合物无寡聚合物存在时，其对基材的附着力低于2公斤重；再者，当组合物无增塑剂(CN997、CN2200或DOUBLEMER3710)时，其对基材的附着力低于1公斤重。另外，比较例中之组成皆无法有效抑制暗点的产生。
虽然本发明已以数个较佳实施例揭露如上，然其并非用以限定本发明，任何本领域技术人员，在不脱离本发明之精神和范围内，当可作任意之更动与润饰，因此本发明之保护范围当视后附之申请专利范围所界定者为准。
Claims (12)
1.一种热固性组合物，包括以下成分：
(a)寡聚合物，其中该寡聚合物系由液态环氧树脂与具有4个反应氢原子的芳族伯胺反应(aromatic primary amine)而得，该环氧树脂与该伯胺之当量摩尔比为1∶0.15～1∶2.50，且该寡聚物占该热固性组合物为1～35重量百分比；
(b)长分子链树脂，其中该长分子链树脂占该热固性组合物为5～10重量百分比；
(c)具有两个或两个以上环氧官能团的环氧树脂，其中该环氧树脂占该热固性组合物为50～80重量百分比；以及
(d)增塑剂(plasticizer)，其中该增塑剂占该热固性组合物为5～15重量百分比。
2.如权利要求1所述的热固性组合物，其中成分(a)中该液态环氧树脂包括双酚A系环氧树脂(bisphenol A epoxy)、或双酚F系(bisphenol F epoxy)环氧树脂、或脂肪族环氧树脂(aliphatic epoxy)、脂环族环氧树脂(cycloaliphaticepoxy)、或上述之衍生物。
3.如权利要求1所述的热固性组合物，其中成分(a)中该具有4个反应氢原子的芳族伯胺包括4，4′-二氨基二苯砜(4，4′-Diaminodiphenyl sulfone)、氨基苯磺酰胺(4-Aminobenzenesulfonamide)、4，4′-二氨基二苯醚(4，4′-diaminodiphenyl ether)、1，3-双(4′-氨基苯氧基)苯(4，4′-(1，3-Phenylenedioxy)dianiline)、4，4′-二氨基二苯甲烷(4，4′-Diaminodiphenyl methane)、或上述之衍生物。
4.如权利要求1所述的热固性组合物，其中成分(b)中该长分子链树脂包括苯氧基树脂(phenoxy resin)、双酚A系环氧树脂、或双酚F系环氧树脂、或双酚A/双酚F系环氧树脂或上述之衍生物。
5.如权利要求1所述的热固性组合物，其中成分(c)中该环氧树脂包括甲酚-可溶酚醛(cresol novolac)环氧树脂、或可溶可熔酚醛(phenol novolac)环氧树脂、双酚A系环氧树脂、或双酚F系环氧树脂、脂肪族环氧树脂、脂环族环氧树脂或上述之衍生物。
6.如权利要求1所述的热固性组合物，其中该成分(d)中增塑剂包括聚氨酯丙烯酸酯寡聚物(urethane acrylate oligmer)、聚酯丙烯酸酯寡聚物(polyester acrylate oligmer)、丙烯酸类寡聚物(acrylic oligmer)、邻苯二甲酸酯类(phthalate esters)、或上述之衍生物。
7.如权利要求1所述的热固性组合物，还包括热硬化剂。
8.如权利要求7所述的热固性组合物，其中该热硬化剂包括三氟化硼乙胺(boron trifluoride monoethylamine)、三氟化硼甲苯胺(boron trifluoridep-toluidine)、三氟化硼二甲基苯胺(boron trifluoride dimethyl aniline)、三氟化硼苄胺(boron trifluoride benzyl amine)、或三氟化硼二甲基胺(borontrifluoride N，N-dimethyl amine)。
9.如权利要求1所述的热固性组合物，还包括填充物(filler)。
10.如权利要求9所述的热固性组合物，其中该填充物包括二氧化硅(silicon dioxide)、滑石粉(talcum powder)、氧化铝(aluminum oxide)、或黏土(clay)。
11.如权利要求1所述的热固性组合物，还包括偶联剂(coupling agent)。
12.如权利要求11所述的热固性组合物，其中该偶联剂包括3-环氧丙氧基丙基三甲氧基硅烷(3-glycidoxypropyltrimethoxysilane)、2-(3，4-环氧基环己基)乙基三甲氧基硅烷(2-(3，4-epoxycyclohexyl)-ethyltrimethoxysilane)、3-环氧丙氧基丙基甲基二乙氧基硅烷(3-glycidoxypropylmethyl diethoxy silane)、或3-环氧丙氧基丙基三乙氧基(3-glycidoxypropyltriethoxysilane)。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099139298A TWI491638B (zh) | 2010-11-16 | 2010-11-16 | 熱硬化型組成物 |
| TW099139298 | 2010-11-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102464862A true CN102464862A (zh) | 2012-05-23 |
| CN102464862B CN102464862B (zh) | 2014-09-10 |
Family
ID=46048367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010601898.XA Active CN102464862B (zh) | 2010-11-16 | 2010-12-22 | 热固性组合物 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8604102B2 (zh) |
| CN (1) | CN102464862B (zh) |
| TW (1) | TWI491638B (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106873309A (zh) * | 2017-02-22 | 2017-06-20 | 浙江福斯特新材料研究院有限公司 | 一种正性感光水溶性阻焊干膜及用途 |
| CN112599508A (zh) * | 2019-10-02 | 2021-04-02 | 财团法人工业技术研究院 | 导电组合物及微型发光二极管显示设备的制造方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI519560B (zh) | 2014-11-24 | 2016-02-01 | 財團法人工業技術研究院 | 含氧雜環丁烷基與環氧基之樹脂與樹脂組成物 |
| US20190083855A1 (en) * | 2017-09-21 | 2019-03-21 | Acushnet Company | Golf balls having covers made with thermoplastic polyurethane and epoxy blend compositions |
| CN113544180A (zh) * | 2019-03-15 | 2021-10-22 | 汉高股份有限及两合公司 | 含砜树脂的阻气粘合剂 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4567216A (en) * | 1983-12-22 | 1986-01-28 | Union Carbide Corporation | Thermoplastic modified epoxy compositions |
| CN1415659A (zh) * | 2001-11-01 | 2003-05-07 | 财团法人工业技术研究院 | 一种铜箔基板用环氧树脂/粘土纳米复合材料 |
| US20060058473A1 (en) * | 2002-10-03 | 2006-03-16 | Yoshihiro Kawada | Epoxy resin composition for sealing optical semiconductor |
| US20080064815A1 (en) * | 2006-09-12 | 2008-03-13 | Henkel Corporation | Reinforcement and Cure Enhancement of Curable Resins |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4330659A (en) * | 1980-10-06 | 1982-05-18 | Ciba-Geigy Corporation | Modified amine hardener systems |
| US5001175A (en) * | 1989-04-11 | 1991-03-19 | Estron Chemical, Inc. | Epoxy-sulfonamide compounds and compositions |
| US4996284A (en) * | 1989-04-24 | 1991-02-26 | Mallavarapu Leo X | Novel epoxy sulfonamide-based resins, a process for their preparation and use of same |
| WO1991015533A1 (fr) * | 1990-04-03 | 1991-10-17 | Kanegafuchi Chemical Industry Co., Ltd. | Composition de resine vulcanisable |
| TW223083B (zh) * | 1991-10-25 | 1994-05-01 | Ciba Geigy Ag | |
| KR0163981B1 (ko) * | 1993-06-29 | 1999-01-15 | 사또오 아키오 | 필름제 액정셀 봉지용 수지조성물 |
| JPH10135255A (ja) | 1996-10-30 | 1998-05-22 | Matsushita Electric Works Ltd | 電子部品の封止方法、及びそれに用いるエポキシ樹脂組成物 |
| JP2000053934A (ja) * | 1998-07-28 | 2000-02-22 | Minnesota Mining & Mfg Co <3M> | 接着剤組成物およびその前駆体 |
| KR100414698B1 (ko) * | 1999-04-01 | 2004-01-13 | 미쯔이카가쿠 가부시기가이샤 | 액정밀봉제 조성물 |
| JP4816863B2 (ja) | 2004-12-22 | 2011-11-16 | 株式会社スリーボンド | 有機ｅｌ素子封止用熱硬化型組成物 |
| JP4909581B2 (ja) | 2005-01-20 | 2012-04-04 | 三井化学株式会社 | 有機ｅｌ素子のシール方法 |
| JP5288150B2 (ja) | 2005-10-24 | 2013-09-11 | 株式会社スリーボンド | 有機ｅｌ素子封止用熱硬化型組成物 |
-
2010
- 2010-11-16 TW TW099139298A patent/TWI491638B/zh active
- 2010-12-22 CN CN201010601898.XA patent/CN102464862B/zh active Active
-
2011
- 2011-05-23 US US13/113,418 patent/US8604102B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4567216A (en) * | 1983-12-22 | 1986-01-28 | Union Carbide Corporation | Thermoplastic modified epoxy compositions |
| CN1415659A (zh) * | 2001-11-01 | 2003-05-07 | 财团法人工业技术研究院 | 一种铜箔基板用环氧树脂/粘土纳米复合材料 |
| US20060058473A1 (en) * | 2002-10-03 | 2006-03-16 | Yoshihiro Kawada | Epoxy resin composition for sealing optical semiconductor |
| US20080064815A1 (en) * | 2006-09-12 | 2008-03-13 | Henkel Corporation | Reinforcement and Cure Enhancement of Curable Resins |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106873309A (zh) * | 2017-02-22 | 2017-06-20 | 浙江福斯特新材料研究院有限公司 | 一种正性感光水溶性阻焊干膜及用途 |
| CN112599508A (zh) * | 2019-10-02 | 2021-04-02 | 财团法人工业技术研究院 | 导电组合物及微型发光二极管显示设备的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120123039A1 (en) | 2012-05-17 |
| US8604102B2 (en) | 2013-12-10 |
| TW201221533A (en) | 2012-06-01 |
| CN102464862B (zh) | 2014-09-10 |
| TWI491638B (zh) | 2015-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10791624B2 (en) | Resin composition and film using same | |
| EP3127933B1 (en) | Heat-curable epoxy resin composition | |
| CN102464862B (zh) | 热固性组合物 | |
| TWI649372B (zh) | 纖維強化複合材料 | |
| US10294324B2 (en) | Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device | |
| US20120296010A1 (en) | Encapsulating sheet and electronic device | |
| KR20100025485A (ko) | 무용제형 폴리이미드 실리콘계 수지 조성물 및 그의 경화물 | |
| US20170174879A1 (en) | Liquid epoxy resin composition | |
| CN108841344B (zh) | 一种高粘结性耐候底涂涂层及用途 | |
| JPWO2019054391A1 (ja) | エポキシ樹脂組成物 | |
| CN104416998A (zh) | 部件密封用薄膜的制造方法 | |
| WO2020235588A1 (ja) | 接着剤組成物 | |
| US11441015B2 (en) | Coated particle | |
| TW201739783A (zh) | 環氧樹脂組成物 | |
| CN108243614B (zh) | 固化性树脂膜及第1保护膜形成用片 | |
| JP2011184668A (ja) | 熱伝導性熱可塑性接着剤組成物 | |
| KR101834376B1 (ko) | 복합 실란 소재를 포함하는 내충격성 에폭시 수지계 접착제 | |
| TWI821245B (zh) | 晶圓等級包裝密封用樹脂組成物 | |
| CN102925066A (zh) | 一种环氧树脂粘结膜及其制备方法 | |
| JP2023101158A (ja) | エポキシ樹脂組成物、硬化物、構造体、及び電子部品 | |
| US11306220B2 (en) | Flexible encapsulating material, process for preparing the same and encapsulating method using the same | |
| TWI722192B (zh) | 片型接著劑及使用其之接著方法 | |
| JP2008115338A (ja) | 熱硬化及び紫外線硬化型エポキシ樹脂組成物およびその硬化物からなるシール材 | |
| TW202313847A (zh) | 組成物及硬化物 | |
| JP3397112B2 (ja) | 低弾性樹脂組成物，低弾性樹脂硬化物及び電子装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |