CN202121046U - 150 tile load sheet of high power aluminum nitride ceramic substrate - Google Patents
150 tile load sheet of high power aluminum nitride ceramic substrate Download PDFInfo
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- CN202121046U CN202121046U CN 201120259920 CN201120259920U CN202121046U CN 202121046 U CN202121046 U CN 202121046U CN 201120259920 CN201120259920 CN 201120259920 CN 201120259920 U CN201120259920 U CN 201120259920U CN 202121046 U CN202121046 U CN 202121046U
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- aluminium nitride
- aluminum nitride
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Abstract
The utility model discloses a 150 tile load sheet of a high power aluminum nitride ceramic substrate, comprising an aluminum nitride substrate of 9.55*6.35 *1 mm. The back side of the aluminum nitride substrate is printed with a back guide layer, and the right side is printed with a conducting wire and a plurality of resistors. The plurality of resistors are in parallel connections to form a load circuit via the conducting wire, a grounding terminal of the load circuit is in electrical connection with the back guide layer, and the load circuit is equipped with a pad. The load sheet takes the aluminum nitride substrate of 9.55*6.35 *1 mm as the substrate, the load circuit employs a design technology of making the resistors in parallel connections without employing the conventional single resistor design technology, so that the areas of the resistors can be increased effectively, and accordingly, the bearing power capability of the load sheet can be consolidated further. Meanwhile, by employing the design technology, the displacement and arrangement of the conducting wire can break through the restriction of the conventional design, and an excellent return loss characteristic can be obtained while enlarging the pad, and the enlargement of the pad can make the soldering more convenient and firmer.
Description
Technical field
The utility model relates to a kind of aluminium nitride ceramics substrate carrier sheet, particularly a kind of powerful aluminium nitride ceramics substrate 150W carrier sheet.
Background technology
Aluminium nitride ceramics substrate carrier sheet is mainly used in the power that in communication base station, absorbs reverse input in the communication component, if can not bear the power of requirement, load will burn out, and possibly cause entire equipment to burn out.In the actual use of aluminium nitride ceramics substrate carrier sheet; All need wire bonds to the pad of carrier sheet; Adopt the design technology of little pad in the market mostly; Because can directly have influence on the return loss of product after pad amplifies, make return loss increase, if but adopt little pad then the convenience that can many welding and the fastness of welding cause adverse influence.
The utility model content
To the deficiency of above-mentioned prior art, the technical problem that the utility model will solve provides a kind of high-power aluminium nitride ceramics substrate 150 tile load sheets that are provided with large bonding pad.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of high-power aluminium nitride ceramics substrate 150 tile load sheets; It comprises the aluminium nitride substrate of a 9.55*6.35**1MM; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with lead and several resistance, and said several resistance form load circuit through said lead parallel connection; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, and said load circuit is provided with pad.Load circuit can adopt two resistive arrangement schemes to increase resistor area.
Preferably, said pad is of a size of 1.2*3mm.
Preferably, be printed with glass protection film on the said resistance, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
Preferably, said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Technique scheme has following beneficial effect: this carrier sheet with the aluminium nitride substrate of 9.55*6.35**1MM as substrate; Load circuit adopts the design technology of parallel resistance; And do not adopt the design technology of traditional single resistance; Can effectively increase the area of resistance like this, the ability that makes carrier sheet bear power is further consolidated, and adopts this design technology to make walking of lead arrange simultaneously and breaks through the restriction of original traditional design; Make pad when increasing, access good return loss characteristic, and the increase of pad can make welding more convenient and firm.
Above-mentioned explanation only is the general introduction of the utility model technical scheme, in order more to know the technological means of understanding the utility model, and can implement according to the content of specification, below with the preferred embodiment of the utility model and conjunction with figs. specify as after.The embodiment of the utility model is provided by following examples and accompanying drawing thereof in detail.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment.
Embodiment
Describe in detail below in conjunction with the preferred embodiment of accompanying drawing to the utility model.
As shown in Figure 1; These high-power aluminium nitride ceramics substrate 150 tile load sheets comprise the aluminium nitride substrate 1 of a 9.55*6.35**1MM; The back up of aluminium nitride substrate 1 has back of the body conducting shell, and the front of aluminium nitride substrate is printed with lead 2 and several resistance 3, and several resistance 3 form load circuit through lead 2 parallel connections; The earth terminal of load circuit is electrically connected through the silver slurry with back of the body conducting shell, can make load circuit ground connection form the loop like this.Load circuit is provided with pad, and pad is of a size of 1.2*3mm.Back of the body conducting shell and lead 2 are formed by the conductive silver paste printing, and resistance is formed by the resistance slurry printing.Be printed with glass protection film 4 on the resistance 3, the upper surface of lead 2 and glass protection film 4 also is printed with one deck black protective film 5, can do further protection to resistance 3, lead 2 and glass protection film 4 like this.
This carrier sheet with the aluminium nitride substrate of 9.55*6.35**1MM as substrate; Load circuit adopts the design technology of parallel resistance; And do not adopt the design technology of traditional single resistance, and can effectively increase the area of resistance like this, the ability that makes carrier sheet bear power is further consolidated.Adopt the carrier sheet of this structure can make the bearing power of the aluminium nitride substrate of above-mentioned dimensions arrive 150W; And satisfy impedance 50 ± 1.5 Ω; Return loss can satisfy the actual production requirement at 3G and 3G frequency range with interior; Adopt this design technology to make walking of lead arrange simultaneously and break through the restriction of original traditional design, make pad when increasing, access good return loss characteristic, and the increase of pad can make welding more convenient and firm.
More than a kind of high-power aluminium nitride ceramics substrate 150 tile load sheets that the utility model embodiment is provided carried out detailed introduction; For one of ordinary skill in the art; According to the thought of the utility model embodiment, the part that on embodiment and range of application, all can change, in sum; This description should not be construed as the restriction to the utility model, and all any changes of being made according to the utility model design philosophy are all within the protection range of the utility model.
Claims (4)
1. high-power aluminium nitride ceramics substrate 150 tile load sheets; It is characterized in that: it comprises the aluminium nitride substrate of a 9.55*6.35**1MM; The back up of said aluminium nitride substrate has back of the body conducting shell, and the front of said aluminium nitride substrate is printed with lead and several resistance, and said several resistance form load circuit through said lead parallel connection; The earth terminal of said load circuit is electrically connected with said back of the body conducting shell, and said load circuit is provided with pad.
2. high-power aluminium nitride ceramics substrate 150 tile load sheets according to claim 1, it is characterized in that: said pad is of a size of 1.2*3mm.
3. high-power aluminium nitride ceramics substrate 150 tile load sheets according to claim 1, it is characterized in that: be printed with glass protection film on the said resistance, the upper surface of said lead and glass protection film also is printed with one deck black protective film.
4. high-power aluminium nitride ceramics substrate 150 tile load sheets according to claim 1, it is characterized in that: said back of the body conducting shell and lead are formed by the conductive silver paste printing, and said resistance is formed by the resistance slurry printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120259920 CN202121046U (en) | 2011-07-22 | 2011-07-22 | 150 tile load sheet of high power aluminum nitride ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120259920 CN202121046U (en) | 2011-07-22 | 2011-07-22 | 150 tile load sheet of high power aluminum nitride ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202121046U true CN202121046U (en) | 2012-01-18 |
Family
ID=45462085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120259920 Expired - Fee Related CN202121046U (en) | 2011-07-22 | 2011-07-22 | 150 tile load sheet of high power aluminum nitride ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202121046U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332625A (en) * | 2011-07-22 | 2012-01-25 | 苏州市新诚氏电子有限公司 | 150W load sheet of high-power aluminum nitride ceramic substrate |
-
2011
- 2011-07-22 CN CN 201120259920 patent/CN202121046U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332625A (en) * | 2011-07-22 | 2012-01-25 | 苏州市新诚氏电子有限公司 | 150W load sheet of high-power aluminum nitride ceramic substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120118 Termination date: 20120722 |