GB0217425D0 - Patterning method - Google Patents

Patterning method

Info

Publication number
GB0217425D0
GB0217425D0 GBGB0217425.8A GB0217425A GB0217425D0 GB 0217425 D0 GB0217425 D0 GB 0217425D0 GB 0217425 A GB0217425 A GB 0217425A GB 0217425 D0 GB0217425 D0 GB 0217425D0
Authority
GB
United Kingdom
Prior art keywords
patterning method
patterning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB0217425.8A
Other versions
GB2391385A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to GB0217425A priority Critical patent/GB2391385A/en
Publication of GB0217425D0 publication Critical patent/GB0217425D0/en
Priority to EP03254560A priority patent/EP1385364A3/en
Priority to US10/623,495 priority patent/US7115507B2/en
Priority to TW092120129A priority patent/TWI299197B/en
Priority to KR1020030051559A priority patent/KR101063833B1/en
Priority to JP2003202638A priority patent/JP4917735B2/en
Priority to CNB031436463A priority patent/CN100418184C/en
Publication of GB2391385A publication Critical patent/GB2391385A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
GB0217425A 2002-07-26 2002-07-26 Patterning method by forming indent region to control spreading of liquid material deposited onto substrate Withdrawn GB2391385A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB0217425A GB2391385A (en) 2002-07-26 2002-07-26 Patterning method by forming indent region to control spreading of liquid material deposited onto substrate
EP03254560A EP1385364A3 (en) 2002-07-26 2003-07-21 Patterning method
US10/623,495 US7115507B2 (en) 2002-07-26 2003-07-22 Patterning method
TW092120129A TWI299197B (en) 2002-07-26 2003-07-23 Patterning method
KR1020030051559A KR101063833B1 (en) 2002-07-26 2003-07-25 Patterning method
JP2003202638A JP4917735B2 (en) 2002-07-26 2003-07-28 Patterning method, electronic device manufacturing method, electro-optical device manufacturing method, conductive internal connection manufacturing method, color filter manufacturing method, printed circuit board manufacturing method, and DNA array microchip manufacturing method
CNB031436463A CN100418184C (en) 2002-07-26 2003-07-28 Pattern forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0217425A GB2391385A (en) 2002-07-26 2002-07-26 Patterning method by forming indent region to control spreading of liquid material deposited onto substrate

Publications (2)

Publication Number Publication Date
GB0217425D0 true GB0217425D0 (en) 2002-09-04
GB2391385A GB2391385A (en) 2004-02-04

Family

ID=9941215

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0217425A Withdrawn GB2391385A (en) 2002-07-26 2002-07-26 Patterning method by forming indent region to control spreading of liquid material deposited onto substrate

Country Status (7)

Country Link
US (1) US7115507B2 (en)
EP (1) EP1385364A3 (en)
JP (1) JP4917735B2 (en)
KR (1) KR101063833B1 (en)
CN (1) CN100418184C (en)
GB (1) GB2391385A (en)
TW (1) TWI299197B (en)

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US10285910B2 (en) 2001-10-12 2019-05-14 Aquestive Therapeutics, Inc. Sublingual and buccal film compositions
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JP5176414B2 (en) 2007-07-11 2013-04-03 株式会社リコー Organic transistor array and display device
US20090014716A1 (en) 2007-07-11 2009-01-15 Takumi Yamaga Organic thin-film transistor and method of manufacturing the same
WO2009011445A1 (en) * 2007-07-18 2009-01-22 Ricoh Company, Ltd. Laminate structure, electronic device, and display device
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Also Published As

Publication number Publication date
CN100418184C (en) 2008-09-10
TWI299197B (en) 2008-07-21
KR101063833B1 (en) 2011-09-08
CN1476049A (en) 2004-02-18
JP2004141856A (en) 2004-05-20
TW200403771A (en) 2004-03-01
EP1385364A2 (en) 2004-01-28
KR20040010404A (en) 2004-01-31
US20050176242A1 (en) 2005-08-11
EP1385364A3 (en) 2005-03-02
GB2391385A (en) 2004-02-04
US7115507B2 (en) 2006-10-03
JP4917735B2 (en) 2012-04-18

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Legal Events

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)