CN102394199B - 具有布置成传导开关电流的衬底的mems开关阵列 - Google Patents
具有布置成传导开关电流的衬底的mems开关阵列 Download PDFInfo
- Publication number
- CN102394199B CN102394199B CN201110175517.0A CN201110175517A CN102394199B CN 102394199 B CN102394199 B CN 102394199B CN 201110175517 A CN201110175517 A CN 201110175517A CN 102394199 B CN102394199 B CN 102394199B
- Authority
- CN
- China
- Prior art keywords
- mems
- substrate
- mechanical system
- electro mechanical
- micro electro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
- H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0063—Switches making use of microelectromechanical systems [MEMS] having electrostatic latches, i.e. the activated position is kept by electrostatic forces other than the activation force
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
- H01H2001/0084—Switches making use of microelectromechanical systems [MEMS] with perpendicular movement of the movable contact relative to the substrate
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Micromachines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/817,578 US8576029B2 (en) | 2010-06-17 | 2010-06-17 | MEMS switching array having a substrate arranged to conduct switching current |
| US12/817578 | 2010-06-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102394199A CN102394199A (zh) | 2012-03-28 |
| CN102394199B true CN102394199B (zh) | 2015-11-25 |
Family
ID=44823403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110175517.0A Active CN102394199B (zh) | 2010-06-17 | 2011-06-17 | 具有布置成传导开关电流的衬底的mems开关阵列 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8576029B2 (https=) |
| EP (1) | EP2398028B1 (https=) |
| JP (1) | JP5802060B2 (https=) |
| CN (1) | CN102394199B (https=) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8635765B2 (en) * | 2011-06-15 | 2014-01-28 | International Business Machines Corporation | Method of forming micro-electrical-mechanical structure (MEMS) |
| US8916996B2 (en) | 2011-07-29 | 2014-12-23 | General Electric Company | Electrical distribution system |
| US9573801B2 (en) * | 2011-09-13 | 2017-02-21 | Texas Instruments Incorporated | MEMS electrostatic actuator device for RF varactor applications |
| US8659326B1 (en) | 2012-09-28 | 2014-02-25 | General Electric Company | Switching apparatus including gating circuitry for actuating micro-electromechanical system (MEMS) switches |
| US9583294B2 (en) * | 2014-04-25 | 2017-02-28 | Analog Devices Global | MEMS swtich with internal conductive path |
| US9362608B1 (en) * | 2014-12-03 | 2016-06-07 | General Electric Company | Multichannel relay assembly with in line MEMS switches |
| WO2016092475A1 (en) * | 2014-12-10 | 2016-06-16 | Okulov Paul D | Micro electro-mechanical strain displacement sensor and usage monitoring system |
| US10640363B2 (en) | 2016-02-04 | 2020-05-05 | Analog Devices Global | Active opening MEMS switch device |
| EP3654358B1 (en) | 2018-11-15 | 2025-12-31 | Infineon Technologies Austria AG | MEMS POWER RELAY CIRCUIT |
| DE102019211460A1 (de) | 2019-07-31 | 2021-02-04 | Siemens Aktiengesellschaft | Anordnung von MEMS-Schaltern |
| EP3929960A1 (de) * | 2020-06-26 | 2021-12-29 | Siemens Aktiengesellschaft | Mems-schalter, verfahren zur herstellung eines mems-schalters und vorrichtung |
| EP3979291A1 (de) * | 2020-09-30 | 2022-04-06 | Siemens Aktiengesellschaft | Elektronikmodul und anlage |
| US12365579B2 (en) | 2021-12-29 | 2025-07-22 | Menlo Microsystems, Inc. | Distributed MEMS switch array design with multiple input/output ports |
| US20240274388A1 (en) * | 2023-02-14 | 2024-08-15 | Texas Instruments Incorporated | Electromechanical switch |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226856A (zh) * | 2007-01-18 | 2008-07-23 | 富士通株式会社 | 微开关器件及其制造方法 |
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| JPH05242788A (ja) * | 1992-02-25 | 1993-09-21 | Matsushita Electric Works Ltd | 静電リレー |
| US6384353B1 (en) * | 2000-02-01 | 2002-05-07 | Motorola, Inc. | Micro-electromechanical system device |
| US7294563B2 (en) | 2000-08-10 | 2007-11-13 | Applied Materials, Inc. | Semiconductor on insulator vertical transistor fabrication and doping process |
| US6504118B2 (en) * | 2000-10-27 | 2003-01-07 | Daniel J Hyman | Microfabricated double-throw relay with multimorph actuator and electrostatic latch mechanism |
| US20020096421A1 (en) * | 2000-11-29 | 2002-07-25 | Cohn Michael B. | MEMS device with integral packaging |
| JP3750574B2 (ja) * | 2001-08-16 | 2006-03-01 | 株式会社デンソー | 薄膜電磁石およびこれを用いたスイッチング素子 |
| US20030057544A1 (en) * | 2001-09-13 | 2003-03-27 | Nathan Richard J. | Integrated assembly protocol |
| US6778046B2 (en) * | 2001-09-17 | 2004-08-17 | Magfusion Inc. | Latching micro magnetic relay packages and methods of packaging |
| EP1331656A1 (en) * | 2002-01-23 | 2003-07-30 | Alcatel | Process for fabricating an adsl relay array |
| US6624003B1 (en) * | 2002-02-06 | 2003-09-23 | Teravicta Technologies, Inc. | Integrated MEMS device and package |
| DE10217610B4 (de) | 2002-04-19 | 2005-11-03 | Infineon Technologies Ag | Metall-Halbleiter-Kontakt, Halbleiterbauelement, integrierte Schaltungsanordnung und Verfahren |
| JP2005536013A (ja) | 2002-08-08 | 2005-11-24 | エックスコム ワイアレス インコーポレイテッド | マルチモルフ・アクチュエータと静電ラッチメカニズムとを有するマイクロ・ファブリケーションされた双投リレー |
| DE10238523B4 (de) * | 2002-08-22 | 2014-10-02 | Epcos Ag | Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung |
| FR2845075B1 (fr) * | 2002-09-27 | 2005-08-05 | Thales Sa | Microcommutateurs a actuation electrostatique a faible temps de reponse et commutation de puissance et procede de realisation associe |
| US7719054B2 (en) | 2006-05-31 | 2010-05-18 | Advanced Analogic Technologies, Inc. | High-voltage lateral DMOS device |
| KR100513723B1 (ko) * | 2002-11-18 | 2005-09-08 | 삼성전자주식회사 | Mems스위치 |
| JP4066928B2 (ja) * | 2002-12-12 | 2008-03-26 | 株式会社村田製作所 | Rfmemsスイッチ |
| ITMI20022769A1 (it) * | 2002-12-24 | 2004-06-25 | St Microelectronics Srl | Metodo per realizzare un interruttore |
| US6873017B2 (en) | 2003-05-14 | 2005-03-29 | Fairchild Semiconductor Corporation | ESD protection for semiconductor products |
| US7170155B2 (en) * | 2003-06-25 | 2007-01-30 | Intel Corporation | MEMS RF switch module including a vertical via |
| US20050012212A1 (en) * | 2003-07-17 | 2005-01-20 | Cookson Electronics, Inc. | Reconnectable chip interface and chip package |
| US20050225412A1 (en) * | 2004-03-31 | 2005-10-13 | Limcangco Naomi O | Microelectromechanical switch with an arc reduction environment |
| DE102004026232B4 (de) | 2004-05-28 | 2006-05-04 | Infineon Technologies Ag | Verfahren zum Ausbilden einer integrierten Halbleiterschaltungsanordnung |
| MX2007003577A (es) | 2004-09-27 | 2007-05-23 | Idc Llc | Conmutadores mems con membranas de deformacion. |
| DE102005026408B3 (de) | 2005-06-08 | 2007-02-01 | Infineon Technologies Ag | Verfahren zur Herstellung einer Stoppzone in einem Halbleiterkörper und Halbleiterbauelement mit einer Stoppzone |
| JP4489651B2 (ja) * | 2005-07-22 | 2010-06-23 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
| US7276991B2 (en) | 2005-09-09 | 2007-10-02 | Innovative Micro Technology | Multiple switch MEMS structure and method of manufacture |
| US7663456B2 (en) | 2005-12-15 | 2010-02-16 | General Electric Company | Micro-electromechanical system (MEMS) switch arrays |
| JP4234737B2 (ja) * | 2006-07-24 | 2009-03-04 | 株式会社東芝 | Memsスイッチ |
| US7554154B2 (en) | 2006-07-28 | 2009-06-30 | Alpha Omega Semiconductor, Ltd. | Bottom source LDMOSFET structure and method |
| US7679104B2 (en) | 2006-11-09 | 2010-03-16 | The Furukawa Electric Co., Ltd. | Vertical type semiconductor device and manufacturing method of the device |
| US7332835B1 (en) | 2006-11-28 | 2008-02-19 | General Electric Company | Micro-electromechanical system based switching module serially stackable with other such modules to meet a voltage rating |
| DE102006061386B3 (de) * | 2006-12-23 | 2008-06-19 | Atmel Germany Gmbh | Integrierte Anordnung, ihre Verwendung und Verfahren zu ihrer Herstellung |
| US7663196B2 (en) * | 2007-02-09 | 2010-02-16 | Freescale Semiconductor, Inc. | Integrated passive device and method of fabrication |
| US7605466B2 (en) | 2007-10-15 | 2009-10-20 | General Electric Company | Sealed wafer packaging of microelectromechanical systems |
| US7915696B2 (en) * | 2007-10-24 | 2011-03-29 | General Electric Company | Electrical connection through a substrate to a microelectromechanical device |
| JP4492677B2 (ja) * | 2007-11-09 | 2010-06-30 | セイコーエプソン株式会社 | アクティブマトリクス装置、電気光学表示装置、および電子機器 |
| US7609136B2 (en) * | 2007-12-20 | 2009-10-27 | General Electric Company | MEMS microswitch having a conductive mechanical stop |
| US7692519B2 (en) | 2007-12-21 | 2010-04-06 | General Electric Company | MEMS switch with improved standoff voltage control |
-
2010
- 2010-06-17 US US12/817,578 patent/US8576029B2/en active Active
-
2011
- 2011-06-10 JP JP2011129654A patent/JP5802060B2/ja active Active
- 2011-06-14 EP EP11169822.1A patent/EP2398028B1/en active Active
- 2011-06-17 CN CN201110175517.0A patent/CN102394199B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226856A (zh) * | 2007-01-18 | 2008-07-23 | 富士通株式会社 | 微开关器件及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20110308924A1 (en) | 2011-12-22 |
| JP2012004112A (ja) | 2012-01-05 |
| JP5802060B2 (ja) | 2015-10-28 |
| CN102394199A (zh) | 2012-03-28 |
| EP2398028A3 (en) | 2012-09-05 |
| EP2398028B1 (en) | 2015-08-12 |
| EP2398028A2 (en) | 2011-12-21 |
| US8576029B2 (en) | 2013-11-05 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |