CN102361127A - SMT (Surface Mount Technology) type load sheet (30W) using alumina ceramic substrate - Google Patents
SMT (Surface Mount Technology) type load sheet (30W) using alumina ceramic substrate Download PDFInfo
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- CN102361127A CN102361127A CN2011102648890A CN201110264889A CN102361127A CN 102361127 A CN102361127 A CN 102361127A CN 2011102648890 A CN2011102648890 A CN 2011102648890A CN 201110264889 A CN201110264889 A CN 201110264889A CN 102361127 A CN102361127 A CN 102361127A
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Abstract
The invention discloses an SMT (Surface Mount Technology) type load sheet (30W) using an alumina ceramic substrate. The SMT type load sheet comprises the alumina substrate with the size of 6.35*6.35*1mm, wherein, a rear conductor layer is printed on the rear face of the alumina substrate; and resistors and leads are printed on the front face of the alumina substrate and are connected together to form a load circuit, a grounding terminal of the load circuit is electrically connected with the rear conductor layer, and glass protective films are printed on the resistors. By adopting the structure, the SMT type load sheet (30W) using the alumina ceramic substrate has the advantages of good VSWR (Voltage Standing Wave Ratio) performance, high power up to 30W on the alumina ceramic substrate with the size of 6.35*6.35*1mm and good characteristics with high frequency band of 3G, thus broadening the use range of the cheap alumina ceramic substrate which is dominant in the current market and realizing significant breakthrough in power of the resistors of the alumina substrate.
Description
Technical field
The present invention relates to a kind of aluminium oxide ceramic substrate carrier sheet, 30 watts of SMD carrier sheet of particularly a kind of aluminium oxide ceramic substrate, power reaches 30W, can be used in the SMT field, makes client realize the high speed paster, quickens processing procedure.
Background technology
Prevailing in the market aluminium oxide ceramics carrier sheet is cheap, is mainly used in the production of consumer industry low-power (less than 1 watt) plate resistor.Aluminium oxide aluminium oxide ceramics and aluminium nitride ceramics compare, and its conductive coefficient has only about 1/4th of aluminium nitride ceramics, so its thermal conductivity is poor, based on this specific character of aluminum oxide substrate, its application on the high power load sheet has obtained restriction.Then be mainly used at present main better aluminium nitride substrate of heat radiation or the poisonous beryllium oxide ceramics of adopting of the powerful carrier sheet of the communications industry as substrate, and the price of these two kinds of ceramic substrates is about 10 times of aluminium oxide ceramic substrate, in addition higher.Present most carrier sheet is that the manual welding or the reflow soldering process that adopt are welded to carrier sheet on client's the product; Again wire bonds to the pad of carrier sheet; The carrier sheet back of the body conducting shell of this technology all is an integral body; After being welded on client's the product, the whole back side and product fit like a glove, good heat dispersion performance.Some client has adopted the SMT paster technique at present, and carrier sheet back of the body conducting shell just need be reserved the slit like this, and after paster was accomplished, back of the body conducting shell can not have the product contact fully, and heat-sinking capability can variation.
Yet based on the increase day by day of production cost, market demand has should satisfy power, performance requirement, and cheap again product occurs.
Summary of the invention
Deficiency to above-mentioned prior art; The technical problem that the present invention will solve provides a kind of cheap again; And can bear the power of 30W, be of a size of 6.35*6.35*1mm, performance can reach the SMD carrier sheet of aluminium oxide ceramic substrate of 3G instructions for use.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
30 watts of SMD carrier sheet of a kind of aluminium oxide ceramic substrate; It comprises the aluminum oxide substrate of a 6.35*6.35*1mm; The back up of said aluminum oxide substrate has back of the body conducting shell, and the front of said aluminum oxide substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The two-terminal-grounding of said load circuit is electrically connected with said back of the body conducting shell, is printed with glass protection film on the said resistance.
Preferably, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
Preferably, said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Technique scheme has following beneficial effect: 30 watts of SMD carrier sheet of this structure adopt cheap aluminum oxide substrate, in the guaranteed price advantage, have good VSWR performance; Power on the aluminium oxide ceramic substrate of 6.35*6.35*1mm reaches 30W; Be suitable for the SMD production technology of SMT and use, can be used in the SMT field and carry out mechanization production, thereby quicken processing procedure; Change original manual welding mode, improved client's production efficiency.This technical scheme has been widened the scope of application of aluminum oxide substrate, performance is combined in price better, for the client provides more choices and the better product of cost performance.
Above-mentioned explanation only is the general introduction of technical scheme of the present invention, understands technological means of the present invention in order can more to know, and can implement according to the content of specification, below with preferred embodiment of the present invention and conjunction with figs. specify as after.Embodiment of the present invention is provided by following examples and accompanying drawing thereof in detail.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing the preferred embodiments of the present invention are described in detail.
As shown in Figure 1; 30 watts of SMD carrier sheet of this aluminium oxide ceramic substrate comprise the aluminum oxide substrate 1 of a 6.35*6.35*1mm; The separative back of the body conducting shell 6 of the back up of aluminum oxide substrate 1, the front of aluminum oxide substrate 1 is printed with resistance 3 and lead 2, and lead 2 connects resistance 3 and forms load circuit; The two-terminal-grounding 7 of load circuit is electrically connected through the silver slurry with back of the body conducting shell, thereby makes the load circuit earth-continuity.Back of the body conducting shell and lead 2 are formed by the conductive silver paste printing, and resistance 3 is formed by the resistance slurry printing.Be printed with glass protection film 4 on the resistance 3.The upper surface of lead 2 and glass protection film 4 also is printed with one deck black protective film 5.
30 watts of SMD carrier sheet of the aluminium oxide ceramic substrate of this structure have good VSWR performance; Power on the aluminium oxide ceramic substrate of 6.35*6.35*1mm reaches 30W; Be suitable for the SMD production technology of SMT and use, can be used in the SMT field and carry out mechanization production, thereby quicken processing procedure; Change original manual welding mode, improved client's production efficiency.This technical scheme has been widened the scope of application of aluminum oxide substrate, performance is combined in price better, for the client provides more choices and the better product of cost performance.
Power according to this aluminium oxide ceramic substrate carrier sheet of detection can be born is highly stable, can reach the requirement that communication period absorbs required power fully,
More than 30 watts of SMD carrier sheet of a kind of aluminium oxide ceramic substrate that the embodiment of the invention provided have been carried out detailed introduction; For one of ordinary skill in the art; According to the thought of the embodiment of the invention, the part that on embodiment and range of application, all can change, in sum; This description should not be construed as limitation of the present invention, and all any changes of making according to design philosophy of the present invention are all within protection scope of the present invention.
Claims (4)
1. 30 watts of SMD carrier sheet of an aluminium oxide ceramic substrate; It is characterized in that: it comprises the aluminum oxide substrate of a 6.35*6.35*1mm; The back up of said aluminum oxide substrate has back of the body conducting shell, and the front of said aluminum oxide substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The both sides earth terminal of said load circuit is electrically connected with said back of the body conducting shell, is printed with glass protection film on the said resistance.
2. according to 30 watts of SMD carrier sheet of the said aluminium oxide ceramic substrate of claim 1, it is characterized in that: said back of the body conducting shell is not an integral body, and it needs the conducting of two-terminal-grounding slurry and connects.
3. 30 watts of SMD carrier sheet of aluminium oxide ceramic substrate according to claim 1, it is characterized in that: the upper surface of said lead and glass protection film also is printed with one deck black protective film.
4. 30 watts of SMD carrier sheet of aluminium oxide ceramic substrate according to claim 1 is characterized in that: said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102648890A CN102361127A (en) | 2011-09-08 | 2011-09-08 | SMT (Surface Mount Technology) type load sheet (30W) using alumina ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102648890A CN102361127A (en) | 2011-09-08 | 2011-09-08 | SMT (Surface Mount Technology) type load sheet (30W) using alumina ceramic substrate |
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| CN102361127A true CN102361127A (en) | 2012-02-22 |
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| CN2011102648890A Pending CN102361127A (en) | 2011-09-08 | 2011-09-08 | SMT (Surface Mount Technology) type load sheet (30W) using alumina ceramic substrate |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709641A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 1-watt 2dB attenuation sheet of high-precision aluminum oxide ceramic substrate |
| CN102709645A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 1-watt 18dB attenuation sheet of aluminum oxide ceramic substrate |
| CN102709644A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 1w 28DB attenuating plate for high heat-conductivity aluminum oxide ceramic substrate |
| CN102709633A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 1-watt 30dB attenuation sheet of aluminum oxide ceramic substrate |
| CN102709646A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | Aluminum oxide ceramic substrate 1W 13dB attenuation sheet |
| CN102709650A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 1-watt 23dB attenuation sheet of aluminum oxide ceramic substrate |
| CN102723560A (en) * | 2012-06-28 | 2012-10-10 | 苏州市新诚氏电子有限公司 | 1-watt 14dB attenuator for aluminum oxide ceramic substrate |
| CN102723549A (en) * | 2012-06-28 | 2012-10-10 | 苏州市新诚氏电子有限公司 | 1-watt 22dB attenuation piece for aluminum oxide ceramic substrate |
| CN107645029A (en) * | 2017-10-24 | 2018-01-30 | 苏州市新诚氏通讯电子股份有限公司 | Aluminium oxide ceramic substrate 30dB coupling pieces |
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| US5332981A (en) * | 1992-07-31 | 1994-07-26 | Emc Technology, Inc. | Temperature variable attenuator |
| CN101075490A (en) * | 2007-05-01 | 2007-11-21 | 北海银河开关设备有限公司 | 12kV fixed-sealed resistant voltage divider |
| CN101859620A (en) * | 2009-04-08 | 2010-10-13 | 深圳市信特科技有限公司 | Manufacturing method of high-frequency high-power resistor |
| CN101923928A (en) * | 2010-03-25 | 2010-12-22 | 四平市吉华高新技术有限公司 | High-frequency patch resistor and manufacturing method thereof |
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2011
- 2011-09-08 CN CN2011102648890A patent/CN102361127A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5332981A (en) * | 1992-07-31 | 1994-07-26 | Emc Technology, Inc. | Temperature variable attenuator |
| CN101075490A (en) * | 2007-05-01 | 2007-11-21 | 北海银河开关设备有限公司 | 12kV fixed-sealed resistant voltage divider |
| CN101859620A (en) * | 2009-04-08 | 2010-10-13 | 深圳市信特科技有限公司 | Manufacturing method of high-frequency high-power resistor |
| CN101923928A (en) * | 2010-03-25 | 2010-12-22 | 四平市吉华高新技术有限公司 | High-frequency patch resistor and manufacturing method thereof |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709641A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 1-watt 2dB attenuation sheet of high-precision aluminum oxide ceramic substrate |
| CN102709645A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 1-watt 18dB attenuation sheet of aluminum oxide ceramic substrate |
| CN102709644A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 1w 28DB attenuating plate for high heat-conductivity aluminum oxide ceramic substrate |
| CN102709633A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 1-watt 30dB attenuation sheet of aluminum oxide ceramic substrate |
| CN102709646A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | Aluminum oxide ceramic substrate 1W 13dB attenuation sheet |
| CN102709650A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 1-watt 23dB attenuation sheet of aluminum oxide ceramic substrate |
| CN102723560A (en) * | 2012-06-28 | 2012-10-10 | 苏州市新诚氏电子有限公司 | 1-watt 14dB attenuator for aluminum oxide ceramic substrate |
| CN102723549A (en) * | 2012-06-28 | 2012-10-10 | 苏州市新诚氏电子有限公司 | 1-watt 22dB attenuation piece for aluminum oxide ceramic substrate |
| CN107645029A (en) * | 2017-10-24 | 2018-01-30 | 苏州市新诚氏通讯电子股份有限公司 | Aluminium oxide ceramic substrate 30dB coupling pieces |
| CN107645029B (en) * | 2017-10-24 | 2023-08-15 | 苏州市新诚氏通讯电子股份有限公司 | 30dB coupling piece of alumina ceramic substrate |
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Application publication date: 20120222 |