KR101692083B1 - 바이트 휠 - Google Patents

바이트 휠 Download PDF

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Publication number
KR101692083B1
KR101692083B1 KR1020110076704A KR20110076704A KR101692083B1 KR 101692083 B1 KR101692083 B1 KR 101692083B1 KR 1020110076704 A KR1020110076704 A KR 1020110076704A KR 20110076704 A KR20110076704 A KR 20110076704A KR 101692083 B1 KR101692083 B1 KR 101692083B1
Authority
KR
South Korea
Prior art keywords
bite
wheel
mounting portion
cutting
mounting
Prior art date
Application number
KR1020110076704A
Other languages
English (en)
Korean (ko)
Other versions
KR20120022594A (ko
Inventor
마사유키 가와세
신이치 나미오카
도모히토 마츠다
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20120022594A publication Critical patent/KR20120022594A/ko
Application granted granted Critical
Publication of KR101692083B1 publication Critical patent/KR101692083B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Milling Processes (AREA)
  • Turning (AREA)
  • Dicing (AREA)
KR1020110076704A 2010-08-04 2011-08-01 바이트 휠 KR101692083B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-175340 2010-08-04
JP2010175340A JP5729937B2 (ja) 2010-08-04 2010-08-04 バイトホイール

Publications (2)

Publication Number Publication Date
KR20120022594A KR20120022594A (ko) 2012-03-12
KR101692083B1 true KR101692083B1 (ko) 2017-01-02

Family

ID=45790917

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110076704A KR101692083B1 (ko) 2010-08-04 2011-08-01 바이트 휠

Country Status (4)

Country Link
JP (1) JP5729937B2 (ja)
KR (1) KR101692083B1 (ja)
CN (1) CN102371372B (ja)
TW (1) TWI531456B (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR8707610A (pt) * 1986-02-24 1989-03-14 James Wilson Ferramenta de corte
JPS63131312U (ja) * 1987-02-18 1988-08-26
JPH0417014U (ja) * 1990-05-31 1992-02-12
JP4249827B2 (ja) 1998-12-04 2009-04-08 株式会社ディスコ 半導体ウェーハの製造方法
JP3835052B2 (ja) * 1999-04-06 2006-10-18 三菱マテリアル株式会社 転削工具
JP2004174691A (ja) * 2002-11-29 2004-06-24 Sanyo Kogyo:Kk 樹脂材端面の鏡面仕上げ用カッターおよびそのカッターを具備した樹脂材端面の鏡面仕上げ装置
JP2006116627A (ja) * 2004-10-20 2006-05-11 Sanyo Kogyo:Kk 樹脂材の鏡面仕上げ用カッタ
US7390150B2 (en) * 2006-05-03 2008-06-24 Valenite Llc Cutting tool with adjustable indexable cutting insert
JP4875532B2 (ja) * 2007-04-03 2012-02-15 株式会社ディスコ 切削加工装置

Also Published As

Publication number Publication date
KR20120022594A (ko) 2012-03-12
CN102371372A (zh) 2012-03-14
TW201210775A (en) 2012-03-16
JP5729937B2 (ja) 2015-06-03
TWI531456B (zh) 2016-05-01
JP2012035344A (ja) 2012-02-23
CN102371372B (zh) 2015-07-15

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Payment date: 20191217

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