CN102456601B - 保持部件形状判定装置及其方法和基板处理装置 - Google Patents

保持部件形状判定装置及其方法和基板处理装置 Download PDF

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Publication number
CN102456601B
CN102456601B CN201110328464.1A CN201110328464A CN102456601B CN 102456601 B CN102456601 B CN 102456601B CN 201110328464 A CN201110328464 A CN 201110328464A CN 102456601 B CN102456601 B CN 102456601B
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Chinese (zh)
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CN102456601A (zh
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梶原英树
牧准之辅
榎木田卓
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Manipulator (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
CN201110328464.1A 2010-10-22 2011-10-21 保持部件形状判定装置及其方法和基板处理装置 Active CN102456601B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-237843 2010-10-22
JP2010237843A JP5333408B2 (ja) 2010-10-22 2010-10-22 保持部材の姿勢判定装置、その方法、基板処理装置及び記憶媒体

Publications (2)

Publication Number Publication Date
CN102456601A CN102456601A (zh) 2012-05-16
CN102456601B true CN102456601B (zh) 2016-01-20

Family

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Family Applications (1)

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CN201110328464.1A Active CN102456601B (zh) 2010-10-22 2011-10-21 保持部件形状判定装置及其方法和基板处理装置

Country Status (5)

Country Link
US (1) US9030656B2 (https=)
JP (1) JP5333408B2 (https=)
KR (1) KR101695197B1 (https=)
CN (1) CN102456601B (https=)
TW (1) TWI505389B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12176233B2 (en) 2021-08-17 2024-12-24 Changxin Memory Technologies, Inc. Apparatus and method for transferring wafer, and apparatus for controlling transferring wafer

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101352253B1 (ko) 2012-04-24 2014-01-17 엘지디스플레이 주식회사 액정표시장치와 그 ｆｒｃ 방법
JP2014008578A (ja) * 2012-06-29 2014-01-20 Daihen Corp 基板搬送装置
KR101385594B1 (ko) * 2012-09-28 2014-04-15 삼성디스플레이 주식회사 자동보정 및 티칭로딩이 가능한 자동반송시스템 및 제어방법
JP6374775B2 (ja) * 2014-11-25 2018-08-15 東京エレクトロン株式会社 基板搬送システム及びこれを用いた熱処理装置
GB2541689B (en) * 2015-08-26 2020-04-15 Rolls Royce Plc Apparatus and methods for determining location of at least a part of an object
JP6700149B2 (ja) 2016-09-29 2020-05-27 株式会社Ｓｃｒｅｅｎホールディングス 姿勢変更装置
US10651067B2 (en) * 2017-01-26 2020-05-12 Brooks Automation, Inc. Method and apparatus for substrate transport apparatus position compensation
JP6858041B2 (ja) * 2017-03-16 2021-04-14 川崎重工業株式会社 基板搬送装置
JP7023094B2 (ja) * 2017-12-05 2022-02-21 日本電産サンキョー株式会社 ロボット
JP7199211B2 (ja) * 2018-12-03 2023-01-05 東京エレクトロン株式会社 搬送検知方法及び基板処理装置
JP7246256B2 (ja) * 2019-05-29 2023-03-27 東京エレクトロン株式会社 搬送方法及び搬送システム
CN110444493B (zh) * 2019-08-15 2021-03-16 德淮半导体有限公司 一种防止手臂撞击晶圆的装置
KR102566135B1 (ko) * 2019-12-02 2023-08-11 주식회사 원익아이피에스 인터락 기능을 갖는 반도체 공정 장비
US11335578B2 (en) * 2020-02-13 2022-05-17 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer apparatus and method of measuring positional deviation of substrate
KR102590268B1 (ko) * 2021-03-25 2023-10-18 피에스케이 주식회사 기판 처리 장치 및 기판 처리 방법
KR102669767B1 (ko) * 2022-04-01 2024-05-28 주식회사 유진테크 기판 이송장치 및 기판 이송장치의 이상 판단방법
JP7787856B2 (ja) * 2023-09-05 2025-12-17 キヤノン株式会社 基板搬送装置、露光装置、及び物品の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5105147A (en) * 1988-05-26 1992-04-14 Galai Laboratories Ltd. Wafer inspection system
CN101271857A (zh) * 2007-03-23 2008-09-24 东京毅力科创株式会社 基板移载装置、基板移载方法和存储介质
CN101308100A (zh) * 2007-05-16 2008-11-19 奥林巴斯株式会社 外观检查装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0810800B2 (ja) * 1988-03-17 1996-01-31 富士通株式会社 部品リードの検査及び姿勢認識方法
DE3941725A1 (de) * 1989-12-18 1991-06-20 Krupp Atlas Elektronik Gmbh Vorrichtung zum erkennen von deformationen auf pressteilen
JPH11179692A (ja) * 1997-12-16 1999-07-06 Shin Meiwa Ind Co Ltd 産業用ロボットのハンド異常検出装置及びハンド異常検出方法
JP2001044263A (ja) * 1999-08-04 2001-02-16 Nikon Corp 基板搬送方法及び基板搬送装置
JP2001127136A (ja) * 1999-10-29 2001-05-11 Applied Materials Inc 基板搬送ロボットの検査装置
US6380503B1 (en) * 2000-03-03 2002-04-30 Daniel G. Mills Apparatus and method using collimated laser beams and linear arrays of detectors for sizing and sorting articles
JP2004296484A (ja) * 2003-03-25 2004-10-21 Hitachi Kokusai Electric Inc 基板処理装置
JP2005303196A (ja) * 2004-04-15 2005-10-27 Canon Inc 位置決め装置、露光装置、半導体デバイスの製造方法
JP4835839B2 (ja) * 2006-04-07 2011-12-14 株式会社安川電機 搬送用ロボットおよび搬送用ロボットの位置補正方法
JP2008141098A (ja) * 2006-12-05 2008-06-19 Dainippon Screen Mfg Co Ltd 基板搬送装置の検査装置および基板処理装置
JP4910945B2 (ja) * 2007-08-28 2012-04-04 パナソニック株式会社 部品実装装置
JP5185756B2 (ja) * 2008-10-01 2013-04-17 川崎重工業株式会社 基板検出装置および方法
JP5246550B2 (ja) * 2009-03-03 2013-07-24 川崎重工業株式会社 ロボット及びその制御方法
JP5614326B2 (ja) * 2010-08-20 2014-10-29 東京エレクトロン株式会社 基板搬送装置、基板搬送方法及びその基板搬送方法を実行させるためのプログラムを記録した記録媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5105147A (en) * 1988-05-26 1992-04-14 Galai Laboratories Ltd. Wafer inspection system
CN101271857A (zh) * 2007-03-23 2008-09-24 东京毅力科创株式会社 基板移载装置、基板移载方法和存储介质
CN101308100A (zh) * 2007-05-16 2008-11-19 奥林巴斯株式会社 外观检查装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12176233B2 (en) 2021-08-17 2024-12-24 Changxin Memory Technologies, Inc. Apparatus and method for transferring wafer, and apparatus for controlling transferring wafer

Also Published As

Publication number Publication date
JP5333408B2 (ja) 2013-11-06
KR101695197B1 (ko) 2017-01-11
US20120099951A1 (en) 2012-04-26
CN102456601A (zh) 2012-05-16
US9030656B2 (en) 2015-05-12
TWI505389B (zh) 2015-10-21
TW201237988A (en) 2012-09-16
KR20120042658A (ko) 2012-05-03
JP2012089809A (ja) 2012-05-10

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