CN202259625U - 100W aluminium nitride ceramic substrate load sheet with wide pad and impedance of 50 ohms - Google Patents
100W aluminium nitride ceramic substrate load sheet with wide pad and impedance of 50 ohms Download PDFInfo
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- CN202259625U CN202259625U CN2011203249713U CN201120324971U CN202259625U CN 202259625 U CN202259625 U CN 202259625U CN 2011203249713 U CN2011203249713 U CN 2011203249713U CN 201120324971 U CN201120324971 U CN 201120324971U CN 202259625 U CN202259625 U CN 202259625U
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Abstract
The utility model discloses a 100W aluminium nitride ceramic substrate load sheet with a wide pad and an impedance of 50 ohms, comprising an aluminium nitride substrate with a size of 5.7*8.9*1.0 mm, wherein a back conductive layer is printed on a back side of the aluminium nitride substrate, a resistor and leads are printed on a right side of the aluminium nitride substrate, the leads are connected with the resistor to form a load circuit, a grounding end of the load circuit is electrically connected with the back conductive layer, and a glass protection film is printed on the resistors. By adopting the above structure, the 100W aluminium nitride ceramic substrate load sheet with the wide pad and the impedance of 50 ohms in the utility model has a good VSWR (Voltage Standing Wave Ratio) performance, and has a power reaching up to 100W on the aluminium nitride substrate with the size of 5.7*8.9*1.0 mm; in addition, characteristics of the 100W aluminium nitride ceramic substrate load sheet also meet requirements of 3G (3rd-Generation), so that the aluminium nitride ceramic substrate with the above size can have a wider using range, and also can further well match with equipment.
Description
Technical field
The utility model relates to a kind of aluminium nitride ceramics substrate carrier sheet, and particularly a kind of wide pad impedance is 50 Ω aluminium nitride ceramics substrates, 100 tile load sheets.
Background technology
Aluminium nitride ceramics substrate carrier sheet is mainly used in the power that in communication base station, absorbs reverse input in the communication component; If can not bear the power of requirement; Load will burn out, and in the actual use of aluminium nitride ceramics substrate carrier sheet, all needs wire bonds to the pad of carrier sheet; Adopt the design technology of little pad in the market mostly; Because can directly have influence on the return loss of product after pad amplifies, make return loss increase, if but adopt little pad then the convenience that can many welding and the fastness of welding cause adverse influence.
The utility model content
To the deficiency of above-mentioned prior art, the technical problem that the utility model will solve provides the 100W aluminium nitride ceramics substrate attenuator of a kind of convenient welding and firm welding.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of impedance is 50 Ω aluminium nitride ceramics substrates, 100 tile load sheets; It comprises the aluminium nitride substrate of a 5.7*8.9*1.0mm; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, is printed with glass protection film on the said resistance.Said load circuit is provided with the pad of wide size.
Preferably, the upper surface of said lead and glass protection film also is printed with the blue diaphragm of one deck.
Preferably, said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Technique scheme has following beneficial effect: the wide pad impedance of this structure is that 50 Ω aluminium nitride ceramics substrates, 100 tile load sheets have good VSWR performance; Make things convenient for the welding of carrier sheet and lead-in wire; Because bonding area increases, weld strength also must arrive raising, effectively the fastness of proof load sheet and wire bonds; Improve the bearing capacity of carrying tablet, reduce return loss.
Above-mentioned explanation only is the general introduction of the utility model technical scheme, in order more to know the technological means of understanding the utility model, and can implement according to the content of specification, below with the preferred embodiment of the utility model and conjunction with figs. specify as after.The embodiment of the utility model is provided by following examples and accompanying drawing thereof in detail.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment.
Embodiment
Describe in detail below in conjunction with the preferred embodiment of accompanying drawing to the utility model.
As shown in Figure 1; This wide pad impedance is the aluminium nitride substrate 1 that 50 Ω aluminium nitride ceramics substrates, 100 tile load sheets comprise a 5.7*8.9*1.0mm; The back up of aluminium nitride substrate 1 has back of the body conducting shell, and the front of aluminium nitride substrate 1 is printed with resistance 3 and lead 2, and lead 2 connects resistance 3 and forms load circuit; The earth terminal of load circuit is electrically connected through the silver slurry with back of the body conducting shell, thereby makes the load circuit earth-continuity.Back of the body conducting shell and lead 2 are formed by the conductive silver paste printing, and resistance 3 is formed by the resistance slurry printing.Be printed with glass protection film 4 on the resistance 3.The upper surface of lead 2 and glass protection film 4 also is printed with the blue diaphragm 5 of one deck.
This structure has increased the area of pad on the basis of original design, through the optimal design of circuit, guaranteed good performance simultaneously.The wide pad impedance of this structure is that 50 Ω aluminium nitride ceramics substrates, 100 tile load sheets have good VSWR performance, can use and 3G and 3G with interior communication network demand, the power on the aluminium nitride ceramics substrate of 5.7*8.9*1.0mm reaches 100W; Make things convenient for the welding of carrier sheet and lead-in wire simultaneously; Because bonding area increases, weld strength also must arrive raising, effectively the fastness of proof load sheet and wire bonds; Improve the bearing capacity of carrying tablet, reduce return loss.Power according to this aluminium nitride ceramics substrate carrier sheet of detection can be born is highly stable, can reach the requirement that communication period absorbs required power fully,
More than a kind of impedance that the utility model embodiment is provided be that 50 Ω aluminium nitride ceramics substrates, 100 tile load sheets have carried out detailed introduction; For one of ordinary skill in the art; According to the thought of the utility model embodiment, the part that on embodiment and range of application, all can change, in sum; This description should not be construed as the restriction to the utility model, and all any changes of being made according to the utility model design philosophy are all within the protection range of the utility model.
Claims (3)
1. one kind wide pad impedance is 50 Ω aluminium nitride ceramics substrates, 100 tile load sheets; It is characterized in that: it comprises the aluminium nitride substrate of a 5.7*8.9*1.0mm; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with resistance and lead, and said lead connects said resistance and forms load circuit; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, is printed with glass protection film on the said resistance.
2. wide pad impedance according to claim 1 is 50 Ω aluminium nitride ceramics substrates, 100 tile load sheets, it is characterized in that: the upper surface of said lead and glass protection film also is printed with the blue diaphragm of one deck.
3. wide pad impedance according to claim 1 is 50 Ω aluminium nitride ceramics substrates, 100 tile load sheets, and it is characterized in that: said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203249713U CN202259625U (en) | 2011-09-01 | 2011-09-01 | 100W aluminium nitride ceramic substrate load sheet with wide pad and impedance of 50 ohms |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203249713U CN202259625U (en) | 2011-09-01 | 2011-09-01 | 100W aluminium nitride ceramic substrate load sheet with wide pad and impedance of 50 ohms |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202259625U true CN202259625U (en) | 2012-05-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203249713U Expired - Fee Related CN202259625U (en) | 2011-09-01 | 2011-09-01 | 100W aluminium nitride ceramic substrate load sheet with wide pad and impedance of 50 ohms |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202259625U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427152A (en) * | 2011-09-01 | 2012-04-25 | 苏州市新诚氏电子有限公司 | 100W aluminum nitride ceramic substrate loading chip with wide solder pad and 50 Ohms impedance |
| CN102709634A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 30-watt 17dB attenuation sheet of aluminum nitride ceramic substrate |
-
2011
- 2011-09-01 CN CN2011203249713U patent/CN202259625U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102427152A (en) * | 2011-09-01 | 2012-04-25 | 苏州市新诚氏电子有限公司 | 100W aluminum nitride ceramic substrate loading chip with wide solder pad and 50 Ohms impedance |
| CN102709634A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | 30-watt 17dB attenuation sheet of aluminum nitride ceramic substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20120901 |