ITMI20022769A1 - Metodo per realizzare un interruttore - Google Patents
Metodo per realizzare un interruttoreInfo
- Publication number
- ITMI20022769A1 ITMI20022769A1 IT002769A ITMI20022769A ITMI20022769A1 IT MI20022769 A1 ITMI20022769 A1 IT MI20022769A1 IT 002769 A IT002769 A IT 002769A IT MI20022769 A ITMI20022769 A IT MI20022769A IT MI20022769 A1 ITMI20022769 A1 IT MI20022769A1
- Authority
- IT
- Italy
- Prior art keywords
- switch
- making
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
- H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT002769A ITMI20022769A1 (it) | 2002-12-24 | 2002-12-24 | Metodo per realizzare un interruttore |
US10/746,868 US7022542B2 (en) | 2002-12-24 | 2003-12-24 | Manufacturing method of a microelectromechanical switch |
US11/343,400 US7242066B2 (en) | 2002-12-24 | 2006-01-31 | Manufacturing method of a microelectromechanical switch |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT002769A ITMI20022769A1 (it) | 2002-12-24 | 2002-12-24 | Metodo per realizzare un interruttore |
Publications (1)
Publication Number | Publication Date |
---|---|
ITMI20022769A1 true ITMI20022769A1 (it) | 2004-06-25 |
Family
ID=32800684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT002769A ITMI20022769A1 (it) | 2002-12-24 | 2002-12-24 | Metodo per realizzare un interruttore |
Country Status (2)
Country | Link |
---|---|
US (2) | US7022542B2 (it) |
IT (1) | ITMI20022769A1 (it) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4137845B2 (ja) * | 2004-02-27 | 2008-08-20 | 東京エレクトロン株式会社 | 半導体装置 |
KR100761476B1 (ko) * | 2004-07-13 | 2007-09-27 | 삼성전자주식회사 | 반도체를 이용한 멤스 rf-스위치 |
US7528529B2 (en) | 2005-10-17 | 2009-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Micro electro mechanical system, semiconductor device, and manufacturing method thereof |
KR100744543B1 (ko) * | 2005-12-08 | 2007-08-01 | 한국전자통신연구원 | 미세전자기계적 구조 스위치 및 그 제조방법 |
CN100389474C (zh) * | 2006-04-17 | 2008-05-21 | 东南大学 | 射频微电子机械双膜桥并联电容式开关及其制造方法 |
JP2008132583A (ja) * | 2006-10-24 | 2008-06-12 | Seiko Epson Corp | Memsデバイス |
KR100799722B1 (ko) * | 2006-12-12 | 2008-02-01 | 삼성전자주식회사 | 메모리 소자 및 그 제조 방법 |
US8633552B1 (en) * | 2007-03-01 | 2014-01-21 | Micrel, Incorporated | ESD protection for MEMS resonator devices |
US9343242B2 (en) * | 2007-06-22 | 2016-05-17 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Method of making contact posts for a microelectromechanical device |
WO2009067222A1 (en) * | 2007-11-19 | 2009-05-28 | Xcom Wireless, Inc. | Microfabricated cantilever slider with asymmetric spring constant |
US7863079B2 (en) | 2008-02-05 | 2011-01-04 | Qualcomm Mems Technologies, Inc. | Methods of reducing CD loss in a microelectromechanical device |
US9019756B2 (en) * | 2008-02-14 | 2015-04-28 | Cavendish Kinetics, Ltd | Architecture for device having cantilever electrode |
US7943410B2 (en) * | 2008-12-10 | 2011-05-17 | Stmicroelectronics, Inc. | Embedded microelectromechanical systems (MEMS) semiconductor substrate and related method of forming |
US7998775B2 (en) * | 2009-02-09 | 2011-08-16 | Taiwan Semiconductor Manufacturing Company, Ltd. | Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures |
US8304274B2 (en) * | 2009-02-13 | 2012-11-06 | Texas Instruments Incorporated | Micro-electro-mechanical system having movable element integrated into substrate-based package |
DE102010012607B4 (de) * | 2010-03-24 | 2012-01-26 | Eads Deutschland Gmbh | HF-MEMS-Schalter |
US8576029B2 (en) * | 2010-06-17 | 2013-11-05 | General Electric Company | MEMS switching array having a substrate arranged to conduct switching current |
US8635765B2 (en) * | 2011-06-15 | 2014-01-28 | International Business Machines Corporation | Method of forming micro-electrical-mechanical structure (MEMS) |
EP2751022B1 (en) | 2011-09-02 | 2019-04-17 | Cavendish Kinetics Inc. | Mems device anchoring |
DE102012219550B4 (de) | 2012-10-25 | 2024-04-18 | Robert Bosch Gmbh | Hybrid integriertes Bauteil |
US9123492B2 (en) * | 2012-12-19 | 2015-09-01 | International Business Machines Corporation | Three-dimensional inter-chip contact through vertical displacement MEMS |
CN110853985B (zh) * | 2019-11-01 | 2021-04-16 | 北京邮电大学 | 一种并联式电容开关 |
EP3979298A1 (en) * | 2020-09-30 | 2022-04-06 | Infineon Technologies Austria AG | Device for controlling trapped ions and method of manufacturing the same |
DE102022212184A1 (de) | 2022-11-16 | 2024-05-16 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanische Vorrichtung mit Kaverne und elektrisch isolierender Stützstruktur und Verfahren zur Herstellung |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5638946A (en) * | 1996-01-11 | 1997-06-17 | Northeastern University | Micromechanical switch with insulated switch contact |
US20020096421A1 (en) * | 2000-11-29 | 2002-07-25 | Cohn Michael B. | MEMS device with integral packaging |
DE10291877B4 (de) * | 2001-04-26 | 2009-01-02 | Advantest Corp. | Mikroschalter und Verfahren zum Herstellen eines Mikroschalters |
-
2002
- 2002-12-24 IT IT002769A patent/ITMI20022769A1/it unknown
-
2003
- 2003-12-24 US US10/746,868 patent/US7022542B2/en not_active Expired - Lifetime
-
2006
- 2006-01-31 US US11/343,400 patent/US7242066B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US7242066B2 (en) | 2007-07-10 |
US20040157364A1 (en) | 2004-08-12 |
US20060134821A1 (en) | 2006-06-22 |
US7022542B2 (en) | 2006-04-04 |
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