CN102371372B - 车刀轮 - Google Patents

车刀轮 Download PDF

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Publication number
CN102371372B
CN102371372B CN201110220277.1A CN201110220277A CN102371372B CN 102371372 B CN102371372 B CN 102371372B CN 201110220277 A CN201110220277 A CN 201110220277A CN 102371372 B CN102371372 B CN 102371372B
Authority
CN
China
Prior art keywords
lathe tool
assembly
department
wheel
counterweight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201110220277.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN102371372A (zh
Inventor
川瀬雅之
波冈伸一
松田智人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN102371372A publication Critical patent/CN102371372A/zh
Application granted granted Critical
Publication of CN102371372B publication Critical patent/CN102371372B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Milling Processes (AREA)
  • Turning (AREA)
  • Dicing (AREA)
CN201110220277.1A 2010-08-04 2011-08-02 车刀轮 Active CN102371372B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010175340A JP5729937B2 (ja) 2010-08-04 2010-08-04 バイトホイール
JP2010-175340 2010-08-04

Publications (2)

Publication Number Publication Date
CN102371372A CN102371372A (zh) 2012-03-14
CN102371372B true CN102371372B (zh) 2015-07-15

Family

ID=45790917

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110220277.1A Active CN102371372B (zh) 2010-08-04 2011-08-02 车刀轮

Country Status (4)

Country Link
JP (1) JP5729937B2 (ja)
KR (1) KR101692083B1 (ja)
CN (1) CN102371372B (ja)
TW (1) TWI531456B (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101505895A (zh) * 2006-05-03 2009-08-12 瓦莱尼特有限责任公司 带有可调整可转位切削刀件的切削刀具

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987004969A1 (en) * 1986-02-24 1987-08-27 James Wilson Cutting tool
JPS63131312U (ja) * 1987-02-18 1988-08-26
JPH0417014U (ja) * 1990-05-31 1992-02-12
JP4249827B2 (ja) 1998-12-04 2009-04-08 株式会社ディスコ 半導体ウェーハの製造方法
JP3835052B2 (ja) * 1999-04-06 2006-10-18 三菱マテリアル株式会社 転削工具
JP2004174691A (ja) * 2002-11-29 2004-06-24 Sanyo Kogyo:Kk 樹脂材端面の鏡面仕上げ用カッターおよびそのカッターを具備した樹脂材端面の鏡面仕上げ装置
JP2006116627A (ja) * 2004-10-20 2006-05-11 Sanyo Kogyo:Kk 樹脂材の鏡面仕上げ用カッタ
JP4875532B2 (ja) * 2007-04-03 2012-02-15 株式会社ディスコ 切削加工装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101505895A (zh) * 2006-05-03 2009-08-12 瓦莱尼特有限责任公司 带有可调整可转位切削刀件的切削刀具

Also Published As

Publication number Publication date
CN102371372A (zh) 2012-03-14
JP2012035344A (ja) 2012-02-23
JP5729937B2 (ja) 2015-06-03
TW201210775A (en) 2012-03-16
KR20120022594A (ko) 2012-03-12
TWI531456B (zh) 2016-05-01
KR101692083B1 (ko) 2017-01-02

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