JP2012035344A - バイトホイール - Google Patents
バイトホイール Download PDFInfo
- Publication number
- JP2012035344A JP2012035344A JP2010175340A JP2010175340A JP2012035344A JP 2012035344 A JP2012035344 A JP 2012035344A JP 2010175340 A JP2010175340 A JP 2010175340A JP 2010175340 A JP2010175340 A JP 2010175340A JP 2012035344 A JP2012035344 A JP 2012035344A
- Authority
- JP
- Japan
- Prior art keywords
- bite
- wheel
- cutting
- mounting portion
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 58
- 238000004904 shortening Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 35
- 239000004065 semiconductor Substances 0.000 description 14
- 230000002093 peripheral effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000007921 spray Substances 0.000 description 3
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000000593 degrading effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Milling Processes (AREA)
- Turning (AREA)
- Dicing (AREA)
Abstract
【解決手段】 被加工物を切削するバイトホイールであって、回転中心から半径方向に第1の距離の位置に形成された第1装着部と、該第1の距離と異なる第2の距離の位置に形成された第2装着部とを有するホイール基台と、該ホイール基台の該第1装着部及び第2装着部の何れか一方に装着された、バイトシャンクと、該バイトシャンクの一端部に固着された切削刃とを有するバイトユニットと、を具備したことを特徴とする。
【選択図】図5
Description
スピンドル一回転当たりのウエーハWの送り量=チャックテーブル30の送り速度/スピンドル回転数…(2)
従って、小径のウエーハWを切削する際に本実施形態のようにバイトユニット26の装着位置を小径位置とすると、バイトユニット26の周速を一定にするためには、(1)式からスピンドル回転数を上昇する必要がある。
D デバイス
2 バイト切削装置
5 バンプ
10 バイト切削ユニット
25 バイトホイール
26 バイトユニット
30 チャックテーブル
50 ホイール基台
64 第1の装着部
66 第2の装着部
70 シャンク(バイトシャンク)
72 切削刃
84 第3の装着部
Claims (2)
- 被加工物を切削するバイトホイールであって、
回転中心から半径方向に第1の距離の位置に形成された第1装着部と、該第1の距離と異なる第2の距離の位置に形成された第2装着部とを有するホイール基台と、
該ホイール基台の該第1装着部及び第2装着部の何れか一方に装着された、バイトシャンクと、該バイトシャンクの一端部に固着された切削刃とを有するバイトユニットと、
を具備したことを特徴とするバイトホイール。 - 該ホイール基台は、回転中心を基準に該第1装着部と該第2装着部に対して点対称位置に形成された第1錘装着部と第2錘装着部とを有しており、
該第1装着部及び該第2装着部の何れか一方に装着された該バイトユニットに対して点対称位置の該第1錘装着部及び該第2錘装着部の何れか一方に装着された、該バイトユニットと同一重量を有するバランス取り用錘を更に具備したことを特徴とする請求項1記載のバイトホイール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010175340A JP5729937B2 (ja) | 2010-08-04 | 2010-08-04 | バイトホイール |
TW100125471A TWI531456B (zh) | 2010-08-04 | 2011-07-19 | Cutting wheel (2) |
KR1020110076704A KR101692083B1 (ko) | 2010-08-04 | 2011-08-01 | 바이트 휠 |
CN201110220277.1A CN102371372B (zh) | 2010-08-04 | 2011-08-02 | 车刀轮 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010175340A JP5729937B2 (ja) | 2010-08-04 | 2010-08-04 | バイトホイール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012035344A true JP2012035344A (ja) | 2012-02-23 |
JP5729937B2 JP5729937B2 (ja) | 2015-06-03 |
Family
ID=45790917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010175340A Active JP5729937B2 (ja) | 2010-08-04 | 2010-08-04 | バイトホイール |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5729937B2 (ja) |
KR (1) | KR101692083B1 (ja) |
CN (1) | CN102371372B (ja) |
TW (1) | TWI531456B (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63131312U (ja) * | 1987-02-18 | 1988-08-26 | ||
US4827995A (en) * | 1986-02-24 | 1989-05-09 | James Wilson | Cutting tool |
JPH0417014U (ja) * | 1990-05-31 | 1992-02-12 | ||
JP2000288819A (ja) * | 1999-04-06 | 2000-10-17 | Mitsubishi Materials Corp | 転削工具 |
JP2008258321A (ja) * | 2007-04-03 | 2008-10-23 | Disco Abrasive Syst Ltd | 切削加工方法および切削加工装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4249827B2 (ja) | 1998-12-04 | 2009-04-08 | 株式会社ディスコ | 半導体ウェーハの製造方法 |
JP2004174691A (ja) * | 2002-11-29 | 2004-06-24 | Sanyo Kogyo:Kk | 樹脂材端面の鏡面仕上げ用カッターおよびそのカッターを具備した樹脂材端面の鏡面仕上げ装置 |
JP2006116627A (ja) * | 2004-10-20 | 2006-05-11 | Sanyo Kogyo:Kk | 樹脂材の鏡面仕上げ用カッタ |
US7390150B2 (en) * | 2006-05-03 | 2008-06-24 | Valenite Llc | Cutting tool with adjustable indexable cutting insert |
-
2010
- 2010-08-04 JP JP2010175340A patent/JP5729937B2/ja active Active
-
2011
- 2011-07-19 TW TW100125471A patent/TWI531456B/zh active
- 2011-08-01 KR KR1020110076704A patent/KR101692083B1/ko active IP Right Grant
- 2011-08-02 CN CN201110220277.1A patent/CN102371372B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4827995A (en) * | 1986-02-24 | 1989-05-09 | James Wilson | Cutting tool |
JPS63131312U (ja) * | 1987-02-18 | 1988-08-26 | ||
JPH0417014U (ja) * | 1990-05-31 | 1992-02-12 | ||
JP2000288819A (ja) * | 1999-04-06 | 2000-10-17 | Mitsubishi Materials Corp | 転削工具 |
JP2008258321A (ja) * | 2007-04-03 | 2008-10-23 | Disco Abrasive Syst Ltd | 切削加工方法および切削加工装置 |
Also Published As
Publication number | Publication date |
---|---|
CN102371372A (zh) | 2012-03-14 |
JP5729937B2 (ja) | 2015-06-03 |
TW201210775A (en) | 2012-03-16 |
KR20120022594A (ko) | 2012-03-12 |
TWI531456B (zh) | 2016-05-01 |
KR101692083B1 (ko) | 2017-01-02 |
CN102371372B (zh) | 2015-07-15 |
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