CN102445850B - 碱显影型阻焊剂及其固化物以及使用其得到的印刷线路板 - Google Patents

碱显影型阻焊剂及其固化物以及使用其得到的印刷线路板 Download PDF

Info

Publication number
CN102445850B
CN102445850B CN2011102722066A CN201110272206A CN102445850B CN 102445850 B CN102445850 B CN 102445850B CN 2011102722066 A CN2011102722066 A CN 2011102722066A CN 201110272206 A CN201110272206 A CN 201110272206A CN 102445850 B CN102445850 B CN 102445850B
Authority
CN
China
Prior art keywords
solder resist
alkali
group
compound
molecule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2011102722066A
Other languages
English (en)
Chinese (zh)
Other versions
CN102445850A (zh
Inventor
伊藤信人
柴崎阳子
加藤贤治
有马圣夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006110411A external-priority patent/JP4827088B2/ja
Priority claimed from JP2006110443A external-priority patent/JP4827089B2/ja
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of CN102445850A publication Critical patent/CN102445850A/zh
Application granted granted Critical
Publication of CN102445850B publication Critical patent/CN102445850B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/061—Polyesters; Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C08G59/1466—Acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/117—Free radical
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing
    • Y10S430/121—Nitrogen in heterocyclic ring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/122—Sulfur compound containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/122—Sulfur compound containing
    • Y10S430/123—Sulfur in heterocyclic ring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/124—Carbonyl compound containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/124—Carbonyl compound containing
    • Y10S430/125—Carbonyl in heterocyclic compound
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/127—Spectral sensitizer containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S522/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S522/913—Numerically specified distinct wavelength
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12729—Group IIA metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
CN2011102722066A 2006-04-13 2007-04-03 碱显影型阻焊剂及其固化物以及使用其得到的印刷线路板 Active CN102445850B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006110411A JP4827088B2 (ja) 2006-04-13 2006-04-13 アルカリ現像型ソルダーレジスト及びその硬化物並びにそれを用いて得られるプリント配線板
JP2006-110443 2006-04-13
JP2006110443A JP4827089B2 (ja) 2006-04-13 2006-04-13 アルカリ現像型ソルダーレジスト及びその硬化物並びにそれを用いて得られるプリント配線板
JP2006-110411 2006-04-13

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2007800133321A Division CN101421672B (zh) 2006-04-13 2007-04-03 碱显影型阻焊剂及其固化物以及使用其得到的印刷线路板

Publications (2)

Publication Number Publication Date
CN102445850A CN102445850A (zh) 2012-05-09
CN102445850B true CN102445850B (zh) 2013-07-31

Family

ID=38609415

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011102722066A Active CN102445850B (zh) 2006-04-13 2007-04-03 碱显影型阻焊剂及其固化物以及使用其得到的印刷线路板

Country Status (5)

Country Link
US (1) US8048613B2 (cg-RX-API-DMAC10.html)
KR (1) KR101063048B1 (cg-RX-API-DMAC10.html)
CN (1) CN102445850B (cg-RX-API-DMAC10.html)
TW (1) TW200813620A (cg-RX-API-DMAC10.html)
WO (1) WO2007119651A1 (cg-RX-API-DMAC10.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008120491A1 (ja) * 2007-03-29 2008-10-09 Taiyo Ink Mfg. Co., Ltd. 光硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板
KR101106806B1 (ko) 2007-11-07 2012-01-19 다이요 홀딩스 가부시키가이샤 광 경화성 수지 조성물 및 경화물 패턴, 및 인쇄 배선판
JP5058757B2 (ja) * 2007-11-07 2012-10-24 太陽ホールディングス株式会社 光硬化性樹脂組成物及びその硬化物パターン、並びに該硬化物パターンを具備するプリント配線板
US8202679B2 (en) * 2007-12-25 2012-06-19 Adeka Corporation Oxime ester compound and photopolymerization initiator containing the same
JP5520509B2 (ja) * 2009-03-31 2014-06-11 太陽ホールディングス株式会社 硬化性樹脂組成物
JP5415923B2 (ja) 2009-12-14 2014-02-12 太陽ホールディングス株式会社 感光性樹脂組成物、そのドライフィルム及びそれらを用いたプリント配線板
JP5638285B2 (ja) * 2010-05-31 2014-12-10 富士フイルム株式会社 重合性組成物、硬化膜、カラーフィルタ、カラーフィルタの製造方法、および固体撮像素子
KR101256553B1 (ko) * 2010-09-16 2013-04-23 주식회사 엘지화학 감광성 수지 조성물, 드라이 필름 솔더 레지스트 및 회로 기판
TWI541594B (zh) * 2011-09-30 2016-07-11 太陽油墨製造股份有限公司 A photosensitive resin composition, a hardened film thereof, and a printed wiring board
JP5875821B2 (ja) * 2011-09-30 2016-03-02 太陽インキ製造株式会社 感光性樹脂組成物、その硬化皮膜およびプリント配線板
TW201435495A (zh) * 2011-09-30 2014-09-16 太陽油墨製造股份有限公司 感光性樹脂組成物、其之硬化皮膜及印刷配線板
JP6557155B2 (ja) * 2015-02-02 2019-08-07 株式会社日本触媒 硬化性樹脂およびその製造方法
US10381296B2 (en) * 2017-03-06 2019-08-13 Advanced Semiconductor Engineering, Inc. Semiconductor device package and a method of manufacturing the same
US10446515B2 (en) * 2017-03-06 2019-10-15 Advanced Semiconductor Engineering, Inc. Semiconductor substrate and semiconductor packaging device, and method for forming the same
JP7028828B2 (ja) * 2019-05-28 2022-03-02 株式会社タムラ製作所 保護被膜を有する配線板の製造方法
KR102925045B1 (ko) * 2023-10-25 2026-02-09 주식회사 케이씨씨 신뢰성 평가 방법 및 상기 평가 방법에 따라 측정된 신뢰성이 우수한 감광성 수지 조성물

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1299812A (zh) * 1999-12-15 2001-06-20 西巴特殊化学品控股有限公司 肟酯光引发剂
CN1514845A (zh) * 2001-06-11 2004-07-21 �������⻯ѧƷ�ع����޹�˾ 具有复合结构的肟酯光引发剂

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2900137B2 (ja) 1995-09-18 1999-06-02 日華化学株式会社 光硬化性樹脂
JP2000338665A (ja) * 1999-05-26 2000-12-08 Mitsubishi Chemicals Corp 感光性材料
SG97168A1 (en) 1999-12-15 2003-07-18 Ciba Sc Holding Ag Photosensitive resin composition
WO2002096969A1 (en) 2001-05-25 2002-12-05 Taiyo Ink Manufacturing Co., Ltd. Light- and heat-curing resin composition
JP4008273B2 (ja) * 2002-03-26 2007-11-14 太陽インキ製造株式会社 アルカリ現像型感光性樹脂組成物及びそれを用いたプリント配線基板
TW200417294A (en) * 2002-11-28 2004-09-01 Taiyo Ink Mfg Co Ltd Photo- and thermo-setting resin composition and printed wiring boards made by using the same
JP4437651B2 (ja) * 2003-08-28 2010-03-24 新日鐵化学株式会社 感光性樹脂組成物及びそれを用いたカラーフィルター
JP2006259150A (ja) * 2005-03-16 2006-09-28 Tamura Kaken Co Ltd 感光性樹脂組成物およびプリント配線板
TW200710572A (en) * 2005-05-31 2007-03-16 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting resin composition, curing/setting product thereof and printed wiring board obtained using the same
EP1906242B1 (en) * 2005-06-30 2015-07-15 DIC Corporation Photosensitive resin composition
WO2007111336A1 (ja) * 2006-03-29 2007-10-04 Taiyo Ink Mfg. Co., Ltd. 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
WO2008059670A1 (en) * 2006-11-15 2008-05-22 Taiyo Ink Mfg. Co., Ltd. Photocurable/thermosetting resin composition, cured object, and printed wiring board
WO2008120491A1 (ja) * 2007-03-29 2008-10-09 Taiyo Ink Mfg. Co., Ltd. 光硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1299812A (zh) * 1999-12-15 2001-06-20 西巴特殊化学品控股有限公司 肟酯光引发剂
CN1514845A (zh) * 2001-06-11 2004-07-21 �������⻯ѧƷ�ع����޹�˾ 具有复合结构的肟酯光引发剂

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2000-338665A 2000.12.08

Also Published As

Publication number Publication date
KR101063048B1 (ko) 2011-09-07
TW200813620A (en) 2008-03-16
TWI355559B (cg-RX-API-DMAC10.html) 2012-01-01
US8048613B2 (en) 2011-11-01
US20090038834A1 (en) 2009-02-12
CN102445850A (zh) 2012-05-09
KR20080106969A (ko) 2008-12-09
WO2007119651A1 (ja) 2007-10-25

Similar Documents

Publication Publication Date Title
CN101421672B (zh) 碱显影型阻焊剂及其固化物以及使用其得到的印刷线路板
JP5117623B2 (ja) 光硬化性・熱硬化性樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
KR101324848B1 (ko) 광 경화성·열 경화성 수지 조성물 및 그의 경화물 및 그것을 이용하여 얻어지는 인쇄 배선판
CN1981237B (zh) 光固化性·热固化性树脂组合物和使用其的干膜、及其固化物
KR101063048B1 (ko) 알칼리 현상형 솔더 레지스트, 그의 경화물 및 그것을 이용하여 얻어지는 인쇄 배선판
JP5567543B2 (ja) 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
JP4830051B2 (ja) 光硬化性・熱硬化性樹脂組成物、硬化物及びプリント配線板
CN101183217B (zh) 感光性组合物
CN101403856B (zh) 组合物、干膜、固化物和印刷线路板
JP5276832B2 (ja) ソルダーレジスト膜形成方法および感光性組成物
JP5384785B2 (ja) 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
CN101578555A (zh) 光固化性树脂组合物和固化物图案、以及印刷线路板
CN101183216A (zh) 感光性组合物
JP4827089B2 (ja) アルカリ現像型ソルダーレジスト及びその硬化物並びにそれを用いて得られるプリント配線板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20120509

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO HOLDINGS Co.,Ltd.

Contract record no.: 2011990000116

Denomination of invention: Alkali developable solder resist, cured product of the same and printed wiring board obtained using the same

Granted publication date: 20130731

License type: Common License

Record date: 20110302

LICC Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model
EC01 Cancellation of recordation of patent licensing contract
EC01 Cancellation of recordation of patent licensing contract

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO HOLDINGS Co.,Ltd.

Contract record no.: 2011990000116

Date of cancellation: 20250512

EE01 Entry into force of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20120509

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO HOLDINGS Co.,Ltd.

Contract record no.: X2025990000228

Denomination of invention: Alkali developable solder resist, cured product of the same and printed wiring board obtained using the same

Granted publication date: 20130731

License type: Common License

Record date: 20250609